ISMI 450mm Transition Program

Transcription

1 SEMATECH Symposium Taiwan September 7, 2010 Accelerating Manufacturing Productivity ISMI 450mm Transition Program Scott Kramer VP Manufacturing Technology SEMATECH Copyright 2010 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

2 Wafer size the great cost equalizer 200mm 300mm 450mm ~ >2012 History shows that increasing wafer surface area by ~2.25X yields a 30% cost reduction and enables the inexpensively part of Moore s Law 2

3 ISMI 450mm program mission and organization ISMI s 450mm mission statement Enable a cost-effective 450mm transition through coordination and development of infrastructure, guidance, and industry readiness ISMI 450mm organization 450mm transition program Supplier engagement Factory integration readiness Test wafer operations Starting materials Vacuum platform development Equipment test methods and metrics 3

4 450mm progress 2007 thru 2010 Wafers Mechanical wafer bank Single crystal wafer bank test wafer generation Improved wafer quality supports equipment demonstrations Equipment Equipment concepts development Supplier engagement 1st 450mm tool (bare wafer particle detector) Equipment demonstrations Factory integration Interoperability Test Bed (ITB) prototype FI components Integrating components Full interoperability testing with standard compliant components Standards First draft ballots proposed for FOUPs and Loadports Mechanical wafer standard completed FOUP and loadport standards completed Developmental wafer standard completed

5 450mm starting materials activities 5

6 Silicon industry update All major silicon suppliers are engaged in the 450mm program and manufacturing developmental test wafers Wafer quality is continuously improving: Scratches have been eliminated Particle levels have been reduced dramatically Surface metals metrology is in development Inspection equipment is coming on line Wafer shipping methodology is in development ISMI is engaged with suppliers to close gaps in silicon manufacturing and inspection line 6

7 450mm surface quality improvements 450mm Surface Quality Improvement Wafer Defects (Lower is Better) Key Surface Parameter Target 2 0 Q3'09 Q4'09 Q1'10 Q2'10 Time Polishing has been improved scratches have been eliminated 2010 Cleaning has been improved particle levels have been reduced 10X 7

8 ISMI silicon activities Benchmark silicon suppliers state of the art Work with suppliers to improve wafer quality Continuous engagement with wafer inspection OEMs Validate wafers specification in preparation for prime wafer spec generation Wafer bank loan program has been complemented with OEMs starting to purchase wafers directly from suppliers SEMI spec M76 published for developmental 450mm polished single crystal silicon wafers We have expended our interface with materials suppliers beyond silicon (E.G. quartzware, sputtering targets), in support of ISMI process test wafers generation 8

9 ISMI test wafer operations 9

10 ISMI test wafer operations 450mm equipment installations continues Bare wafer particle/edge inspection Wafer cleaning Film thickness measurements EFEMs / wafer sorters FOUP wash 450mm test wafer processing experiments are progressing Wafer cleaning Metrology inspections ISMI continues working with suppliers on test wafer capabilities 10

11 ISMI prototype wafer cleans tool SSEC Wet clean tool installation complete in SEMATECH cleanroom SC1 / SC2 cleaning capability 12mm pitch loadport Cleaning experiments underway Cleaner wafers becoming available in ISMI wafer bank Particle experiments with loadports / carriers underway 11

12 450mm test wafer utilities matrix Collecting early 450mm utility projections Inputs will be used for 450mm test wafer facility planning Supplier surveys Consolidate surveys Supplier estimates for 450mm equipment facility requirements are requested 12

13 450mm demonstration test methodology 13

14 450 mm demonstration test methodology (450 DTM) The 450 DTM provides an efficient equipment demonstration model for the industry Consolidated inputs from IC makers and suppliers Clear and consistent procedures; standardized methodology for common equipment requirements Equipment demonstrations will focus on process repeatability, stability, and equipment reliability As demonstrations begin, engagement and input from IC maker and equipment suppliers is key 14

15 450mm factory integration 15

16 Reduced standards development time ISMI s ITB testing helped to enable a 60-65% time reduction in FI standards development vs. 300mm 300mm transition FI standards transition Org standards published Provisional or full standards published Decision to start wafer size transition and standards development Approved FI standards published 450mm transition Ongoing prototype testing

17 ITB lab testing focused on the latest FOUPs, MACs and load ports FOUPs Carriers 12mm Pitch Std FOUPs MAC Carrier 12mm Pitch Std MACs TDK 12 mm pitch load port under continuous cycling Completed >123 k cycles with FOUPs Gudeng 12mm Pitch Latch Key FOUP Brooks 12mm pitch load port, compatible with FOUPs and MACs cycling at supplier site Completed >34 k cycles with FOUPs Planning MAC testing in Q Sinfonia 12mm pitch load port cycling with latest FOUPs Completed >183 k cycles with FOUPs Working with Sinfonia to test new MAC/FOUP compatible Load port Entegris 12mm Pitch Latch Key FOUP 17

18 AMHS testing planned for H mm OHT 450mm Stocker New 450mm stockers and transport systems are under advanced development at suppliers sites ISMI will assess systems in H2 10 against ISMI 450mm guidelines and interoperability with 450mm standard carriers and load ports Goal is to demonstrate AMHS will be ready for 450mm pilot lines 18

19 Summary 450mm factory integration >5.0M robotic moves and >648k load port cycles completed in the ITB with prototype carriers Upgrades to prototype 12mm pitch Std FOUPs, load ports and EFEMs continued to demonstrate good interoperability and reliability Sun-setting ITB after completion of MAC, MAC load port (i.e., new standard load ports), and interoperability with FOUPs and MACs testing Working with AMHS Suppliers to complete evaluations of stockers and overhead hoist transport before end of

20 450mm vacuum platform development 20

21 450mm vacuum platform readiness 1st 450mm vacuum platform test is ongoing 450mm vacuum platform solutions are becoming available for EFEM and chamber integration ISMI will communicate additional guidelines to suppliers and industry organizations based on test results ISMI will continue to support the integration of process chamber and platform to enable prototype 450mm equipment development 21

22 450mm vacuum platform roadmap Phase I : Evaluation and Motivation Host ISMI 450mm workshop, with 16 suppliers Created preliminary ISMI 450mm platform guidelines Published ISMI 450mm EQP software guidelines Phase III : Evaluate the feasibility of platform standardization Project initiation Completed test plan (platform only) Engaged with 5 vacuum platform suppliers; received 1 st test proposals Completed early evaluation for 450mm platform standardization Test 1 st 450mm platform, at supplier site Encouraged suppliers to start on site test Phase II : Testing and Integration 22

23 1st 450mm platform configuration RORZE Type: Pentagon Interface # : 3 process chambers, 2 Load lock 300mm and 450mm wafer handling in the same platform 23

24 Accelerating the next technology revolution Research Development Manufacturing 24