R5323x SERIES. 150mA Dual LDO REGULATOR OUTLINE FEATURES APPLICATIONS NO.EA

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1 SERIES 5mA Dual LDO REGULATOR NO.EA OUTLINE The R5323x Series are CMOS-based voltage regulator ICs with high output voltage accuracy, low supply current, low dropout, and high ripple rejection. Each of these voltage regulator ICs consists of a voltage reference unit, an error amplifier, resistors for setting Output Voltage, a current limit circuit, and a chip enable circuit. These ICs perform with low dropout voltage due to built-in transistor with low ON resistance, and a chip enable function prolongs the battery life of each system. The line transient response and load transient response of the R5323x Series are excellent, thus these ICs are very suitable for the power supply for hand-held communication equipment. The output voltage of these ICs is internally fixed with high accuracy. Since the packages for these ICs are SOT-23-6, DFN(PLP)82-6 and WLCSP-6-P package, dual LDO regulators are included in each package, high density mounting of the ICs on boards is possible. FEATURES Supply Current...Typ. 9µA (VR, VR2) Standby Mode...Typ..µA (VR, VR2) Dropout Voltage...Typ..22V (IOUT=5mA, VOUT=3.V) Ripple Rejection...Typ.75dB(VOUT < = 2.4V),Typ.7dB(VOUT < = 2.5V), (f=khz) Typ.65dB(VOUT < = 2.4V),Typ.6dB(VOUT < = 2.5V), (f=khz) Temperature-drift Coefficient of Output Voltage...Typ. ±ppm/ C Line Regulation...Typ..2%/V Output Voltage Accuracy...±2.% Packages...SOT-23-6, DFN(PLP)82-6, WLCSP-6-P Output Voltage...Stepwise setting with a step of.v in the range of.5v to 4.V is possible Built-in chip enable circuit (A/B: active high) Built-in fold-back protection circuit...typ. 4mA (Current at short mode) Ceramic Capacitor is recommended. (.µf or more) APPLICATIONS Power source for handheld communication equipment. Power source for electrical appliances such as cameras, VCRs and camcorders. Power source for battery-powered equipment.

2 BLOCK DIAGRAMS R5323xxxxA CE VOUT Error Amp. R_ VDD Vref Current Limit R2_ GND R_2 Error Amp. Vref R2_2 CE2 Current Limit VOUT2 R5323xxxxB CE VOUT Error Amp. R_ VDD Vref Current Limit R2_ GND R_2 Error Amp. CE2 Vref Current Limit R2_2 VOUT2 2

3 SELECTION GUIDE The output voltage, mask option, and the taping type for the ICs can be selected at the user's request. The selection can be made with designating the part number as shown below; R5323xxxxx-xx-x Part Number a b c d e Code a b c d e Designation of Package Type: N : SOT-23-6 K : DFN(PLP)82-6 Z : WLCSP-6-P Contents Setting combination of dual Output Voltage (VOUT) : Serial Number for Voltage Setting, Stepwise setting with a step of.v in the range of.5v to 4.V is possible for each channel. Designation of Mask Option: A version: without auto discharge function* at OFF state. B version: with auto discharge function* at OFF state. Designation of Taping Type: Ex. TR (refer to Taping Specifications; TR type is the standard direction.) Designation of composition of plating: F : Lead free plating (SOT-23-5, WLCSP-6-P) None : Au plating (DFN(PLP)82-6) *) When the mode is into standby with CE signal, auto discharge transistor turns on, and it makes the turn-off speed faster than normal type. 3

4 PIN CONFIGURATION SOT DFN(PLP)82-6 Top View Bottom View (mark side) Mark Side WLCSP-6-P Bump Side PIN DESCRIPTIONS SOT-23-6 DFN(PLP)82-6 Pin No. Symbol Description Pin No. Symbol Description VOUT Output Pin VOUT2 Output Pin 2 2 VDD Input Pin 2 VDD Input Pin 3 VOUT2 Output Pin 2 3 VOUT Output Pin 4 CE2 Chip Enable Pin 2 4 GND Ground Pin 5 GND Ground Pin 5 CE Chip Enable Pin 6 CE Chip Enable Pin 6 CE2 Chip Enable Pin 2 WLCSP-6-P Pin No. Symbol Description VOUT Output Pin 2 VDD Input Pin 3 VOUT2 Output Pin 2 4 CE2 Chip Enable Pin 2 5 GND Ground Pin 6 CE Chip Enable Pin ) Tab in the parts have GND level. (They are connected to the back side of this IC.) Do not connect to other wires or land patterns. 4

5 ABSOLUTE MAXIMUM RATINGS Symbol Item Rating Unit VIN Input Voltage 6.5 V VCE Input Voltage (CE Pin).3 to 6.5 V VOUT Output Voltage.3 to VIN +.3 V IOUT Output Current 2 ma IOUT2 Output Current 2 2 ma Power Dissipation (SOT-23-6)* 42 PD Power Dissipation (DFN(PLP)82-6) * 88 mw Power Dissipation (WLCSP-6-P) 633 Topt Operating Temperature Range 4 to 85 C Tstg Storage Temperature Range 55 to 25 C ) For Power Dissipation, please refer to PACKAGE INFORMATION to be described. ABSOLUTE MAXIMUM RATINGS Absolute Maximum ratings are threshold limit values that must not be exceeded ever for an instant under any conditions. Moreover, such values for any two items must not be reached simultaneously. Operation above these absolute maximum ratings may cause degradation or permanent damage to the device. These are stress ratings only and do not necessarily imply functional operation below these limits. 5

6 ELECTRICAL CHARACTERISTICS R5323xxxxA/B Topt=25 C Symbol Item Conditions Min. Typ. Max. Unit VOUT Output voltage VIN=Set VOUT+V ma < = IOUT < = 3mA.98.2 V IOUT Output Current VIN VOUT =.V 5 ma VOUT/ IOUT Load regulation VIN=Set VOUT+V ma < = IOUT < = 5mA VDIF Dropout Voltage IOUT=5mA 5 4 mv VOUT= VOUT= VOUT= V < = VOUT < = 2.V V < = VOUT < = 2.7V V < = VOUT < = 4.V ISS Supply Current VIN=Set VOUT+V 9 2 µa Istandby VOUT/ VIN RR Standby Current Line regulation Ripple Rejection VIN=Set VOUT+V VCE=GND Set VOUT+.5V < = VIN < = 6.V IOUT=3mA Ripple.5Vp-p VIN=Set VOUT+V IOUT=3mA (In case that VOUT < =.7V, VIN=Set VOUT+.2V) V.. µa.2. %/V 75 Note 65 Note2 VIN Input Voltage V VOUT/ Topt Output Voltage Temperature Coefficient IOUT=3mA 4 C < = Topt < = 85 C Ilim Short Current Limit VOUT=V 4 ma RPD Pull-down resistance for CE pin MΩ VCEH CE Input Voltage H.5 6. V VCEL CE Input Voltage L.3 V en Output Noise BW=Hz to khz 3 µvrms RLOW Low Output Nch Tr. ON Resistance (of B version) Note: f=khz, 7dB as to VOUT > = 2.5V Output type. Note2: f=khz, 6dB as to VOUT > = 2.5V Output type. ± VCE=V 6 Ω db ppm / C 6

7 TYPICAL APPLIATION IN CE2 VOUT2 R5323x Series VDD GND C3 OUT2 C CE VOUT OUT C2 C=C2=C3=Ceramic.µF TECHNICAL NOTES When using these ICs, consider the following points: Phase Compensation In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For this purpose, use a capacitor C2 and C3 with good frequency characteristics and ESR (Equivalent Series Resistance). (Note: If additional ceramic capacitors are connected with parallel to the output pin with an output capacitor for phase compensation, the operation might be unstable. Because of this, test these ICs with as same external components as ones to be used on the PCB.) PCB Layout Make VDD and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result. Connect a capacitor C with a capacitance value as much as.µf or more between VDD and GND pin, and as close as possible to the pins. Set external components, especially the output capacitor C2 and C3, as close as possible to the ICs, and make wiring as short as possible. 7

8 TEST CIRCUIT CE2 VOUT2 R5323x Series VDD GND C3 V VOUT2 IOUT2 ISS A CE2 VOUT2 R5323x Series VDD GND C3 C CE VOUT C2 V VOUT IOUT C CE VOUT C2 Fig. Standard test Circuit C=C2=C3=Ceramic.µF C=C2=C3=Ceramic.µF Fig.2 Supply Current Test Circuit CE2 VOUT2 R5323x Series VDD GND C3 IOUT2 CE2 VOUT2 R5323x Series VDD GND C3 IOUT2a Pulse Generator PG CE VOUT C2 IOUT C CE VOUT IOUT2b C2 IOUTb IOUTa C2=C3=Ceramic.µF Fig.3 Ripple Rejection, Line Transient Response Test Circuit C=C2=C3=Ceramic.µF Fig.4 Load Transient Response Test Circuit 8

9 TYPICAL CHARACTERISTICS ) Output Voltage vs. Output Current (Topt=25 C).5V (VR).5V (VR2) VIN=.8V VIN=2.V VIN=3.5V VIN=2.5V VIN=.8V VIN=2.V VIN=3.5V VIN=2.5V V (VR) 2.8V (VR2) VIN=3.V VIN=4.8V VIN=3.V VIN=4.8V V (VR) 4.V (VR2) 5 VIN=6.V VIN=4.3V 4 VIN=4.3V 3 2 VIN=6.V

10 2) Output Voltage vs. Input Voltage (Topt=25 C).5V (VR).5V (VR2) ma 3mA 5mA ma 3mA 5mA V (VR) 2.8V (VR2) ma 3mA 5mA ma 3mA 5mA V (VR) 4.V (VR2) ma 3mA 5mA ma 3mA 5mA

11 3) Dropout Voltage vs. Output Current.5V (VR).5V (VR2) Dropout Voltage VDIF(V) Topt= 85 C 25 C -4 C Dropout Voltage VDIF(V) Topt= 85 C 25 C -4 C Dropout Voltage VDIF(V) Dropout Voltage VDIF(V) V (VR) 2.8V (VR2).4 Topt= 85 C Topt= 85 C 25 C C -4 C.3-4 C Dropout Voltage VDIF(V) V (VR) 4.V (VR2).4 Topt= 85 C Topt= 85 C 25 C C -4 C.3-4 C Dropout Voltage VDIF(V)

12 4) Output Voltage vs. Temperature.5V (VR).5V (VR2).54 VIN=2.5V, IOUT=3mA Temperature Topt( C).54 VIN=2.5V, IOUT=3mA Temperature Topt( C) V (VR) 2.8V (VR2) VIN=3.8V, IOUT=3mA 2.86 VIN=3.8V, IOUT=3mA Temperature Topt( C) Temperature Topt( C) V (VR) 4.V (VR2) VIN=5.V, IOUT=3mA 4.8 VIN=5.V, IOUT=3mA Temperature Topt( C) Temperature Topt( C) 2

13 5) Supply Current vs. Input Voltage (Topt=25 C).5V 2.8V Supply Current ISS(µA) VR VR2 Supply Current ISS(µA) VR VR2 4.V Supply Current ISS(µA) VR VR2 6) Supply Current vs. Temperature.5V (VR).5V (VR2) VIN=2.5V VIN=2.5V Supply Current ISS(µA) Supply Current ISS(µA) Temperature Topt( C) Temperature Topt( C) 3

14 2.8V (VR) 2.8V (VR2) VIN=3.8V VIN=3.8V Supply Current ISS(µA) Supply Current ISS(µA) Temperature Topt( C) Temperature Topt( C) 4.V (VR) 4.V (VR2) VIN=5.V VIN=5.V Supply Current ISS(µA) Supply Current ISS(µA) Temperature Topt( C) Temperature Topt( C) 7) Dropout Voltage vs. Set Output Voltage (Topt=25 C) VR Dropout Voltage VDIF(V) ma 3mA 5mA 5mA Dropout Voltage VDIF(V) VR2 ma 3mA 5mA 5mA Set Output Voltage Vreg(V) Set Output Voltage Vreg(V) 4

15 8) Ripple Rejection vs. Frequency (Topt=25 C).5V (VR).5V (VR2) VIN=2.5V+.5Vp-p, COUT=Ceramic.µF IOUT=mA IOUT=3mA IOUT=5mA. Frequency f(khz) VIN=2.5V+.5Vp-p, COUT=Ceramic.µF IOUT=mA IOUT=3mA IOUT=5mA. Frequency f(khz).5v (VR).5V (VR2) VIN=2.5V+.5Vp-p, COUT=Ceramic 2.2µF VIN=2.5V+.5Vp-p, COUT=Ceramic 2.2µF 2 IOUT=mA 2 IOUT=mA IOUT=3mA IOUT=3mA IOUT=5mA IOUT=5mA.. Frequency f(khz) Frequency f(khz) 2.8V (VR) 2.8V (VR2) VIN=3.8V+.5Vp-p, COUT=Ceramic.µF VIN=3.8V+.5Vp-p, COUT=Ceramic.µF 2 IOUT=mA 2 IOUT=mA IOUT=3mA IOUT=3mA IOUT=5mA IOUT=5mA.. Frequency f(khz) Frequency f(khz) 5

16 2.8V (VR) 2.8V (VR2) VIN=3.8V+.5Vp-p, COUT=Ceramic 2.2µF VIN=3.8V+.5Vp-p, COUT=Ceramic 2.2µF 2 IOUT=mA 2 IOUT=mA IOUT=3mA IOUT=3mA IOUT=5mA IOUT=5mA.. Frequency f(khz) Frequency f(khz) 4.V (VR) 4.V (VR2) VIN=5.V+.5Vp-p, COUT=Ceramic.µF VIN=5.V+.5Vp-p, COUT=Ceramic.µF 2 IOUT=mA 2 IOUT=mA IOUT=3mA IOUT=3mA IOUT=5mA IOUT=5mA.. Frequency f(khz) Frequency f(khz) 4.V (VR) 4.V (VR2) VIN=5.V+.5Vp-p, COUT=Ceramic 2.2µF VIN=5.V+.5Vp-p, COUT=Ceramic 2.2µF 2 IOUT=mA 2 IOUT=mA IOUT=3mA IOUT=3mA IOUT=5mA IOUT=5mA.. Frequency f(khz) Frequency f(khz) 6

17 9) Ripple Rejection vs. Input Voltage (DC bias) (COUT=Ceramic.µF, Topt=25 C) 2.8V (VR) 2.8V (VR2) IOUT=mA f=khz f=khz f=khz IOUT=mA V (VR) 2.8V (VR2) IOUT=3mA f=khz 2 f=khz f=khz f=khz f=khz f=khz IOUT=3mA V (VR) 2.8V (VR2) IOUT=5mA f=khz 2 f=khz f=khz f=khz f=khz f=khz IOUT=5mA f=khz f=khz f=khz 7

18 ) Input Transient Response (IOUT=3mA, tr=tf=5µs) R5323Nx(2.8V, VR) IOUT=3mA, tr=tf=5µs, COUT=Ceramic.µF VIN VOUT Time T(µs) R5323Nx(2.8V, VR) Topt=25 C, COUT=Ceramic 2.2µF VIN VOUT Time T(µs) R5323Nx(2.8V, VR) Topt=25 C, COUT=Ceramic 4.4µF VIN VOUT Time T(µs) 8

19 R5323Nx(2.8V, VR2) Topt=25 C, COUT=Ceramic.µF VIN VOUT Time T(µs) R5323Nx(2.8V, VR2) Topt=25 C, COUT=Ceramic 2.2µF VIN VOUT Time T(µs) R5323Nx(2.8V, VR2) Topt=25 C, COUT=Ceramic 4.4µF VIN VOUT Time T(µs) 9

20 ) Load Transient Response 2.8V (VR) 2.8V (VR2) CIN=Ceramic.µF, COUT=Ceramic.µF 5 IOUT 5 VOUT VOUT2 IOUT2=3mA CIN=Ceramic.µF, COUT=Ceramic.µF VOUT VOUT2 IOUT2 IOUT=3mA 5 5 Output Current IOUT2(mA) Time T(µs) Time T(µs) 2.8V (VR) 2.8V (VR2) CIN=Ceramic.µF, COUT=Ceramic 4.4µF CIN=Ceramic.µF, COUT=Ceramic.µF IOUT IOUT VOUT 2.85 VOUT IOUT=3mA VOUT IOUT2=3mA Time T(µs) VOUT Time T(µs) Output Current IOUT2(mA) 2.8V (VR2) 2.8V (VR2) CIN=Ceramic.µF, COUT=Ceramic 2.2µF CIN=Ceramic.µF, COUT=Ceramic 4.4µF IOUT2 IOUT VOUT 2.85 VOUT IOUT=3mA 2.75 IOUT=3mA VOUT2 Output Current IOUT2(mA) VOUT2 5 5 Output Current IOUT2(mA) Time T(µs) Time T(µs) 2

21 2) Minimum Operating Voltage.5V Minimum Operating Voltage Range 2.3 VDD(V) VDD.6 VIN(MIN)

22 ESR vs. Output Current When using these ICs, consider the following points: The relations between IOUT (Output Current) and ESR of an output capacitor are shown below. The conditions when the white noise level is under 4µV (Avg.) are marked as the hatched area in the graph. Measurement conditions Frequency Band : Hz to 2MHz (BW=3Hz) Temperature : 25 C R5323N/K.5V (VR) VIN=2.5V CIN=COUT=Ceramic.µF R5323N/K.5V (VR2) VIN=2.5V CIN=COUT=Ceramic.µF ESR(Ω) ESR(Ω) R5323N/K 2.8V (VR) VIN=3.8V CIN=COUT=Ceramic.µF R5323N/K 2.8V (VR2) VIN=3.8V CIN=COUT=Ceramic.µF ESR(Ω) ESR(Ω)

23 R5323Z.5V (VR/VR2) VIN=2.5V CIN=COUT=Ceramic.µF R5323Z 2.8V (VR/VR2) VIN=3.8V CIN=COUT=Ceramic.µF ESR(Ω) ESR(Ω)

24 PACKAGE INFORMATION PE-SOT SOT-23-6 (SC-74) PACKAGE DIMENSIONS Unit: mm 2.9±.2.9±.2 (.95) (.95) ± ±.3 to Min. TAPING SPECIFICATION.3±. φ ±. 2.± ±.5.75± ± Max. 4.±. TR.±. User Direction of Feed TAPING REEL DIMENSIONS REUSE REEL (EIAJ-RRM-8Bc) (reel=3pcs).4±. 9.±.3 3±.2 2±.5 2±

25 PACKAGE INFORMATION PE-SOT POWER DISSIPATION (SOT-23-6) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Standard Land Pattern Environment Mounting on Board (Wind velocity=m/s) Board Material Glass cloth epoxy plactic (Double sided) Board Dimensions 4mm 4mm.6mm Copper Ratio Top side : Approx. 5%, Back side : Approx. 5% Through-hole φ.5mm 44pcs Measurement Result (Topt=25 C,Tjmax=25 C) Standard Land Pattern Free Air Power Dissipation 42mW 25mW Thermal Resistance θja=(25 25 C)/.42W=263 C/W 4 C/W 6 Power Dissipation PD(mW) On Board Ambient Temperature ( C) Power Dissipation Measurement Board Pattern IC Mount Area Unit : mm RECOMMENDED LAND PATTERN.7 MAX (Unit: mm)

26 PACKAGE INFORMATION PE-DFN(PLP) DFN(PLP)82-6 PACKAGE DIMENSIONS Unit: mm A.8 B.6±..2±..5 M AB ±..25±..25±. INDEX 3.5 TAPING SPECIFICATION.5.6Max..NOM. Bottom View.3±. Attention: Tabs or Tab suspension leads in the parts have VDD or GND level.(they are connected to the reverse side of this IC.) Refer to PIN DISCRIPTION. Do not connect to other wires or land patterns..25± ±. 2.±.5 3.5±.5 8.±.3.75±. 2.4.±. 2.2.Max. 4.±. User Direction of Feed TAPING REEL DIMENSIONS REUSE REEL (EIAJ-RRM-8Bc) (reel=5pcs) (R5323K,R5325K : reel=3pcs) TR.4±. 9.±.3 3±.2 2±.5 2±

27 PACKAGE INFORMATION PE-DFN(PLP) POWER DISSIPATION (DFN(PLP)82-6) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Standard Land Pattern Environment Mounting on Board (Wind velocity=m/s) Board Material Glass cloth epoxy plastic (Double sided) Board Dimensions 4mm 4mm.6mm Copper Ratio Top side : Approx. 5%, Back side : Approx. 5% Through-hole φ.54mm 3pcs Measurement Result Power Dissipation Thermal Resistance (Topt=25 C,Tjmax=25 C) Standard Land Pattern 88mW θja=(25 25 C)/.88W=4 C/W 2 Power Dissipation PD(mW) On Board Ambient Temperature ( C) Power Dissipation Measurement Board Pattern IC Mount Area Unit : mm RECOMMENDED LAND PATTERN (Unit: mm)

28 PACKAGE INFORMATION PE-WLCSP-6-P-6 WLCSP-6-P PACKAGE DIMENSIONS Unit: mm A.29 B.5.5 X INDEX. S.4±.2 Bottom View.6±.3.5 M SAB S.6 S.8±.3 TAPING SPECIFICATION.8± ±. 2.±.5.75±..8± ±. 2.±.5.75±. 2.± ±.5 8.±.3 2.± ±.5 8.±.3 Dummy Pocket.5± Dummy Pocket.5± Max. 4.±..2Max. 4.±. E2 User Direction of Feed The TAPING SPECIFICATION becomes one kind in each product. Please reter to SELECTION GUIDE for details. TR User Direction of Feed TAPING REEL DIMENSIONS REUSE REEL (EIAJ-RRM-8Bc) (reel=5pcs : E2 Type) (reel=3pcs : TR Type).4±. 9.±.3 3±.2 2± ±.8

29 PACKAGE INFORMATION PE-WLCSP-6-P-6 POWER DISSIPATION (WLCSP-6-P) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Environment Board Material Board Dimensions Standard Land Pattern Mounting on Board (Wind velocity=m/s) Glass cloth epoxy plactic (Double sided) 4mm 4mm.6mm Copper Ratio Top side : Approx. 5%, Back side : Approx. 5% Through-hole Measurement Result Power Dissipation Thermal Resistance (Topt=25 C,Tjmax=25 C) Standard Land Pattern 633mW θja=(25 25 C)/.633W=58 C/W Power Dissipation PD(mW) On Board Ambient Temperature ( C) Measurement Board Pattern Power Dissipation IC Mount Area (Unit : mm)

30 PACKAGE INFORMATION PE-WLCSP-6-P-6 RECOMMENDED LAND PATTERN (WLCSP) Solder Mask (resist) Copper Pad NSMD Substrate SMD NSMD and SMD Pad Definition (Unit : mm) Pad definition Copper Pad Solder Mask Opening NSMD (Non-Solder Mask defined).2mm Min..3mm SMD (Solder Mask defined) Min..3mm.2mm * Pad layout and size can be modified by customers material, equipment, method. * Please adjust pad layout according to your conditions. * Recommended Stencil Aperture Size...ø.3mm * Since lead free WL-CSP components are not compatible with the tin/lead solder process, you shall not mount lead free WL-CSP components using the tin/lead solder paste.

31 MARK INFORMATION ME-R5323N-77 R5323N SERIES MARK SPECIFICATION SOT-23-6 (SC-74), 2 : Product Code (refer to Part Number vs. Product Code) 3, 4 : Lot Number Part Number vs. Product Code Part Number Product Code Set VOUT 2 VR VR2 Part Number Product Code Set VOUT 2 VR VR2 Part Number Product Code Set VOUT 2 VR VR2 R5323NB N 2.8V 2.8V R5323N3B N Z 2.7V 3.V R5323NA U G 2.8V 2.8V R5323N2B N 2.9V 2.9V R5323N3B U.9V 2.8V R5323N2A N 9 2.9V 2.9V R5323N3B N 2 3.V 3.V R5323N32B U 2.5V 2.8V R5323N3A N A 3.V 3.V R5323N4B N 3.8V.8V R5323N33B U 2 2.4V 3.V R5323N3A N C.8V 3.3V R5323N5B N 4 2.7V 2.7V R5323N34B U 3 2.5V 2.9V R5323N9A N J 2.8V 3.V R5323N6B N 5 2.5V 2.5V R5323N35B U 4.5V 2.7V R5323N2A N L.5V 2.9V R5323N7B N 6.5V.5V R5323N36B U 5 2.6V 2.9V R5323N23A N Q 2.8V 3.3V R5323N8B N 7 2.8V 4.V R5323N37B U 7.8V 2.6V R5323N24A N S 3.V 3.V R5323N9B N 8 2.5V 2.7V R5323N38B U 8.7V 2.8V R5323N3A N Y 2.7V 3.V R5323NB N B 2.6V 2.6V R5323N39B U 9.8V 3.V R5323NB U 6 3.3V 3.V R5323N4B U A.8V 3.V R5323N2B N W 3.3V 2.5V R5323N4B U B 2.7V.8V R5323N3B N T.8V 3.3V R5323N42B U C 3.3V 3.3V R5323N4B N D 2.8V 2.9V R5323N43B U H 2.7V 2.85V R5323N5B N E.5V 3.3V R5323N44B U J 2.6V 3.3V R5323N6B N F.5V 2.8V R5323N45B U K.5V 2.85V R5323N7B N G.5V 2.5V R5323N46B U L.5V 3.V R5323N8B N H 3.2V 3.V R5323N47B U M 2.6V 2.8V R5323N9B N K 2.8V 3.V R5323N2B N M.5V 2.9V R5323N2B N N 2.9V.8V R5323N22B N P 2.8V.8V R5323N23B N R 2.8V 3.3V R5323N24B U D 3.V 3.V R5323N25B U E 2.9V 3.V R5323N26B N X 3.3V.9V R5323N27B N U.8V 2.5V R5323N28B U F 3.V 3.V R5323N29B N V 2.85V 2.85V

32 MARK INFORMATION ME-R5323K-77 R5323K SERIES MARK SPECIFICATION DFN(PLP)82-6 to 4 : Product Code (refer to Part Number vs. Product Code) 2 3 5, 6 : Lot Number Part Number vs. Product Code Part Number Product Code Set VOUT VR VR2 Part Number Product Code Set VOUT VR VR2 Part Number Product Code Set VOUT VR VR2 R5323KB C 2.8V 2.8V R5323K3B C V 3.V R5323KA C 5 2.8V 2.8V R5323K2B C 2 2.9V 2.9V R5323K3B C 3 5.9V 2.8V R5323K2A C 2.9V 2.9V R5323K3B C 3 3.V 3.V R5323K32B C V 2.8V R5323K3A C 3.V 3.V R5323K4B C 4.8V.8V R5323K33B C V 3.V R5323K3A C 3.8V 3.3V R5323K5B C 5 2.7V 2.7V R5323K34B C V 2.9V R5323K9A C 9 2.8V 3.V R5323K6B C 6 2.5V 2.5V R5323K35B C 3 9.5V 2.7V R5323K2A C 2.5V 2.9V R5323K7B C 7.5V.5V R5323K36B C 4 2.6V 2.9V R5323K23A C V 3.3V R5323K8B C 8 2.8V 4.V R5323K37B C 4 2.8V 2.6V R5323K24A C V 3.V R5323K9B C 9 2.5V 2.7V R5323K38B C 4 3.7V 2.8V R5323K3A C V 3.V R5323KB C 2 2.6V 2.6V R5323K39B C 4 4.8V 3.V R5323KB C 4 3.3V 3.V R5323K4B C 4 5.8V 3.V R5323K2B C 3 3.3V 2.5V R5323K4B C V.8V R5323K3B C 2 8.8V 3.3V R5323K42B C V 3.3V R5323K4B C 4 2.8V 2.9V R5323K43B C V 2.85V R5323K5B C 5.5V 3.3V R5323K44B C V 3.3V R5323K6B C 6.5V 2.8V R5323K45B C 5 4.5V 2.85V R5323K7B C 7.5V 2.5V R5323K46B C 5 5.5V 3.V R5323K8B C 8 3.2V 3.V R5323K47B C V 2.8V R5323K9B C 2 2.8V 3.V R5323K2B C 2 2.5V 2.9V R5323K2B C V.8V R5323K22B C V.8V R5323K23B C V 3.3V R5323K24B C V 3.V R5323K25B C V 3.V R5323K26B C V.9V R5323K27B C 2 9.8V 2.5V R5323K28B C 5 3.V 3.V R5323K29B C V 2.85V

33 MARK INFORMATION ME-R5323Z-77 R5323Z SERIES MARK SPECIFICATION WLCSP-6-P : G (Fixed) 2 3 2, 3 : Lot Number Product Code vs. Marking Part Number Product Code Set VOUT VR VR2 Part Number Product Code Set VOUT VR VR2 Part Number Product Code Set VOUT VR VR2 Part Number Product Code Set VOUT VR VR2 R5323ZA G 2.8V 2.8V R5323Z36A G 2.6V 2.9V R5323ZB G 2.8V 2.8V R5323Z36B G 2.6V 2.9V R5323Z2A G 2.9V 2.9V R5323Z37A G.8V 2.6V R5323Z2B G 2.9V 2.9V R5323Z37B G.8V 2.6V R5323Z3A G 3.V 3.V R5323Z38A G.7V 2.8V R5323Z3B G 3.V 3.V R5323Z38B G.7V 2.8V R5323Z4A G.8V.8V R5323Z39A G.8V 3.V R5323Z4B G.8V.8V R5323Z39B G.8V 3.V R5323Z5A G 2.7V 2.7V R5323Z4A G.8V 3.V R5323Z5B G 2.7V 2.7V R5323Z4B G.8V 3.V R5323Z6A G 2.5V 2.5V R5323Z4A G 2.7V.8V R5323Z6B G 2.5V 2.5V R5323Z4B G 2.7V.8V R5323Z7A G.5V.5V R5323Z42A G 3.3V 3.3V R5323Z7B G.5V.5V R5323Z42B G 3.3V 3.3V R5323Z8A G 2.8V 4.V R5323Z43A G 2.7V 2.85V R5323Z8B G 2.8V 4.V R5323Z43B G 2.7V 2.85V R5323Z9A G 2.5V 2.7V R5323Z44A G 2.6V 3.3V R5323Z9B G 2.5V 2.7V R5323Z44B G 2.6V 3.3V R5323ZA G 2.6V 2.6V R5323Z45A G.5V 2.85V R5323ZB G 2.6V 2.6V R5323Z45B G.5V 2.85V R5323ZA G 3.3V 3.V R5323Z46A G.5V 3.V R5323ZB G 3.3V 3.V R5323Z46B G.5V 3.V R5323Z2A G 3.3V 2.5V R5323Z47A G 2.6V 2.8V R5323Z2B G 3.3V 2.5V R5323Z47B G 2.6V 2.8V R5323Z3A G.8V 3.3V R5323Z3B G.8V 3.3V R5323Z4A G 2.8V 2.9V R5323Z4B G 2.8V 2.9V R5323Z5A G.5V 3.3V R5323Z5B G.5V 3.3V R5323Z6A G.5V 2.8V R5323Z6B G.5V 2.8V R5323Z7A G.5V 2.5V R5323Z7B G.5V 2.5V R5323Z8A G 3.2V 3.V R5323Z8B G 3.2V 3.V R5323Z9A G 2.8V 3.V R5323Z9B G 2.8V 3.V R5323Z2A G.5V 2.9V R5323Z2B G.5V 2.9V R5323Z2A G 2.9V.8V R5323Z2B G 2.9V.8V R5323Z22A G 2.8V.8V R5323Z22B G 2.8V.8V R5323Z23A G 2.8V 3.3V R5323Z23B G 2.8V 3.3V R5323Z24A G 3.V 3.V R5323Z24B G 3.V 3.V R5323Z25A G 2.9V 3.V R5323Z25B G 2.9V 3.V R5323Z26A G 3.3V.9V R5323Z26B G 3.3V.9V R5323Z27A G.8V 2.5V R5323Z27B G.8V 2.5V R5323Z28A G 3.V 3.V R5323Z28B G 3.V 3.V R5323Z29A G 2.85V 2.85V R5323Z29B G 2.85V 2.85V R5323Z3A G 2.7V 3.V R5323Z3B G 2.7V 3.V R5323Z3A G.9V 2.8V R5323Z3B G.9V 2.8V R5323Z32A G 2.5V 2.8V R5323Z32B G 2.5V 2.8V R5323Z33A G 2.4V 3.V R5323Z33B G 2.4V 3.V R5323Z34A G 2.5V 2.9V R5323Z34B G 2.5V 2.9V R5323Z35A G.5V 2.7V R5323Z35B G.5V 2.7V