Dual LDO Regulator (ch1: 300mA, ch2: 100mA) with ON/OFF Switch

Transcription

1 XC6419 Series ETR338-5 Dual LDO Regulator (ch1: 3mA, ch2: 1mA) with ON/OFF Switch GENERAL DESCRIPTION The XC6419 series is a dual CMOS LDO regulator. The series features high accuracy, low output noise, high ripple rejection and low dropout and consists of a voltage reference, error amplifier, driver transistor, current limiter, thermal shutdown circuit and phase compensation circuit. Each output voltage is set independently by laser trimming and selectable in 5V increments within a range of.8 to 5.V. The EN function turns each output of the two regulators off independently. In this state, the electric charge at the output capacitor (C L ) is discharged via the internal auto-discharge switch, and as a result the V OUT voltage quickly returns to the V SS level. The output stabilization capacitor (C L ) is also compatible with low ESR ceramic capacitors. The high level of output stability is maintained even during frequent load fluctuations, due to the excellent transient response performance. VR1 and VR2 are completely isolated so that a cross talk during load fluctuations is minimized. APPLICATIONS Smart phones / Mobile phones Portable games Digital still cameras / camcorders Digital audio equipment Mobile devices / terminals TYPICAL APPLICATION CIRCUITS FEATURES Range : 1.5~6.V Maximum Output Current : 3mA (ch1), 1mA (ch2) Range :.8~5.V Output Accuracy : ±1% (XC6419A/B) ±2mV@ V OUT V ±2% (XC6419C/D) ±3mV@ V OUT 1.5V Dropout Voltage (V OUT =2.8V) : 115mV@I OUT =2mA (ch1) 115mV@I OUT =5mA (ch2) Low Power Consumption : 28μA (ch1), 23μA (ch2) Stand-by Current : Less than.1μa Ripple Rejection : 6dB@f=1kHz Current Limit : 4mA (ch1), 15mA (ch2) Low ESR Capacitor CL High Speed Discharge Packages : USP-6C, SOT-26 TYPICAL PERFORMANCE CHARACTERISTICS Dropout Voltage vs. Output Current DropoutVoltage : : Vdif [mv] (mv) ch2 2CH Maximum 最大出力電流 Output Current 1mA 2CH ch2 V OUT V=2.8V OUT =2.8V ch1 Maximum 1CH 最大出力電流 Output Current 3mA 1CH ch OutputCurrent : I OUT [ma] (ma) 1/29

2 XC6419 Series PIN CONFIGURATION *The dissipation pad for the USP-6C package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the V SS (No. 4) pin. PIN ASSIGNMENT PIN NUMBER SOT-26 USP-6C PIN NAME FUNCTIONS 1 3 EN1 ON/OFF Control V IN Power Input 3 1 EN2 ON/OFF Control V OUT2 Output V SS Ground 6 5 V OUT1 Output 1 PRODUCT CLASSIFICATION Ordering Information XC DESIGNATOR DESCRIPTION SYMBOL DESCRIPTON A EN High Active without C L auto discharge (Accuracy:1%) B EN High Active with C L auto discharge (Accuracy:1%) 1 VR1 C EN High Active without C L auto discharge (Accuracy:2%) D EN High Active with C L auto discharge (Accuracy:2%) A EN High Active without C L auto discharge (Accuracy:1%) B EN High Active with C L auto discharge (Accuracy:1%) 2 VR2 C EN High Active without C L auto discharge (Accuracy:2%) D EN High Active with C L auto discharge (Accuracy:2%) Sequential number showing VR1 and VR2 voltage combination 34 1~ VR1 range:.8 ~ 5.V, VR2 range :.8 ~ 5.V (5V increments) Refer to the table below MR-G SOT-26 (3,/Reel) 56-7 (*1) ER USP-6C (3,/Reel) Packages MR SOT-26 (3,/Reel) (Order Unit) ER-G USP-6C (3,/Reel) (*1) The -G suffix indicates that the products are Halogen and Antimony free as well as being fully EU RoHS compliant. 2/29

3 XC6419 Series PRODUCT CLASSIFICATION (Continued) DESIGNATOR VR1 VR2 34 VR1 VR2 34 VR1 VR *For other combinations, please ask Torex sales contacts. BLOCK DIAGRAMS * Diodes inside the circuits are ESD protection diodes and parasitic diodes. ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL RATINGS UNITS V IN -.3 ~ V Output Current I OUT1 +I OUT2 5 (*1) ma 1 / 2 V OUT1 /V OUT2 V SS -.3 ~ V IN +.3 V EN1/EN2 V EN1 /V EN2 V SS -.3 ~ V 12 Power USP-6C Pd 1 (PCB mounted) (*2) Dissipation SOT mw Operating Ambient Temperature Topr - 4 ~ + 85 Storage Temperature Tstg - 55 ~ *1: Please use within the range of Pd > { (V IN -V OUT1 ) I OUT1 + (V IN -V OUT2 ) I OUT2 } *2: This power dissipation figure shown is PCB mounted and is for reference only. Please refer to page 28 for details. 3/29

4 XC6419 Series ELECTRICAL CHARACTERISTICS XC6419 Series Regulator 1 PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUITS V OUT(T) V (A, B Series), V EN1 =V IN, I OUT =1mA V OUT 1.95V(A, B Series), V OUT(E) V EN1 =V IN, I OUT =1mA V OUT(T) (*2) V OUT(T) >1.5V(C, D Series).98 (*4) 1.2 V 1 V EN1 =V IN, I OUT =1mA V OUT 1.5V (C, D Series) V EN1 =V IN, I OUT =1mA Output Current I OUTMAX 3 ma 1 Load Regulation V OUT V EN1 =V IN,.1mA I OUT 2mA Refer to table E-11 mv 1 Dropout Voltage (*5) Vdif I OUT =2mA, V EN1 =V IN Refer to table E-12 mv 1 Supply Current I SS V IN =V EN1 =V OUT(T) +1.V, I OUT =ma 28 7 μa 2 Stand-by Current I STBY V IN =6.V, V EN1 =V SS 1.1 μa 2 V OUT(T) +.5V V IN 6.V :V OUT(T) 1.V Line Regulation V OUT V EN1 =V IN, I OUT =1mA V IN V OUT 1.5V V IN 6.V 1.2 %/V 1 :V OUT(T).95V V EN1 =V IN, I OUT =1mA V IN V 1 V OUT V EN1 =V IN, I OUT =3mA Temperature Ta V OUT -4 Ta 85 Characteristics ±1 ppm/ 1 V IN ={V OUT(T) +1.}V DC +.5Vp-pAC :V OUT(T) 4.75V Ripple Rejection Rate PSRR V EN1 =V IN, I OUT =3mA, f=1khz V IN =5.75VDC+.5Vp-pAC 6 db 3 :V OUT(T) 4.8V V EN1 =V IN, I OUT =3mA, f=1khz Limit Current I LIM V EN1 =V IN 31 4 ma 1 Short Current I SHORT V EN1 =V IN, Short V OUT to V SS level 3 ma 1 EN H Level Voltage V ENH V 1 EN L Level Voltage V ENL.3 V 1 EN H Level Current I ENH V EN1 =V IN μa 1 EN L Level Current I ENL V EN1 =V SS μa 1 C L Discharge Resistor (*8) R DCHG V IN =6.V, V OUT =4.V, V EN1 = V SS 55 Ω 1 NOTE: *1: Unless otherwise stated, V IN =V OUT (T) +1.V, V EN2 =V. *2: V OUT (E) = Actual output voltage (refer to the voltage table) (ie. The output voltage when V OUT (T) +1.V is provided at the V IN pin while maintaining a certain I OUT value. *3: Characteristics of the actual V OUT (E) by nominal output voltage is shown in the voltage table. *4: V OUT (T) is nominal output voltage *5: Vdif = V IN1 (*7) -V OUT3 (*6) *6: V OUT 3 is a voltage equal to 98% of the V OUT (T) when an amply stabilized input voltage is applied in V OUT (T) +1.V. *7: V IN1 is the input voltage when V OUT3 appears while input voltage is gradually decreased. *8: For XC6419Bx/Dx series only. XC6419Ax/Cx series discharge with only Rx1 and Rx2 resistors as shown in the BLOCK DIAGRAMS. 4/29

5 XC6419 Series ELECTRICAL CHARACTERISTICS (Continued) XC6419 Series Regulator 2 PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUITS V OUT(T) V (A, B Series), V EN2 =V IN, I OUT =1mA V OUT 1.95V (A, B Series), V OUT(E) V EN2 =V IN, I OUT =1mA V OUT(T) (*2) V OUT(T) >1.5V(C, D Series).98 (*4) 1.2 V 1 V EN2 =V IN, I OUT =1mA V OUT 1.5V (C, D Series) V EN2 =V IN, I OUT =1mA Output Current I OUTMAX 1 ma 1 Load Regulation V OUT V EN2 =V IN,.1mA I OUT 5mA Refer to table E-21 mv 1 Dropout Voltage (*5) Vdif I OUT =5mA, V EN2 =V IN Refer to table E-22 mv 1 Supply Current I SS V IN =V EN2 =V OUT(T) +1.V, I OUT =ma 23 6 μa 2 Stand-by Current I STBY V IN =6.V, V EN2 =V SS 1.1 μa 2 V OUT(T) +.5V V IN 6.V :V OUT(T) 1.V Line Regulation V OUT V EN2 =V IN, I OUT =1mA V IN V OUT 1.5V V IN 6.V 1.2 %/V 1 :V OUT(T).95V V EN2 =V IN, I OUT =1mA V IN V 1 Temperature Characteristics V OUT Ta V OUT V EN2 =V IN, I OUT =3mA -4 Ta 85 ±1 ppm/ 1 Ripple Rejection Rate PSRR V IN ={V OUT(T) +1.} V DC +.5Vp-pAC :V OUT(T) 4.75V V EN2 =V IN, I OUT =3mA f=1khz 6 db 3 V IN =5.75V DC +.5Vp-pAC :V OUT(T) 4.8V V EN2 =V IN, I OUT =3mA, f=1khz Limit Current I LIM V EN2 =V IN ma 1 Short Current I SHORT V EN2 =V IN, Short V OUT to V SS level 15 ma 1 EN H Level Voltage V ENH V 1 EN L Level Voltage V ENL.3 V 1 EN H Level Current I ENH V EN2 =V IN μa 1 EN L Level Current I ENL V EN2 =V SS μa 1 C L Discharge Resistor (*8) R DCHG V IN =6.V, V OUT =4.V, V EN2 = V SS 55 Ω 1 NOTE: *1: Unless otherwise stated, V IN =V OUT (T) +1.V, V EN1 =V. *2: V OUT (E) is actual output voltage (refer to the voltage table) (ie. The output voltage when V OUT (T) +1.V is provided at the V IN pin while maintaining a certain I OUT value. *3: Characteristics of the actual V OUT (E) by nominal output voltage is shown in the voltage table *4: V OUT (T) is nominal output voltage *5: Vdif = V IN1 (*7) -V OUT3 (*6) *6: V OUT3 is a voltage equal to 98% of the output voltage whenever an amply stabilized I OUT {V OUT(T) +1.V} is input. *7: V IN1 is the input voltage when V OUT3 appears while input voltage is gradually decreased. *8: For XC6419 xb/xd series only. XC6419 xa /xc series discharge with only Rx1 and Rx2 resistors as shown in the BLOCK DIAGRAMS. 5/29

6 XC6419 Series ELECTRICAL CHARACTERISTICS REGULATOR 1 REGULATOR 2 NOMINAL OUTPUT VOLTAGE OUTPUT VOLTAGE ±1% (A, B Series) OUTPUT VOLTAGE ±2% (C, D Series) LOAD REGULATION E-11 DROPOUT VOLTAGE E-12 LOAD REGULATION E-21 DROPOUT VOLTAGE E-22 (V) (V) (V) (mv) (mv) (mv) (mv) V OUT(T) V OUT(E) V OUT V dif V OUT V dif MIN MAX MIN MAX TYP MAX TYP MAX TYP MAX TYP MAX /29

7 XC6419 Series ELECTRICAL CHARACTERISTICS (Continued) NOMINAL OUTPUT OUTPUT VOLTAGE ±1% OUTPUT VOLTAGE ±2% LOAD REGULATION REGULATOR 1 REGULATOR 2 DROPOUT VOLTAGE LOAD REGULATION DROPOUT VOLTAGE VOLTAGE (A, B Series) (C, D Series) E-11 E-12 E-21 E-22 (V) (V) (V) (mv) (mv) (mv) (mv) V OUT(T) V OUT(E) V OUT V dif V OUT V dif MIN MAX MIN MAX TYP MAX TYP MAX TYP MAX TYP MAX /29

8 XC6419 Series OPERATIONAL DESCRIPTION The voltage divided by resistors Rx1 and Rx2 is compared with the internal reference voltage by the error amplifier. The P-channel MOSFET connected to the VOUT pin is then driven by the subsequent output signal. The output voltage at the VOUT pin is controlled and stabilized by a system of negative feedback. The current limit circuit and short protect circuit operate in relation to the level of output current. Further, the IC's internal circuitry can be shutdown via the EN pin's signal. <CL Auto-Discharge Function> XC6419xB/Bx/xD/Dx series can quickly discharge the electric charge at the output capacitor (CL) through the N-channel transistor located between the VOUT pin and the VSS pin (refer to the BLOCK DIAGRAM) when a low level signal is applied to the EN pin. The C L discharge resistance is set to 55Ω when V IN is 6.V (TYP.) and V OUT is 4.V (TYP.). Moreover, discharge time of the output capacitor (CL) is set by the C L auto-discharge resistance (R) and the output capacitor (CL). By setting time constant of a CL auto-discharge resistance value [R] and an output capacitor value (CL) as τ(τ=c x R), the output voltage after discharge via the N channel transistor is calculated by the following formulae. V = VOUT x e t/τ, or t = τln(v OUT(E) / V) where V: Output voltage after discharge, VOUT(E): Output voltage, t: Discharge time, τ: CL auto-discharge resistance R DCHG CL capacitance C C L high-speed discharge function can be set by each regulator. <Current Limiter, Short-Circuit Protection> The XC6419 series includes a fold-back circuit, which aid the operations of the current limiter and circuit protection. When the load current reaches the current limit level, the fold-back circuit operates and output voltage drops. As a result of this drop in output voltage, output current also decreases. When the output pin is shorted, the output current flows go down to 3mA / ch1 and 15mA / ch2 (TYP.). <EN Pin> Each regulator can be shut-downed via the signal from the EN pin with the XC6419 series. In shutdown mode, output at the VOUT pin will be pulled down to the VSS level via Rx1 & Rx2. However, as for the XC6419xB/Bx/xD/Dx series, the CL auto-discharge resistor is connected in parallel to Rx1 and Rx2 while the power supply is applied to the VIN pin. Therefore, time until the VOUT pin reaches the VSS level becomes short. The output voltage becomes unstable, when the EN pin is open. If this IC is used with the correct output voltage for the EN pin, the logic is fixed and the IC will operate normally. However, supply current may increase as a result of through current in the IC's internal circuitry when medium 8/29

9 XC6419 Series OPERATIONAL DESCRIPTION (Continued) <Input and Output Capacitor> The XC6419 needs an output capacitor C L for phase compensation. The requested capacitance values are described in the table below. The device may go into unstable operation when the output capacitance reduction happens as a result of bias or temperature drift. Please choose a capacitor with less influence from temperature and bias. Also, please place 1.μF input capacitor C IN between V IN and V SS pins for stabilizing input supply voltage. SETTING VOLTAGE.8V~1.15V 1.2V~5.V OUTPUT CAPACITOR C L 2.2μF C L 1.μF NOTES ON USE 1. Please use this IC within the stated absolute maximum ratings. The IC is liable to malfunction should the ratings be exceeded. 2. Where wiring impedance is high, operations may become unstable due to noise and/or phase lag depending on output current. Please wire the input capacitor CIN and the output capacitor CL as close to the IC as possible. 9/29

10 XC6419 Series TEST CIRCUITS Circuit 1 Circuit 2 Circuit 3 1/29

11 XC6419 Series TYPICAL PERFORMANCE CHARACTERISTICS * EN Voltage condition: Unless otherwise stated, V EN =V IN while the other channel is turned off ((V EN =V SS ). (1) (1) Output 出力電圧 Voltage - 出力電流特性例 vs. Output Current XC6419(V OUT1 =.8V) VR1 XC6419(V OUT2 =.8V) VR2 1., C IN=1.μF(ceramic), C L1=2.2μF(ceramic) 1., C IN=1.μF(ceramic), C L2=2.2μF(ceramic) VIN=1.6V VIN=1.8V VIN=2.3V VIN=1.6V VIN=1.8V VIN=2.3V OutputCurrent : I OUT1 (ma) OutputCurrent : I OUT2 (ma) XC6419(V OUT1 =1.5V) VR1 XC6419(V OUT2 =1.5V) VR2 1.8, C IN=1.μF(ceramic), C L1=1.μF(ceramic) 1.8, C IN=1.μF(ceramic), C L2=1.μF(ceramic) VIN=1.6V VIN=1.8V VIN=V VIN=2.5V OutputCurrent : I OUT1 (ma) VIN=1.6V VIN=1.8V VIN=V VIN=2.5V OutputCurrent : I OUT2 (ma) XC6419(V OUT1 =2.8V) VR1 XC6419(V OUT2 =2.8V) VR2 3.2, C IN=1.μF(ceramic), C L1=1.μF(ceramic) 3.2, C IN=1.μF(ceramic), C L2=1.μF(ceramic) VIN=2.9V VIN=3.1V VIN=3.3V VIN=3.8V VIN=6.V OutputCurrent : I OUT1 (ma) VIN=2.9V VIN=3.1V VIN=3.3V VIN=3.8V VIN=6.V OutputCurrent : I OUT2 (ma) 11/29

12 XC6419 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (1) 出力電圧 - 出力電流特性例 vs. Output Current (Continued) XC6419(V OUT1 =5.V) VR1 XC6419(V OUT2 =5.V) VR2 6., C IN =1.μF(ceramic), C L1 =1.μF(ceramic) 6., C IN =1.μF(ceramic), C L2 =1.μF(ceramic) VIN=5.1V VIN=5.3V VIN=5.5V VIN=6.V OutputCurrent : I OUT1 (ma) VIN=5.1V VIN=5.3V VIN=5.5V VIN=6.V OutputCurrent : I OUT2 (ma) (2) (2) 出力電圧 - 入力電圧特性例 vs. Input Current XC6419(V OUT1 =.8V) VR1, C IN=1.μF(ceramic), C L1=2.2μF(ceramic) IOUT1=3mA XC6419(V OUT1 =.8V) VR1, C IN=1.μF(ceramic), C L1=2.2μF(ceramic) IOUT1=3mA XC6419(V OUT2 =.8V) VR2, C IN=1.μF(ceramic), C L2=2.2μF(ceramic) IOUT2=3mA XC6419(V OUT2 =.8V) VR2, C IN=1.μF(ceramic), C L2=2.2μF(ceramic) IOUT2=3mA /29

13 XC6419 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (2) 出力電圧 - 入力電圧特性例 vs. Input Current (Continued) XC6419(V OUT1 =1.5V) VR1 XC6419(V OUT1 =1.5V) VR1, C IN =1.μF(ceramic), C L1 =1.μF(ceramic) 1.6, C IN=1.μF(ceramic), C L1=1.μF(ceramic) IOUT1=3mA IOUT1=3mA XC6419(V OUT2 =1.5V) VR2 XC6419(V OUT2 =1.5V) VR2, C IN=1.μF(ceramic), C L2=1.μF(ceramic) 1.6, C IN=1.μF(ceramic), C L2=1.μF(ceramic) IOUT2=3mA IOUT2=3mA XC6419(V OUT1 =2.8V) VR1 XC6419(V OUT1 =2.8V) VR1 3.2, C IN=1.μF(ceramic), C L1=1.μF(ceramic) 2.9, C IN=1.μF(ceramic), C L1=1.μF(ceramic) IOUT1=3mA IOUT1=3mA /29

14 XC6419 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (2) (2) 出力電圧 - 入力電圧特性例 vs. Input Current (Continued) XC6419(V OUT2 =2.8V) VR2 XC6419(V OUT2 =2.8V) VR2 3.2, C IN =1.μF(ceramic), C L2 =1.μF(ceramic) 2.9, C IN=1.μF(ceramic), C L2=1.μF(ceramic) IOUT2=3mA IOUT2=3mA XC6419(V OUT1 =5.V) VR1 XC6419(V OUT1 =5.V) VR1 6., C IN=1.μF(ceramic), C L1=1.μF(ceramic) 5.1, C IN=1.μF(ceramic), C L1=1.μF(ceramic) IOUT1=3mA IOUT1=3mA XC6419(V OUT2 =5.V) VR2 XC6419(V OUT2 =5.V) VR2 6., C IN=1.μF(ceramic), C L2=1.μF(ceramic) 5.1, C IN=1.μF(ceramic), C L2=1.μF(ceramic) IOUT2=3mA IOUT2=3mA /29

15 XC6419 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (3) 入出力電位差 Dropout Voltage - 出力電流特性例 vs. Output Current XC6419(V OUT1 =.8V) VR1 XC6419(V OUT2 =.8V) VR C IN=1.μF(ceramic), C L1=2.2μF(ceramic) 1..9 C IN=1.μF(ceramic), C L2=2.2μF(ceramic) DropoutVoltage : Vdif (V) Below the minimum operating Ta=-4 DropoutVoltage : Vdif (V) Below the minimum operating Ta= OutputCurrent : I OUT1 (ma) OutputCurrent : I OUT2 (ma) XC6419(V OUT1 =1.5V) VR1 XC6419(V OUT2 =1.5V) VR2.5 C IN=1.μF(ceramic), C L1=1.μF(ceramic).5 C IN=1.μF(ceramic), C L2=1.μF(ceramic) DropoutVoltage : Vdif (V) Ta=-4 DropoutVoltage : Vdif (V) Ta= OutputCurrent : I OUT1 (ma) OutputCurrent : I OUT2 (ma) XC6419(V OUT1 =2.8V) VR1 XC6419(V OUT2 =2.8V) VR2.5 C IN=1.μF(ceramic), C L1=1.μF(ceramic).5 C IN=1.μF(ceramic), C L2=1.μF(ceramic) DropoutVoltage : Vdif (V) Ta=-4 DropoutVoltage : Vdif (V) Ta= OutputCurrent : I OUT1 (ma) OutputCurrent : I OUT2 (ma) 15/29

16 XC6419 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (3) (3) 入出力電位差 Dropout Voltage - 出力電流特性例 vs. Output Current XC6419(V OUT1 =5.V) VR1 XC6419(V OUT2 =5.V) VR2.5 C IN=1.μF(ceramic), C L1=1.μF(ceramic).5 C IN=1.μF(ceramic), C L2=1.μF(ceramic) OutputVoltage : Vdif (V) Ta=-4 OutputVoltage : Vdif (V) Ta= OutputCurrent : I OUT1 (ma) OutputCurrent : I OUT2 (ma) (4) 消費電流 Supply Current - 入力電圧特性例 vs. XC6419(V OUT1 =.8V) VR1 XC6419(V OUT2 =.8V) VR2 6 6 SupplyCurrent : ISS (μa) Ta=-4 SupplyCurrent : ISS (μa) Ta= XC6419(V OUT1 =1.5V) VR1 XC6419(V OUT2 =1.5V) VR2 6 6 SupplyCurrent : ISS (μa) Ta=-4 SupplyCurrent : ISS (μa) Ta= /29

17 XC6419 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (4) (4) 消費電流 Supply Current - 入力電圧特性例 vs. (Continued) XC6419(V OUT1 =2.8V) VR1 XC6419(V OUT2 =2.8V) VR2 6 6 SupplyCurrent : ISS (μa) Ta=-4 SupplyCurrent : ISS (μa) Ta= XC6419(V OUT1 =5.V) VR1 XC6419(V OUT2 =5.V) VR2 6 6 SupplyCurrent : ISS (μa) Ta=-4 SupplyCurrent : ISS (μa) Ta= (5) (5) 出力電圧 - 周囲温度特性例 vs. Ambient Temperature XC6419(V OUT1 =.8V) VR1 XC6419(V OUT2 =.8V) VR2.9 V IN=1.8V, C IN=1.μF(ceramic), C L1=2.2μF(ceramic).9 V IN=1.8V, C IN=1.μF(ceramic), C L2=2.2μF(ceramic) IOUT1=3mA IOUT2=3mA AmbientTemperature : Ta ( ) AmbientTemperature : Ta ( ) 17/29

18 XC6419 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (5) 出力電圧 - 周囲温度特性例 vs. Ambient Temperature (Continued) XC6419(V OUT1 =1.5V) VR1 XC6419(V OUT2 =1.5V) VR2 1.6 V IN=2.5V, C IN=1.μF(ceramic), C L1=1.μF(ceramic) 1.6 V IN=2.5V, C IN=1.μF(ceramic), C L2=1.μF(ceramic) IOUT1=3mA IOUT2=3mA AmbientTemperature : Ta ( ) AmbientTemperature : Ta ( ) XC6419(V OUT1 =2.8V) VR1 XC6419(V OUT2 =2.8V) VR2 2.9 V IN=3.8V, C IN=1.μF(ceramic), C L1=1.μF(ceramic) 2.9 V IN=3.8V, C IN=1.μF(ceramic), C L2=1.μF(ceramic) IOUT1=3mA IOUT2=3mA AmbientTemperature : Ta ( ) AmbientTemperature : Ta ( ) XC6419(V OUT1 =5.V) VR1 XC6419(V OUT2 =5.V) VR2 5.2 V IN=6.V, C IN=1.μF(ceramic), C L1=1.μF(ceramic) 5.2 V IN=6.V, C IN=1.μF(ceramic), C L2=1.μF(ceramic) IOUT1=3mA IOUT2=3mA AmbientTemperature : Ta ( ) AmbientTemperature : Ta ( ) 18/29

19 XC6419 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (6) (6) 消費電流 Supply Current - 周囲温度特性例 vs. Ambient Temperature XC6419 VR1 XC6419 VR2 5 V IN=V OUT1+1.V 5 V IN=V OUT2+1.V SupplyCurrent : ISS (μa) VOUT1=.8V VOUT1=1.5V VOUT1=2.8V VOUT1=5.V AmbientTemperature : Ta ( ) SupplyCurrent : ISS (μa) VOUT2=.8V VOUT2=1.5V VOUT2=2.8V VOUT2=5.V AmbientTemperature : Ta ( ) (7) EN 閾値電圧 Threshold - 周囲温度特性例 Voltage vs. Ambient Temperature XC EN Threshold Voltage : VENH, VENL (V) EN"H"LEVEL.2 EN"L"LEVEL AmbientTemperature : Ta ( ) 19/29

20 XC6419 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) 入力立ち上がり特性例 Rising Response Time XC6419(V OUT =.8V) XC6419(V OUT =1.5V) 3. tr=5μs,, V IN= 1.8V, C L=2.2μF(ceramic) tr=5μs,, V IN= 2.5V, C L=1.μF(ceramic) 3. : VIN (V) Time (4μs/div) IOUT=.1mA IOUT=1mA IOUT=3mA IOUT=1mA : VOUT (V) : VIN (V) Time (4μs/div) IOUT=.1mA IOUT=1mA IOUT=3mA IOUT=1mA : VOUT (V) XC6419(V OUT =2.8V) XC6419(V OUT =5.V) 6. tr=5μs,, V IN= 3.8V, C L=1.μF(ceramic) tr=5μs,, V IN= 6.V, C L=1.μF(ceramic) 1 : VIN (V) IOUT=.1mA IOUT=1mA IOUT=3mA IOUT=1mA : VOUT (V) : VIN (V) IOUT=.1mA IOUT=1mA IOUT=3mA IOUT=1mA : VOUT (V) -6. Time (4μs/div) -4. Time (4μs/div) (9) 入力過渡応答特性例 Input Transient Response : VIN (V) XC6419(V OUT1 =.8V) VR1 tr=tf=5μs,, V IN= V, C L1=2.2μF(ceramic) IOUT1=.1mA -1.2 IOUT1=3mA -2.2 Time (1μs/div) : VOUT1 (V) : VIN (V) XC6419(V OUT2 =.8V) VR2 tr=tf=5μs,, V IN= V, C L2=2.2μF(ceramic) Time (1μs/div) IOUT2=.1mA IOUT2=3mA : VOUT2 (V) 2/29

21 XC6419 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (9) 入力過渡応答特性例 Input Transient Response (Continued) XC6419(V OUT1 =1.5V) VR1 XC6419(V OUT2 =1.5V) VR2 tr=tf=5μs,, V IN= V, C L1=1.μF(ceramic) tr=tf=5μs,, V IN= V, C L2=1.μF(ceramic) : VIN (V) IOUT1=.1mA IOUT1=3mA : VOUT1 (V) : VIN (V) IOUT2=.1mA : VOUT2 (V) IOUT2=3mA 1.4 Time (1μs/div) Time (1μs/div) XC6419(V OUT1 =2.8V) VR1 XC6419(V OUT2 =2.8V) VR2 tr=tf=5μs,, V IN= V, C L1=1.μF(ceramic) tr=tf=5μs,, V IN= V, C L2=1.μF(ceramic) 3. : VIN (V) IOUT1=.1mA IOUT1=3mA : VOUT1 (V) : VIN (V) IOUT2=.1mA : VOUT2 (V) IOUT2=3mA 2.7 Time (1μs/div) Time (1μs/div) XC6419(V OUT1 =5.V) VR1 XC6419(V OUT1 =5.V) VR2 6.5 tr=tf=5μs, V IN=5.5 6.V, C L1=1.μF(ceramic) tr=tf=5μs, V IN=5.5 6.V, C L1=1.μF(ceramic) 5.2 : VIN (V) IOUT1=.1mA IOUT1=3mA : VOUT1 (V) : VIN (V) IOUT2=.1mA : VOUT2 (V) IOUT2=3mA 4.9 Time (1μs/div) Time (1μs/div) 21/29

22 XC6419 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (1) 負荷過渡応答特性例 Load Transient Response XC6419(V OUT1 =.8V) VR1 XC6419(V OUT2 =.8V) VR2.85 V IN=1.8V, tr=tf=5μs, I OUT1 =.1 5mA, C IN =C L1 =2.2μF(ceramic) V IN=1.8V, tr=tf=5μs, I OUT2 =.1 5mA, C IN =C L2 =2.2μF(ceramic) 25 : VOUT1 (V) Output Current 5mA Output Current : IOUT1(mA) : VOUT2 (V) Output Current 5mA Output Current : IOUT2 (ma).6 Time (2μs/div).1mA.6 Time (2μs/div).1mA XC6419(V OUT1 =1.5V) VR1 XC6419(V OUT2 =1.5V) VR V IN=2.5V, tr=tf=5μs, I OUT1=.1 5mA, C IN=C L1=1.μF(ceramic) V IN=2.5V, tr=tf=5μs, I OUT2=.1 5mA, C IN=C L2=1.μF(ceramic) 25 : VOUT1 (V) Output Current 5mA Output Current : IOUT1 (ma) : VOUT2 (V) Output Current 5mA Output Current : IOUT2 (ma) 1.3 Time (2μs/div).1mA 1.3 Time (2μs/div).1mA XC6419(V OUT1 =2.8V) VR1 XC6419(V OUT2 =2.8V) VR V IN=3.8V, tr=tf=5μs, I OUT1=.1 5mA, C IN=C L1=1.μF(ceramic) V IN=3.8V, tr=tf=5μs, I OUT2=.1 5mA, C IN=C L2=1.μF(ceramic) 25 : VOUT1 (V) Output Current 5mA Output Current : IOUT1 (ma) : VOUT2 (V) Output Current 5mA Output Current : IOUT2 (ma) 2.6 Time (2μs/div).1mA 2.6 Time (2μs/div).1mA 22/29

23 XC6419 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (1) (1) 負荷過渡応答特性例 Load Transient Response (Continued) XC6419(V OUT1 =5.V) VR1 XC6419(V OUT2 =5.V) VR2 5.5 V IN=6.V, tr=tf=5μs, I OUT1 =.1 5mA, C IN =C L1 =1.μF(ceramic) V IN=6.V, tr=tf=5μs, I OUT2 =.1 5mA, C IN =C L2 =1.μF(ceramic) 25 : VOUT1 (V) Output Current 5mA Output Current : IOUT1 (ma) : VOUT2 (V) Output Current 5mA Output Current : IOUT2 (ma) 4.8 Time (2μs/div).1mA 4.8 Time (2μs/div).1mA (11) (11) EN 立ち上がり特性例 Rising Response Time XC6419(V OUT1 =.8V) VR1 XC6419(V OUT2 =.8V) VR2 3. tr=5μs, V IN=1.8V, V EN1= 1.8V, C IN=C L1=2.2μF(ceramic) tr=5μs, V IN=1.8V, V EN2= 1.8V, C IN=C L2=2.2μF(ceramic) 3. EN1 : VEN1 (V) EN1 EN1 IOUT1=.1mA IOUT1=3mA : VOUT1 (V) EN2 : VEN2 (V) EN2 EN2 IOUT2=.1mA IOUT2=3mA : VOUT2 (V) -3. Time (2μs/div) -3. Time (2μs/div) XC6419(V OUT1 =1.5V) VR1 XC6419(V OUT2 =1.5V) VR2 3. tr=5μs, V IN=2.5V, V EN1= 2.5V, C IN=C L1=1.μF(ceramic) tr=5μs, V IN=2.5V, V EN2= 2.5V, C IN=C L2=1.μF(ceramic) 3. EN1 : VEN1 (V) EN1 Time (2μs/div) EN1 IOUT1=.1mA IOUT1=3mA : VOUT1 (V) EN2 : VEN2 (V) EN2 EN2 IOUT2=.1mA IOUT2=3mA Time (2μs/div) : VOUT2 (V) 23/29

24 XC6419 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (11) EN 立ち上がり特性例 Rising Response Time (Continued) XC6419(V OUT1 =2.8V) VR1 XC6419(V OUT2 =2.8V) VR2 6. tr=5μs, V IN=3.8V, V EN1= 3.8V, C IN=C L1=1.μF(ceramic) tr=5μs, V IN=3.8V, V EN2= 3.8V, C IN=C L2=1.μF(ceramic) 6. EN1 : VEN1 (V) EN1 Time (2μs/div) EN1 IOUT1=.1mA IOUT1=3mA : VOUT1 (V) EN2 : VEN2 (V) EN2 EN2 IOUT2=.1mA IOUT2=3mA Time (2μs/div) : VOUT2 (V) XC6419(V OUT1 =5.V) VR1 XC6419(V OUT2 =5.V) VR2 8. tr=5μs, V IN=6.V, V EN1= 6.V, C IN=C L1=1.μF(ceramic) 1 8. tr=5μs, V IN=6.V, V EN2= 6.V, C IN=C L2=1.μF(ceramic) 1 EN1 : VEN1 (V) EN1 Time (2μs/div) EN1 IOUT1=.1mA IOUT1=3mA : VOUT1 (V) EN2 : VEN2 (V) EN2 Time (2μs/div) EN2 Input Voltage IOUT2=.1mA : VOUT2 (V) (12) リップル除去率特性例 Ripple Rejection Rate Ripple Ripple Rejection Rejection Rate Rate : PSRR : (db) XC6419(V OUT1 =.8V) VR1, V IN=1.8V+.5V p-pac, C L1=2.2μF(ceramic) IOUT1=.1mA 2 IOUT1=3mA Ripple Frequency : f (khz) Ripple Ripple Rejection Rejection Rate Rate : PSRR : (db) (db) XC6419(V OUT2 =.8V) VR2, V IN=1.8V+.5V p-pac, C L2=2.2μF(ceramic) 8 IOUT2=.1mA IOUT2=3mA Ripple Frequency : f (khz) 24/29

25 XC6419 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (12) (12) リップル除去率特性例 Ripple Rejection Rate (Continued) Ripple Ripple Rejection Rejection Rate Rate : PSRR : (db) XC6419(V OUT1 =1.5V) VR1, V IN=2.5V+.5V p-pac, C L1=1.μF(ceramic) IOUT1=.1mA IOUT1=3mA Ripple Frequency : f (khz) Ripple Ripple Rejection Rejection Rate Rate : PSRR : (db) (db) XC6419(V OUT2 =1.5V) VR2, V IN=2.5V+.5V p-pac, C L2=1.μF(ceramic) IOUT2=.1mA IOUT2=3mA Ripple Frequency : f (khz) XC6419(V OUT1 =2.8V) VR1 XC6419(V OUT2 =2.8V) VR2 Ripple Ripple Rejection Rate Rate : PSRR : (db) (db) , V IN=3.8V+.5V p-pac, C L1=1.μF(ceramic) IOUT1=.1mA IOUT1=3mA Ripple Frequency : f (khz) Ripple Ripple Rejection Rejection Rate Rate : PSRR : (db) (db) , V IN=3.8V+.5V p-pac, C L2=1.μF(ceramic) IOUT2=.1mA IOUT2=3mA Ripple Frequency : f (khz) Ripple Ripple Rejection Rate Rate : : PSRR (db) (db) XC6419(V OUT1 =5.V) VR1, V IN=5.75V+.5V p-pac, C L1=1.μF(ceramic) IOUT1=.1mA IOUT1=3mA Ripple Frequency : f (khz) Ripple Ripple Rejection Rejection Rate Rate : : PSRR (db) (db) XC6419(V OUT2 =5.V) VR2, V IN=5.75V+.5V p-pac, C L2=1.μF(ceramic) IOUT2=.1mA IOUT2=3mA Ripple Frequency : f (khz) 25/29

26 XC6419 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (13) VR1 Cross VR2 Talk 負荷過渡相互干渉特性例 XC6419(V OUT1 =1.8V, V OUT2 =2.8V) XC6419(V OUT1 =1.8V, V OUT2 =2.8V) 1.9 V IN=3.8V, tr=tf=5μs, I OUT2=.1 5mA, C IN=C L1=C L2=1.μF(ceramic) V IN=3.8V, tr=tf=5μs, I OUT1=.1 5mA, C IN=C L1=C L2=1.μF(ceramic) 25 (VR1) : VOUT1 (V) (VR1 : 1mA) Output Current (VR2 :.1mA 5mA) Output Current(VR2) : IOUT2 (ma) (VR2) : VOUT2 (V) (VR2 : 1mA) Output Current (VR1 :.1mA 5mA) Output Current(VR1) : IOUT1 (ma) 1.65 Time (2μs/div) 2.65 Time (2μs/div) 26/29

27 XC6419 Series PACKAGING INFORMATION SOT-26 USP-6C USP-6C Reference Pattern Layout USP-6C Reference Metal Mask Design *The side of pins are not gilded, but nickel is used. 27/29

28 XC6419 Series PACKAGING INFORMATION (Continued) USP-6C Power Dissipation Power dissipation data for the USP-6C is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 4 x 4 mm (16 mm 2 in one side) Copper (Cu) traces occupy 5% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125 ) Ambient Temperature( ) Power Dissipation Pd(mW) Thermal Resistance ( /W) Pd vs. Ta Power Dissipation Pd(mW) Ambient Temperature Ta( ) 28/29

29 XC6419 Series 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 29/29

30 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Torex Semiconductor: XC6419BB71ER-G XC6419BB18ER-G XC6419BB7ER-G XC6419AA28ER-G XC6419BBD7ER-G XC6419AA15ER-G XC6419BB7ER-G XC6419BB72ER-G XC6419BB74ER-G XC6419BBD9ER-G XC6419CC15MR-G XC6419BB75ER-G XC6419BB73ER-G XC6419BBD8ER-G XC6419DD6MR-G XC6419BBE1ER-G XC6419BB61ER-G XC6419CC97MR-G XC6419AA12MR-G XC6419AA62ER-G XC6419BB23ER-G XC6419CC43MR-G XC6419AA15MR-G XC6419AB28ER-G XC6419CC22MR-G XC6419BB77ER-G XC6419BBEER-G XC6419BB76ER-G XC6419CC4MR-G