RP114x SERIES. 300mA LDO REGULATOR OUTLINE FEATURES APPLICATIONS NO. EA

Transcription

1 SERIES 3mA LDO REGULATOR NO. EA OUTLINE The RPx Series are CMOS-based voltage regulator ICs with high output voltage accuracy, low supply current, low dropout, and high ripple rejection. Each of these voltage regulator ICs consists of a voltage reference unit, an error amplifier, resistors for setting output voltage, a short current limit circuit, a chip enable circuit, and so on. RPx features a minimum input voltage from.v and the output voltage, which can be set from.8v to 3.6V (in.v step). The output voltage of these ICs is internally fixed. These ICs perform with low dropout voltage due to built-in transistor with low ON resistance. Low supply current and a chip enable function prolong the battery life of each system. The ripple rejection, line transient response and load transient response of the RPx Series are excellent, thus these ICs are very suitable for the power supply for hand-held communication equipment. Since the packages for these ICs are DFN(PLP)-, SC-88A, SOT-3-5, therefore high density mounting of the ICs on boards is possible. FEATURES Supply Current...Typ. 5μA Standby Current...Typ..μA Input Voltage Range...V to 5.5V Range...8V to 3.6V (.V steps) (For other voltages, please refer to MARK INFORMATIONS.) Accuracy...±.% (VSET>.V, Topt=5 C) Temperature-Drift Coefficient of...typ. ±8ppm/ C Dropout Voltage...Typ..5V (IOUT=3mA, VSET=.8V) Ripple Rejection...Typ. 75dB (f=khz) Line Regulation...Typ..%/V Packages...DFN(PLP)-, SC-88A, SOT-3-5 Built-in Fold Back Protection Circuit...Typ. 6mA (Current at short mode) Ceramic capacitors are recommended to be used with this IC....μF or more APPLICATIONS Power source for portable communication equipment. Power source for electrical appliances such as cameras, VCRs and camcorders. Power source for battery-powered equipment.

2 BLOCK DIAGRAMS RPxxxxB RPxxxxD VDD VOUT VDD VOUT Vref Current Limit Vref Current Limit CE GND CE GND SELECTION GUIDE The set output voltage, auto discharge function, and package, etc. for the ICs can be selected at the user s request. Product Name Package Quantity per Reel Pb Free Halogen Free RPKxx -TR DFN(PLP)-, pcs Yes Yes RPQxx -TR-FE SC-88A 3, pcs Yes Yes RPNxx -TR-FE SOT-3-5 3, pcs Yes Yes xx : The set output voltage can be selected from.8v(8) to 3.6V(36) in.v steps. The second decimal point of the voltage is described as below..5v: RPK 5-TR, RPQ 5-TR-FE, RPN 5-TR-FE.85V: RPK8 5-TR, PRQ8 5-TR-FE, RPN8 5-TR-FE.85V: RPK8 5-TR, PRQ8 5-TR-FE, RPN8 5-TR-FE : The auto discharge function at off state is options as follows. (B) without auto discharge function at off state (D) with auto discharge function at off state

3 PIN CONFIGURATIONS DFN(PLP)- SC-88A SOT-3-5 Top View Bottom View (mark side) (mark side) 3 3 PIN DESCRIPTIONS DFN(PLP)- Pin No Symbol Pin Description VOUT Output Pin GND Ground Pin 3 CE Chip Enable Pin ("H" Active) VDD Input Pin ) Tab is GND level. (They are connected to the reverse side of this IC.) The tab is better to be connected to the GND, but leaving it open is also acceptable. SC-88A SOT-3-5 Pin No Symbol Pin Description CE Chip Enable Pin ("H" Active) NC No Connection 3 GND Ground Pin VOUT Output Pin 5 VDD Input Pin Pin No Symbol Pin Description VDD Input Pin GND Ground Pin 3 CE Chip Enable Pin ("H" Active) NC No Connection 5 VOUT Output Pin 3

4 RPx ABSOLUTE MAXIMUM RATINGS Symbol Item Rating Unit VIN Input Voltage 6. V VCE Input Voltage (CE Pin).3 to 6. V VOUT.3 to VIN+.3 V IOUT Output Current ma Power Dissipation (DFN(PLP)-) PD Power Dissipation (SC-88A) 38 mw Power Dissipation (SOT-3-5) Topt Operating Temperature Range to 85 C Tstg Storage Temperature Range 55 to 5 C ) For Power Dissipation, please refer to PACKAGE INFORMATION. ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages and may degrade the life time and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured.

5 POWER DISSIPATION (DFN(PLP)-) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Environment Board Material Board Dimensions Standard Land Pattern Mounting on Board (Wind velocity=m/s) Glass cloth epoxy plastic (Double sided) mm mm.6mm Copper Ratio Top side : Approx. 5%, Back side : Approx. 5% Through-holes φ.5mm pcs Measurement Results Power Dissipation Thermal Resistance Thermal Resistance (Topt=5 C, Tjmax=5 C) Standard Land Pattern mw θja=(5 5 C)/.W=5 C/W θjc=67 C/W 6 Power Dissipation PD (mw) Ambient Temperature ( C) Power Dissipation Measurement Board Pattern IC Mount Area (Unit: mm) The above graph shows the Power Dissipation of the package based on Tjmax=5 C and Tjmax=5 C. Operating the IC in the shaded area in the graph might have an influence it's lifetime. Operating time must be within the time limit described in the table below, in case of operating in the shaded area. Operating time 3,hrs Estimated years 9years The volume is calculated on the supposition that operating four hours/day. RECOMMENDED LAND PATTERN 3-C (Unit: mm) 5

6 POWER DISSIPATION (SC-88A) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Environment Board Material Board Dimensions Standard Land Pattern Mounting on Board (Wind velocity=m/s) Glass cloth epoxy plastic (Double sided) mm mm.6mm Copper Ratio Top side : Approx. 5%, Back side : Approx. 5% Through-holes Measurement Results φ.5mm pcs Standard Land Pattern (Topt=5 C, Tjmax=5 C) Free Air Power Dissipation 38mW 5mW Thermal Resistance θja=(5 5 C)/.38W=63 C/W θja=(5 5 C)/.5W=667 C/W Thermal Resistance θjc=75 C/W 6 Power Dissipation PD (mw) Free Air On Board Ambient Temperature ( C) Power Dissipation Measurement Board Pattem IC Mount Area (Unit: mm) The above graph shows the Power Dissipation of the package based on Tjmax=5 C and Tjmax=5 C. Operating the IC in the shaded area in the graph might have an influence it's lifetime. Operating time must be within the time limit described in the table below, in case of operating in the shaded area. RECOMMENDED LAND PATTERN.35 Operating time 3,hrs Estimated years 9years The volume is calculated on the supposition that operating four hours/day (Unit: mm) 6

7 POWER DISSIPATION (SOT-3-5) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: (Power Dissipation (SOT-3-5) is substitution of SOT-3-6.) Measurement Conditions Environment Board Material Board Dimensions Standard Land Pattern Mounting on Board (Wind velocity=m/s) Glass cloth epoxy plastic (Double sided) mm mm.6mm Copper Ratio Top side : Approx. 5%, Back side : Approx. 5% Through-holes φ.5mm pcs Measurement Results Tjmax=5 C) Standard Land Pattern Free Air Power Dissipation mw 5mW Thermal Resistance θja=(5 5 C)/.W=38 C/W C/W (Topt=5 C, 6 55 Power Dissipation PD (mw) Free Air On Board Ambient Temperature ( C) Power Dissipation The above graph shows the Power Dissipation of the package based on Tjmax=5 C and Tjmax=5 C. Operating the IC in the shaded area in the graph might have an influence it's lifetime. Operating time must be within the time limit described in the table below, in case of operating in the shaded area. RECOMMENDED LAND PATTERN. Measurement Board Pattern.7 Max. IC Mount Area (Unit: mm) Operating time 3,hrs Estimated years 9years The volume is calculated on the supposition that operating four hours/day (Unit: mm) 7

8 ELECTRICAL CHARACTERISTICS RPx VIN=VSET+.V (VSET >.5V), VIN=.5V (VSET.5V), IOUT=mA, CIN=COUT=.μF, unless otherwise noted. VSET is Set. The specification in is checked and guaranteed by design engineering at C Topt 85 C. Topt=5 C Symbol Item Conditions Min. Typ. Max. Unit VOUT Topt=5 C C Topt 85 C VSET >.V.99. V VSET.V + mv VSET >.V.97.3 V VSET.V 6 +6 mv IOUT Output Current 3 ma ΔVOUT/ΔIOUT Load Regulation ma IOUT 3mA 5 mv VDIF Dropout Voltage Refer to the following table. ISS Supply Current IOUT=mA 5 75 μa Istandby Standby Current VCE=V.. μa ΔVOUT/ΔVIN Line Regulation VSET+.5V VIN 5.5V (VIN.V).. %/V RR Ripple Rejection f=khz, Ripple.Vp-p VIN=VSET+V, IOUT=3mA (In case that VSET.V, VIN=3V) 75 db VIN Input Voltage. 5.5 V ΔVOUT/ ΔTopt Temperature Coefficient C Topt 85 C ±8 ISC Short Current Limit VOUT=V 6 ma IPD CE Pull-down Current.3 μa VCEH CE Input Voltage "H". V VCEL CE Input Voltage "L". V en Output Noise BW=Hz to khz, IOUT=3mA 75 μvrms RLOW Low Output Nch Tr. ON Resistance (of D version) VIN=.V, VCE=V 5 Ω ) The maximum Input Voltage of the ELECTRICAL CHARACTERISTICS is 5.5V. In case of exceeding this specification, the IC must be operated on condition that the Input Voltage is up to 5.5V and the total operating time is within 5hrs. All of units are tested and specified under load conditions such that Tj Topt=5 C except for Output Noise, Ripple Rejection, Temperature Coefficient. RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS) All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions. ppm / C 8

9 Dropout Voltage by Set Topt=5 C Set Dropout Voltage VDIF (V) VSET (V) Condition Typ. Max. VSET= VSET= VSET < VSET < VSET <.7 IOUT=3mA VSET < VSET < VSET < VSET The specification in is checked and guaranteed by design engineering at - C Topt 85 C. 9

10 TYPICAL APPLICATIONS VDD VOUT VOUT C RPx Series C CE GND (External Components) C Ceramic.μF MURATA: GRM55B3A5KE5 TECHNICAL NOTES When using these ICs, consider the following points: Phase Compensation In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For this purpose, use a capacitor C with.μf or more and good ESR (Equivalent Series Resistance). (Note: If additional ceramic capacitors are connected with parallel to the output pin with an output capacitor for phase compensation, the operation might be unstable. Because of this, test these ICs with as same external components as ones to be used on the PCB.) PCB Layout Make VDD and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result. Connect a capacitor C with a capacitance value as much as.μf or more between VDD and GND pin, and as close as possible to the pins. Set external components, especially the output capacitor C, as close as possible to the ICs, and make wiring as short as possible.

11 TEST CIRCUITS VDD VOUT C RPx Series C V VOUT IOUT CE GND Basic Test Circuit C=Ceramic.μF C=Ceramic.μF VDD VOUT VOUT A ISS C RPx Series C CE GND C=Ceramic.μF C=Ceramic.μF Test Circuit for Supply Current Pulse Generator P.G. VDD VOUT RPx Series C IOUT CE GND Test Circuit for Ripple Rejection C=Ceramic.μF VDD VOUT VOUT C RPx Series C CE GND IOUTa IOUTb C=Ceramic.μF C=Ceramic.μF Test Circuit for Load Transient Response

12 TYPICAL CHARACTERISTICS ) vs. Output Current (C=.μF, C=.μF, Topt=5 C).9 RPx8xx 3. RPx5xx VOUT (V) VIN=.8V VIN=.8V VIN=3.6V VIN=.V VIN=5.V VIN=5.5V VOUT (V) VIN=3.5V VIN=.V VIN=5.V VIN=5.5V RPx36xx 3.5 VOUT (V) VIN=.6V VIN=5.V VIN=5.5V ) vs. Input Voltage (C=.μF, C=.μF, Topt=5 C) VOUT (V) RPx8xx IOUT=mA IOUT=3mA IOUT=5mA 3 5 Input Voltage VIN (V) VOUT (V) RPx5xx IOUT=mA IOUT=3mA IOUT=5mA 3 5 Input Voltage VIN (V)

13 VOUT (V) RPx36xx IOUT=mA. IOUT=3mA.5 IOUT=5mA 3 5 Input Voltage VIN (V) 3) Supply Current vs. Input Voltage (C=.μF, C=.μF, Topt=5 C) 7 RPx8xx 7 RPx5xx Supply Current ISS (µa) Supply Current ISS (µa) Input Voltage VIN (V) 3 5 Input Voltage VIN (V) RPx36xx 7 Supply Current ISS (µa) Input Voltage VIN (V) 3

14 ) vs. Temperature (C=.μF, C=.μF, IOUT=mA) VOUT (V) RPx8xx VIN=.8V Temperature Topt ( C) VOUT (V) RPx5xx VIN=3.5V Temperature Topt ( C) VOUT (V) RPx36xx VIN=.6V Temperature Topt ( C) 5) Supply Current vs. Temperature (C=.μF, C=.μF, IOUT=mA) 7 RPx8xx VIN=.8V 7 RPx5xx VIN=3.5V Supply Current ISS (μa) Supply Current ISS (μa) Temperature Topt ( C) Temperature Topt ( C)

15 Supply Current ISS (μa) RPx36xx VIN=.6V Temperature Topt ( C) 6) Dropout Voltage vs. Output Current (C=.μF, C=.μF) 7 RPx8xx 3 RPx5xx Dropout Voltage VDIF (mv) C 5 C 85 C Dropout Voltage VDIF (mv) C 5 C 85 C Dropout Voltage VDIF (mv) RPx36xx - C 5 C 85 C

16 7) Dropout Voltage vs. Set (C=.μF, C=.μF, Topt=5 C) 6 Dropout Voltage VDIF (mv) 5 3 IOUT=3mA IOUT=mA IOUT=3mA Set VREG (V) 8) Dropout Voltage vs. Temperature (C=none, C=.μF) 7 RPx8xx 3 RPx5xx Dropout Voltage VDIF (mv) mA 5mA 3mA Dropout Voltage VDIF (mv) mA 5mA 3mA Temperature Topt ( C) Temperature Topt ( C) RPx36xx 5 Dropout Voltage VDIF (mv) 5 5 5mA 5mA 3mA Temperature Topt ( C) 6

17 9) Ripple Rejection vs. Input Voltage (C=none, C=.μF, Ripple=.Vp-p, Topt=5 C) Ripple Rejection RR (db) RPx5xx IOUT=mA khz khz khz Input Voltage VIN (V) Ripple Rejection RR (db) RPx5xx IOUT=3mA khz khz khz Input Voltage VIN (V) ) Ripple Rejection vs. Frequency (C=none, C=.μF, Topt=5 C) Ripple Rejection RR (db) RPx8xx ma 3mA 5mA VIN=3.V. Frequency f (khz) Ripple Rejection RR (db) RPx5xx ma 3mA 5mA VIN=3.5V. Frequency f (khz) Ripple Rejection RR (db) RPx36xx ma 3mA 5mA VIN=.6V. Frequency f (khz) 7

18 ) Input Transient Response (IOUT=3mA, tr=tf=5μs, Topt=5 C) RPx8xx RPx5xx VOUT (V) Input Voltage.8V<-->.8V Input Voltage VIN (V) VOUT (V) Input Voltage 3.5V<-->.5V Input Voltage VIN (V) RPx36xx VOUT (V) Input Voltage.6V<-->5.6V Input Voltage VIN (V) ) Load Transient Response (C=.μF, C=.μF, tr=tf=.5μs, Topt=5 C) VOUT (V) RPx8xx Output Current 5mA<-->mA VIN=.8V VOUT (V) RPx5xx Output Current 5mA<-->mA VIN=3.5V

19 VOUT (V) RPx36xx Output Current 5mA<-->mA VIN=.6V RPx8xx VIN=.8V 5 RPx5xx VIN=3.5V VOUT (V) Output Current ma<-->3ma VOUT (V) Output Current ma<-->3ma RPx36xx VIN=.6V 5 3 VOUT (V) Output Current ma<-->3ma

20 3) Turn On Speed with CE pin (C=.μF, C=.μF, Topt=5 C) RPx8xx VIN=.8V 3 RPx5xx VIN=3.5V 6 Output Voltgage VOUT (V) CE Input Voltage IOUT=mA IOUT=3mA IOUT=3mA 8 6 CE Input Voltage VCE (V) Output Voltgage VOUT (V) 3 CE Input Voltage IOUT=mA IOUT=3mA IOUT=3mA 8 6 CE Input Voltage VCE (V) Output Voltgage VOUT (V) 3 RPx36xx CE Input Voltage IOUT=mA IOUT=3mA IOUT=3mA VIN=.6V CE Input Voltage VCE (V) ) Turn Off Speed with CE pin (B version) (C=.μF, C=.μF, Topt=5 C) RPx8xB VIN=.8V 3 RPx5xB VIN=3.5V 6 Output Voltgage VOUT (V) CE Input Voltage IOUT=mA Time t (ms) CE Input Voltage VCE (V) Output Voltgage VOUT (V) 3 CE Input Voltage IOUT=mA Time t (ms) CE Input Voltage VCE (V)

21 RPx36xB VIN=.6V 6 Output Voltgage VOUT (V) 3 CE Input Voltage IOUT=mA CE Input Voltage VCE (V) Time t (ms) 5) Turn Off Speed with CE pin (D version) (C=.μF, C=.μF, Topt=5 C) RPx8xD VIN=.8V 3 RPx5xD VIN=3.5V 6 Output Voltgage VOUT (V) CE Input Voltage IOUT=mA IOUT=3mA IOUT=3mA CE Input Voltage VCE (V) Output Voltgage VOUT (V) 3 CE Input Voltage IOUT=mA IOUT=3mA IOUT=3mA CE Input Voltage VCE (V) RPx36xD VIN=.6V 6 Output Voltgage VOUT (V) 3 CE Input Voltage IOUT=mA IOUT=3mA IOUT=3mA CE Input Voltage VCE (V)

22 ESR vs. Output Current When using these ICs, consider the following points: The relations between IOUT (Output Current) and ESR of an output capacitor are shown below. The conditions when the white noise level is under μv (Avg.) are marked as the hatched area in the graph. Measurement conditions Frequency Band: Hz to MHz Temperature : C to 85 C C, C :.μf RPx8xx VIN=.V to 5.5V RPx5xx VIN=.5V to 5.5V Topt=85 C Topt=85 C ESR (Ω) Topt=- C ESR (Ω) Topt=- C RPx36xx VIN=3.6V to 5.5V Topt=85 C ESR (Ω) Topt=- C

23 Ricoh presented with the Japan Management Quality Award for 999. Ricoh continually strives to promote customer satisfaction, and shares the achievements of its management quality improvement program with people and society. Ricoh awarded ISO certification. The Ricoh Group was awarded ISO certification, which is an international standard for environmental management systems, at both its domestic and overseas production facilities. Our current aim is to obtain ISO certification for all of our business offices. Ricoh completed the organization of the Lead-free production for all of our products. After Apr., 6, we will ship out the lead free products only. Thus, all products that will be shipped from now on comply with RoHS Directive.