28V Low Power Consumption 150mA Voltage Regulators (with Stand-by Function)

Transcription

1 XC/XE Series ETR_ V Low Power Consumption ma Voltage Regulators (with Stand-by Function) GENERAL DESCRIPTION XC/XE series are positive voltage regulator ICs with V of operation voltage. The series consists of a voltage reference, an error amplifier, a current limiter, a thermal shutdown circuit and a phase compensation circuit plus a driver transistor. The output voltage is selectable in.v increments within the range of.v to V using laser trimming technologies. With external resistors, the output voltage range can be expanded from.v to V. The output stabilization capacitor (CL) is also compatible with low ESR ceramic capacitors. The over current protection circuit and the thermal shutdown circuit are built-in. These two protection circuits will operate when the output current reaches current limit level or the junction temperature reaches temperature limit level. The CE function enables the output to be turned off and the IC becomes a stand-by mode resulting in greatly reduced power consumption. APPLICATIONS Car audio, Car navigation systems Note PCs / Tablet PCs Mobile devices / terminals Digital still cameras / Camcorders Smart phones / Mobile phones Multi-function power supplies TYPICAL APPLICATION CIRCUIT FEATURES Max Output Current Dropout Voltage Input Voltage Range Range : More than ma (ma limit) (VIN=VOUT+.V) : mv@iout=ma :.V~.V :.V~.V (.V increments).v~v with external resistors Fixed Output Accuracy :±% ±% (Vout.V) ±mv (Vout.9V) Low Power Consumption : μa Stand-by Current : Less than.μa High Ripple Rejection : db@khz Operating Temperature : - ~+ Low ESR Capacitor : Ceramic Capacitor Compatible Built in Protection : Current Limit Circuit Thermal Shutdown Circuit Operating Ambient Temperature : - ~+ Packages Environmentally Friendly : SOT-, SOT-9, SOT-9-, USP-C, SOT-, TO- USP-B, SOT- : EU RoHS Compliant, Pb Free TYPICAL PERFORMANCE CHARACTERISTICS vs. Input Volatage Fixed XCB/XEB Series VIN VOUT R CIN CE VOFB CL uf VSS R uf kω 設定電圧外部設定品 External Setting XCC/XECシリーズ XCC Series /9

2 XC/XE Series BLOCK DIAGRAMS XC Series XC Series B Type XC Series C Type XC Series D Type XE Series XE Series B Type *Diodes inside the circuit are an ESD protection diode and parasitic diodes. /9

3 XC/XE Series PRODUCT CLASSIFICATION Ordering Information XC-7 (*) : CE function (Active High) Fixed output voltage.v~.v(.v increments) DESIGNATOR ITEM SYMBOL DESCRIPTION -7 (*) Type and Options of Regulators Accuracy (*) Packages (Order Unit) B Fixed output voltage,.v~.v(.v increments) C Output voltage externally set (VOFB=.V) (*) For the voltage within.v ~9.9V (.V increments); e.g..v,.v ~ C For the voltage within.v~.v (.V increments); e.g..v A,.V B,.V C For C type (output voltage externally set), VOFB=.V only ±% VOUT.V:±%,VOUT.9V:±mV (*) MR SOT- (,pcs/reel) MR-G SOT- (,pcs/reel) PR SOT-9- (,pcs/reel) PR-G SOT-9- (,pcs/reel) ER USP-C (,pcs/reel) ER-G USP-C (,pcs/reel) R-G USP-B (,pcs/reel) (*) The -G suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. (*) For the Type C, the accuracy is based on V OFB voltage. The actual output voltage accuracy is depended on the external resistances. (*) For the Type C and Accuracy±% (±mv) do not haveusp-b package XCD- (*) : pin regulator (No CE function), Fixed output voltage.v~.v(.v increments) DESIGNATOR ITEM SYMBOL DESCRIPTION ~ C - (*) Accuracy Packages (Order Unit) For the voltage within.v~9.9v (.V increments); e.g..v,.v For the voltage within.v~.v (.V increments); e.g..v A,.V B,.V C ±% VOUT.V:±%,VOUT.9V:±mV PR SOT-9 (,pcs/reel) PR-G SOT-9 (,pcs/reel) FR SOT- (,pcs/reel) FR-G SOT- (,pcs/reel) JR TO- (,pcs/reel) JR-G TO- (,pcs/reel) MR-G SOT- (,pcs/reel) (*) The -G suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. XEB- (*) : CE function (Active High), Fixed output voltage.v~.v(.v increments) Characteristics are guaranteed over the temperature range of - to. DESIGNATOR ITEM SYMBOL DESCRIPTION ~C - (*) Accuracy Package (Order Unit) ±% PR PR-G For the voltage within.v ~9.9V (.V increments); e.g..v,.v For the voltage within.v~.v (.V increments); e.g..v A,.V B,.V C SOT-9- (,pcs/reel) SOT-9- (,pcs/reel) (*) The -G suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. /9

4 XC/XE Series PIN CONFIGURATION * The dissipation pad for the USP-C and USP-B packages should be solderplated in reference mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the VSS (No. ) pin. VIN VSS NC VOUT NC CE USP-B (BOTTOM VIEW) USP-B (BOTTOM VIEW) PIN ASSIGNMENT TO- (TOP VIEW) XC Series B Type PIN NUMBER SOT- SOT-9- USP-C USP-B PIN NAME FUNCTIONS VIN Power Input VSS Ground,, NC No connection CE ON/OFF Control VOUT Output XC Series C Type PIN NUMBER SOT- SOT-9- USP-C PIN NAME FUNCTIONS VIN Power Input VSS Ground VOFB Adjustment CE ON/OFF Control VOUT Output - - NC No connection XC Series D Type PIN NUMBER SOT-9 SOT- TO- SOT- PIN NAME FUNCTIONS VIN Power Input VSS Ground VOUT Output /9

5 XC/XE Series PIN ASSIGNMENT XE Series B Type PIN NUMBER PIN NAME FUNCTIONS SOT-9- VOUT Output VSS Ground CE ON/OFF Control NC No connection VIN Power Input LOGIC CONDITION FOR THE PIN PIN NAME DESIGNATOR CONDITIONS IC OPERATION CE L V VCE.V OFF H.V VCE.V ON OPEN CE=OPEN Undefined state * Please avoid the state of OPEN, and make CE Pin arbitrary fixed potential. (XC Series B Type, XE Series B Type, XC Series C Type) PIN FUNCTION ASSIGNMENT SERIES XC Series B Type/XE Series B Type XC Series C Type XC Series D Type CHIP ENABLE PIN Available Available Not Available ABSOLUTE MAXIMUM RATINGS XC Series B Type PARAMETER SYMBOL RATINGS UNITS Input Voltage VIN VSS-.~+ V Output Current IOUT (*) ma VOUT VSS-.~VIN+. V CE Input Voltage VCE VSS-.~ V Power Dissipation SOT- SOT-9- USP-C Pd (mm x mm Standard board) (*) (mm x mm Standard board) (*) (mm x mm Standard board) (*) (JEDEC board) *) mw (Ta= ) USP-B 9 (mm x mm Standard board) (*) Operating Ambient Temperature Topr -~+ Storage Temperature Tstg -~+ *: Pd > (V IN -V OUT ) I OUT *: The power dissipation figure shown is PCB mounted and is for reference only. Please see the power dissipation page for the mounting condition. /9

6 XC/XE Series ABSOLUTE MAXIMUM RATINGS (Continued) /9 XC Series C Type PARAMETER SYMBOL RATINGS UNITS Input Voltage VIN VSS-.~+ V Output Current IOUT (*) ma VOUT VSS-.~VIN+. V CE Input Voltage VCE VSS-. ~ + V FB Voltage VOFB VSS-. ~ + V SOT- (mm x mm Standard board) (*) Power Dissipation SOT-9- USP-C Pd (mm x mm Standard board) (*) (mm x mm Standard board) (*) mw (Ta= ) (JEDEC board) *) SOP-FD (mm x mm Standard board) (*) Operating Ambient Temperature Topr -~+ Storage Temperature Tstg -~+ *: Pd > (V IN -V OUT ) I OUT *: The power dissipation figure shown is PCB mounted and is for reference only. Please see the power dissipation page for the mounting condition. XCD Series PARAMETER SYMBOL RATINGS UNITS Input Voltage VIN VSS-.~+ V Output Current IOUT (*) ma VOUT VSS-.~VIN+. V SOT-9 (mm x mm Standard board) (*) Power Dissipation SOT- (mm x mm Standard board) (*) mw Pd (Ta= ) TO- (mm x mm Standard board) (*) SOT- (mm x mm Standard board) (*) Operating Ambient Temperature Topr -~+ Storage Temperature Tstg -~+ *: Pd > (V IN -V OUT ) I OUT *: The power dissipation figure shown is PCB mounted and is for reference only. Please see the power dissipation page for the mounting condition. XE Series B Type PARAMETER SYMBOL RATINGS UNITS Input Voltage VIN VSS-.~+ V Output Current IOUT (*) ma VOUT VSS-.~VIN+. V CE Input Voltage VCE VSS-.~+ V Power Dissipation SOT-9- Pd mw (mm x mm Standard board) (*) (Ta= ) Operating Ambient Temperature Topr -~+ Junction Temperature TJ -~+ Storage Temperature Tstg -~+ *: Pd > (V IN -V OUT ) I OUT *: The power dissipation figure shown is PCB mounted and is for reference only. Please see the power dissipation page for the mounting condition.

7 XC/XE Series ELECTRICAL CHARACTERISTICS XC Series B Type Ta= PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT VOUT(E) (*) IOUT=mA, VCE=VIN E- V VIN=VOUT(T)+.V, VCE=VIN (*) - - ma (VOUT(T).V) Maximum Output Current IOUTMAX VIN=VOUT(T)+.V, VCE=VIN (*) - - ma (VOUT(T)<.V) Load Regulation VOUT ma IOUT ma, VCE=VIN (.V VOUT(T) 7.V) ma IOUT ma, VCE=VIN (7.<VOUT(T).V ) - 9 mv - mv Dropout Voltage Vdif (*) IOUT=mA, VCE=VIN - E- mv Dropout Voltage Vdif (*) IOUT=mA,VCE=VIN - E- mv Supply Current ISS VCE=VIN 9 μa Stand-by Current ISTB VCE=VSS -.. μa Line Regulation VOUT / VOUT(T)+.V VIN.V (*) ( VIN VOUT) IOUT=mA, VCE=VIN -.. %/V Line Regulation VOUT / VOUT(T)+.V VIN.V (*) ( VIN VOUT) IOUT=mA, VCE=VIN -.. %/V Input Voltage VIN. -. V - Temperature Characteristics Power Supply Rejection Ratio VOUT / ( Topr VOUT) PSRR IOUT=mA, VCE=VIN - Topr VIN=[VOUT(T)+.]V+.Vp-pAC (*) IOUT=mA, f=khz, VCE=VIN - ± - ppm/ - - db Short Current ISHORT VCE=VIN (*) - - ma CE H Level Voltage VCEH V CE L Level Voltage VCEL - -. V CE H Level Current ICEH VIN=VCE=.V μa CE L Level Current ICEL VIN=.V, VCE=VSS μa Thermal Shutdown Detect Temperature Thermal Shutdown Release Temperature TTSD TTSR VCE=VIN Junction Temperature VCE=VIN Junction Temperature Hysteresis Width TTSD-TTSR VCE=VIN Junction Temperature Unless otherwise stated, V IN =V OUT(T) +.V. NOTE: *: V OUT(T) : Nominal output voltage *: V OUT(E) : Effective output voltage (i.e. the output voltage when V OUT(T) +.V is provided at the V IN pin while maintaining a certain I OUT value.) *: Vdif={V IN - V OUT } V OUT : V OUT(T) <.V, A voltage equal to 9% of the output voltage whenever an amply stabilized I OUT {V OUT(T) +.V} is input. V OUT(T).V, A voltage equal to 9% of the output voltage whenever an amply stabilized I OUT {V OUT(T) +.V} is input. V IN : The input voltage when V OUT appears as input voltage is gradually decreased. 7/9

8 XC/XE Series ELECTRICAL CHARACTERISTICS (Continued) XC Series C Type Ta= PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT (Accuracy±%) VOUT(E) (*) (Accuracy±%) VOUT(E) (*) VIN=.V, IOUT=mA, VCE=VIN, VOFB=VOUT VIN=.V, IOUT=mA, VCE=VIN, VOFB=VOUT V Divided Resistor Maximum Output Current Load Regulation RFB IOUTMAX VOUT VIN=VOUT=.V, VCE=VSS VOFB=VOUT VIN=.V, VCE=VIN, VOFB=VOUT VIN=.V ma IOUT ma, VCE=VIN, VOFB=VOUT.7.. MΩ - - ma - 9 mv Dropout Voltage Vdif (*) IOUT=mA, VCE=VIN, VOFB=VOUT - mv Dropout Voltage Vdif (*) IOUT=mA, VCE=VIN, - 9 mv VOFB=VOUT Supply Current ISS VIN=.V, VCE=VIN, VOFB=VOUT 9 μa Stand-by Current ISTB VIN=.V, VCE=VSS, VOFB=VOUT -.. μa VOUT /.V VIN.V, Line Regulation -.. %/V ( VIN VOUT) IOUT=mA, VCE=VIN,VOFB=VOUT Line Regulation VOUT / ( VIN VOUT).V VIN.V, IOUT=mA, VCE=VIN, VOFB=VOUT -.. %/V Input Voltage VIN. -. V - Temperature Characteristics Power Supply Rejection Ratio Short Current VOUT / ( Topr VOUT) PSRR ISHORT VIN=.V, IOUT=mA, VCE=VIN, VOFB=VOUT, - Topr VIN=.V+.Vp-pAC, IOUT=mA, f=khz, VCE=VIN VOFB=VOUT VIN=.V, VCE=VIN, VOFB=VOUT - ± - ppm/ - - db - - ma CE H Level Voltage VCEH VIN=.V, VOFB=VOUT. -. V CE L Level Voltage VCEL VIN=.V, VOFB=VOUT -. V CE H Level Current ICEH VIN=VCE=.V, VOFB=VOUT μa CE L Level Current Thermal Shutdown Detect Temperature Thermal Shutdown Release Temperature ICEL TTSD TTSR VIN=.V, VCE=VSS VOFB=VOUT VIN=.V, VCE=VIN Junction Temperature VIN=.V, VCE=VIN Junction Temperature μa Hysteresis Width TTSD-TTSR VIN=.V, VCE=VIN Junction Temperature NOTE: *: V OUT(T) : Nominal output voltage C type is.v. *: V OUT(E) : Effective output voltage (i.e. the output voltage when V OUT(T) +.V is provided at the V IN pin while maintaining a certain I OUT value.) *: Vdif={V IN - V OUT } V OUT : V OUT(T) <.V, A voltage equal to 9% of the output voltage whenever an amply stabilized I OUT {V OUT(T) +.V} is input. V OUT(T).V, A voltage equal to 9% of the output voltage whenever an amply stabilized I OUT {V OUT(T) +.V} is input. V IN : The input voltage when V OUT appears as input voltage is gradually decreased. /9

9 XC/XE Series ELECTRICAL CHARACTERISTICS (Continued) XC Series D type Ta= PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT VOUT(E) (*) IOUT=mA E- V Maximum Output Current Load Regulation IOUTMAX VOUT VIN=VOUT(T)+.V (*) (VOUT(T).V) VIN=VOUT(T)+.V (*) (VOUT(T)<.V) ma IOUT ma (.V VOUT(T) 7.V ) ma IOUT ma ( 7.V<VOUT(T).V ) - - ma - - ma - 9 mv - mv Dropout Voltage Vdif (*) IOUT=mA - E- mv Dropout Voltage Vdif (*) IOUT=mA - E- mv Supply Current ISS 9 μa Line Regulation VOUT(T)+.V VIN.V (*) ( VIN VOUT) IOUT=mA -.. %/V Line Regulation VOUT / VOUT(T)+.V VIN.V (*) ( VIN VOUT) IOUT=mA -.. %/V Input Voltage VIN. -. V - Temperature Characteristics Power Supply Rejection Ratio VOUT / VOUT / IOUT=mA ( Topr VOUT) - Topr PSRR VIN=[VOUT(T)+.]V+.Vp-pAC (*) IOUT=mA, f=khz - ± - ppm/ - - db Short Current ISHORT VIN=VOUT(T)+.V (*) - - ma Thermal Shutdown Detect Temperature TTSD Junction Temperature - - Thermal Shutdown Release Temperature TTSR Junction Temperature - - Hysteresis Width TTSD-TTSR Junction Temperature Unless otherwise stated, V IN =V OUT(T) +.V. NOTE: *: V OUT(T) : Nominal output voltage *: V OUT(E) : Effective output voltage (i.e. the output voltage when V OUT(T) +.V is provided at the V IN pin while maintaining a certain I OUT value.) *: Vdif={V IN - V OUT } V OUT : V OUT(T) <.V, A voltage equal to 9% of the output voltage whenever an amply stabilized I OUT {V OUT(T) +.V} is input. V OUT(T).V, A voltage equal to 9% of the output voltage whenever an amply stabilized I OUT {V OUT(T) +.V} is input. V IN : The input voltage when V OUT appears as input voltage is gradually decreased. 9/9

10 XC/XE Series ELECTRICAL CHARACTERISTICS (Continued) Voltage Chart (XC Series) PARAMETER E- E- E- NOMINAL OUTPUT VOLTAGE(V) VOUT(T) OUTPUT VOLTAGE (V) % ACCURACY OUTPUT VOLTAGE (V) % ACCURACY DROPOUT VOLTAGE (mv) IOUT=mA DROPOUT VOLTAGE (mv) IOUT=mA VOUT(E) VOUT(E) Vdif Vdif MIN. MAX. MIN. MAX. TYP. MAX. TYP. MAX /9

11 XC/XE Series ELECTRICAL CHARACTERISTICS (Continued) Voltage Chart (XC Series) (Continued) PARAMETER E- E- E- NOMINAL OUTPUT VOLTAGE(V) VOUT(T) OUTPUT VOLTAGE (V) % ACCURACY OUTPUT VOLTAGE (V) % ACCURACY DROPOUT VOLTAGE (mv) IOUT=mA DROPOUT VOLTAGE (mv) IOUT=mA VOUT(E) VOUT(E) Vdif Vdif MIN. MAX. MIN. MAX. TYP. MAX. TYP. MAX /9

12 XC/XE Series ELECTRICAL CHARACTERISTICS (Continued) Voltage Chart (XC Series) (Continued) PARAMETER E- E- E- NOMINAL OUTPUT VOLTAGE(V) VOUT(T) OUTPUT VOLTAGE (V) % ACCURACY OUTPUT VOLTAGE (V) % ACCURACY DROPOUT VOLTAGE (mv) IOUT=mA DROPOUT VOLTAGE (mv) IOUT=mA VOUT(E) VOUT(E) Vdif Vdif MIN. MAX. MIN. MAX. TYP. MAX. TYP. MAX /9

13 XC/XE Series ELECTRICAL CHARACTERISTICS (Continued) XE Series B Type PARAMETER SYMBOL CONDITIONS Ta= Ta=- ~ MIN. TYP. MAX. MIN. TYP. MAX. UNITS CIRCUIT VOUT(E) (*) IOUT=mA, VCE=VIN E-- E-- V Maximum Output Current (*) IOUTMAX VIN=VOUT(T)+.V, VCE=VIN (*) (VOUT(T).V) VIN = VOUT(T)+.V, VCE=VIN (*) (VOUT(T)<.V) ma ma Load Regulation (*) VOUT VCE=VIN, ma IOUT ma - E-- - E-- mv Dropout Voltage Vdif (*) IOUT=mA, VCE=VIN - E-- - E-- mv Dropout Voltage (*) Vdif (*) IOUT=mA, VCE=VIN - E-- - E-- mv Supply Current ISS VCE=VIN 9. μa Stand-by Current ISTB VCE=VSS μa Line Regulation (*) Line Regulation (*) VOUT/ ( VIN VOUT) VOUT/ ( VIN VOUT) VOUT(T)+.V VIN.V (*) IOUT=mA, VCE=VIN VOUT(T)+.V VIN.V (*) IOUT=mA, VCE=VIN %/V %/V Input Voltage VIN.... V Temperature Characteristics Power Supply Rejection Ratio VOUT/ ( Topr VOUT) PSRR IOUT=mA, VCE=VIN - Topr VIN=[VOUT(T)+.]V+.Vp-pAC (*) IOUT=mA, f=khz, VCE=VIN - ± ± ppm/ db Short Current ISHORT VCE=VIN ma CE "H" Level Voltage VCEH V CE "L" Level Voltage VCEL V CE "H" Level Current ICEH VIN=VCE=.V μa CE "L" Level Current ICEL VIN=.V, VCE=VSS μa Thermal Shutdown Detect Temperature TTSD VCE=VIN Junction Temperature Thermal Shutdown Release Temperature TTSR VCE=VIN Junction Temperature Hysteresis Width TTSD - TTSR VCE=VIN Junction Temperature Unless otherwise stated, VIN=VOUT(T)+.V. NOTE: *: VOUT(T): Nominal output voltage *: VOUT(E): Effective output voltage (i.e. the output voltage when VOUT(T)+.V is provided at the VIN pin while maintaining a certain IOUT value.) *: Vdif={VIN- VOUT} VOUT: V OUT(T) <.V, A voltage equal to 9% of the output voltage whenever an amply stabilized IOUT{VOUT(T)+.V} is input. V OUT(T).V, A voltage equal to 9% of the output voltage whenever an amply stabilized IOUT{VOUT(T)+.V} is input. VIN: The input voltage when VOUT appears as input voltage is gradually decreased. (*)Junction temperature range is Tj=-~ for this table. /9

14 XC/XE Series ELECTRICAL CHARACTERISTICS (Continued) Voltage Chart (XE Series) MBOL E-- E-- Temperature / Ta -~ PARAMETER NOMINAL OUTPUT VOLTAGE(V) VOUT(T) OUTPUT VOLTAGE (V) Accuracy ±% VOUT(E) OUTPUT VOLTAGE (V) Accuracy +%, -.% VOUT(E) MIN. MAX. MIN. MAX SYMBOL E-- E-- Temperature / Ta PARAMETER NOMINAL OUTPUT VOLTAGE(V) VOUT(T) -~ OUTPUT VOLTAGE (V) Accuracy ±% VOUT(E) OUTPUT VOLTAGE (V) Accuracy +%, -.% VOUT(E) MIN. MAX. MIN. MAX /9

15 XC/XE Series ELECTRICAL CHARACTERISTICS (Continued) Voltage Chart (XE Series) SYMBOL E-- E-- Temperature /Ta -~ PARAMETER NOMINAL OUTPUT VOLTAGE(V) OUTPUT VOLTAGE (V) Accuracy ±% OUTPUT VOLTAGE (V) Accuracy +%, -.% VOUT(T) VOUT(E) VOUT(E) MIN. MAX. MIN. MAX /9

16 XC/XE Series ELECTRICAL CHARACTERISTICS (Continued) Voltage Chart (XE Series) SYMBOL E-- E-- E-- E-- E-- E-- Temperature /Ta PARAMETER NOMINAL OUTPUT VOLTAGE(V) VOUT(T) (V) ~ -~ -~ LOAD REGULATION (mv) LOAD REGULATION (mv) DROPOUT VOLTAGE (mv) IOUT=mA DROPOUT VOLTAGE (mv) IOUT=mA DROPOUT VOLTAGE (mv) IOUT=mA DROPOUT VOLTAGE (mv) IOUT=mA VOUT VOUT Vdif Vdif Vdif Vdif TYP. MAX. TYP. MAX. TYP. MAX. TYP. MAX. TYP. MAX. TYP. MAX /9

17 XC/XE Series ELECTRICAL CHARACTERISTICS (Continued) Voltage Chart (XE Series) SYMBOL E-- E-- E-- E-- E-- E-- Temperature / Ta -~ -~ -~ PARAMETER NOMINAL OUTPUT VOLTAGE(V) VOUT(T) (V) LOAD REGULATION (mv) LOAD REGULATION (mv) DROPOUT VOLTAGE (mv) IOUT=mA DROPOUT VOLTAGE (mv) IOUT=mA DROPOUT VOLTAGE (mv) IOUT=mA DROPOUT VOLTAGE (mv) IOUT=mA VOUT VOUT Vdif Vdif Vdif Vdif TYP. MAX. TYP. MAX. TYP. MAX. TYP. MAX. TYP. MAX. TYP. MAX /9

18 XC/XE Series ELECTRICAL CHARACTERISTICS (Continued) Voltage Chart (XE Series) SYMBOL E-- E-- E-- E-- E-- E-- Temperature / Ta PARAMETER NOMINAL OUTPUT VOLTAGE(V) VOUT(T) (V) ~ -~ -~ LOAD REGULATION (mv) LOAD REGULATION (mv) DROPOUT VOLTAGE (mv) IOUT=mA DROPOUT VOLTAGE (mv) IOUT=mA DROPOUT VOLTAGE (mv) IOUT=mA DROPOUT VOLTAGE (mv) IOUT=mA VOUT VOUT Vdif Vdif Vdif Vdif TYP. MAX. TYP. MAX. TYP. MAX. TYP. MAX. TYP. MAX. TYP. MAX /9

19 XC/XE Series TEST CIRCUITS Circuit XCB/XEB Type XCC Type XCD Type Circuit XCB/XEB Type XCC Type XCD Type Circuit XCB/XEB Type XCC Type XCD Type Circuit XCC Type 9/9

20 XC/XE Series OPERATIONAL EXPLANATION < Control> The voltage divided by resistors R & R is compared with the internal reference voltage by the error amplifier. The P- channel MOSFET which is connected to the VOUT pin is then driven by the subsequent controlled signal. The output voltage at the VOUT pin is controlled and stabilized by a system of negative feedback. The current limit circuit and short protect circuit operate in relation to the level of output current and heat dissipation. Further, the IC s internal circuitry can be shutdown via the CE pin s signal. <Short-Circuit Protection> The XC/XE series includes a current fold-back circuit as a short circuit protection. When the load current reaches the current limit level, the current fold-back circuit operates and output voltage drops. The output voltage drops further and output current decreases. When the output pin is shorted, a current of about ma flows. <CE Pin> The IC s internal circuitry can be shutdown via the signal from the CE pin with the XC/XE series. In shutdown mode, output at the VOUT pin will be pulled down by R and R to the VSS level. Note that as the XC/XE series has no pull down resistor so that it will become unstable with the CE pin open. We suggest that you use this IC with either a VIN voltage or a VSS voltage input at the CE pin. If this IC is used with the correct specifications for the CE pin, the operational logic is fixed and the IC will operate normally. However, supply current may increase as a result of through current in the IC s internal circuitry if a medium voltage is applied. <Thermal Protection> When the junction temperature of the built-in driver transistor reaches the temperature limit, the thermal shutdown circuit operates and the driver transistor will be set to OFF. The IC resumes its operation when the thermal shutdown function is released and the IC s operation is automatically restored because the junction temperature drops to the level of the thermal shutdown release voltage. <Minimum Operating Voltage> For the stable operation of the IC, over.v of input voltage is necessary. if the input voltage is less than.v. The output voltage may not be generated normally NOTES ON USE. Please use this IC within the stated absolute maximum ratings. The IC is liable to malfunction should the ratings be exceeded.. Where wiring impedance is high, operations may become unstable due to the noise and/or phase lag depending on output current. Please strengthen VIN and VSS wiring in particular.. Phase compensation inside the IC is performed in the XC/XE series. Therefore, an abnormal oscillation does not occur even if there is no output capacitor CL. An input capacitor CIN around.μf~.μf between the power input pin (VIN) and the ground pin (VSS) is required for input stability. Also, the output voltage fluctuation such as under shoot or over shoot, which occurs because of the load change can be controlled by placing the output capacitor CL around.μ F~.μF between the VOUT pin and VSS pin. The input capacitor (CIN) and the output capacitor (CL) should be placed to the IC as close as possible with a shorter wiring. /9

21 XC/XE Series NOTES ON USE. Notes on setting output voltage externally (C type) Ta= The output voltage can be set externally by the following equation: I=IFB+I () I=.V/R () I=IFB+.V/R If the equation () is assigned to the equation (), the equation becomes as below: VOUT=.V+R I () For this, the following equation can be used for setting output voltage externally: VOUT=.V+R I () And the equation () will be; VOUT=.V+R (IFB+.V/R) =.V (R + R) / R + R IFB () The second term of the equation (), R IFB, is the cause of the output accuracy error. The IFB can be calculated by the following equation: IFB=.V / RFB () The cause of the output accuracy error, R IFB can be calculated by the equation below; R IFB=R.V/ RFB =.V R / RFB (7) Accordingly, if R<< RFB, the output voltage error becomes minute. Setting Resistance-Dependant of XC Series C type s. Torex places an importance on improving our products and its reliability. However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment. /9

22 XC/XE Series TYPICAL PERFORMANCE CHARACTERISTICS () vs. Output Current XCB/C/D XCB/C/D. VIN=VCE=.V, Ta=, CIN=CL=.μF (ceramic). Ta=, CIN=CL=.μF (ceramic) : VOUT (V).... Ta=- Ta= Ta= : VOUT (V).... VIN=V VIN=V VIN=V. Output Current: IOUT (ma). Output Currrent: IOUT (ma) XCB/D XCB/D. VIN=VCE=.V, Ta=, CIN=CL=.μF (ceramic). Ta=, CIN=CL=.μF (ceramic).. Output Voltage: : VOUT (V) (V) Ta=- Ta= Ta= Output Current: : IOUT (ma) : VOUT (V) VIN=.V VIN=.V VIN=.V Output Current: IOUT (ma) XCB/D XCB/D. VIN=VCE=.V, Ta=, CIN=CL=.μF (ceramic). Ta=, CIN=CL=.μF (ceramic) : : VOUT (V)..... Ta=- Ta= Output Voltage: : VOUT (V) (V)..... VIN=V VIN=7V. Ta= Output Current: : IOUT (ma). VIN=V Output Current: : IOUT (ma) /9

23 XC/XE Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) () vs. Output Current (Continued) XCB/D C XCB/D C VIN=VCE=.V, Ta=, CIN=CL=.μF (ceramic) Ta=, CIN=CL=.μF (ceramic) : : VOUT (V) Ta=- Ta= Ta= Output Current: : IOUT (ma) : : VOUT (V) VIN=V VIN=V VIN=V Output Current: : IOUT (ma) () vs. Input Voltage XCB/C/D XCB/C/D. Ta=, CIN=CL=.μF (ceramic). Ta=, CIN=CL=.μF (ceramic) : : VOUT (V) IOUT=mA. IOUT=mA IOUT=mA.... Input Input Voltage: VIN Voltage: (V) (V) : : VOUT (V) IOUT=mA IOUT=mA IOUT=mA Input Voltage: VIN : (V) (V) XCB/D XCB/D. Ta=, CIN=CL=.uF(ceramic). Ta=, CIN=CL=.uF(ceramic) : VOUT (V)... IOUT=mA.9 IOUT=mA IOUT=mA Input Voltage : VIN (V) : VOUT (V)... IOUT=mA IOUT=mA.9 IOUT=mA. Input Voltage : VIN (V) /9

24 XC/XE Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) () vs. Input Voltage (Continued) XCB/D XCB/D. Ta=, CIN=CL=.μF (ceramic). Ta=, CIN=CL=.μF (ceramic).. : : VOUT (V) (V).... IOUT=mA IOUT=mA IOUT=mA : : VOUT (V).... IOUT=mA IOUT=mA IOUT=mA.... Input Input Voltage Voltage: : VIN (V) (V). Input Voltage: : VIN (V) XCB/D C XCB/D C. Ta=, CIN=CL=.μF (ceramic). Ta=, CIN=CL=.μF (ceramic) Output Voltage: : VOUT (V).... IOUT=mA. IOUT=mA IOUT=mA. Input Input Voltage: : VIN (V) (V) : : VOUT (V)... IOUT=mA. IOUT=mA IOUT=mA. Input Voltage: VIN : VIN (V) (V) () Dropout Voltage vs. Output Current XCB/C/D XCB/D. CIN=CL=.uF (ceramic). CIN=CL=.uF (ceramic) Input/Output Dropout Difference Voltage Voltage : VDIF (V) : VDIF (V) Ta=- Ta= Ta= 7 Output Current: : IOUT (ma) (V) Input/Output Dropout Difference Voltage : Voltage VDIF (V) : VDIF (V) Ta=- Ta= Ta= 7 Output Output Current Current: : IOUT IOUT (ma) (V) /9

25 XC/XE Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) () Dropout Voltage vs. Output Current XCB/D XCB/D C. CIN=CL=.uF(ceramic). CIN=CL=.uF (ceramic) Input/Output Dropout Difference Voltage: Voltage VDIF (V) : VDIF (V) Ta=- Ta= Ta= 7 Output Current: : IOUT (V) (ma) Input/Output Dropout Difference Voltage Voltage : VDIF (V) : VDIF (V) Ta=- Ta= Ta= 7 Output Current: : IOUT (V) (ma) () Supply Current vs. Input Voltage Supply Current: : ISS (μa) (ua) XCB/C/D 9 7 Ta=- Ta= Ta= Input Voltage: : VIN (V) Supply Current: ISS : ISS (μa) (ua) 9 7 XCB/C/D VIN=.V - - Ambient Temprature: Ta ( ) Supply Current: : ISS (ua) (μa) XCB/D 9 7 Ta=- Ta= Ta= Input Voltage: : VIN (V) Supply Current: : ISS (μa) (ua) XCB/D VIN=.V Ambient Temprature: Ta ( ) /9

26 XC/XE Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) () Supply Current vs. Input Voltage (Continued) XCB/D XCB/D 9 9 VIN=7.V Supply Current: : ISS (μa) (ua) 7 Ta=- Supply Current: : ISS (μa) (ua) 7 Ta= Ta= - - Input Voltage: : VIN (V) Ambient Temperature: Ta ( ) XCB/D C XCB/D C Supply Current: : ISS (μa) (ua) 9 7 Ta=- Ta= Ta= Input Voltage: : VIN (V) Supply Current: : ISS (μa) (ua) VIN=.V Ambient Temprature: Ta ( ) () vs. Ambient Temperature XCB/C/D XCB/D. CIN=CL=.μF (ceramic). CIN=CL=.μF (ceramic).. : : VOUT (V) (V) IOUT=mA IOUT=mA IOUT=mA Ambient Temperature: Ta ( ) : VOUT : VOUT (V) (V) IOUT=mA IOUT=mA IOUT=mA Ambient Temperature: Ta ( ) /9

27 XC/XE Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) () vs. Ambient Temperature XCB/D XCB/D C. CIN=CL=.μF (ceramic). CIN=CL=.μF (ceramic).. : : VOUT (V) (V) IOUT=mA IOUT=mA IOUT=mA Ambient Temperature: Ta ( ) : : VOUT (V) (V) IOUT=mA IOUT=mA IOUT=mA Ambient Temperature: Ta ( ) () Line Transient Response. XCB/C/D IOUT=mA, tr=tf=μs CL=μF (ceramic), Ta=.. XCB/C/D IOUT=mA, tr=tf =μs CL=μF (ceramic), Ta=..... Input Voltage: V : VIN (V) (V).... Input Voltage....9 : : VOUT (V) (V) Input Voltage: : V VIN (V).... Input Voltage....9 : : VOUT (V).... Time (ms/div) Time (ms/div) 7. XCB/D IOUT=mA, tr=tf =μs CL=μF (ceramic), Ta=.7 7. XCB/D IOUT=mA, tr=tf =μs CL=μF (ceramic), Ta=.7 Input Voltage: : V VIN (V)..... Input Voltage..... : : VOUT (V) Input Voltage: V : VIN (V) (V)..... Input Voltage..... : : VOUT (V) (V).... Time (ms/div) Time (ms/div) 7/9

28 XC/XE Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) () Line Transient Response (Continued) XCB/D XCB/D IOUT=mA, tr=tf=μs IOUT=mA, tr=tf =μs 9. CL=μF (ceramic), Ta=. 9. CL=μF (ceramic), Ta=. Input Voltage: : V VIN (V) Input Voltage : : VOUT (V) Input Voltage: : VIN V (V) Input Voltage Output Voltage: : VOUT (V) (V). Time (ms/div).. Time (ms/div). XCB/D C XCB/D C IOUT=mA, tr=tf=μs IOUT=mA, tr=tf =μs. CL=μF (ceramic), Ta=.. CL=μF (ceramic), Ta=..... Input Voltage: : V VIN IN (V) (V).... Input Voltage....9 Output Voltage: : VOUT (V) (V) Input Voltage: : V VIN (V).... Input Voltage....9 Output Output Voltage Voltage: VOUT : (V) (V).... Time (ms/div) Time (ms/div) (7) Load Transient Response XCB/C/D VIN=.V, tr=tf=us CIN=CL=.uF(ceramic), Ta= XCB/D VIN=.V, tr=tf=us CIN=CL=.uF(ceramic), Ta= : VOUT (V) Output Current 9 Output Current : IOUT (ma) Output Vltage : VOUT (V) m Output Current 9 Output Current : IOUT (ma) m m Time (ms/div) Time (ms/div) /9

29 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (7) Load Transient Response (Continued) XC/XE Series 7 XCB/D VIN=7.V, tr=tf=us CIN=CL=.uF(ceramic), Ta= XCB/D C VIN=.V, tr=tf=us CIN=CL=.uF(ceramic), Ta= : VOUT (V) m Output Current 9 Output Current : IOUT (ma) : VOUT (V) Output Current 9 Output Current : IOUT (ma) m Time (ms/div) 9 m Time (ms/div) () Input Rise Time XCB/C/D XCB/C/D VIN=.V, tr=μs IOUT=mA, CL=μF (ceramic),ta= VIN=.V, tr=μs IOUT=mA, CL=μF (ceramic),ta= Input Voltage: V : VIN (V) - - Input Voltage Output Output Voltage Voltage: : V VOUT (V) OUT (V) Input Voltage: : V VIN (V) - - Input Voltage : V : VOUT (V) (V) - - Time(ms/div) Time (ms/div) XCB/D XCB/D Input Voltage VIN=.V, tr=us IOUT=mA CL=uF(ceramic),Ta= 7 Input Voltage VIN=.V, tr=us IOUT=mA CL=uF(ceramic),Ta= 7 Input Voltage : VIN (V) - - : VOUT (V) Input Voltage : VIN (V) - - : VOUT (V) Time(ms/div) - Time(ms/div) 9/9

30 XC/XE Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) () Input Rise Time (Continued) XCB/D XCB/D VIN=7.V, tr=us IOUT=mA CL=μF(ceramic),Ta= VIN=7.V, tr=us IOUT=mA CL=μF(ceramic),Ta= Input Voltage 7 Input Voltage 7 Input Voltage : VIN (V) - - : VOUT (V) Input Voltage : VIN (V) - - : VOUT (V) Time (ms/div) Time (ms/div) XCB/D C VIN=.V, tr=us IOUT=mA CL=μF(ceramic),Ta= Input Voltage XCB/D C VIN=.V, tr=us IOUT=mA CL=μF(ceramic),Ta= Input Voltage Input Voltage : VIN (V) : VOUT (V) Input Voltage : VIN (V) : VOUT (V) - Time (ms/div) - Time (ms/div) (9) CE Rise Time XCB/C/D XCB/C/D CE Input Voltage: : V VCE (V) - - VIN=.V, tr=μs IOUT=mA, CL=μF (ceramic),ta= CE Input Voltage Output Voltage: : VOUT V OUT (V) (V) CE CE Input Voltage: : VCE V (V) - - VIN=.V, tr=μs IOUT=mA, CL=μF (ceramic),ta= CE Input Voltage : : VOUT V (V) (V) - - Time (ms/div) Time(ms/div) /9

31 XC/XE Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (9) CE Rise Time (Continued) XCB/D XCB/D VIN=.V, tr=μs IOUT=mA, CL=μF (ceramic),ta= CE Input Voltage 7 VIN=.V, tr=μs IOUT=mA, CL=μF (ceramic),ta= CE Input Voltage 7 CE CE Input Voltage: V : VIN CE (V) (V) - - Output Output Voltage Voltage: : V VOUT (V) OUT (V) CE Input Voltage: : VCE V (V) - - : : VOUT V (V) Time (ms/div) Time (ms/div) XCB/D VIN=7.V, tr=μs IOUT=mA, CL=μF (ceramic),ta= XCB/D VIN=7.V, tr=μs IOUT=mA, CL=μF (ceramic),ta= CE Input Voltage 7 CE Input Voltage 7 CE CE Input Voltage: V : VCE (V) (V) - - Output : : V VOUT OUT (V) (V) CE Input Voltage: : V VCE (V) - - : : VOUT V (V) Time (ms/div) Time (ms/div) XCB/D C XCB/D C VIN=.V, tr=μs IOUT=mA, CL=μF (ceramic),ta= VIN=.V, tr=μs IOUT=mA, CL=μF (ceramic),ta= CE CE Input Voltage: : VCE V (V) - - CE Input Voltage 9 : : VOUT V OUT (V) (V) CE CE Input Input Voltage: : VCE V CE (V) - - CE Input Voltage 9 Output Output Voltage Voltage: : VOUt V (V) OUT (V) - Time (ms/div) - Time (ms/div) /9

32 XC/XE Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) () Ripple Rejection Rate XCB/C/D Ripple Rejection Ratio : PSRR (db) Ripple Rejection Ratio : PSRR (db) Ripple Rejection Ratio : PSRR (db) 9 7 VIN=.Vdc+.Vp-p, IOUT=mA CL=μF(ceramic),Ta= Ripple Frequency : f (khz) XCB/D VIN=.Vdc+.Vp-p, IOUT=mA CL=μF(ceramic),Ta=.. Ripple Frequency : f (khz) XCB/D VIN=7.Vdc+.Vp-p, IOUT=mA CL=μF(ceramic),Ta=.. Ripple Rejection Ratio : PSRR (db) Ripple Rejection Ratio : PSRR (db) 9 7 XCB/C/D VIN=.Vdc+.Vp-p, IOUT=mA CL=μF(ceramic),Ta= Ripple Frequency : f (khz) XCB/D VIN=.Vdc+.Vp-p, IOUT=mA CL=μF(ceramic),Ta=.. Ripple Frequency : f (khz) Ripple Frequency : f (khz) /9

33 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) () Ripple Rejection Time (Continued) XC/XE Series Ripple Rejection Ratio : PSRR (db) 9 7 XCB/D C VIN=VCE=.Vdc+.Vp-p, IOUT=mA CL=μF(ceramic),Topr=.. Ripple Frequeency : f (khz) Ripple Rejection Ratio : PSRR (db) 9 7 XCB/D C VIN=VCE=.Vdc+.Vp-p, IOUT=mA CL=μF(ceramic),Topr=.. Ripple Frequency : f (khz) /9

34 XC/XE Series PACKAGING INFORMATION SOT- SOT- Reference Pattern Layout SOT ±. ~ ±..9± ±..MAX.MIN /9

35 XC/XE Series PACKAGING INFORMATION (Continued) SOT-9 SOT-9 Reference Pattern Layout.± φ...±..7±..± (.7) ±..±... SOT-9-.± ±..±..± SOT-9- Reference Pattern Layout. Φ..±..7±..± (.7) (.) ±..± /9

36 XC/XE Series PACKAGING INFORMATION (Continued) SOT- TO MIN (.9) (.9) USP-C USP-C Reference Pattern Layout BOTTOM VIEW USP-C Reference Metal Mask Design /9

37 XC/XE Series PACKAGING INFORMATION (Continued) USP-B USP-B Reference Pattern Layout pin INDENT.±. USP-B Reference Metal Mask Design..±. (.) (.) 7/9

38 XC/XE Series PACKAGING INFORMATION (Continued) SOT- Power Dissipation (mm x mm Standard board) Power dissipation data for the SOT- is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition.. Measurement Condition Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions x mm ( mm in one side) Copper (Cu) traces occupy % of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT- is used.) Material: Glass Epoxy (FR-) Thickness:.mm Through-hole: x. Diameter.Power Dissipation vs. Ambient Temperature Evaluation Board (Unit:mm) Board Mount (Tj max = ) Ambient Temperature( ) Power Dissipation Pd(mW) Thermal Resistance ( /W).7 7 Pd vs Ta Power Dissipation Pd(mW) Ambient Temperature( ) /9

39 XC/XE Series PACKAGING INFORMATION (Continued) SOT-9- Power Dissipation (mm x mm Standard board) Power dissipation data for the SOT-9- is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition.. Measurement Condition Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions x mm ( mm in one side) Copper (Cu) traces occupy % of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-) Thickness:.mm Through-hole: x. Diameter.Power Dissipation vs. Ambient Temperature Evaluation Board (Unit:mm) Board Mount (Tj max = ) Ambient Temperature( ) Power Dissipation Pd(mW) Thermal Resistance ( /W) 7.9 Pd vs Ta Power Dissipation Pd(mW) Ambient Temperature( ) 9/9

40 XC/XE Series PACKAGING INFORMATION (Continued) USP-C Power Dissipation (mm x mm Standard board) Power dissipation data for the USP-C is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition.. Measurement Condition Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions x mm ( mm in one side) Copper (Cu) traces occupy % of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-) Thickness:.mm Through-hole: x. Diameter.Power Dissipation vs. Ambient Temperature Evaluation Board (Unit:mm) Board Mount (Tj max = ) Ambient Temperature( ) Power Dissipation Pd(mW) Thermal Resistance ( /W). Pd vs Ta Power Dissipation Pd(mW) Ambient Temperature( ) /9

41 XC/XE Series PACKAGING INFORMATION (Continued) /9

42 XC/XE Series PACKAGING INFORMATION (Continued) TO- Power Dissipation (mm x mm Standard board) Power dissipation data for the TO- is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition.. Measurement Condition Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions x mm ( mm in one side) Copper (Cu) traces occupy % of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-) Thickness:.mm Through-hole: x. Diameter.Power Dissipation vs. Ambient Temperature Evaluation Board (Unit:mm) Board Mount (Tj max = ) Ambient Temperature( ) Power Dissipation Pd(mW) Thermal Resistance ( /W) 7. Power Dissipation Pd(mW) Pd vs Ta Ambient Temperature( ) /9

43 XC/XE Series PACKAGING INFORMATION (Continued) SOT-9 Power Dissipation (mm x mm Standard board) Power dissipation data for the SOT-9 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition.. Measurement Condition Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions x mm ( mm in one side) Copper (Cu) traces occupy % of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-) Thickness:.mm Through-hole: x. Diameter.Power Dissipation vs. Ambient Temperature Evaluation Board (Unit:mm) Board Mount (Tj max = ) Ambient Temperature( ) Power Dissipation Pd(mW) Thermal Resistance ( /W). Pd vs Ta Power Dissipation Pd(mW) Ambient Temperature( ) /9

44 XC/XE Series PACKAGING INFORMATION (Continued) /9

45 XC/XE Series PACKAGING INFORMATION (Continued) /9

46 XC/XE Series MARKING RULE (XC Series) SOT-, SOT-9,SOT-9-,USP-C,SOT-,TO-,USP-B, SOT- SOT- USP-C SOT-9 SOT-9- USP-B SOT- SOT- TO- (mark header:~) *Mark header does not change with a lot. represents the product series MARK PRODUCT SERIES XCxxxxxx represents the output voltage range MARK VOLTAGE (V) PRODUCT SERIES.~..~. XCBxxxxx.~9. 9.~..~..~. XCDxxxxx.~ ~.. XCCxxxxx /9

47 XC/XE Series MARKING RULE (XC Series) (Continued) represents the output voltage MARK VOLTAGE(V) MARK VOLTAGE(V) F H K L M N P R S T.... A U.... B V C X.... D Y E Z represents assembly lot number to 9, A to Z, to 9Z, A to A9, AA to AZ, B to ZZ repeated (G, I, J, O, Q, W excluded) Note: No character inversion used. 7/9

48 XC/XE Series MARKING RULE (XE Series) SOT-9- represents the product series MARK PRODUCT SERIES XExxxxxx represents the output voltage range MARK VOLTAGE (V) PRODUCT SERIES.~..~. XEBxxxxx.~9. 9.~. SOT-9- MARK VOLTAGE(V) MARK VOLTAGE(V) F H K L M N P R S T.... A U.... B V C X.... D Y E Z represents assembly lot number,,9, A,B,,Z,,,9,A,B,,Z,, repeated (G, I, J, O, Q, W excluded) Bar marking of a-b-c-d combination represents production year. Bar marking of e-f-g-h combination represents production month. Production Year a b c d xxx xxx xxx xxx xxx - - xxx - - xxx - - xxx7 - - xxx - - xxx9 - - Production Month e f g h January February March April May - - June - - July - - August - - September - - October - - November - December - /9

49 XC/XE Series. The product and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date.. The information in this datasheet is intended to illustrate the operation and characteristics of our products. We neither make warranties or representations with respect to the accuracy or completeness of the information contained in this datasheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet.. Applicable export control laws and regulations should be complied and the procedures required by such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported.. The product is neither intended nor warranted for use in equipment of systems which require extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious property damage including but not limited to devices or equipment used in ) nuclear facilities, ) aerospace industry, ) medical facilities, ) automobile industry and other transportation industry and ) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance.. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention features.. Our products are not designed to be Radiation-resistant. 7. Please use the product listed in this datasheet within the specified ranges.. We assume no responsibility for damage or loss due to abnormal use. 9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex Semiconductor Ltd in writing in advance. TOREX SEMICONDUCTOR LTD. 9/9