XC6210 Series APPLICATIONS. TYPICAL PERFORMANCE CHARACTERISTICS Dropout Voltage vs. Output Current TYPICAL APPLICATION CIRCUIT

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1 ETR317_6 High Current, High Speed LDO Regulators GENERAL DESCRIPTION The XC621 series are precise, low noise, high current, positive voltage low dropout regulators. They are fabricated using Torex s CMOS process. The series features a voltage reference, an error amplifier, a current limiter, and a phase compensation circuit plus a driver transistor. With a low ON resistance driver transistor built into, batteries can be used until input-output voltage differential is minimal and can accordingly be used for a longer time. The series is also compatible with low ESR ceramic capacitors which give added output stability. The output voltage of the LDO is selectable in 5V increments within the range of.8v to V. The current limiter's foldback circuit also operates as the output current limiter and the output pin protection. The IC's internal regulator circuit can be placed in stand-by mode via the CE function. In the stand-by mode, power consumption is greatly reduced. APPLICATIONS Optical disk drive Magnetic disk drive Digital still cameras / Camcorders Digital audio equipments Multi-function power supplies FEATURES Maximum Output Current : More than 7mA (8mA limit, TYP.) (1.6V<V OUT <V) Dropout Voltage : 1mA : 2mA Operating Voltage Range : 1.5V ~ 6.V Range :.8V ~ V (5V increments) Highly Accurate : +2% (1.55VV OUT V) +3mV (.8VV OUT 1.5V) Low Power Consumption : 35A (TYP.) High Ripple Rejection : Operational Ambient Temperature : -4 ~ +85 CMOS Low ESR Capacitor Compatible Packages : SOT-25 SOT-89-5 USP-6B Environmentally Friendly : EU RoHS Compliant, Pb Free TYPICAL APPLICATION CIRCUIT TYPICAL PERFORMANCE CHARACTERISTICS Dropout Voltage vs. Output Current Dropout Voltage : Vdif(V) C IN=μF(ceramic),C L=μF(ceramic) Ta=85 Ta=25 Ta= /27

2 PIN CONFIGURATION SOT-25 (TOP VIEW) SOT-89-5 (TOP VIEW) USP-6B (BOTTOM VIEW) *The dissipation pad for the USP-6B package should be solder-plated in reference mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the VSS pins. PIN ASSIGNMENT PIN NUMBER SOT-25 SOT-89-5 USP-6B PIN NAME FUNCTION CE ON/OFF Control V IN Power Input V SS Ground V OUT Output 4 3 2, 6 NC No Connection LOGIC CONDIFION FOR THE PIN PIN NAME DESIGNATOR CONDITIONS H 1.3VV CE 6.V CE L V CE.25V * V CE CE pin voltage 2/27

3 XC621 Series PIN FUNCTION ASSIGNMENT 1) XC621A Type (CE High ActiveCE pull-down resistor) CE "H" Level "L" Level "OPEN" IC Operation ON/OFF ON OFF 2) XC621B Type (CE High ActiveCE no pull-down resistor) CE "H" Level "L" Level "OPEN" IC Operation ON/OFF ON OFF Undefined state 3) XC621C Type (CE Low ActiveCE pull-up resistor) CE IC Operation ON/OFF "H" Level OFF "L" Level ON "OPEN" OFF 4) XC621D Type (CE Low ActiveCE no pull-up resistor) CE "H" Level "L" Level "OPEN" IC Operation ON/OFF OFF ON Undefined state PRODUCT CLASSIFICATION Ordering Information XC621 *1 DESIGNATOR ITEM SYMBOL DESCRIPTION A High Active with pull-down resistor CE Pin Functions B High Active with no pull-down resistor C Low Active with pull-up resistor D Low Active with no pull-up resistor 8~5 ex.) V =3, = (*1) ( The second place of decimal point) Packages (Oder Unit) 2 A MR MR-G PR PR-G DR DR-G.1V increments ex.) V=3, =, =2 5V increments ex.) 5V=3, =, =A SOT-25 (3,/Reel) SOT-25 (3,/Reel) SOT-89-5 (1,/Reel) SOT-89-5 (1,/Reel) USP-6B (3,/Reel) USP-6B (3,/Reel) The -G suffix indicates that the products are Halogen and Antimony free as well as being fully EU RoHS compliant. 3/27

4 BLOCK DIAGRAM XC621A Series XC621B/D Series XC621C Series *Diodes shown in the above circuit are ESD protection diodes and parasitic diodes ABSOLUTE MAXIMUM RATINGS Ta=25 PARAMETER SYMBOL RATINGS UNITS Input Voltage V IN 6.5 V Output Current * I OUT 9 ma V OUT V SS -.3 ~ V IN +.3 V CE Pin Voltage V CE V SS -.3 ~ 6.5 V SOT * Power Dissipation SOT-89-5 Pd 5 13* mw USP-6B 1 1* Operating Temperature Range Topr - 4 ~ + 85 Storage Temperature Range Tstg - 55 ~ *1: I OUT =Pd / (V IN V OUT ) *2: The power dissipation figure shown is PCB mounted. Please refer to pages 22 to 24 for details. 4/27

5 XC621 Series ELECTRICAL CHARACTERISTICS XC621 series PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. V OUT(E) (*3) Maximum Output Current I OUTMAX V IN =V OUT(T) +V, I OUT =3mA V CE =ON (V IN or V SS ) (V OUT(T) 1.5V) V IN =V OUT(T) +V, I OUT =3mA, V CE =ON(V IN or V SS )(V OUT(T) 1.5V) V IN =V OUT(T) +V,V CE =ON(V IN or V SS ) (V OUT(T) 1.5V) V IN =V OUT(T) +V,V CE =ON(V IN or V SS ) (V OUT(T) 1.5V) x.98 V OUT(T) (*2) (-3mV) V OUT(T) (*2) x 2 (+3mV) Load Regulation V OUT 1mA<I OUT <1mA, V CE =ON(V IN or V SS ) mv Dropout Voltage Vdif1 (*4) I OUT =3mA, V CE =ON(V IN or V SS ) E-1 Vdif2 (*4) I OUT =1mA, V CE =ON(V IN or V SS ) E-2 Supply Current (A type) V IN =V CE =V OUT(T) +V E-3 Supply Current (B type) V IN =V CE =V OUT(T) +V I DD Supply Current (C type) V IN =V OUT(T) +V, V CE =V SS E-3 Supply Current (D type) V IN =V OUT(T) +V, V CE =V SS Stand-by Current I STBY V IN =6.V,V CE =OFF(V IN or V SS ) A Line Regulation V OUT V IN V OUT V OUT(T) +VV IN 6.V V CE =ON(V IN or V SS ), I OUT =3mA V OUT(T) 4.5V 5.5VV IN 6.V V CE =ON(V IN or V SS ), I OUT =3mA V OUT(T) 4.5V UNIT S V ma mv A Ta=25 CIRCUIT % / V Input Voltage V IN V - Temperature Characteristics V OUT ToprV OUT I OUT =3mA, V CE =ON (V IN or V SS ) -4Topr ppm/ Ripple Rejection Rate Current Limiter PSRR I LIM V IN =[V OUT(T) +]V DC +.5V P-PAC V CE =ON(V IN or V SS ), I OUT =3mA, f=1khz V OUT(T) 4.75V V IN =5.75V DC +.5V P-PAC V CE =ON(V IN or V SS ), I OUT =3mA, f=1khz V OUT(T) 4.75V V IN =V OUT(T) +V, V CE =ON(V IN or V SS ) V OUT(T) 1.5V V IN =V OUT(T) +V, V CE =ON(V IN or V SS ) V OUT(T) 1.5V db Short-Circuit Current I SHORT V IN =V OUT(T) +V, V CE =ON(V IN or V SS ) ma CE High Level Voltage V CEH CE Low Level Voltage V CEL CE High Level Current (A type) CE High Level Current (B / C / D type) CE Low Level Current (C type) CE Low Level Current (A / B / D type) I CEH I CEL V CE =V IN =V OUT(T) +V E-4 - E-4 V CE =V IN =V OUT(T) +V V IN =V OUT(T) +V, V CE =V SS E-5 - E-5 V IN =V OUT(T) +V, V CE =V SS NOTE: *1: Unless otherwise stated, V IN =V OUT(T) +V *2: V OUT(T) =Specified output voltage *3: V OUT(E) =Effective output voltage (i.e. the output voltage when " V OUT(T) +V" is provided while maintaining a certain I OUT value). *4: Vdif ={V (*6) IN1 -V (*5) OUT1 } *5: A voltage equal to 98% of the output voltage whenever a stabilized V OUT1 =I OUT {V OUT(T) +V} is input. *6: V IN1 = the input voltage when V OUT1, which appears as input voltage is gradually decreased. *7: V CE conditions: XC621A / B type: ON=V IN, OFF=V SS ma V A A XC621C / D type: ON=V SS, OFF=V IN 5/27

6 VOLTAGE CHART Dropout Voltage, Supply Current, CE H / L Level Current Chart SETTING OUTPUT VOLTAGE OUTPUT VOLTAGE E-1 E-2 E-3 E-4 E-5 DROPOUT VOLTAGE 1 (I OUT =3mA) DROPOUT VOLTAGE 2 (I OUT =1mA) SUPPLY CURRENT CE H LEVEL CURRENT CE L LEVEL CURRENT (V) (V) (mv) (mv) (μa) (μa) (μa) V OUT(T) V OUT Vdif1 Vdif2 I DD I CEH I CEL MIN. MAX. TYP. MAX. TYP. MAX. TYP. MAX. MIN. MAX. MIN. MAX Ta= /27

7 XC621 Series VOLTAGE CHART (Continued) Dropout Voltage, Supply Current, CE H / L Level Current Chart Ta=25 E-1 E-2 E-3 E-4 E-5 SETTING OUTPUT DROPOUT DROPOUT OUTPUT SUPPLY CE H LEVEL CE L LEVEL VOLTAGE VOLTAGE 1 VOLTAGE 2 VOLTAGE CURRENT CURRENT CURRENT (I OUT =3mA) (I OUT =1mA) (V) (V) (mv) (mv) (μa) (μa) (μa) V OUT(T) V OUT Vdif1 Vdif2 I DD I CEH I CEL MIN. MAX. TYP. MAX. TYP. MAX. TYP. MAX. MIN. MAX. MIN. MAX /27

8 TEST CIRCUITS Circuit, Maximum, Load Regulation, Dropout Voltage, Line Regulation, Temperature Characteristics, Current Limiter, Short-Circuit Current, CE H L Level Voltage, CE H L Level Current) Circuit (Supply Current, Stand-by Current) Circuit (Ripple Rejection Rate) Output Capacitor Corresponding Chart OUTPUT VOLTAGE.8V1.45V 1.5V1.75V 1.8VV CL More than 6.8F More than 4.7F More than F 8/27

9 XC621 Series OPERATIONAL EXPLANATION < Regulator Control> The voltage, divided by resistors R1 & R2, which are connected to the V OUT pin is compared with the internal reference voltage by the error amplifier. The P-channel MOSFET, which is connected to the V OUT pin, is then driven by the subsequent output signal. The output voltage at the V OUT pin is controlled & stabilized by negative feedback. The constant current limit circuit and short circuit protection operate in relation to the level of output current. <Low ESR Capacitor> With the XC621 series regulator, a stable output voltage is achievable even if low ESR capacitors are used, as a phase compensation circuit is built into the regulator. In order to ensure the effectiveness of the phase compensation, we suggest that an output capacitor (C L ) be connected as close as possible, between the output pin (V OUT ) and the V SS pin. Please use an output capacitor (C L ) with a capacitance, based on the chart below. We also suggest an input capacitor (C IN ) of μf: this should be connected between V IN and V SS in order to stabilize input power source. Output Capacitor Corresponding Chart V OUT C L.8V ~ 1.45V More than 6.8F 1.5V ~ 1.75V More than 4.7F 1.8V ~ V More than F <Current Limiter, Short-Circuit Protection> The XC621 series regulator offers a combination of current limit and short circuit protection by means of a built-in fixed current limiter circuit and a foldback circuit. When the load current reaches the current limit level, the fixed current limiter circuit operates and output voltage drops. As a result of this drop in output voltage, the foldback circuit operates, the output voltage drops further and output current decreases. When the output pin is shorted, a current of about 5mA flows. <CE Pin> The IC's internal regulator circuitry can be shut down via the signal from the CE pin with the XC621 series. In shutdown mode, output at the V OUT pin will be pulled down to the V SS level via R1 & R2. Options are available for the CE pin logic (See the product classification). Note that as the XC621B types are 'High Active / No Pull-Down', operations will become unstable with the CE pin open. Although the CE pin is equal to an inverter input with CMOS hysteresis, with either the pull-up or pull-down options, the CE pin input current will increase when the IC is in operation. We suggest that you use this IC with either a V IN voltage or a V SS voltage input at the CE pin. If this IC is used with the correct specifications for the CE pin, the IC will operate normally. However, supply current may increase as a result of through current in the IC's internal circuitry if a voltage other than VIN or V SS is applied. 9/27

10 NOTES ON USE 1. Please use this IC within the stated absolute maximum ratings. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded. 2. Where wiring impedance is high, operations may become unstable due to noise and/or phase lag depending on output current. Please strengthen V IN and V SS wiring in particular. 3. Please wire the input capacitor (C IN ) and the output capacitor (C L ) as close to the IC as possible. If rapid input fluctuation or load fluctuation should occur, please increase the capacitor value such as C IN or C L more than the recommended values to stabilize the operation. 4. Torex places an importance on improving our products and its reliability. However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment. 1/27

11 XC621 Series TYPICAL PERFORMANCE CHARACTERISTICS (1) vs. Output Current.9 V IN =1.8V C IN =μf(ceramic),c L =6.8μF(ceramic).9 Ta=25 C IN =μf(ceramic),c L =6.8μF(ceramic) Ta=-4 Ta=25 Ta= VIN=1.5V VIN=1.8V VIN=3V VIN=6V V IN =V Ta= Ta=-4 Ta=25 Ta= VIN=3.2V VIN=3.5V VIN=4V VIN=5V VIN=6V V IN =6.V 6. Ta=25 Ta=-4 Ta=25 Ta=85 VIN=6V VIN=5.8V VIN=5.6V VIN=5.4V /27

12 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (2) vs. Input Voltage 1.1 Ta=25 C IN =μf(ceramic),c L =6.8μF(ceramic).9 Ta=25 C IN =μf(ceramic),c L =6.8μF(ceramic) IOUT=mA IOUT=3mA IOUT=1mA IOUT=mA IOUT=3mA IOUT=1mA Ta= Ta= IOUT=mA IOUT=3mA IOUT=1mA IOUT=mA IOUT=3mA IOUT=1mA Ta= Ta= IOUT=mA IOUT=3mA IOUT=1mA IOUT=mA IOUT=3mA IOUT=1mA /27

13 XC621 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (3) Dropout Voltage vs. Output Current XC621x122xx Dropout Voltage : Vdif(V) C IN =μf(ceramic),c L =6.8μF(ceramic) Below the minimum operating voltage Ta=85 Ta=25 Ta= Dropout Voltage : Vdif(V) C IN =μf(ceramic),c L =6.8μF(ceramic) Ta=85 Ta=25 Ta=-4 Below the minimum operating voltage XC621x152xx XC621x252xx C IN =μf(ceramic),c L =2.2μF(ceramic) Ta=85 Dropout Voltage : Vdif(V) Ta=85 Ta=25 Ta=-4 Dropout Voltage : Vdif(V) Ta=25 Ta= VR VR Dropout Voltage : Vdif(V) Ta=85 Ta=25 Ta=-4 Dropout Voltage : Vdif(V) Ta=85 Ta=25 Ta= VR VR 13/27

14 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (4) Supply Current vs. Input Voltage 1 C IN =μf(ceramic),c L =6.8μF(ceramic) 1 Ta=85 Ta=85 Supply Current : I DD (μa) Ta=25 Ta=-4 Supply Current : I DD (μa) Ta=25 Ta= (5) vs. Ambient Temperature V IN =1.8V C IN =μf(ceramic),c L =6.8μF(ceramic) IOUT=mA 1 IOUT=3mA Supply Current : I DD (μa) Ta=85 Ta=25 Ta=-4 : V OUT(V) IOUT=1mA Ambient Temperature : Topr() V IN =V IOUT=1mA IOUT=3mA IOUT=1mA V IN =6.V IOUT=1mA IOUT=3mA IOUT=1mA Ambient Temperature : Topr() Ambient Temperature : Topr() 14/27

15 XC621 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (6) Supply Current vs. Ambient Temperature 5 V IN =1.8V C IN =μf(ceramic),c L =6.8μF(ceramic) 5 V IN =V Supply Current : I DD (μa) Supply Current : I DD (μa) Ambient Temperature : Topr() V IN =6.V Ambient Temperature : Topr() Supply Current : I DD (μa) Ambient Temperature : Topr() (7) CE Pin Threshold Voltage vs. Ambient Temperature CE Threshold Voltage : V CEH V CEL (V) XC621xxxxxx V IN =V OUT +V H Level Voltage L Level Voltage Ambient Temperature : Topr() 15/27

16 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) Input Transient Response I OUT =3mA,tr=tf=μs C L =6.8μF(ceramic),Ta=25 Input Voltage I OUT =2mA,tr=tf=μs C L =6.8μF(ceramic),Ta=25 Input Voltage Time (2μs/div) Time (2μs/div) I OUT =3mA,tr=tf=μs C L =μf(ceramic),ta=25 Input Voltage I OUT =2mA,tr=tf=μs C L =μf(ceramic),ta=25 Input Voltage Time (2μs/div) Time (2μs/div) I OUT =3mA,tr=tf=μs C L =uf(ceramic),ta=25 Input Voltage I OUT =2mA,tr=tf=μs C L =uf(ceramic),ta=25 Input Voltage Time (2μs/div) Time (2μs/div) 16/27

17 XC621 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (9) Load Transient Response V IN =1.8V,tr=tf=μs,Ta=25 C IN =μf(ceramic),c L =6.8μF(ceramic) 5 V IN =1.8V,tr=tf=μs,Ta=25 C IN =μf(ceramic),c L =6.8μF(ceramic) mA 1mA Output Current Time (25μs/div) mA 1mA Output Current Time (25μs/div) V IN =V,tr=tf=μs,Ta= V IN =V,tr=tf=μs,Ta= mA 1mA Output Current mA 1mA Output Current Time (25μs/div) Time (25μs/div) 5.4 V IN =6.V,tr=tf=μs,Ta= V IN =6.V,tr=tf=μs,Ta= mA Output Current mA Output Current mA 1mA Time (25μs/div) Time (25μs/div) 17/27

18 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (1) Ripple Rejection Rate 8 V IN =1.8V DC +.5V P-PAC,I OUT =3mA,Ta=25 C IN =μf(ceramic),c L =6.8μF(ceramic) 8 V IN =V DC +.5V P-PAC,I OUT =3mA,Ta=25 Ripple Rejection Rate : PSRR(dB) Ripple Rejection Rate : PSRR(dB) Ripple Frequency : f (khz) Ripple Frequency : f (khz) 8 V IN =5.75V DC +.5V P-PAC,I OUT =3mA,Ta=25 Ripple Rejection Rate : PSRR(dB) Ripple Frequency : f (khz) 18/27

19 XC621 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (11) Input Transient Response 2 V IN =1.8V,I OUT =3mA,tr=μs C IN =μf(ceramic),c L =6.8μF(ceramic),Ta=25 CE Input Voltage V IN =1.8V,I OUT =3mA,tr=μs C IN =μf(ceramic),c L =6.8μF(ceramic),Ta=25 CE Input Voltage - - CE Input Voltage : V CE (V) - - CE Input Voltage : V CE (V) Time (25μs/div) Time (25μs/div) V IN =V,I OUT =3mA,tr=μs,Ta=25 CE Input Voltage 6. - CE Input Voltage : V CE (V) V IN =V,I OUT =3mA,tr=μs,Ta=25 CE Input Voltage 6. - CE Input Voltage : V CE (V) - - Time (25μs/div) Time (25μs/div) 1 V IN =6.V,I OUT =3mA,tr=μs,Ta=25 CE Input Voltage 8. 1 V IN =6.V,I OUT =3mA,tr=μs,Ta=25 CE Input Voltage CE Input Voltage : V CE (V) CE Input Voltage : V CE (V) - - Time (25μs/div) Time (25μs/div) 19/27

20 PACKAGING INFORMATION SOT-25 SOT-89-5 (unit : mm) (unit : mm) USP-6B (unit : mm) 2/27

21 XC621 Series PACKAGING INFORMATION (Continued) USP-6B Reference Pattern Layout USP-6B Reference Metal Mask Design (unit : mm) (unit : mm) 21/27

22 PACKAGING INFORMATION (Continued) SOT-25 Power Dissipation Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 4 x 4 mm (16 mm 2 in one side) Copper (Cu) traces occupy 5% of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT-26 is used.) Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient temperature Board Mount (Tj max = 125) Ambient Temperature Power Dissipation PdmW Thermal Resistance (/W) Power Dissipation Pd (mw) Pd vs. Ta Ambient Temperature Ta () 22/27

23 XC621 Series PACKAGING INFORMATION (Continued) SOT-89-5 Power Dissipation Power dissipation data for the SOT-89-5 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 4 x 4 mm (16 mm 2 in one side) Copper (Cu) traces occupy 5% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 5 x.8 Diameter 2. Power Dissipation vs. Ambient temperature Evaluation Board (Unit: mm) Board Mount (Tj max = 125) Ambient Temperature Power Dissipation PdmW Thermal Resistance (/W) Power Dissipation Pd (mw) Pd vs. Ta Ambient Temperature Ta () 23/27

24 PACKAGING INFORMATION (Continued) USP-6B Power Dissipation Power dissipation data for the USP-6B is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 4 x 4 mm (16 mm 2 in one side) Copper (Cu) traces occupy 5% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x.8 Diameter 2. Power Dissipation vs. Ambient temperature Evaluation Board (Unit: mm) Board Mount (Tj max = 125) Ambient Temperature Power Dissipation PdmW Thermal Resistance (/W) Power Dissipation Pd (mw) Pd vs. Ta Ambient Temperature Ta () 24/27

25 XC621 Series MARKING RULE SOT-25 represents product series MARK PRODUCT SERIES XC621xxxxxx represents CE function SOT-89-5 MARK OUTPUT OUTPUT OUTPUT OUTPUT VOLTAGE= VOLTAGE= VOLTAGE= VOLTAGE= PRODUCT SERIES.8~V 3.1~V.85~5V 3.15~4.95V V A E L XC621Axxxxx X B F M XC621Bxxxxx Y C H N XC621Cxxxxx Z D K P XC621Dxxxxx represents output voltage SOT-89-5 (TOP VIEW) MARK OUTPUT VOLTAGE (V) MARK OUTPUT VOLTAGE (V) F H K L M N P R S T A U B V C X D Y E Z represents production lot number to 9, A to Z reverse character to 9, A to Z repeated (G, I, J, O, Q, W excluded) 25/27

26 MARKING RULE (Continued) USP-6B represents product series MARK PRODUCT SERIES 1 XC621xxxxxx represents CE Function USP-6B (TOP VIEW) MARK TYPE PRODUCT SERIES A CE High Active with pull-down resistor XC621AxxxDx B CE High Active with no pull-down resistor XC621BxxxDx C CE Low Active with pull-up resistor XC621CxxxDx D CE Low Active with no pull-up resistor XC621DxxxDx represents the integer number of output voltage ex.) MARK VOLTAGE (V) PRODUCT SERIES 3 3.x XC621x3xxDx 5 5.x XC621x5xxDx represents the decimal point of output voltage MARK VOLTAGE PRODUCT VOLTAGE PRODUCT MARK (V) SERIES (V) SERIES x. XC621xx2Dx A x.5 XC621xxADx 1 x.1 XC621xx12Dx B x.15 XC621xx1ADx 2 x.2 XC621xx22Dx C x.25 XC621xx2ADx 3 x.3 XC621xx32Dx D x.35 XC621xx3ADx 4 x.4 XC621xx42Dx E x.45 XC621xx4ADx 5 x.5 XC621xx52Dx F x.55 XC621xx5ADx 6 x.6 XC621xx62Dx H x.65 XC621xx6ADx 7 x.7 XC621xx72Dx K x.75 XC621xx7ADx 8 x.8 XC621xx82Dx L x.85 XC621xx8ADx 9 x.9 XC621xx92Dx M x.95 XC621xx9ADx represents production lot number to 9, A to Z repeated (G, I, J, O, Q, W, excluded) Note: No character inversion used. 26/27

27 XC621 Series 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 27/27