FEATURES Ultra-Low Power. High Accuracy. Temperature Characteristics Hysteresis width. Detect voltage range Operating voltage range Output type

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1 XC6136 Series Ultra-Low Power (88nA) Voltage Detector ETR242-1a GENERAL DESCRIPTION The XC6136 series is ultra-low power voltage detector with high accuracy detection, manufactured using CMOS process and laser trimming technologies. The device is available in both CMOS and N-channel open drain output configurations. Also detect logic is available in both RESETB (Active Low) and RESET (Active High). Ultra-small low height package USPQ-4B5 and standard packages SSOT-24 and SOT-25 which are ideally suited for small design of portable devices and high densely mounting applications. UVLO circuit is implemented in order to suppress the floating of RESETB pin (undefined operation) when VIN voltage is lower than the minimum operating voltage. APPLICATIONS Energy Harvesting Wearable devices Smart meter Microprocessor logic reset circuitry System battery life and charge voltage monitors Power-on reset circuits Power failure Detection FEATURES Ultra-Low Power High Accuracy Temperature Characteristics Hysteresis width Detect voltage range Operating voltage range Output type Output logic Undefined operation Protection (CMOS Output only) Packages Environment friendly :91nA V DF =1.2V, =1.1V) :88nA V DF =1.2V, =1.32V) :±.8% (V DF 3.V, Ta=25 ) ±1.% (3.1V V DF, Ta=25 ) :±2.5% (V DF 3.V, Ta=-4 ~15 ) ±2.7% (3.1V V DF, Ta=-4 ~15 ) :±5ppm/ (TYP.) :TYPE:A/C V DF 5.% (TYP.) TYPE:B/D 2mV~28mV (TYP.) :1.2V~5.V (.1Vstep) :1.1V~6.V :CMOS Nch open drain :RESETB(Active Low) RESET(Active High) :Output pin Voltage.38V(MAX:Ta=-4 ~+15 supply Input pin Voltage< operating voltage(min.) :USPQ-4B5,SSOT-24,SOT-25 :EU RoHS Compliant, Pb Free TYPICAL APPLICATION CIRCUIT TYPICAL PERFORMANCE CHARACTERISTICS XC6136 Series R Pull (*1) RESETB /RESET RESETB /RESET INPUT 2 1 μprocessor V SS V SS (*1) Unused for the CMOS output products 1/23

2 XC6136 Series BLOCK DIAGRAMS (1) XC6136C Series A/B type(resetb OUTPUT:CMOS output/active Low) R SEN =RA+RB+RC RA + - UVLO M2 RESETB RB RC VREF M1 V SS * Diodes inside the circuits are ESD protection diodes and parasitic diodes. (2) XC6136C Series C/D type (RESET OUTPUT:CMOS output /Active High) R SEN =RA+RB+RC RA + - UVLO M2 RESET RB RC VREF M1 V SS * Diodes inside the circuits are ESD protection diodes and parasitic diodes. 2/23

3 XC6136 Series BLOCK DIAGRAMS (3) XC6136N Series A/B type (RESETB OUTPUT: Nch open drain output /Active Low) R SEN =RA+RB+RC RA + - UVLO RESETB RB RC VREF M1 V SS * Diodes inside the circuits are ESD protection diodes and parasitic diodes (4) XC6136N Series C/D type (RESET OUTPUT: Nch open drain output /Active High) R SEN =RA+RB+RC RA + - UVLO RESET RB RC VREF M1 V SS * Diodes inside the circuits are ESD protection diodes and parasitic diodes 3/23

4 XC6136 Series PRODUCT CLASSIFICATION Ordering Information XC (*1) DESIGNATOR ITEM SYMBOL DESCRIPTION 1 Output Configuration C N CMOS output Nch open drain output 23 Detect Voltage 12~5 e.g. 1.2V 2=1, 3= (*1) Type PKG A B C D 9R-G Refer to Selection Guide USPQ-4B5 (5,pcs/Reel) NR-G SSOT-24 (3,pcs/Reel) MR-G SOT-25 (3,pcs/Reel) (*2) (*1) The -G suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. (*2) SOT-25 uses Cu bonding wires. Selection Guide TYPE RESETB/RESET OUTPUT HYSTERESIS A Active Low VDF 5.%(TYP) B 2mV~28mV(TYP) (*1) C Active High VDF 5.%(TYP) D 2mV~28mV(TYP) (*1) (*1) Refer to SPEC TABLE. PIN CONFIGURATION Type : A/B V SS RESETB 3 NC 5 NC 4 2 NC Type : C/D USPQ-4B5 (BOTTOM VIEW) V SS 3 1 RESETB NC SSOT-24 V SS (TOP VIEW) 4 RESET RESETB SOT-25 (TOP VIEW) NC 5 V SS NC NC RESET USPQ-4B5 (BOTTOM VIEW) 1 2 NC V SS SSOT-24 (TOP VIEW) RESET SOT-25 (TOP VIEW) V SS *The dissipation pad for the USPQ-4B5 package should be solder-plated in reference mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to V SS (No. 3) pin. 4/23

5 XC6136 Series PIN ASSIGNMENT PIN NUMBER USPQ-4B5 SSOT-24 SOT-25 PIN NAME FUNCTION RESETB Reset Output (Active Low) (*1) RESET Reset Output (Active High) (*2) 2 1 4, 5 NC No Connection VSS Ground VIN Power Input (*1) Type A,B (Refer to the 4 in Ordering Information table.) (*2) Type C,D (Refer to the 4 in Ordering Information table.) ABSOLUTE MAXIMUM RATINGS Output Voltage Output Current Power Dissipation Ta=25 PARAMETER SYMBOL RATINGS UNITS Input Voltage VIN -.3~+7. V XC6136C (*2) VSS-.3~VIN+.3 or +7. (*1) V VRESETB VRESET XC6136N (*3) VSS-.3~+7. V XC6136C (*2) ±5 IRBOUT IROUT XC6136N (*3) 5 USPQ-4B (4mm x 4mm Standard board) (*4) SSOT-24 Pd 15 5 (4mm x 4mm Standard board) (*4) SOT (4mm x 4mm Standard board) (*4) Operating Ambient Temperature Topr -4~+15 Storage Temperature Tstg -55~+125 * All voltages are described based on the V SS. (*1) The maximum value should be either +.3 or +7. in the lowest. (*2) CMOS output (*3) Nch open drain output (*4) The power dissipation figure shown is PCB mounted and is for reference only. Please see the power dissipation page for the mounting condition. ma mw 5/23

6 XC6136 Series ELECTRICAL CHARACTERISTICS PARAMETER SYMBOL CONDITIONS Ta=25-4 Ta 15 (*4) MIN. TYP. MAX. MIN. TYP. MAX. UNITS CIRCUIT Operating Voltage V Detect Voltage Temperature Characteristics V DF V DF / ( Topr V DF ) (*1) V DF(T) =1.2V~3.V (*1) V DF(T) =3.1V~5.V V DF(T).992 V DF(T).99 V DF(T) V DF(T) V DF(T) V DF(T) V DF(T) V DF(T) V DF(T) V DF(T) V DF(T) 1.25 V DF(T) Topr 15 - ±5 - - ±5 - ppm/ V V 1 Hysteresis Width (TYPE: A/C) Hysteresis Width (TYPE: B/D) Supply Current1 (TYPE:A/B) CMOS output Supply Current1 (TYPE:C/D) CMOS output Supply Current1 (TYPE:A/B/C/D) Nch open drain output Supply Current2 (TYPE:A/B) CMOS output Supply Current2 (TYPE:C/D) CMOS output Supply Current2 (TYPE:A/B/C/D) Nch open drain output V HYS V DF V DF V DF V DF V DF V DF E-1 (*2) - E-2 (*2) V I ss1 =V DF.9 - E-3 ( *2) - I ss2 =V DF E-7 ( *2) - E-4 ( *2) E-5 ( *2) E-6 ( *2) E-8 ( *2) E-9 ( *2) E-1 ( *2) V na 2 Undefined Operation (*3) (TYPE:A/B) Undefined Operation (*3) (TYPE:C/D) V UNO <1.1V V UNO <1.1V V 3 UVLO Release Voltage V UVLOR =V 1.1V UVLO Detect Voltage V UVLOD =1.1V V UVLO Release Delay Time (*1) V DF(T) : Nominal detect voltage (*2) Refer to SPEC TABLE(P.8,9). t UVLOR = V 1.1V µs - (*3) XC6136C(CMOS output)only. (*4) The ambient temperature range (-4 Ta 15 ) is a design value. 6/23

7 ELECTRICAL CHARACTERISTICS Ta=25-4 Ta 15 (*16) PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. MIN. TYP. MAX. UNITS XC6136 Series CIRCUIT Release Delay Time (*5) t DR =V DF.9 V DF Detect Delay Time (*6) t DF =V DF 1.1 V DF RESETB Output Current RESET Output Current RESETB Output Leakage Current RESET Output Leakage Current I RBOUTN I RBOUTP (*1) I ROUTN I ROUTP (*1) I LEAKN (*15) I LEAKP I LEAKN (*15) I LEAKP Nch. V RESETB =.3V =1.1V =2.V (*7) =3.V (*8) =4.V (*9) Pch. V RESETB = -.3V =3.V (*11) =6.V Nch. V RESET =.3V =2.V (*12) =3.V (*11) =4.V (*13) =5.V (*14) =6.V Pch. V RESET = -.3V =1.1V =3.V (*8) =6.V, Nch. V RESETB =6.V =1.1V, Pch. V RESETB =V =1.1V, Nch. V RESET =6.V =6.V, Pch. V RESET =V (*5) RESETB product: Time from when the pin voltage reaches the release voltage until the reset output pin reaches 9%. RESET product: Time from when the pin voltage reaches the release voltage until the reset output pin reaches 1% Release voltage (V DR ) =Detect voltage (V DF ) + Hysteresis width (V HYS ). (*6) RESETB product: Time from when the pin voltage reaches the detect voltage until the reset output pin reaches 1%. RESET product: Time from when the pin voltage reaches the detect voltage until the reset output pin reaches 9%. (*7) For V DF(T) 2.1V only (*8) For V DF(T) 3.1V only. (*9) For V DF(T) 4.1V only. (*1) For XC6136C (CMOS output) only. (*11) For V DF(T) 2.9V only. (*12) For V DF(T) 1.9V only. (*13) For V DF(T) 3.8V only. (*14) For V DF(T) 4.8V only. (*15) Max. value is for XC6136N (Nch open drain). (*16) The ambient temperature range (-4 Ta 15 ) is a design Value. µs 4 ma ma µa 5 7/23

8 XC6136 Series ELECTRICAL CHARACTERISTICS (SPEC TABLE) Table of Characteristics by Voltage Setting NOMINAL E-1 E-2 E-3 E-4 E-5 E-6 DETECT Ta=25-4 Ta 15 Ta=25-4 Ta 15 VOLTAGE(V) Hysteresis Width (mv) Supply Current1 (na) V DF(T) TYP. MAX. TYP. MAX. TYP. MAX. TYP. MAX. TYP. MAX. TYP. MAX /23

9 XC6136 Series ELECTRICAL CHARACTERISTICS (SPEC TABLE) Table of Characteristics by Voltage Setting NOMINAL E-7 E-8 E-9 E-1 DETECT Ta=25-4 Ta 15 VOLTAGE(V) Supply Current2 (na) V DF(T) TYP. MAX. TYP. MAX. TYP. MAX. TYP. MAX /23

10 XC6136 Series TEST CIRCUITS CIRCUIT1 V RESETB/ RESET 1kΩ (Unused for the CMOS output products) VSS V CIRCUIT2 A RESETB/ RESET VSS CIRCUIT3 V RESETB/ RESET VSS V CIRCUIT4 RESETB/ RESET 1kΩ (Unused for the CMOS output products) Waveform measure point VSS CIRCUIT5 RESETB/ RESET A VSS * RESETB is A/B type, and RESET is C/D type. 1/23

11 XC6136 Series OPERATIONAL DESCRIPTION Fig. 1: Typical block diagram (CMOS output/active Low product) Fig. 2: Timing chart of Fig. 1 The circuit operation in the above representative circuit example will be explained using the timing chart. (1) Assume that the input voltage (VIN) in the initial state is higher than the release voltage (VDR), and VIN gradually decreases. In a state where a voltage higher than the detection voltage (VDF) is applied to the input voltage (VIN), the input voltage (VIN) is output to the RESETB pin (released state). * In the case of N-ch open drain output products, the RESETB pin goes into a high impedance state. When the output is pulled up, the pull-up voltage is output to the RESETB pin. (2) When the input voltage (VIN) drops below the detection voltage (VDF), the ground potential (VSS) is output to the RESETB pin (detection state). * N-ch open drain output products are also the same. (3) If the input voltage (VIN) further decreases and becomes lower than the minimum operating voltage (1.1V), the output becomes undefined. However, the XC6136C series (CMOS output product) has an under-voltage lockout (UVLO) circuit to prevent undefined operation due to a decrease in VIN. Therefore, the floating of the RESETB terminal caused by less than the minimum operating voltage is minimized. * Pull-up voltage may be output to the RESETB terminal when the output terminal is pulled up with an N-ch open drain output product. (4) The RESETB pin holds the ground potential (VSS) until the input voltage (VIN) rises above the minimum operating voltage (1.1V) and reaches the release voltage (VDR). (5) When the input voltage (VIN) becomes equal to or higher than the release voltage (VDR), the input voltage (VIN) is output to the RESETB pin. * In the case of N-ch open drain output products, the RESETB pin goes into a high-impedance state in the same way as in 1), and if the output is pulled up, the pull-up voltage is output to the RESETB pin. (6) The difference between the release voltage (VDR) and the detect voltage (VDF) is the hysteresis width (VHYS). Note: In the above explanation, the operation time of the circuit is omitted for simplicity of explanation. In addition, above explanation is the operation using Active Low product. For Active High products, please reverse the output logic of RESETB pin voltage. 11/23

12 XC6136 Series NOTES ON USE (1) Please use this IC within the stated maximum ratings. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded. (2) The power input pin voltage may fall due to the flow through current during IC operation and the resistance component between the power supply and the power input pin. In the case of CMOS output, a drop in the power input pin voltage may occur in the same way due to the output current. When this happens, if the power input pin voltage drops below the minimum operating voltage, a malfunction may occur. (3) Note that large, sharp changes of the power input pin voltage may lead to malfunction. (4) Since the power supply noise may cause malfunction, please fully evaluate with an actual system. As necessary, please take measures such as inserting a capacitor between VIN and VSS. (5) When an N-ch open drain output is used, the VRESETB voltage at detection and release is determined by the pull-up resistance connected to the output pin. Refer to the following when selecting the resistance value. At detection: VRESETB = Vpull / (1 + Rpull / RON) Vpull :Voltage after pull-up RON (*1) :ON resistance of N-ch driver M1 (calculated from VRESETB/IRBOUTN based on electrical characteristics) Example: When VIN=2.V (*2), RON =.3V / ( A) 73.2Ω (MAX.) If it is desired to make VRESETB at detection.1v or less when Vpull is 3.V, Rpull = { ( Vpull / VRESETB ) 1 } RON = { ( 3V /.1V ) 1 } 73.2Ω 2.1kΩ Therefore, to make the output voltage at detection.1v or less under the above conditions, the pull-up resistance must be 2.1kΩ or higher. (*1) Note that RON becomes larger as VIN becomes smaller. (*2) For VIN in the calculation, use the lowest value of the input voltage range you will use. At release: VRESETB = Vpull / ( 1 + Rpull / Roff ) Vpull :Voltage after pull-up Roff :Resistance when N-ch driver M1 is OFF (calculated from VRESETB/ILEAKN based on electrical characteristics) Example: When Vpull is 6.V, Roff = 6V / ( A) = 6MΩ (MIN.). If it is desired to make VRESETB 5.99V or higher, Rpull = { ( Vpull / VRESETB ) 1 } Roff = { ( 6V / 5.99V ) 1 } Ω 1kΩ Therefore, to make the output voltage at release 5.99V or higher under the above conditions, the pull-up resistance must be 1kΩ or less. The above VRESETB voltage is an example calculation of Active Low products. To calculate the VRESET voltage (Active High product), calculate by inverting the logic at detection and release. (6) Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems. 12/23

13 TYPICAL PERFORMANCE CHARACTERISTICS (1)Detect, Release Voltage vs. Ambient Temperature Detect, Release Voltage : VDF,VDR (V) XC6136 (V DF =1.2V,TYPE:A) V DR V DF Ambient Temperature : Ta ( ) (2)Output Voltage vs. Input Voltage Output Voltage : VRESETB (V) XC6136 (V DF =1.2V,TYPE:A) Input Voltage : (V) XC6136 Series (3)Hysteresis Width vs. Ambient Temperature Hysteresis Width : VHYS (mv) XC6136 (V DF =1.2V,TYPE:A) Ambient Temperature : Ta ( ) Hysteresis Width : VHYS (mv) XC6136 (V DF =5.V,TYPE:A) Ambient Temperature : Ta ( ) (4)Supply Current vs. Ambient Temperature Supply Current : IIN (na) XC6136 (V DF =1.2V,CMOS output, TYPE:A) =V DF.9 =V DF Ambient Temperature : Ta ( ) Supply Current : IIN (na) XC6136 (V DF =5.V,CMOS output, TYPE:A) =V DF 1.1 =V DF Ambient Temperature : Ta ( ) (5)Supply Current vs. Input Voltage Supply Current : IIN (na) XC6136 (V DF =1.2V,CMOS output, TYPE:A) Ta=15 Ta=25 Ta= Input Voltage : (V) Supply Current : IIN (na) XC6136 (V DF =5.V,CMOS output, TYPE:A) Ta=15 Ta= Input Voltage : (V) Ta=25 13/23

14 XC6136 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (6)Undefined Operation vs. Input Voltage Output Voltage : VRESETB (V) XC6136 (CMOS output, TYPE:A) Input Voltage : (V) Output Voltage : VRESET (V) XC6136 (CMOS output, TYPE:C) Input Voltage : (V) (7)Release, Detect Delay Time vs. Ambient Temperature Release, Detect Delay Time : tdr, tdf (μs) XC6136 t DR t DF =V DF.9 V DF Ambient Temperature : Ta ( ) (8)RESETB Output Current vs. Ambient Temperature RESETB Output Current : IRBOUTN (ma) XC6136 (V DF =5.V,TYPE:A) Nch. V RESETB =.3V =3.V =4.V 5 =2.V VIN =1.1V Ambient Temperature : Ta ( ) RESETB Output Current : IRBOUTP (ma) XC6136 (V DF =1.2V,TYPE:A) Pch. V RESETB =.3V =3.V 5 =6.V Ambient Temperature : Ta ( ) (9)RESETB Output Leakage Current vs. Ambient Temperature RESETB Output Leakage Current : ILEAKN (na) XC6136 (Nch open drain output, TYPE:A) =6.V V RESETB =6.V Ambient Temperature : Ta ( ) 14/23

15 XC6136 Series PACKAGING INFORMATION USPQ-4B5 (unit:mm) 1.±.5.32±.5.25±.5.7±.5.33MAX 1.±.5 1pin INDENT.25± (.65).5 USPQ-4B5 Reference Pattern Layout (unit:mm) USPQ-4B5 Reference Metal Mask Design /23

16 XC6136 Series PACKAGING INFORMATION SSOT-24 (unit:mm) ± ±.3 1.3± ± MAX SSOT-24 Reference Pattern Layout (unit:mm) /23

17 XC6136 Series PACKAGING INFORMATION SOT-25 (unit:mm) ± ~ ± (.95) 1.9± ±.1 1.3MAX.2MIN SOT-25 Reference Pattern Layout (unit:mm) /23

18 18/23 XC6136 Series

19 XC6136 Series SSOT-24 Power Dissipation (4mm x 4mm Standard board) Power dissipation data for the SSOT-24 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 4 x 4 mm (16 mm2 in one side) Copper (Cu) traces occupy 5% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6mm Through-hole: 4 x.8 Diameter 2.Power Dissipation vs. Ambient Temperature Evaluation Board (Unit:mm) Board Mount (Tj max = 125 ) Ambient Temperature( ) Power Dissipation Pd(mW) Thermal Resistance ( /W) Power Dissipation Pd (mw) Pd vs Ta Ambient Temperature Ta ( ) 19/23

20 XC6136 Series SOT-25 Power Dissipation 15 (4mm x 4mm Standard board) Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 4 x 4 mm (16 mm2 in one side) Copper (Cu) traces occupy 5% of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT-26 is used.) Material: Glass Epoxy (FR-4) Thickness: 1.6mm Through-hole: 4 x.8 Diameter 2.Power Dissipation vs. Ambient Temperature Evaluation Board (Unit:mm) Board Mount (Tj max = 125 ) Ambient Temperature( ) Power Dissipation Pd(mW) Thermal Resistance ( /W) Pd vs Ta Power Dissipation Pd(mW) Ambient Temperature( ) 2/23

21 XC6136 Series MARKING RULE USPQ-4B5 (with underline mark) SSOT-24 (with underline mark) represents products series MARK X PRODUCT SERIES XC6136******-G 2 represents internal sequential number ~9 A~Z repeated. (G, I, J, O, Q, W excluded) 3,4 represents production lot number 1~9, A~Z, 11~9Z, A1~A9, AA~A9, AA~Z9 repeated. (G,I,J,O,Q,W excluded) * No character inversion used. 21/23

22 XC6136 Series MARKING RULE SOT-25 (under dot) Expansion 1 represents products series MARK X PRODUCT SERIES XC6136******-G 23 represents internal sequential number 1~9 1~99 A~A9 B~B9 Z~Z9 AA~AZ BA~BZ ZA~ZZ repeated. (G, I, J, O, Q, W excluded) 45 represents production lot number 1~9 A~Z 11 9Z A1~A9 AA Z9 ZA~ZZ repeated (G,I,J,O,Q,W excluded) * No character inversion used.. 22/23

23 XC6136 Series 1. The product and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. The information in this datasheet is intended to illustrate the operation and characteristics of our products. We neither make warranties or representations with respect to the accuracy or completeness of the information contained in this datasheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet. 3. Applicable export control laws and regulations should be complied and the procedures required by such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported. 4. The product is neither intended nor warranted for use in equipment of systems which require extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious property damage including but not limited to devices or equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other transportation industry and 5) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance. 5. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention features. 6. Our products are not designed to be Radiation-resistant. 7. Please use the product listed in this datasheet within the specified ranges. 8. We assume no responsibility for damage or loss due to abnormal use. 9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex Semiconductor Ltd in writing in advance. TOREX SEMICONDUCTOR LTD. 23/23