XC2163 Series GENERAL DESCRIPTION APPLICATIONS FEATURES PIN ASSIGNMENT PIN CONFIGURATION /INH, Q0 PIN FUNCTION
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1 ETR1403_001a ICs for use with 3rd Overtone Crystal Oscillators GENERAL DESCRIPTION The XC2163 series are high frequency, low current consumption CMOS ICs with built-in crystal oscillator and divider circuits. Output is selectable from any one of the following values for f0: f0/1, f0/2, f0/4, f0/8. With oscillation capacitors and a feedback resistors built-in, it is possible to configure a stable 3rd overtone oscillator using only an external crystal oscillator. Also available is an external oscillation capacitor/external oscillation feedback resistor type, which makes oscillation frequency control possible. APPLICATIONS FEATURES Oscillation Frequency : 40MHz ~ 125MHz Crystal Oscillation Modules (Rf, Cg, Cd internal; 5.0V) Computer, DSP Clocks (3rd Overtone) : 57MHz ~ 125MHz (Rf, Cg, Cd internal; 3.3V) Communication Equipment : 20MHz ~ 125MHz Various System Clocks (Rf, Cg, Cd external) Divider Ratio : Selectable from f0/1, f0/2, Output f0/4, f0/8. : 3-State Operating Voltage Range : 3.3V 10%, 5.0V 10% Low Current Consumption : Stand-by function included * CMOS Built-in Oscillation Capacitor Built-in Oscillation Feedback Resistor Package : SOT-26 Environmentally Friendly : EU RoHS Compliant, Pb Free * Oscillation continues in stand-by mode PIN CONFIGURATION PIN ASSIGNMENT PIN NUMBER PIN NAME FUNCTION 1 /INH Stand-by Control* 2 XT Crystal Oscillator Connection (Input) 3 VSS GND 4 Q0 Clock Output 5 VDD Power Supply 6 /XT Crystal Oscillator Connection (Output) * Stand-by control pin has a pull-up resistor built-in. /INH, Q0 PIN FUNCTION /INH "H" or OPEN "L"(Stand-by) Q0 Divider Output High Impedance "H" = High Level "L" = Low Level 1/9
2 PRODUCT CLASSIFICATION Ordering Information XC2163 *1 DESIGNATOR DESCRIPTION SYMBOL DESCRIPTION C : f0/1 D : f0/2 Divider Ratio E : f0/4 F : f0/8 Output Capacity 5 : 10TTL (*1) (*2) Duty Level 1 : CMOS (VDD/2) *TTL : 20MHz to 37MHz Frequency Range & Z : External type (refer to table 1) Rf, Cg, Cd Values AL : Built-in type (refer to table 2) Packages Taping Type (*2) MR-G : SOT-26 The -G suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. The device orientation is fixed in its embossed tape pocket. For reverse orientation, please contact your local Torex sales office or representative. (Standard orientation: R-, Reverse orientation: L-) Table 1: Frequency for External Type SYMBOL Z 5.0V TYPE 3.3V TYPE FREQUENCY RANGE Rf Cg/Cd FREQUENCY RANGE Rf Cg/Cd 108MHz125MHz 1.6k 10pF 108MHz125MHz 3.9k 4pF 93MHz110MHz 2.4k 10pF 95MHz110MHz 2.4k 7pF 80MHz95MHz 2.4k 12pF 80MHz97MHz 2.7k 8pF 68MHz83MHz 2.4k 15pF 68MHz83MHz 2.7k 10pF 55MHz70MHz 3.3k 15pF 58MHz70MHz 3.9k 10pF 45MHz57MHz 3.3k 20pF 50MHz60MHz 3.9k 12pF 35MHz47MHz 3.6k 24pF 40MHz52MHz 2.4k 20pF 28MHz37MHz 4.7k 27pF 33MHz42MHz 3.6k 20pF 24MHz30MHz 5.6k 30pF 28MHz35MHz 3.6k 24pF 20MHz26MHz 6.8k 33pF 24MHz30MHz 3.9k 27pF MHz26MHz 3.9k 33pF Note: We recommend that a damping resistor Rd be added between the /XT pin & the crystal oscillator pin in order to safeguard the crystal oscillator and improve oscillation stability. Table 2: Frequency for Built-In Type SYMBOL 5.0V TYPE 3.3V TYPE FREQUENCY RANGE Rf Cg/Cd FREQUENCY RANGE Rf Cg/Cd A MHz125MHz 1.5k 5.5pF B MHz110MHz 1.7k 6.5pF C 108MHz125MHz 2.2k 5.5pF 80MHz95MHz 2.2k 5.5pF D 95MHz110MHz 2.4k 6.5pF 72MHz83MHz 2.4k 6.5pF E 80MHz97MHz 3.2k 6.5pF 65MHz75MHz 3.2k 6.5pF F 68MHz83MHz 3.7k 6.5pF 57MHz67MHz 3.7k 6.5pF H 55MHz70MHz 4.9k 7.6pF K 45MHz57MHz 5.5k 11.0pF L 40MHz48MHz 6.5k 11.0pF /9
3 XC2163 Series BLOCK DIAGRAMS ABSOLUTE MAXIMUM RATINGS Supply Voltage VDD VSS-0.3VSS+7.0 V Input Voltage VIN VSS-0.3VDD+0.3 V Power Dissipation Pd 250 * mw Operating Temperature Range Topr Storage Temperature Range Tstg * When implemented on a glass epoxy PCB. 3/9
4 ELECTRICAL CHARACTERISTICS XC2163C51AMR FOSC=108MHz~125MHz (Unless otherwise stated, VDD=3.3V, Ta=25) Operating Voltage VDD V 'H' Level Input Voltage VIH /INH pin V 'L' Level Input Voltage VIL /INH pin V 'H' Level Output Voltage VOH Qo pin, VDD =2.97V, IOH = 8mA V 'L' Level Output Voltage VOL Qo pin, VDD = 2.97V, IOL = 8mA V Supply Current 1 IDD1 /INH = OPEN, CL = 15pF, f = 125MHz ma Supply Current 2 IDD2 /INH = 'L', f = 125MHz ma Input Pull-Up Resistance 1 Rup1 /INH = 'L' M Input Pull-Up Resistance 2 Rup2 /INH = 0.7VDD k Internal Oscillation Capacity Cg R&D Value pf Cd R&D Value pf Internal Oscillation Feedback Resistance Rf k Output Off Leak Current IOZ Qo pin, /INH = 'L' A Note) R&G value XC2163C51BMR FOSC=93MHz~110MHz (Unless otherwise stated, VDD=3.3V, No load, Ta=25) Operating Voltage VDD V 'H' Level Input Voltage VIH /INH pin V 'L' Level Input Voltage VIL /INH pin V 'H' Level Output Voltage VOH Qo pin, VDD = 2.97V, IOH = 8mA V 'L' Level Output Voltage VOL Qo pin, VDD = 2.97V, IOL = 8mA V Supply Current 1 IDD1 /INH = OPEN, CL = 15pF, f = 110MHz ma Supply Current 2 IDD2 /INH = 'L', f = 110MHz ma Input Pull-Up Resistance 1 Rup1 /INH = 'L' M Input Pull-Up Resistance 2 Rup2 /INH = 0.7VDD k Internal Oscillation Capacity Cg R&D Value pf Cd R&D Value pf Internal Oscillation Feedback Resistance Rf k Output Off Leak Current IOZ Qo pin, /INH = 'L' A SWITCHING CHARACTERISTICS XC2163C51AMR/XC2163C51BMR CMOS DUTY:VDD=3.3V, Ta=25 Output Rise Time tr CL=15pF, 0.1VDD0.9VDD ns Output Fall Time tf CL=15pF, 0.9VDD0.1VDD ns Output Duty Cycle DUTY C51A 0.5VDD, CL=15pF, f=125mhz C51B 0.5VDD, CL=15pF, f=110mhz % Output Disable tplz CL=15pF ns 4/9
5 XC2163 Series ELECTRICAL CHARACTERISTICS (Continued) XC2163C51ZMR FOSC = 108MHz to 125MHz; Rf = 1.6k, Cg = Cd = 10pF external (Unless otherwise stated, VDD=5.0V, Ta=25) Operating Voltage VDD V 'H' Level Input Voltage VIH /INH pin V 'L' Level Input Voltage VIL /INH pin V 'H' Level Output Voltage VOH Qo pin, VDD = 4.5V, IOH = -16mA V 'L' Level Output Voltage VOL Qo pin, VDD = 4.5V, IOL = 16mA V Supply Current 1 IDD1 /INH = OPEN, CL = 15pF, f = 120MHz ma Supply Current 2 IDD2 /INH = 'L', f = 120MHz ma Input Pull-Up Resistance 1 Rup1 /INH = 'L' M Input Pull-Up Resistance 2 Rup2 /INH = 0.7VDD k Output Off Leak Current IOZ Qo pin, /INH = 'L' A SWITCHING CHARACTERISTICS XC2163C51ZMR CMOS DUTY : VDD=5.0V, Ta=25 Output Rise Time tr CL=15pF, 0.1VDD0.9VDD ns Output Fall Time tf CL=15pF, 0.9VDD0.1VDD ns Output Duty Cycle DUTY 0.5VDD, CL=15pF, f=120mhz % Output Disable tplz CL=15pF ns Output Enable tpzl CL=15pF ns The contents can be changed without advance notice. 5/9
6 ELECTRICAL CHARACTERISTICS (Continued) XC2163C51ZMR FOSC= 108MHz to 125MHz : Rf = 3.9k, Cg = Cd = 4pF external (Unless otherwise stated, VDD=3.3V, Ta=25) Operating Voltage VDD V 'H' Level Input Voltage VIH /INH pin V 'L' Level Input Voltage VIL /INH pin V 'H' Level Output Voltage VOH Qo pin, VDD = 2.97V, IOH = -8mA V 'L' Level Output Voltage VOL Qo pin, VDD = 2.97V, IOL = 8mA V Supply Current 1 IDD1 /INH = OPEN, CL = 15pF, f = 120MHz ma Supply Current 2 IDD2 /INH = 'L', f = 100MHz ma Input Pull-Up Resistance 1 Rup1 /INH = 'L' M Input Pull-Up Resistance 2 Rup2 /INH = 0.7VDD k Output Off Leak Current IOZ Qo pin, /INH = 'L' A SWITCHING CHARACTERISTICS XC2163C51ZMR CMOS DUTY : VDD=3.3V, Ta=25 Output Rise Time tr CL=15pF, 0.1VDD ~ 0.9VDD ns Output Fall Time tf CL=15pF, 0.9VDD ~ 0.1VDD ns Output Duty Cycle DUTY 0.5VDD, CL=15pF, f=120mhz % Output Disable tplz CL=15pF ns Output Enable tpzl CL=15pF ns The contents can be changed without advance notice. 6/9
7 XC2163 Series SWITCHING CHARACTERISTICS MEASUREMENT WAVEFORMS (1) Switching Time (2) Output Waveform Symmetry (3) Output Disable, Output Enable *) /INH Pin Input Waveform tr = tf = less than 10ns 7/9
8 PACKAGING INFORMATION SOT-26 MARKING RULE SOT-26 (TOP VIEW) Represents product series MARK 6 Represents divider ratio MARK RATIO MARK RATIO C fo/1 E fo/4 D fo/2 F fo/8 Represents frequency & Rf, Cg & Cd values MARK Frequency (MHz) 5.0V 3.3V A - 108~125 B - 93~110 C 108~125 80~95 D 95~110 72~83 E 80~97 65~75 F 68~83 57~67 H 55~70 - K 45~57 - L 40~48 - Z External Represents assembly lot number (Based on internal standards) 8/9
9 XC2163 Series 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 9/9
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