R1501x SERIES. 1A LDO REGULATOR (Operating Voltage up to 24V) OUTLINE FEATURES APPLICATIONS NO.EA

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1 R5x SERIES A LDO REGULATOR (Operating Voltage up to 24V) NO.EA OUTLINE The R5x series are CMOS-based positive voltage regulator (VR) ICs. The R5xxxxB has features of high input voltage operating, A output current drive, and low supply current. A DMOS transistor is used for the driver, high voltage operating and low on resistance (.Ω at VOUT=V) device is realized. A standard regulator circuit with a current limit circuit and a thermal shutdown circuit are built in the R5x series. As the operating temperature range is from -4 C to 5 C and maximum input voltage is up to 24V, the R5x series are suitable for the constant voltage source for digital home appliances and car accessories. The regulator output voltage is fixed in the R5x. Output voltage accuracy is ±2.% and output voltage range is from 3.V to 2.V with a step of.v, and from 2.5V to 8.V with a step of.5v. The chip enable pin realizes ultra low supply current standby mode. Since the packages for these ICs are the HSOP-J for high density mounting of the ICs on boards, and the TO P2. ) The DMOS (Double Diffused MOS) transistor adopted by R5x is characterized by a double diffusion structure which comprises a low density n-type (channel) diffused layer and a high density p-type (sources) diffused layer from the edge of the gate electrode. The R5x series possess outstanding properties of high operating voltage and low on-resistance, which have been achieved by the channel length scaled down to submicron dimensions and decreased thickness of the gate oxide film. FEATURES Input Voltage Range...3.V to 24.V Supply Current...Typ. 7µA Standby Current...Typ..µA Ripple Rejection...Typ. db (VOUT=5.V) Temperature-Drift Coefficient of...typ. ±ppm/ C Output Current...Min. A Line Regulation...Typ..5%/V Accuracy...±2% Packages...HSOP-J, TO P2...Stepwise setting with a step of.v in the range of 3.V to 2.V, and with a step of.5v in the range of 2.5V to 8.V is possible. Built-in Current Limit Circuit Built-in Fold-Back Circuit Built-in Thermal Shutdown Circuit Operating Temperature range... 4 C to 5 C APPLICATIONS Power source for home appliances such as refrigerators, rice cookers, electoric water warmers, etc. Power source for car audio equipment, car navigation system, ETC system, etc. Power source for notebook PCs, digital TVs, cordless phones, and private LAN system, etc. Power source for office equipment machines such as copiers, printers, facsimiles, scanners, projectors, etc.

2 R5x BLOCK DIAGRAMS R5xxxxB VDD Thermal Shutdown Circuit VOUT CE Vref Short Protection Current Limit GND SELECTION GUIDE The output voltage, the active type, and the taping type for the ICs can be selected at the user s request. The selection can be made with designating the part number as shown below; R5xxxxB-xx-x Part Number a b c d e Code a b c d e Designation of Package Type: S: HSOP-J J: TO P2 Contents Setting (VOUT): Stepwise setting with a step of.v in the range of 3.V to 2.V, and with a step of.5v in the range of 2.5V to 8.V is possible. Designation of Active Type: B: active high Designation of Taping Type: E2: HSOP-J T: TO P2 (Refer to Taping Specifications) Designation of composition of pin plating: -F: Lead free solder plating (HSOP-J, TO P2) 2

3 R5x PIN CONFIGURATIONS HSOP-J TO P PIN DESCRIPTIONS HSOP-J TO P2 Pin No. Symbol Description Pin No. Symbol Description VDD Input Pin VDD Input Pin 2 GND* Ground Pin 2 GND* Ground Pin 3 GND* Ground Pin 3 GND* Ground Pin 4 CE Chip Enable Pin ("H" Active) 4 CE Chip Enable Pin ("H" Active) 5 GND* Ground Pin 5 VOUT Output Pin VOUT Output Pin *) No.2, No.3 and No.5 pins must be wired short each other and connected to the GND plane when it is mounted on board. *) No.2 and No.3 pins must be wired short each other and connected to the GND plane when it is mounted on board. 3

4 R5x ABSOLUTE MAXIMUM RATINGS Symbol Item Rating Unit VIN Input Voltage.3 to 3 V VCE Input Voltage (CE Pin).3 to VIN +.3 < = 3 V VOUT.3 to VIN +.3 < = 3 V IOUT Output Current 2. A PD Power Dissipation (HSOP-J)* 7 Power Dissipation (TO P2)* 9 Topt Operating Temperature Range 4 to 5 C Tj Operating Junction Temperature Range 4 to 25 C Tstg Storage Temperature Range 55 to 25 C *) For Power Dissipation, please refer to PACKAGE INFORMATION to be described. mw ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages and may degrade the life time and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured. RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS) All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions. 4

5 R5x ELECTRICAL CHARACTERISTICS R5xxxxB VIN=VOUT+.V, VCE=VIN, unless otherwise noted. The specification in is checked and guaranteed by design engineering at 4 C < = Topt < = 5 C. Topt=25 C Symbol Item Conditions Min. Typ. Max. Unit VIN Input Voltage 3 24 V ISS Supply Current VIN=24V, IOUT=A 7 µa Istandby Standby Current VIN=24V, VCE=V.. µa VOUT IOUT=mA Topt=25 C.98.2 V 4 C < = Topt < = 5 C V IOUT Output Current A VOUT / IOUT VOUT / VIN VDIF VOUT / Topt Load Regulation.mA < = IOUT < = 2mA 25 mv.ma < = IOUT < = A guaranteed by design engineering 25 3 mv Line Regulation VOUT+V < = VIN < = 24V, IOUT=mA.5. %/V Dropout Voltage Temperature Coefficient IOUT=2mA IOUT=A guaranteed by design engineering IOUT=mA 4 C < = Topt < = 5 C 3.V < = VOUT < 5.V V < = VOUT < 9.V V < = VOUT < 2.V V < = VOUT < = 8.V V < = VOUT < 5.V V < = VOUT < 9.V V < = VOUT < 2.V V < = VOUT < = 8.V.45.7 Ilim Short Current Limit VOUT=V 5 ma RR Ripple Rejection f=khz, Ripple.5Vp-p, IOUT=mA, VIN=VOUT+2V ± VOUT < =.V VOUT >.V 5 VCEH CE Input Voltage "H" 2. VIN V VCEL CE Input Voltage "L".5 V TTSD TTSR Thermal Shutdown Temperature Thermal Shutdown Released Temperature Junction Temperature C Junction Temperature 35 C All of unit are tested and specified under load conditions such that Topt=25 C except for Temperature Coefficient, Ripple Rejection, Thermal Shutdown Temperature, Thermal Shutdown Released Temperature, Load Regulation at.ma < = IOUT < = A, Dropout Voltage at IOUT=A. V V ppm / C db 5

6 R5x TYPICAL APPLICATION VDD VOUT VOUT C R5x Series C2 CE GND C=Ceramic.47µF C2=Ceramic µf (External Components) C2: Ceramic µf MURATA: GRM32DB3EK (size: 3225) TECHNICAL NOTES When using these ICs, consider the following points: Phase Compensation In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For this purpose, use a capacitor C2 with good frequency characteristics and ESR (Equivalent Series Resistance). If you use a tantalum type capacitor and ESR value of the capacitor is large, output might be unstable. Evaluate your circuit with considering frequency characteristics. Depending on the capacitor size, manufacturer, and part number, the bias characteristics and temperature characteristics are different. Evaluate the circuit with actual using capacitors. PCB Layout Make VDD and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result. Connect a capacitor C with a capacitance value as much as.47µf or more between VDD and GND pin, and as close as possible to the pins. Set external components, especially the output capacitor C2, as close as possible to the ICs, and make wiring as short as possible. No.2 pin, No.3 pin and No.5 pin of HSOP-J package must be wired to the GND plane when it is mounted on board. No.2 pin and No.3 pin of TO P2 package must be wired to the GND plane when it is mounted on board.

7 R5x TYPICAL APPLICATION FOR PREVENTING IC DESTRUCTION D VDD VOUT VOUT C R5x Series C2 D2 CE GND C:.47µF or more (preventing for unstable operation) C2: µf or more (preventing for unstable operation) D: If VOUT pin could be higher than VIN pin, D is necessary. D2: If VOUT pin could be lower than GND pin, SBD is necessary. Note: Do not force the voltage to VOUT pin. 7

8 R5x TEST CIRCUITS VDD VOUT C R5x Series V C2 VOUT IOUT CE GND C=Ceramic.47µF C2=Ceramic µf Basic Test Circuit VDD VOUT VOUT A ISS C R5x Series C2 CE GND C=Ceramic.47µF C2=Ceramic µf Test Circuit for Supply Current Pulse Generator VDD VOUT P.G. R5x Series C2 IOUT CE GND C2=Ceramic µf Test Circuit for Ripple Rejection, Input Transient Response 8

9 R5x VDD VOUT VOUT C R5x Series C2 CE GND IOUTa IOUTb C=Ceramic.47µF C2=Ceramic µf Test Circuit for Load Transient Response VDD VOUT C R5x Series C2 IOUT CE GND P.G. CE pin Input Waveform Pulse Generator V C=Ceramic.47µF C2=Ceramic µf Set VOUT+.V Test Circuit for Turn On Speed with CE pin 9

10 R5x TYPICAL CHARACTERISTICS Topt=25 C, unless otherwise noted. ) vs. Output Current (C=Ceramic.47µF, C2=Ceramic µf) 3.5 R5x3B. R5x5B VOUT (V) VIN=3.5V VIN=4.V VIN=5.V VOUT (V) VIN=5.5V VIN=.V VIN=7.V Output Current IOUT (A) Output Current IOUT (A). R5x9B 2. R5x8B VOUT (V) VIN=9.5V VIN=.V VIN=.V VOUT (V) VIN=8.5V VIN=9.V VIN=2.V Output Current IOUT (A) Output Current IOUT (A) 2) vs. Input Voltage (C=Ceramic.47µF, C2=Ceramic µf) 3.5 R5x3B R5x5B VOUT (V) IOUT=.mA.5 IOUT=mA IOUT=5mA Input Voltage VIN (V) VOUT (V) IOUT=.mA IOUT=mA IOUT=5mA Input Voltage VIN (V)

11 R5x R5x9B 2 R5x8B VOUT (V) 8 4 IOUT=.mA 2 IOUT=mA IOUT=5mA Input Voltage VIN (V) VOUT (V) IOUT=.mA IOUT=mA IOUT=5mA Input Voltage VIN (V) 3) Supply Current vs. Input Voltage (C=Ceramic.47µF, C2=Ceramic µf) R5x3B R5x5B Supply Current ISS (µa) Supply Current ISS (µa) Input Voltage VIN (V) Input Voltage VIN (V) R5x9B R5x8B Supply Current ISS (µa) Supply Current ISS (µa) Input Voltage VIN (V) Input Voltage VIN (V)

12 R5x 4) vs. Temperature (C=Ceramic.47µF, C2=Ceramic µf, IOUT=mA) R5x3B R5x5B 3.3 VIN=4.V 5.5 VIN=.V VOUT (V) VOUT (V) Temperature Topt ( C) Temperature Topt ( C) R5x9B R5x8B 9.9 VIN=.V 9.8 VIN=9.V VOUT (V) VOUT (V) Temperature Topt ( C) Temperature Topt ( C) 5) Supply Current vs. Temperature (C=Ceramic.47µF, C2=Ceramic µf, IOUT=mA) 2 R5x3B VIN=4.V 2 R5x5B VIN=.V VOUT (V) 8 4 VOUT (V) Temperature Topt ( C) Temperature Topt ( C) 2

13 R5x 2 R5x9B VIN=.V 2 R5x8B VIN=9.V VOUT (V) 8 4 VOUT (V) Temperature Topt ( C) Temperature Topt ( C) ) Dropout Voltage vs. Output Current (C=Ceramic.47µF, C2=Ceramic µf) Dropout Voltage VDIF (mv) R5x3B 5 C 25 C -4 C Dropout Voltage VDIF (mv) R5x5B 5 C 25 C -4 C Dropout Voltage VDIF (mv) R5x9B 5 C 25 C -4 C Dropout Voltage VDIF (mv) R5x8B 5 C 25 C -4 C

14 R5x 7) Dropout Voltage vs. Set (C=Ceramic.47µF, C2=Ceramic µf) Dropout Voltage VDIF (mv) ma 8mA ma 4mA 2mA ma Set VREG (V) 8) Ripple Rejection vs. Input Bias Voltage (C=none, C2=Ceramic µf, IOUT=mA) Ripple Rejection RR (db) R5x3B Ripple=.5Vp-p Hz khz khz Input Bias VIN (V) Ripple Rejection RR (db) R5x3B Ripple=.2Vp-p Hz khz khz Input Bias VIN (V) Ripple Rejection RR (db) R5x5B Ripple=.5Vp-p Hz khz khz Input Bias VIN (V) Ripple Rejection RR (db) R5x5B Ripple=.2Vp-p Hz khz khz Input Bias VIN (V) 4

15 R5x Ripple Rejection RR (db) R5x9B Ripple=.5Vp-p Hz khz khz Input Bias VIN (V) Ripple Rejection RR (db) R5x9B Ripple=.2Vp-p Hz khz khz Input Bias VIN (V) Ripple Rejection RR (db) R5x8B Ripple=.5Vp-p Hz khz khz Input Bias VIN (V) Ripple Rejection RR (db) R5x8B Ripple=.2Vp-p Hz khz khz Input Bias VIN (V) 9) Ripple Rejection vs. Frequency (C=none, C2=Ceramic µf, Ripple=.5Vp-p) Ripple Rejection RR (db) mA ma ma R5x3B VIN=4.V. Frequency f (khz) Ripple Rejection RR (db) mA ma ma R5x5B VIN=.V. Frequency f (khz) 5

16 R5x Ripple Rejection RR (db) mA ma ma R5x9B VIN=.V. Frequency f (khz) Ripple Rejection RR (db) mA ma ma R5x8B VIN=9.V. Frequency f (khz) ) Input Transient Response (C=none, C2=Ceramic µf, IOUT=mA, tr=tf=µs) R5x3B 2 R5x5B 4 VOUT (V) Input Voltage 4V 8V 8 4 Input Voltage VIN (V) VOUT (V) Input Voltage V V Input Voltage VIN (V) R5x9B 8 R5x8B 27 VOUT (V) Input Voltage V 4V 4 Input Voltage VIN (V) VOUT (V) Input Voltage 9V 23V 23 9 Input Voltage VIN (V)

17 R5x ) Load Transient Response (C=Ceramic.47µF, C2=Ceramic µf, tr=tf=.5µs) R5x3B VIN=4.V 75 R5x5B VIN=.V 75 VOUT (V) Output Current 5mA 5mA 5 25 VOUT (V) Output Current 5mA 5mA R5x9B VIN=.V 75 R5x8B VIN=9.V 75 VOUT (V) Output Current 5mA 5mA 5 25 VOUT (V) Output Current 5mA 5mA ) Turn On Speed with CE pin (C=Ceramic.47µF, C2=Ceramic µf, tr=tf=.5µs) R5x3B IOUT=mA R5x3B IOUT=5mA VOUT (V) 3 2 CE Input Voltage 4 2 CE Input Voltage VCE (V) VOUT (V) 3 2 CE Input Voltage 4 2 CE Input Voltage VCE (V)

18 R5x R5x5B IOUT=mA 9 R5x5B IOUT=5mA 9 VOUT (V) 4 2 CE Input Voltage 3 CE Input Voltage VCE (V) VOUT (V) 4 2 CE Input Voltage 3 CE Input Voltage VCE (V) R5x9B IOUT=mA 5 R5x9B IOUT=5mA 5 VOUT (V) 9 3 CE Input Voltage 5 CE Input Voltage VCE (V) VOUT (V) 9 3 CE Input Voltage 5 CE Input Voltage VCE (V) R5x8B IOUT=mA 3 R5x8B IOUT=5mA 3 VOUT (V) 8 2 CE Input Voltage 2 CE Input Voltage VCE (V) VOUT (V) 8 2 CE Input Voltage 2 CE Input Voltage VCE (V)

19 R5x 3) Turn Off Speed with CE (C=Ceramic.47µF, C2=Ceramic µf, IOUT=5mA, tr=tf=.5µs) R5x3B R5x5B 9 VOUT (V) 3 2 CE Input Voltage 4 2 CE Input Voltage VCE (V) VOUT (V) 4 2 CE Input Voltage 3 CE Input Voltage VCE (V) R5x9B 5 R5x8B 3 VOUT (V) 9 3 CE Input Voltage 5 CE Input Voltage VCE (V) VOUT (V) 8 2 CE Input Voltage 2 CE Input Voltage VCE (V)

20 R5x ESR vs. Output Current When using these ICs, consider the following points: The relations between IOUT (Output Current) and ESR of an output capacitor are shown below. The conditions when the white noise level is under the specified certain level are marked as the hatched area in the graph. Measurement conditions Input Voltage : VOUT +V to 24V Frequency Band : Hz to MHz Temperature : 4 C to 5 C Capacitor : C=Ceramic.47µF C2=Ceramic µf R5x3B R5x3B Noise level < = 4µVrms Noise level < = 4µVrms VIN=4V to 24V VIN=4V to 24V ESR (Ω) ESR (Ω) R5x5B R5x5B Noise level < = 5µVrms Noise level < = 5µVrms VIN=V to 24V VIN=V to 24V ESR (Ω) ESR (Ω)

21 R5x R5x9B R5x9B Noise level < = 2µVrms Noise level < = 2µVrms VIN=V to 24V VIN=V to 24V ESR (Ω) ESR (Ω) R5x8B R5x8B Noise level < = 22µVrms Noise level < = 22µVrms VIN=9V to 24V VIN=9V to 24V ESR (Ω) ESR (Ω)

22 PACKAGES INFORMATION PE-HSOP-J-7 HSOP-J PACKAGE DIMENSIONS 5.2±.3 Unit: mm 5 4.±.3 3.9±.2.±.2.5Typ TAPING SPECIFICATION.7±..4±..2 M..5±..5±..3± ±. 2.± ±. 5.5±.5 2±.3 2.7Max..7 8.±. 2.5±. User Direction of Feed TAPING REEL DIMENSIONS REUSE REEL (EIAJ-RRM-2Bc) (reel=pcs) E2 5.4±. 3±.3 2±.8 3± ±.5

23 PACKAGES INFORMATION PE-HSOP-J-7 POWER DISSIPATION (HSOP-J) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions High Wattage Land Pattern Standard Land Pattern Environment Mounting on Board (Wind velocity=m/s) Mounting on Board (Wind velocity=m/s) Board Material Glass cloth epoxy plactic (Double sided) Glass cloth epoxy plactic (Double sided) Board Dimensions 5mm 5mm.mm 5mm 5mm.mm Copper Ratio 9% 5% Through-hole φ.5mm 44pcs φ.5mm 44pcs Measurement Result Power Dissipation PD(mW) (Topt=25 C,Tjmax=25 C) High Wattage Land Pattern Standard Land Pattern Free Air Power Dissipation 2mW 7mW 54mW Thermal Resistance 5 C/W 59 C/W 85 C/W On Boad (High Wattage Land Pattern) On Boad (Standerd Land Pattern) 5 8 Free Air Ambient Temperature ( C) Power Dissipation High Wattage Standard Measurement Board Pattern IC Mount Area Unit : mm RECOMMENDED LAND PATTERN (HSOP-J) (Unit: mm)

24 PACKAGE INFORMATION PE-TO P2-89 TO P2 PACKAGE DIMENSIONS Unit: mm.± ±.2 C..5±. R.225 R.325 (4.9) (.5) 9.9±.3.±.2 (.).±.2 (.2) ( 8 ) (5.4) (3.5) (4.) (.27) (.) 2.3±.2.5± Bottom View 2.7±.2 S..5±..2 M TAPING SPECIFICATION.3±. 4.±. 2.± ± ±..±.3 3.3Max. 8.±. 7. T User Direction of Feed TAPING REEL DIMENSIONS REUSE REEL (EIAJ-RRM-Dc) (reel=3,pcs) 2.4± 7.4± 2±.8 3±.2 2±.5 ± 33±2

25 PACKAGE INFORMATION PE-TO P2-89 POWER DISSIPATION (TO P2) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Environment Board Material Board Dimensions Standard Land Pattern Mounting on Board (Wind velocity=m/s) Glass cloth epoxy plastic (Double sided) 5mm 5mm.mm Copper Ratio Top side : Approx. 5%, Back side : Approx. 5% Through-hole φ.5mm 24pcs Measurement Result Power Dissipation Thermal Resistance (Topt=25 C,Tjmax=25 C) Standard Land Pattern 9mW θja=(25 25 C)/.9W=53 C/W 5 Power Dissipation PD(mW) 2 9 On Board Ambient Temperature ( C) Power Dissipation Measurement Board Pattern IC Mount Area (Unit: mm) RECOMMENDED LAND PATTERN (Unit: mm)

26 MARK INFORMATIONS ME-R5S-89 R5S SERIES MARK SPECIFICATION HSOP-J : H (fixed) 2, 3, 4 : Setting Voltage (Refer to Part Number vs. Product Code) 2 3 5, : Lot Number 4 5 Part Number vs. Product Code Product Code Product Code Product Code Product Code Part Number Part Number Part Number Part Number R5S3B H 3 R5SB H R5S9B H 9 R5S2B H 2 R5S3B H 3 R5SB H R5S9B H 9 R5S25B H 2 5 R5S32B H 3 2 R5S2B H 2 R5S92B H 9 2 R5S3B H 3 R5S33B H 3 3 R5S3B H 3 R5S93B H 9 3 R5S35B H 3 5 R5S34B H 3 4 R5S4B H 4 R5S94B H 9 4 R5S4B H 4 R5S35B H 3 5 R5S5B H 5 R5S95B H 9 5 R5S45B H 4 5 R5S3B H 3 R5SB H R5S9B H 9 R5S5B H 5 R5S37B H 3 7 R5S7B H 7 R5S97B H 9 7 R5S55B H 5 5 R5S38B H 3 8 R5S8B H 8 R5S98B H 9 8 R5SB H R5S39B H 3 9 R5S9B H 9 R5S99B H 9 9 R5S5B H 5 R5S4B H 4 R5S7B H 7 R5SB H R5S7B H 7 R5S4B H 4 R5S7B H 7 R5SB H R5S75B H 7 5 R5S42B H 4 2 R5S72B H 7 2 R5S2B H 2 R5S8B H 8 R5S43B H 4 3 R5S73B H 7 3 R5S3B H 3 R5S44B H 4 4 R5S74B H 7 4 R5S4B H 4 R5S45B H 4 5 R5S75B H 7 5 R5S5B H 5 R5S4B H 4 R5S7B H 7 R5SB H R5S47B H 4 7 R5S77B H 7 7 R5S7B H 7 R5S48B H 4 8 R5S78B H 7 8 R5S8B H 8 R5S49B H 4 9 R5S79B H 7 9 R5S9B H 9 R5S5B H 5 R5S8B H 8 R5SB H R5S5B H 5 R5S8B H 8 R5SB H R5S52B H 5 2 R5S82B H 8 2 R5S2B H 2 R5S53B H 5 3 R5S83B H 8 3 R5S3B H 3 R5S54B H 5 4 R5S84B H 8 4 R5S4B H 4 R5S55B H 5 5 R5S85B H 8 5 R5S5B H 5 R5S5B H 5 R5S8B H 8 R5SB H R5S57B H 5 7 R5S87B H 8 7 R5S7B H 7 R5S58B H 5 8 R5S88B H 8 8 R5S8B H 8 R5S59B H 5 9 R5S89B H 8 9 R5S9B H 9

27 MARK INFORMATIONS ME-R5J-89 R5J SERIES MARK SPECIFICATION TO P , : A (fixed) : J (Package),, : Setting Voltage : Type (B) : Blank, : Lot Number (Refer to Part Number vs. Product Code) Part Number vs. Product Code Product Code Part Number Part Number Product Code Part Number Product Code R5J3B A J 3 B R5J3B A J 3 B R5J32B A J 3 2 B R5J33B A J 3 3 B R5J34B A J 3 4 B R5J35B A J 3 5 B R5J3B A J 3 B R5J37B A J 3 7 B R5J38B A J 3 8 B R5J39B A J 3 9 B R5J4B A J 4 B R5J4B A J 4 B R5J42B A J 4 2 B R5J43B A J 4 3 B R5J44B A J 4 4 B R5J45B A J 4 5 B R5J4B A J 4 B R5J47B A J 4 7 B R5J48B A J 4 8 B R5J49B A J 4 9 B R5J5B A J 5 B R5J5B A J 5 B R5J52B A J 5 2 B R5J53B A J 5 3 B R5J54B A J 5 4 B R5J55B A J 5 5 B R5J5B A J 5 B R5J57B A J 5 7 B R5J58B A J 5 8 B R5J59B A J 5 9 B R5JB A J B R5JB A J B R5J2B A J 2 B R5J3B A J 3 B R5J4B A J 4 B R5J5B A J 5 B R5JB A J B R5J7B A J 7 B R5J8B A J 8 B R5J9B A J 9 B R5J7B A J 7 B R5J7B A J 7 B R5J72B A J 7 2 B R5J73B A J 7 3 B R5J74B A J 7 4 B R5J75B A J 7 5 B R5J7B A J 7 B R5J77B A J 7 7 B R5J78B A J 7 8 B R5J79B A J 7 9 B R5J8B A J 8 B R5J8B A J 8 B R5J82B A J 8 2 B R5J83B A J 8 3 B R5J84B A J 8 4 B R5J85B A J 8 5 B R5J8B A J 8 B R5J87B A J 8 7 B R5J88B A J 8 8 B R5J89B A J 8 9 B R5J9B A J 9 B R5J9B A J 9 B R5J92B A J 9 2 B R5J93B A J 9 3 B R5J94B A J 9 4 B R5J95B A J 9 5 B R5J9B A J 9 B R5J97B A J 9 7 B R5J98B A J 9 8 B R5J99B A J 9 9 B R5JB A J B R5JB A J B R5J2B A J 2 B R5J3B A J 3 B R5J4B A J 4 B R5J5B A J 5 B R5JB A J B R5J7B A J 7 B R5J8B A J 8 B R5J9B A J 9 B R5JB A J B R5JB A J B R5J2B A J 2 B R5J3B A J 3 B R5J4B A J 4 B R5J5B A J 5 B R5JB A J B R5J7B A J 7 B R5J8B A J 8 B R5J9B A J 9 B R5J2B A J 2 B R5J25B A J 2 5 B R5J3B A J 3 B R5J35B A J 3 5 B R5J4B A J 4 B R5J45B A J 4 5 B R5J5B A J 5 B R5J55B A J 5 5 B R5JB A J B R5J5B A J 5 B R5J7B A J 7 B R5J75B A J 7 5 B R5J8B A J 8 B