Built-in Inrush Current Protection, 300mA High Speed LDO Voltage Regulator

Transcription

1 XC6223 Series ETR339-5 Built-in Inrush Current Protection, 3mA High Speed LDO Voltage Regulator GENERAL DESCRIPTION The XC6223 series is a high speed LDO regulator that features high accurate, low noise, high ripple rejection, low dropout and low power consumption. The series consists of a voltage reference, an error amplifier, a driver transistor, a current limiter, a phase compensation circuit, a thermal shutdown circuit and an inrush current protection circuit. The CE function enables the circuit to be in stand-by mode by inputting low level signal. In the stand-by mode, the series enables the electric charge at the output capacitor CL to be discharged via the internal switch, and as a result the VOUT pin quickly returns to the VSS level. The output stabilization capacitor CL is also compatible with low ESR ceramic capacitors. The output voltage is selectable in 5V increments within the range of 1.2V to 4.V which fixed by laser trimming technologies. The over current protection circuit and the thermal shutdown circuit are built-in. These two protection circuits will operate when the output current reaches current limit level or the junction temperature reaches temperature limit level. APPLICATIONS Digital still cameras Cell phones Portable games Camera modules IC recorders Portable media players Bluetooth Wireless LAN Terrestrial digital TV tuners Cordless phones FEATURES Maximum Output Current : 3mA Input Voltage Range : 1.6~5.5V s : 2.~4.V (Accuracy ±1%) 1.2~1.95V (Accuracy ±2mV) 5V increments Dropout Voltage : 2mV@I OUT =3mA (V OUT =3.V) Low Power Consumption : 1μA Stand-by Current :.1μA High Ripple Rejection : 8dB@f=1kHz Protection Circuits : Current Limit(4mA) Short Circuit Protection Over Heat Protection Inrush Current Protection Low ESR Capacitors : C IN =1.μF, C L =1.μF CE Function : Active High C L High Speed Discharge Small Packages : USPQ-4B3 USP-4 SSOT-24 SOT-25 SOT-89-5 Environmentally Friendly : EU RoHS Compliant, Pb Free TYPICAL APPLICATION CIRCUIT TYPICAL PERFORMANCE CHARACTERISTICS XC6223x251 tr = tf =.5μs,, I OUT = 1 15mA V IN = 3.5V, C IN = 1μF (ceramic), C L = 1μF (ceramic) Output Current Time [2μs/div] Output Current Iout[mA] 1/36

2 XC6223 Series PIN CONFIGURATION *The dissipation pad for the USPQ-4B3,USP-4 packages should be solder-plated in reference mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the V SS (No. 2) pin. PIN ASSIGNMENT PIN NUMBER USPQ-4B3 USP-4 SSOT-24 SOT-25 SOT-89-5 PIN NAME FUNCTIONS V IN Power Input V OUT Output V SS Ground CE ON/OFF Control NC No Connection PIN FUNCTION ASSIGNMENT CE Ethics Condition IC Operation State ON/OFF H Operation ON L Operation OFF(Stand-by) OPEN * * Undefined state in XC6223 A/B/E/F. On the other hand, Operation OFF states in XC6223C/D/G/H because that an internal pull-down resister maintains the CE pin voltage to be low. 2/36

3 XC6223 Series PRODUCT CLASSIFICATION Ordering Information XC ( *1 ) DESIGNATOR ITEM SYMBOL DESCRIPTION 1 Type of Regulator (CE active high) Inrush Current Protection CE Pull-Down Resistor C L Discharge A NO NO NO B NO NO YES C NO YES (1MΩ, TYP built-in) NO D NO YES (1MΩ, TYP built-in) YES E YES NO NO F YES NO YES G YES YES (1MΩ, TYP built-in) NO H (The Recommended Type) YES YES (1MΩ, TYP built-in) YES 23 12~4 ex.) 2.8V 2=2, 3=8, 4=please see down below. 4 (2 nd decimal place) 1 ex.) 2.8V 4=1 B ex.) 2.85V 4=B 9R-G USPQ-4B3 (5,/Reel) 56-7 ( *1) Packages (Order Unit) GR-G NR-G MR-G USP-4 (3,/Reel) SSOT-24 (3,/Reel) SOT-25 (3,/Reel) PR-G SOT-89-5 (3,/Reel) (*1) The -G suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. 3/36

4 4/36 XC6223 Series ON/OFF Control + - Error Amp Voltage Reference R1 R2 CFB XC6223Bseries VIN CE VSS VOUT ON/OFF Control + - Error Amp Voltage Reference CurrentLimit R1 R2 CFB XC6223Aseries VIN CE VSS VOUT + - Error Amp Voltage Reference R1 R2 CFB XC6223Dseries VIN VSS VOUT ON/OFF Control + - Error Amp Voltage Reference each circuit R1 R2 CFB XC6223Cseries VIN CE VSS VOUT ON/OFF Control each circuit CE CurrentLimit CurrentLimit CurrentLimit TSD ON/OFF Control + - Error Amp Voltage Reference R1 R2 CFB XC6223Fseries VIN CE VSS VOUT ON/OFF Control + - Error Amp Voltage Reference CurrentLimit R1 R2 CFB XC6223Eseries VIN CE VSS VOUT XC6223Hseries ON/OFF Control + - Error Amp Voltage Reference R1 R2 CFB XC6223Gseries VIN CE VSS VOUT CurrentLimit CurrentLimit each circuit each circuit each circuit each circuit each circuit Non Rush TSD TSD TSD TSD TSD TSD Non Rush Non Rush Rdischg Rdischg Rdischg + - Error Amp Voltage Reference R1 R2 CFB VIN VSS VOUT ON/OFF Control CE CurrentLimit each circuit CE TSD Non Rush Rdischg CE CE CE BLOCK DIAGRAMS

5 XC6223 Series ABSOLUTE MAXIMUM RATINGS Power Dissipation PARAMETER SYMBOL RATINGS UNITS Input Voltage V IN V SS -.3~+7. V Output Current I OUT 5 (*1) ma V OUT V SS -.3~V IN +.3 V CE Input Voltage V CE V SS -.3~+7. V USPQ-4B (PCB mounted) (*2) USP-4 SSOT-24 SOT-25 SOT-89-5 Pd 12 1 (PCB mounted) (*2) 15 5 (PCB mounted) (*2) 25 6 (PCB mounted) (*2) 5 13 (PCB mounted) (*2) Operating Temperature Range Topr -4~+85 Storage Temperature Range Tstg -55~+125 mw (*1) : IOUT Pd / (VIN-VOUT) (*2) : The power dissipation figure shown is PCB mounted. Please refer to page 26~29 for details. 5/36

6 XC6223 Series ELECTRICAL CHARACTERISTICS XC6223A/B/C/D/E/F/G/H Series PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUITS V OUT(T) 2.V, V CE =V IN, I OUT =1mA V OUT(E) (*1) V OUT(T) <2.V, V CE =V IN, I OUT =1mA (*3) V OUT(T).99 (*2) V OUT(T) -2mV (*2) V OUT(T) (*2) V OUT(T) (*2) V OUT(T) 1.1 (*2) V V OUT(T) +2mV (*2) V Ta=25 1 Maximum Output Current Load Regulation Dropout Voltage I OUT MAX V CE =V IN ma 1 V CE =V IN, mv 1.1mA I OUT 3mA Vdif (*4) V CE =V IN, I OUT =3mA E-1 mv 1 ΔV OUT 6/36 Supply Current I SS V CE =V IN μa 2 Stand-by Current Istby V CE =V SS μa 2 Line Regulation ΔV OUT / (ΔV IN V OUT ) V OUT(T) +.5V V IN 5.5 V V CE =V IN, I OUT =5mA %/V 1 Input Voltage V IN V 1 Temperature Characteristics ΔV OUT / (ΔTa V OUT ) V CE =V IN, I OUT =1mA -4 Ta 85 V OUT(T) <2.5V V IN =3.V DC +.5Vp-p AC V CE =V OUT(T) +1.V I OUT =3mA f=1khz Ripple Rejection Rate PSRR V OUT(T) 2.5V V IN ={V OUT(T) +1.} V DC +.5Vp-p AC V CE =V OUT(T) +1.V I OUT =3mA f=1khz - ±1 - ppm / db 3 Current Limit I LIM V CE =V IN ma 1 Short Current I SHORT V CE =V IN, V OUT =V SS ma 1 CE High Level Voltage V CEH V 4 CE Low Level Voltage V CEL V 4 CE High Level Current (A/B/E/F Type) CE High Level Current (C/D/G/H Type) I CEH V CE =V IN =5.5V μa 4 I CEH V CE =V IN =5.5V μa 4 CE Low Level Current I CEL V CE =V SS μa 4 CL Discharge Resistance (Only B/D/F/H Type) Inrush Current (Only E/F/G/H Type) Thermal Shutdown Detect Temperature Thermal Shutdown Release Temperature Thermal Shutdown Hysteresis Width R DCHG V IN =5.5V, V OUT =2.V, V CE =V SS Ω 1 Irush V IN =V CE =5.5V ma 5 T TSD Junction Temperature T TSR Junction Temperature T TSD - T TSR Junction Temperature NOTE: *1: VOUT(E): Effective output voltage (i.e. the output voltage when VOUT(T)+1.V is provided at the VIN pin while maintaining a certain IOUT value.) *2: VOUT(T): Nominal output voltage *3: The standard output voltage is specified in V OUT(T) ±2mV where V OUT(T) <2.V. *4: Vdif={V IN1 {*5}-V OUT1 {*6}} (V IN1 1.6V) *5: V IN1 =The input voltage when V OUT1 appears as input voltage is gradually decreased. *6: V OUT1 =A voltage equal to 98% of the output voltage whenever an amply stabilized I OUT {V OUT(T) +1.V} is input *7: Unless otherwise stated regarding input voltage conditions, V IN =V OUT(T) +1.V. 1

7 XC6223 Series ELECTRICAL CHARACTERISTICS (Continued) Voltage Chart 1 NOMINAL OUTPUT SYMBOL E- E-1 VOLTAGE (V) PARAMETER V OUT(T) OUTPUT VOLTAGE (V) V OUT(E) DROPOUT VOLTAGE (mv) Vdif MIN MAX TYP MAX /36

8 XC6223 Series ELECTRICAL CHARACTERISTICS (Continued) Voltage Chart2 SYMBOL E- E-1 PARAMETER NOMINAL OUTPUT VOLTAGE (V) V OUT(T) OUTPUT VOLTAGE (V) V OUT(E) DROPOUT VOLTAGE (mv) Vdif MIN. MAX. TYP. MAX /36

9 XC6223 Series OPERATIONAL EXPLANATION The voltage divided by resistors R1 & R2 is compared with the internal reference voltage by the error amplifier. The P-channel MOSFET which is connected to the VOUT pin is then driven by the subsequent output signal. The output voltage at the VOUT pin is controlled and stabilized by a system of negative feedback. The current limit circuit and short circuit protection operate in relation to the level of output current and heat dissipation. Further, the IC s internal circuitry can be shutdown via the CE pin signal. <Low ESR Capacitor> The XC6223 series needs an output capacitor C L for phase compensation. In order to ensure the stable phase compensation, please place an output capacitor of 1.μF or bigger at the V OUT pin and V SS pin as close as possible. For a stable power input, please connect an input capacitor (CIN) of 1.μF between the VIN pin and the VSS pin. <Current Limiter, Short-Circuit Protection> The protection circuit operates as a combination of an output current limiter and fold-back short circuit protection. When load current reaches the current limit level, the output voltage drops. As a result, the load current starts to reduce with showing fold-back curve. The output current finally falls at the level of 5mA when the output pin is short-circuited. <CE Pin> The IC's internal circuitry can be shutdown via the signal from the CE pin. In shutdown mode, the XC6223B/D/F/H series enables the electric charge at the output capacitor (C L ) to be discharged via the internal auto-discharge switch, and as a result the V OUT pin quickly returns to the V SS level. When the CE pin is open, the output voltage becomes undefined state in the XC6223A/B/E/F series because of a high active and no pull-down. On the other hand, the XC6223C/D/G/H series has a pull-down resistor at the CE pin inside, so that the CE pin input current flows. <Thermal Shutdown> The over heat protection circuit is built-in with the XC6223 series. When the junction temperature of the IC reaches the temperature limit level (15 TYP.), the thermal shutdown circuit operates and the driver transistor will be turned off. The IC resumes its operation when the thermal shutdown function is released as a result of the junction temperature drops to the release point. <Inrush Current Protection> The inrush current protection circuit is built in the XC6223 series. When the IC starts to operate, the protection circuit limits the inrush current from V IN to V OUT to charge C L capacitor. This function is built in the XC6223E/F/G/H series. 9/36

10 XC6223 Series NOTES ON USE 1. Where wiring impedance is high, operations may become unstable due to the noise and/or phase lag depending on output current. Please strengthen V IN and V SS wiring in particular. 2. The input capacitor C IN and the output capacitor C L should be placed to the as close as possible with a shorter wiring. 3. The IC is controlled with constant current start-up. Start-up sequence control is requested to draw a load current after rising up the output voltage. 4. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded. 5. Torex places an importance on improving our products and its reliability. However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment. 1/36

11 XC6223 Series TEST CIRCUITS Circuit 1 Circuit 2 Circuit 3 11/36

12 XC6223 Series TEST CIRCUITS (Continued) Circuit 4 Circuit 5 12/36

13 XC6223 Series TYPICAL PERFORMANCE CHARACTERISTICS (1) vs. Output Current XC6223x121 XC6223x V IN = 2.2V C IN = 1.μF (ceramic) 1.4 C IN = 1.μF (ceramic) Ta=-4 Ta=25 Ta= VIN=1.6V VIN=2.2V VIN=2.7V VIN=5.5V Output Current: IOUT [ma] Output Current: IOUT [ma] XC6223x181 Ta=-4 Ta=25 Ta=85 VIN = 2.8V C IN = 1.μF (ceramic) Output Current: I OUT [ma] XC6223x181 VIN=1.9V VIN=2.3V VIN=2.8V VIN=3.3V VIN=5.5V C IN = 1.μF (ceramic) Output Current: I OUT [ma] XC6223x251 XC6223x251 VIN = 3.5V C IN = 1.μF (ceramic) C IN = 1.μF (ceramic) Ta=-4 Ta=25 Ta= VIN=2.6V VIN=3.V VIN=3.5V VIN=4.V VIN=5.5V Output Current: I OUT [ma] Output Current: I OUT [ma] 13/36

14 XC6223 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (1) vs. Output Current (Continued) XC6223x41 Ta=-4 Ta=25 Ta=85 VIN = 5.V C IN = 1.μF (ceramic) Output Current: I OUT [ma] XC6223x41 VIN=4.1V 25 VIN=4.5V VIN=5.V 25 VIN=5.5V C IN = 1.μF (ceramic) Output Current: I OUT [ma] (2) vs. Input Voltage 1.4 XC6223x121 C IN = 1μF (ceramic), C L = 1μF (ceramic) XC6223x121 C IN = 1μF (ceramic), C L = 1μF (ceramic) : V OUT [V] IOUT=1mA IOUT=1mA IOUT=3mA : V OUT [V] IOUT=1mA IOUT=1mA IOUT=3mA.4 IOUT=5mA Input Voltage: V IN [V] IOUT=5mA Input Voltage: V IN [V] : V OUT [V] XC6223x181 C IN = 1μF (ceramic), C L = 1μF (ceramic) IOUT=1mA IOUT=1mA IOUT=3mA IOUT=5mA Input Voltage: V IN [V] : V OUT [V] XC6223x181 C IN = 1μF (ceramic), C L = 1μF (ceramic) IOUT=1mA IOUT=1mA IOUT=3mA IOUT=5mA Input Voltage: V IN [V] 14/36

15 XC6223 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (2) vs. Input Voltage (Continued) XC6223x251 XC6223x251 C IN = 1μF (ceramic), C L = 1μF (ceramic) C IN = 1μF (ceramic), C L = 1μF (ceramic) : V OUT [V] IOUT=1mA IOUT=1mA IOUT=3mA IOUT=5mA Input Voltage: V IN [V] : V OUT [V] IOUT=1mA IOUT=1mA IOUT=3mA IOUT=5mA Input Voltage: V IN [V] : V OUT [V] XC6223x41 C IN = 1μF (ceramic), C L = 1μF (ceramic) IOUT=1mA IOUT=1mA IOUT=3mA IOUT=5mA Input Voltage: V IN [V] : V OUT [V] XC6223x41 C IN = 1μF (ceramic), C L = 1μF (ceramic) IOUT=1mA IOUT=1mA IOUT=3mA IOUT=5mA Input Voltage: V IN [V] (3) Dropout Voltage vs. Output Current XC6223x121 XC6223x181.5 C IN = 1μF (ceramic), C L = 1μF (ceramic).5 C IN = 1μF (ceramic), C L = 1μF (ceramic) Dropout Voltage: Vdif [V] Ta = -4 Ta = 85 Dropout Voltage: Vdif [V] Ta = -4 Ta = Output Current: I OUT [ma] Output Current: I OUT [ma] 15/36

16 XC6223 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (3) Dropout Voltage vs. Output Current (Continued) XC6223x251 XC6223x41.5 C IN = 1μF (ceramic), C L = 1μF (ceramic).5 C IN = 1μF (ceramic), C L = 1μF (ceramic) Ta = -4 Dropout Voltage: Vdif [V] Ta = -4 Ta = 85 Dropout Voltage: Vdif [V] Ta = Output Current: I OUT [ma] Output Current: I OUT [ma] (4) Supply Current vs. Input Voltage XC6223x121 XC6223x Supply Current: ISS [μa] Ta = -4 Ta = Supply Current: ISS [μa] Ta = -4 Ta = Input Voltage: V IN [V] Input Voltage: V IN [V] XC6223x251 XC6223x Supply Current: ISS [μa] Ta = -4 Ta = Input Voltage: V IN [V] Supply Current: ISS [μa] Ta = -4 Ta = Input Voltage: V IN [V] 16/36

17 XC6223 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (5) vs. Ambient Temperature XC6223x121 V IN = 2.2V C IN = 1μF (ceramic), C L = 1μF (ceramic) IOUT= 1mA IOUT=1mA IOUT=3mA IOUT=5mA Ambient Temperature: Ta [ ] XC6223x181 V IN = 2.8V C IN = 1μF (ceramic), C L = 1μF (ceramic) 1.84 IOUT= 1mA 1.83 IOUT=1mA 1.82 IOUT=3mA 1.81 IOUT=1mA Ambient Temperature: Ta [ ] XC6223x251 V IN = 3.5V C IN = 1μF (ceramic), C L = 1μF (ceramic) IOUT= 1mA IOUT=1mA IOUT=3mA IOUT=1mA Ambient Temperature: Ta [ ] XC6223x41 V IN = 5.V C IN = 1μF (ceramic), C L = 1μF (ceramic) IOUT= 1mA IOUT=1mA 4.4 IOUT=3mA 4.2 IOUT=1mA Ambient Temperature: Ta [ ] (6) Rising Response Time XC6223x121 XC6223x181 tr = 5μs,,VIN = 2.2V C IN =.1μF (ceramic), C L = 1μF (ceramic) tr = 5μs,,VIN = 2.8V C IN =.1μF (ceramic), C L = 1μF (ceramic) Input Voltage: VIN [V] Input Voltage Time [5μs/div] IOUT=.1mA IOUT=3mA IOUT=1mA Input Voltage: VIN [V] Input Voltage Time [5μs/div] IOUT=.1mA IOUT=3mA IOUT=1mA /36

18 XC6223 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (6) Rising Response Time (Continued) XC6223x251 XC6223x41 tr = 5μs,,VIN = 3.5V CIN =.1μF (ceramic), C L = 1μF (ceramic) tr = 5μs,,VIN = 5.V C IN =.1μF (ceramic), C L = 1μF (ceramic) Input Voltage: VIN [V] Input Voltage IOUT=.1mA IOUT=3mA IOUT=1mA Input Voltage: VIN [V] Input Voltage IOUT=.1mA IOUT=3mA IOUT=1mA Time [5μs/div] Time [5μs/div] (7) Input Transient Response XC6223x121 XC6223x181 tr = tf = 5μs,, VIN = 2.2V 3.2V C IN =.1μF (ceramic), CL = 1.μF (ceramic) tr = tf = 5μs,, VIN = 2.8V 3.8V C IN =.1μF (ceramic), CL = 1.μF (ceramic) Input Voltage: VIN [V] Input Voltage IOUT=.1mA IOUT=3mA IOUT=1mA Time [1μs/div] Input Voltage: VIN [V] Input Voltage IOUT=.1mA IOUT=3mA IOUT=1mA Time [1μs/div] XC6223x251 XC6223x41 tr = tf = 5μs,, VIN = 3.5V 4.5V C IN =.1μF (ceramic), CL = 1.μF (ceramic) tr = tf = 5μs,, VIN = 4.5V 5.5V C IN =.1μF (ceramic), CL = 1.μF (ceramic) Input Voltage: VIN [V] Input Voltage Time [1μs/div] IOUT=.1mA IOUT=3mA IOUT=1mA Input Voltage: VIN [V] Input Voltage Time [1μs/div] IOUT=1mA IOUT=3mA IOUT=1mA /36

19 XC6223 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) Load Transient Response (tr=tf=.5μs) XC6223x121 tr = tf =.5μs,, I OUT = 1 15mA V IN = 2.2V, C IN = 1μF (ceramic), C L = 1μF (ceramic) Output Current Time [2μs/div] Output Current Iout[mA] XC6223x121 tr = tf =.5μs,, I OUT = 5 1mA V IN = 2.2V, C IN = 1μF (ceramic), C L = 1μF (ceramic) Output Current Time [2μs/div] Output Current Iout[mA] 1.9 XC6223x181 tr = tf =.5μs,, I OUT = 1 15mA V IN = 2.8V, C IN = 1μF (ceramic), C L = 1μF (ceramic) XC6223x181 tr = tf =.5μs,, I OUT = 5 1mA V IN = 2.8V, C IN = 1μF (ceramic), C L = 1μF (ceramic) Output Current Output Current Iout[mA] Output Current Output Current Iout[mA] 1.5 Time [2μs/div] 1.74 Time [2μs/div] 2.6 XC6223x251 tr = tf =.5μs,, I OUT = 1 15mA V IN = 3.5V, C IN = 1μF (ceramic), C L = 1μF (ceramic) XC6223x251 tr = tf =.5μs,, I OUT = 5 1mA V IN = 3.5V, C IN = 1μF (ceramic), C L = 1μF (ceramic) Output Current Time [2μs/div] Output Current Iout[mA] Output Current Time [2μs/div] Output Current Iout[mA] 19/36

20 XC6223 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) Load Transient Response (tr=tf=.5μs) (Continued) XC6223x41 tr = tf =.5μs,, I OUT = 1 15mA V IN = 5.V, C IN = 1μF (ceramic), C L = 1μF (ceramic) XC6223x41 tr = tf =.5μs,, I OUT =5 1mA V IN = 5.V, C IN = 1μF (ceramic), C L = 1μF (ceramic) Output Current Time [2μs/div] Output Current Iout[mA] Output Current Time [2μs/div] Output Current Iout[mA] (8) Load Transient Response (tr=tf=5μs) (Continued) XC6223x121 tr = tf = 5μs,, I OUT = 1 15mA V IN = 2.2V, C IN = 1μF (ceramic), C L = 1μF (ceramic) Output Current Output Current Iout[mA] XC6223x121 tr = tf = 5μs,, I OUT = 5 1mA V IN = 2.2V, C IN = 1μF (ceramic), C L = 1μF (ceramic) Output Current Output Current Iout[mA] 1.14 Time [5μs/div] 1.14 Time [5μs/div] XC6223x181 tr = tf = 5μs,, I OUT = 1 15mA V IN = 2.8V, C IN = 1μF (ceramic), C L = 1μF (ceramic) Output Current Output Current Iout[mA] XC6223x181 tr = tf = 5μs,, I OUT = 5 1mA V IN = 2.8V, C IN = 1μF (ceramic), C L = 1μF (ceramic) Output Current Output Current Iout[mA] 1.74 Time [5μs/div] 1.74 Time [5μs/div] 2/36

21 XC6223 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) Load Transient Response (tr=tf=5μs) (Continued) 2.52 XC6223x251 tr = tf = 5μs,, I OUT = 1 15mA V IN = 3.5V, C IN = 1μF (ceramic), C L = 1μF (ceramic) XC6223x251 tr = tf = 5μs,, I OUT = 5 1mA V IN = 3.5V, C IN = 1μF (ceramic), C L = 1μF (ceramic) Output Current Output Current Iout[mA] Output Current Output Current Iout[mA] Time [5μs/div] Time [5μs/div] XC6223x41 XC6223x tr = tf = 5μs,, I OUT = 1 15mA V IN = 5.V, C IN = 1μF (ceramic), C L = 1μF (ceramic) tr = tf = 5μs,, I OUT = 5 1mA V IN = 5.V, C IN = 1μF (ceramic), C L = 1μF (ceramic) Output Current Output Current Iout[mA] Output Current Output Current Iout[mA] 3.94 Time [5μs/div] 3.94 Time [5μs/div] (9) CE Rising Response Time (A,B,C,D Type) XC6223x121 XC6223x181 V IN = 2.2V, tr = 5μs, V CE = V IN, C IN = C L = 1.μF (ceramic) V IN = 2.8V, tr = 5μs, V CE = V IN, C IN = C L = 1.μF (ceramic) Input Voltage: VCE [V] CE Input Voltage Time [2μs/div] IOUT=mA IOUT=3mA IOUT=1mA Input Voltage: VCE [V] CE Input Voltage Time [2μs/div] IOUT=mA IOUT=3mA IOUT=1mA /36

22 XC6223 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (9) CE Rising Response Time (A,B,C,D Type) (Continued) 6. XC6223x251 V IN = 3.5V, tr = 5μs, V CE = V IN, C IN = C L = 1.μF (ceramic) XC6223x41 V IN = 5.V, tr = 5μs, V CE = V IN, C IN = C L = 1.μF (ceramic) 6. Input Voltage: VCE [V] CE Input Voltage Time [2μs/div] IOUT=mA IOUT=3mA IOUT=1mA Input Voltage: VCE [V] CE Input Voltage Time [2μs/div] IOUT=mA IOUT=3mA IOUT=1mA (9) CE Rising Response Time (E,F,G,H Type) (Continued) Input Voltage: VCE [V] XC6223x121 V IN = 2.2V, tr = 5μs, V CE = V IN, C IN = C L = 1.μF (ceramic) CE Input Voltage Time [2μs/div] IOUT=mA IOUT=3mA IOUT=1mA Input Voltage: VCE [V] XC6223x181 V IN = 2.8V, tr = 5μs, V CE = V IN, C IN = C L = 1.μF (ceramic) CE Input Voltage Time [5μs/div] IOUT=mA IOUT=3mA IOUT=1mA XC6223x251 V IN = 3.5V, tr = 5μs, V CE = V IN, C IN = C L = 1.μF (ceramic) XC6223x41 V IN = 5.V, tr = 5μs, V CE = V IN, C IN = C L = 1.μF (ceramic) 6. Input Voltage: VCE [V] CE Input Voltage Time [5μs/div] IOUT=mA IOUT=3mA IOUT=1mA Input Voltage: VCE [V] CE Input Voltage IOUT=mA IOUT=3mA IOUT=1mA Time [5μs/div] /36

23 XC6223 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (1) Inrush Current Response Time (E,F,G,H Type) Input Voltage: VCE [V] V IN = 2.2V, tr = 5μs, V CE = V IN, C IN = C L = 1.μF (ceramic) CE Input Voltage XC6223x121 Rush Current Time [2μs/div] Rush Curren: IRUSH [ma] Input Voltage: VCE [V] CE Input Voltage XC6223x181 V IN = 2.8V, tr = 5μs, V CE = V IN, C IN = C L = 1.μF (ceramic) Rush Current Time [5μs/div] Rush Curren: IRUSH [ma] Input Voltage: VCE [V] XC6223x251 V IN = 3.5V, tr = 5μs, V CE = V IN, C IN = C L = 1.μF (ceramic) CE Input Voltage Rush Current Rush Curren: IRUSH [ma] Input Voltage: VCE [V] CE Input Voltage XC6223x41 V IN = 5.V, tr = 5μs, V CE = V IN, C IN = C L = 1.μF (ceramic) Rush Current Rush Curren: IRUSH [ma] Time [5μs/div] Time [5μs/div] 23/36

24 XC6223 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (11) Ripple Rejection Rate Ripple Rejection Rate: RR [db] XC6223x121, V IN = 3.VDC+.5Vp-pAC C IN =.1μF (ceramic), C L = 1μF (ceramic) IOUT=.1mA 2 IOUT=1mA IOUT=3mA Ripple Frequency: f [khz] Ripple Rejection Rate: RR [db] XC6223x181, V IN = 3.VDC+.5Vp-pAC C IN =.1μF (ceramic), C L = 1μF (ceramic) IOUT=.1mA IOUT=1mA IOUT=3mA Ripple Frequency: f [khz] Ripple Rejection Rate: RR [db] XC6223x251, V IN = 3.5VDC+.5Vp-pAC C IN =.1μF (ceramic), C L = 1μF (ceramic) IOUT=.1mA IOUT=1mA IOUT=3mA Ripple Frequency: f [khz] Ripple Rejection Rate: RR [db] XC6223x331, V IN = 4.3VDC+.5Vp-pAC C IN =.1μF (ceramic), C L = 1μF (ceramic) IOUT=.1mA IOUT=1mA IOUT=3mA Ripple Frequency: f [khz] 24/36

25 XC6223 Series PACKAGING INFORMATION *The package don t have filet because side of lead is no plating. 25/36

26 XC6223 Series PACKAGING INFORMATION (Continued) 1.5±.1 1.1±.1 1.3MAX (.1).8 MIN ±.2.2MIN 2.5± MAX (.4).8 MIN 5 26/36

27 XC6223 Series PACKAGING INFORMATION (Continued) USPQ-4B3 Reference Pattern Layout USPQ-4B3 Reference Metal Mask Design USP-4 Reference Pattern Layout USP-4 Reference Metal Mask Design 27/36

28 XC6223 Series PACKAGING INFORMATION (Continued) USPQ-4B3 Power Dissipation Power dissipation data for the USPQ-4B3 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition : Mount on a board Ambient : Natural convection Soldering : Lead (Pb) free Board Dimensions : 4 x 4 mm (16mm 2 ) Board Structure : 4 Copper Layers Each layer is connected to the package heat-sink and terminal pin No.1. Each layer has approximately 8mm 2 copper area. Material : Glass Epoxy (FR-4) Thickness : 1.6 mm Through-hole : 4 x.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient temperature Board Mount (Tj max = 125 ) Ambient Temperature( ) Power Dissipation Pd(mW) Thermal Resistance ( /W) Pd vs Ta Power Dissipation Pd(mW) Ampient Temperature Ta( ) 28/36

29 XC6223 Series PACKAGING INFORMATION (Continued) USP-4 Power Dissipation Power dissipation data for the USP-4 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 4 x 4 mm (16 mm 2 in one side) Copper (Cu) traces occupy 5% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient temperature Board Mount (Tj max = 125 ) Ambient Temperature( ) Power Dissipation Pd(mW) Thermal Resistance ( /W) Pd vs Ta Ambient Temperature Ta( ) 29/36

30 XC6223 Series PACKAGING INFORMATION (Continued) SSOT-24 Power Dissipation Power dissipation data for the SSOT-24 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 2. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 4 x 4 mm (16 mm 2 in one side) Copper (Cu) traces occupy 5% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient temperature Board Mount (Tj max = 125 ) Ambient Temperature( ) Power Dissipation Pd(mW) Thermal Resistance ( /W) Power Dissipation Pd (mw) 3/36

31 XC6223 Series PACKAGING INFORMATION (Continued) SOT-25 Power Dissipation Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 4 x 4 mm (16 mm 2 in one side) Copper (Cu) traces occupy 5% of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT-26 is used.) Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x.8 Diameter 2. Power Dissipation vs. Ambient temperature 評価基板レイアウト Evaluation Board (Unit: mm) ( 単位 :mm) Board Mount (Tj max = 125 ) Ambient Temperature( ) Power Dissipation Pd(mW) Thermal Resistance ( /W) Power Dissipation Pd (mw) 許容損失 Pd(mW) Pd-Ta 特性グラフ Pd vs. Ta Ambient 周辺温度 Temperature Ta( ) ( ) 31/36

32 XC6223 Series PACKAGING INFORMATION (Continued) SOT-89-5 Power Dissipation Power dissipation data for the SOT-89-5 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 4 x 4 mm (16 mm 2 in one side) Copper (Cu) traces occupy 5% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 5 x.8 Diameter て Evaluation Board (Unit: mm) 2. Power Dissipation vs. Operating temperature Board Mount (Tj max = 125 ) Ambient Temperature( ) Power Dissipation Pd(mW) Thermal Resistance ( /W) Power Dissipation Pd (mw) 許容損失 Pd(mW) Pd-Ta 特性グラフ Pd vs. Ta Ambient 周辺温度 Temperature Ta( ) ( ) 32/36

33 XC6223 Series MARKING RULE USPQ-4B3 1 represents type of regulator and output voltage range. MARK OUTPUT VOLTAGE.1V INCREMENTS OUTPUT VOLTAGE 5V INCREMENTS VOLTAGE=1.2~3.9V VOLTAGE =4.V VOLTAGE =1.25~3.95V PRODUCT SERIES 8 XC6223A***** 1 9 XC6223B***** 2 A XC6223C***** 3 B XC6223D***** H 4 C XC6223E***** 5 D XC6223F***** 6 E XC6223G***** 7 F XC6223H***** USPQ-4B3 (TOP VIEW) 2 represents output voltage. VOLTAGE=1.2~3.95[V] MARK OUTPUT VOLTAGE (V) MARK OUTPUT VOLTAGE (V) - - F H K L M N P R S T A U B V C X D Y E Z VOLTAGE=4.[V] PRODUCT SERIES MARK XC6223A***** XC6223B***** 1 XC6223C***** 2 XC6223D***** 3 XC6223E***** 4 XC6223F***** 5 XC6223G***** 6 XC6223H***** 7 34 represents production lot number. 1 to 9, A to Z, 11 to 9Z, A1 to A9, AA to Z9, ZA to ZZ in order. (G, I, J, O, Q, W excepted) *No character inversion used. 33/36

34 XC6223 Series MARKING RULE (Continued) SSOT-24 (with bar) 1 represents type of regulator and output voltage range. OUTPUT VOLTAGE.1V INCREMENTS MARK OUTPUT VOLTAGE 5V INCREMENTS VOLTAGE =1.2~2.9V VOLTAGE =3.~4.V VOLTAGE =1.25~3.95V PRODUCT SERIES B 3 8 XC6223A***** C 5 9 XC6223B***** D 7 S XC6223C***** E A T XC6223D***** K F U XC6223E***** L H V XC6223F***** M P X XC6223G***** N Z Y XC6223H***** SSOT-24(with bar) (TOP VIEW) 2 represents output voltage. MARK OUTPUT VOLTAGE (V) MARK OUTPUT VOLTAGE (V) F H K L M N P R S T A U B V C X D Y E Z represents production lot number. 1 to 9, A to Z, 11 to 9Z, A1 to A9, AA to Z9, ZA to ZZ in order. (G, I, J, O, Q, W excepted) *No character inversion used. 34/36

35 XC6223 Series MARKING RULE (Continued) 5 4 SOT-25, SOT-89-5,USP represents product series MARK PRODUCT SERIES 9 XC6223****** SOT-25 (TOP VIEW) 2 represents type of regulator. OUTPUT VOLTAGE.1V INCREMENTS MARK OUTPUT VOLTAGE 5V INCREMENTS VOLTAGE =1.2~3.9V VOLTAGE =4.V VOLTAGE =1.25~3.95V PRODUCT SERIES C D E XC6223A***** F H K XC6223B***** L M N XC6223C***** P R S XC6223D***** T U V XC6223E***** X Y Z XC6223F***** 1 2 XC6223G***** XC6223H***** SOT-89-5 (TOP VIEW) 3 represents output voltage. MARK OUTPUT VOLTAGE (V) MARK OUTPUT VOLTAGE (V) F H K L M N P R S T A U B V C X D Y E Z USP-4 (TOP VIEW) represents production lot number. 1 to 9, A to Z, 11 to 9Z, A1 to A9, AA to Z9, ZA to ZZ in order. (G, I, J, O, Q, W excepted) *No character inversion used. 35/36

36 XC6223 Series 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 36/36