XC6215 Series FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUIT TYPICAL PERFORMANCE CHARACTERISTICS

Transcription

1 XC Series ETR9_.8μA Low Power Consumption Voltage Regulator with ON/OFF Switch GENERAL DESCRIPTION The XC series are highly precise, low noise, positive voltage LDO regulators manufactured using CMOS processes. The series achieves very low supply current,.8μa (TYP.) and consists of a reference voltage source, an error amplifier, a current foldback circuit, and a phase compensation circuit plus a driver transistor. Ultra small packages USP-, USP-, USPN-, USP-B and SSOT-, and small package SOT- packages make high density mounting possible. Therefore, the series is ideal for applications where high density mounting is required such as in mobile phones. Output voltage is selectable in.v increments within a range of.9v ~.V by laser trimming The series is also compatible with low ESR ceramic capacitors, which give added output stability. The current limiter's foldback circuit also operates as a short protect for the output current limiter and the output pin. Furthermore, the CE function allows the output of the regulator to be turned off, resulting in greatly reduced power consumption. APPLICATIONS Smart phones / Mobile phones Portable game consoles Digital still cameras / Camcorders Digital audio equipments Mobile devices / terminals TYPICAL APPLICATION CIRCUIT USP-, SSOT-, SOT-,USPN-,USP-B packages (For the USP- package, with no CE pin) VIN VOUT VOUT FEATURES Maximum Output Current : ma (ma Limit, VOUT=.V, VIN=.V Dropout Voltage : IOUT = VOUT =.V Operating :.V ~.V Range :.9V ~.V (.V Increments) Highly Accurate : Set voltage accuracy ±% (.V<VOUT(T)<.V) Set voltage accuracy ±mv (.9V<VOUT(T)<.V) Low Power Consumption :.8μA (TYP.) Stand-by Current : Less than.μa Operating Temperature Range : - ~ 8 Low ESR Capacitor Compatible : Ceramic capacitor Current Limiter Circuit Built-In Packages : USP- SSOT- USP- (For the XCP series only) SOT- USPN- USP-B Environmentally Friendly : EU RoHS Compliant, Pb Free TYPICAL PERFORMANCE CHARACTERISTICS Supply Current vs... XCx VIN=VCE CIN=.μF(ceramic),CL=.μF(ceramic) CIN=.uF (ceramic) CE VSS CL=.uF (ceramic) Supply Current I SS (μa) Ta=- Ta= Ta=8. VIN (V) /9

2 XC Series PIN CONFIGURATION VSS USPN- (BOTTOM VIEW) VOUT VIN VSS USP- (BOTTOM VIEW) USP- (BOTTOM VIEW) * For mounting intensity and heat dissipation, please refer to recommended mounting pattern and recommended metal mask when soldering the pad of USP- and USP-B. Mounting should be electrically isolated or connected to the VSS (No.) pin. SSOT- (TOP VIEW) SOT- (TOP VIEW) USP-B (BOTTOM VIEW) PIN ASSIGNMENT PIN NUMBER USPN- USP- USP- SSOT- SOT- USP-B PIN NAME FUNCTIONS VIN Power Supply VSS Ground - CE ON / Off Switch VOUT Output , NC No Connection /9

3 XC Series PRODUCT CLASSIFICATION Ordering Information XC-7 (*) DESIGNATOR ITEM SYMBOL DESCRIPTION Type of Regulator 9 ~ Accuracy -7 Packages (Order Unit) B P GR-G NR NR-G MR MR-G HR HR-G 7R-G 8R-G CE logic = High active with no pull-down resistor pin regulator with no CE pin (USP- only).9 V ~.V,.V step e.g. VOUT=.V =, = + % accuracy e.g. VOUT=.V =, =, = USP- (,pcs/reel) SSOT- (,pcs/reel) SSOT- (,pcs/reel) SOT- (,pcs/reel) SOT- (,pcs/reel) (*) The -G suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. USP- (for the XCP series only) (,pcs/reel) USP- (for the XCP series only) (,pcs/reel) USPN- (,pcs/reel) USP-B (,pcs/reel) PIN FUNCTION ASSIGNMENT XC Series (Type B) CE IC OPERATION H Operation ON L Operation OFF *CE pin should not be left open. /9

4 XC Series BLOCK DIAGRAMS XCB Series XCP Series VIN VIN VOUT CE ON/OFF Control - Error Amp + each circuit Current Limit VOUT Current Limit + Error Amp - R Voltage Reference R R VSS Voltage Reference R VSS * Diodes shown in the above circuit are ESD protection diodes and parasitic diodes ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL RATINGS UNITS VIN -. ~ + 7. V Output Current IOUT (*) ma VOUT VSS -. ~ VIN +. V CE (*) VCE VSS -. ~ + 7. V Power Dissipation SOT- (PCB mounted) (*) SSOT- (PCB mounted) (*) USP- Pd (PCB mounted) (*) USP- USPN- (PCB mounted) (*) USP-B 9(PCB mounted) (*) Operating Ambient Temperature Topr - ~ + 8 Note: Storage Temperature Tstg - ~ + (*) : IOUT = Pd/ (VIN-VOUT) (*) : Except for the XCP series (*) : The power dissipation figure shown is PCB mounted. Please refer to pages to 8 for details mw /9

5 XC Series ELECTRICAL CHARACTERISTICS XCB Series Ta = PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNIT. CIRCUIT (*) Maximum Output Current Load Regulation Dropout Voltage (*) Supply Current Stand-by Current VOUT(E) IOUTMAX VOUT Vdif IDD Istby VIN=VCE=VOUT(T) (*) +.V, IOUT=mA VIN=VCE=VOUT(T) +.V VOUT(T)=.9V VIN=VCE=VOUT(T) +.V VOUT(T)=.V ~.V VIN=VCE=VOUT(T) +.V V VOUT(T)=.V ~.V VIN=VCE=VOUT(T) +.V VOUT(T)=.V ~.V VIN=VCE=VOUT(T) +.V VOUT(T)=.7V ~.V VIN=VCE=VOUT(T) +.V VOUT(T)=.V ~.9V VIN=VCE=VOUT(T) +.V VOUT(T).V VIN=VCE=VOUT(T) +.V VOUT(T)=.9V ma IOUT ma VIN=VCE=VOUT(T) +.V VOUT(T)=.V ~.V ma IOUT ma VIN=VCE=VOUT(T) +.V VOUT(T)=.V~.V ma IOUT 8mA VIN=VCE=VOUT(T) +.V VOUT(T).V ma IOUT ma VCE=VIN, VOUT(T)=.9V IOUT=mA VCE=VIN, VOUT(T)=.V ~.V IOUT=mA VCE=VIN, VOUT(T)=.V ~.V IOUT=8mA VCE=VIN, VOUT(T).V IOUT=mA VIN=VCE=VOUT(T) +.V VOUT(T).9V VIN=VCE=VOUT(T) +.V VOUT(T).V VIN=VOUT(T) +.V, VCE=VSS E-(*) V ma - 7 mv E-(*) mv μa -.. μa /9

6 XC Series ELECTRICAL CHARACTERISTICS (Continued) XCB Series (Continued) Ta = PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNIT. CIRCUIT VOUT(T)=.9V, VCE=VIN.V VIN.V IOUT=mA Line Regulation VOUT/ ( VIN VOUT) VOUT(T)=.V~.V, VCE=VIN VOUT(T)+.V VIN.V IOUT=mA -.. %/V VOUT(T).V, VCE=VIN VOUT(T)+.V VIN.V IOUT=mA VIN V - Temperature Characteristics Current Limit Short Circuit Current VOUT/ ( Topr VOUT) IIim Ishort VIN=VCE=VOUT(T)+.V, IOUT =ma - < Topr < 8 VOUT=VOUT(E).9 VOUT(T)=.9V VIN=VCE= VOUT(T)+.V VOUT=VOUT(E).9 VOUT(T)=.V ~.V VIN=VCE= VOUT(T)+.V VOUT=VOUT(E).9 VOUT(T)=.V ~.V VIN=VCE= VOUT(T)+.V VOUT=VOUT(E).9 VOUT(T)=.V ~.9V VIN=VCE= VOUT(T)+.V VOUT=VOUT(E).9 VOUT(T).V VIN=VCE= VOUT(T)+.V VIN=VCE=VOUT(T)+.V, VOUT=V - ± - ppm / ma - - ma CE H Level Voltage VCEH VIN=VOUT(T)+.V. -. CE L Level Voltage VCEL VIN=VOUT(T)+.V - -. CE H Level Current ICEH VIN=VCE=VOUT(T)+.V CE L Level Current ICEL VIN=VOUT(T)+.V, VCE=VSS NOTE: *: VOUT(T): Fixed output voltage *: VOUT(E) = Effective output voltage (i.e. the output voltage when VOUT(T) +.V is provided at the VIN pin while maintaining a certain IOUT value). *: Vdif = { VIN (*) VOUT (*) } *: VIN = The input voltage when VOUT appears as input voltage is gradually decreased. *: VOUT = A voltage equal to 98% of the output voltage whenever an amply stabilized IOUT { VOUT(T) +.V } is input. *: Refer to VOLTAGE CHART. V μa /9

7 XC Series ELECTRICAL CHARACTERISTICS (Continued) XCP Series Ta = PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNIT. CIRCUIT (*) VOUT(E) VIN=VOUT(T) (*) +.V, IOUT=mA E- (*) V VIN=VOUT(T) +.V VOUT(T)=.9V 7 - VIN=VOUT(T) +.V VOUT(T)=.V ~.V 8 - VIN=VOUT(T) +.V VOUT(T)=.V ~.V 8 - Maximum Output Current IOUTMAX VIN=VOUT(T) +.V VOUT(T)=.V ~.V - ma VIN=VOUT(T) +.V VOUT(T)=.7V ~.V - VIN=VOUT(T) +.V VOUT(T)=.V ~.9V 9 - VIN=VOUT(T) +.V VOUT(T).V - VIN=VOUT(T) +.V VOUT(T)=.9V ma IOUT ma VIN=VOUT(T) +.V Load Regulation VOUT VOUT(T)=.V~.V ma IOUT ma VIN=VOUT(T) +.V VOUT(T)=.V~.V ma IOUT 8mA - 7 mv VIN=VOUT(T) +.V VOUT(T).V ma IOUT ma VOUT(T)=.9V IOUT=mA Dropout Voltage (*) Vdif VOUT(T)=.V ~.V IOUT=mA VOUT(T)=.V ~.V IOUT=8mA E- (*) mv VOUT(T).V IOUT=mA Supply Current IDD VIN=VOUT(T)=.V VOUT(T).9V VIN= VOUT(T)+.V VOUT(T).V μa 7/9

8 XC Series ELECTRICAL CHARACTERISTICS (Continued) XCP Series (Continued) Ta = PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNIT. CIRCUIT Line Regulation VOUT VIN VOUT VOUT(T)=.9V.V VIN.V IOUT=mA VOUT(T)=.V~.V VOUT(T)+.V VIN.V IOUT=mA VOUT(T).V VOUT(T)+.V VIN.V IOUT=mA -.. %/V VIN V - Temperature Characteristics Current Limit VOUT Topr VOUT IIim VIN=VOUT(T)+.V, IOUT= ma - < Topr < 8 VOUT=VOUT(E).9 VOUT(T)=.9V VIN= VOUT(T)+.V VOUT=VOUT(E).9 VOUT(T)=.V ~.V VIN=VOUT(T)+.V VOUT=VOUT(E).9 VOUT(T)=.V ~.V VIN=VOUT(T)+.V VOUT=VOUT(E).9 VOUT(T)=.V ~.9V VIN=VOUT(T)+.V VOUT=VOUT(E).9 VOUT(T).V VIN=VOUT(T)+.V - ± - ppm / Short Circuit Current Ishort VIN=VOUT(T)+.V, VOUT=V - - ma NOTE: *: VOUT(T): Fixed output voltage *: VOUT(E) = Effective output voltage (i.e. the output voltage when VOUT(T) +.V is provided at the VIN pin while maintaining a certain IOUT value). *: Vdif = { VIN (*) VOUT (*) } *: VIN = The input voltage when VOUT appears as input voltage is gradually decreased. *: VOUT = A voltage equal to 98% of the output voltage whenever an amply stabilized IOUT { VOUT(T) +.V } is input. *: Refer to VOLTAGE CHART. ma 8/9

9 XC Series VOLTAGE CHART Dropout Voltage Chart SETTING OUTPUT VOLTAGE E- E- OUTPUT VOLTAGE (V) VOUT DROPOUT VOLTAGE (mv) Vdif VOUT(T) MIN. MAX. TYP. MAX Ta = 9/9

10 XC Series TEST CIRCUITS Circuit V CIN=.uF (ceramic) V VIN CE VSS VOUT CL=.uF (ceramic) V A IOUT RL Ishort Circuit A VIN VOUT OPEN CIN=.uF (ceramic) A CE VSS /9

11 XC Series OPERATIONAL EXPLANATION XCB Series (As for the XCP Series, with no CE pin) < Control> The voltage divided by resistors R & R is compared with the internal reference voltage by the error amplifier. The P-channel MOSFET, which is connected to the VOUT pin, is then driven by the subsequent output signal. The output voltage at the VOUT pin is controlled and stabilized by a system of negative feedback. The current limit circuit and short protect circuit operate in relation to the level of output current. Further, the IC's internal circuitry can be operated or shutdown via the CE pin's signal. VIN CE ON/OFF Control - Error Amp + each circuit Current Limit VOUT R Voltage Reference R VSS <Short Protection Circuit> The XC series regulator offers circuit protection by means of a built-in foldback circuit. When the load current reaches the current limit level, the fixed current limiter circuit operates and output voltage drops. As a result of this drop in output voltage, the foldback circuit operates, the output voltage drops further and output current decreases. When the output pin is shorted, a current of about ma flows. <CE Pin> The IC's internal circuitry can be operated or shutdown via the signal from the CE pin with the XCB series. In shutdown mode, output at the VOUT pin will be pulled down to the VSS level via R & R. Note that the XC series regulator is High Active/No Pull-Down, operations will become unstable with the CE pin open. We suggest that you use this IC with either a VIN voltage or a VSS voltage input at the CE pin. If this IC is used with the correct specifications for the CE pin, the operational logic is fixed and the IC will operate normally. However, supply current may increase as a result of through current in the IC's internal circuitry. NOTES ON USE. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded.. Where wiring impedance is high, operations may become unstable due to noise and/or phase lag depending on output current.. As for the XC series, internally achieved phase compensation makes a stable operation of the IC possible even when there is no output capacitor (C L ). In order to stabilize the VIN s voltage level, we recommend that an input capacitor (C IN ) of about. to.μf be connected between the V IN pin and the V SS pin. Moreover, during transient response, so as to prevent an undershoot or overshoot, we recommend that the output capacitor (C L ) of about. to.μf be connected between the V OUT pin and the V SS pin. However, please wire the input capacitor (C IN ) and the output capacitor (C L ) as close to the IC as possible.. Torex places an importance on improving our products and its reliability. However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment. /9

12 XC Series TYPICAL PERFORMANCE CHARACTERISTICS () vs. Output Current XCx9 XCx9. VIN=VCE=.9V CIN=.μF(ceramic),CL=.μF(ceramic). Ta= CIN=.μF(ceramic),CL=.μF(ceramic).9.. Ta=- Ta= Ta=8.9.. VIN=.V VIN=.9V VIN=.V VIN=.9V.. Output Current IOUT (ma) Output Current IOUT (ma) XCx XCx.8 VIN=VCE=.V CIN=.μF(ceramic),CL=.μF(ceramic).8 Ta= CIN=.μF(ceramic),CL=.μF(ceramic) Ta=- Ta= Ta= VIN=.8V VIN=.V VIN=.V VIN=.V.. Output Current IOUT (ma) Output Current IOUT (ma) XCx XCx. VIN=VCE=.V CIN=.μF(ceramic),CL=.μF(ceramic). Ta= CIN=.μF(ceramic),CL=.μF(ceramic) Ta=- Ta= Ta= VIN=.V VIN=.V VIN=.V VIN=.V.. Output Current IOUT (ma) Output Current IOUT (ma) /9

13 XC Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) () vs. Output Current (Continued). XCx VIN=VCE=.V CIN=.μF(ceramic),CL=.μF(ceramic). XCx Ta= CIN=.μF(ceramic),CL=.μF(ceramic) Ta=- Ta= Ta=8.... VIN=.V VIN=.V VIN=.V.. Output Current IOUT (ma) Output Current IOUT (ma) () vs. XCx9 XCx9. VIN=VCE CIN=.μF(ceramic),CL=.μF(ceramic).9 VIN=VCE CIN=.μF(ceramic),CL=.μF(ceramic) IOUT=mA IOUT=mA IOUT=mA IOUT=mA.9 IOUT=mA IOUT=mA.... VIN (V) VIN (V) XCx XCx.9 VIN=VCE CIN=.μF(ceramic),CL=.μF(ceramic). VIN=VCE CIN=.μF(ceramic),CL=.μF(ceramic).7... IOUT=mA IOUT=mA IOUT=mA IOUT=mA. IOUT=mA IOUT=mA IOUT=mA IOUT=mA.9... VIN (V)..... VIN (V) /9

14 XC Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) () vs. (Continued) XCx VIN=VCE CIN=.μF(ceramic),CL=.μF(ceramic) IOUT=mA IOUT=mA IOUT=mA IOUT=mA.. XCx VIN=VCE CIN=.μF(ceramic),CL=.μF(ceramic) IOUT=mA IOUT=mA IOUT=mA IOUT=mA... VIN (V).9... VIN (V). XCx VIN=VCE CIN=.μF(ceramic),CL=.μF(ceramic) IOUT=mA. XCx VIN=VCE CIN=.μF(ceramic),CL=.μF(ceramic) IOUT=mA...8. IOUT=mA IOUT=mA IOUT=mA. IOUT=mA IOUT=mA IOUT=mA... VIN (V) () Dropout Voltage vs. Output Current VIN (V) XCx9 VIN=VCE CIN=.μF(ceramic),CL=.μF(ceramic) XCx VIN=VCE CIN=.μF(ceramic),CL=.μF(ceramic) Dropout Voltage Vdif (V) Minimum Operating Voltage Ta=- Ta= Ta=8 Dropout Voltage Vdif (V) Ta=- Ta= Ta=8 8 Output Current IOUT (ma) Output Current IOUT (ma) /9

15 XC Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) () Dropout Voltage vs. Output Current (Continued) XCx XCx VIN=VCE CIN=.μF(ceramic),CL=.μF(ceramic) VIN=VCE CIN=.μF(ceramic),CL=.μF(ceramic) Dropout Voltage Vdif (V) Ta=- Ta= Ta=8 Dropout Voltage Vdif (V) Ta=- Ta= Ta=8.. Output Current IOUT (ma) Output Current IOUT (ma) () Supply Current vs. XCx9 XCx. VIN=VCE CIN=.μF(ceramic),CL=.μF(ceramic). VIN=VCE CIN=.μF(ceramic),CL=.μF(ceramic). Ta=- Ta=. Supply Current I SS (μa)..8.. Ta=8 Supply Current I SS (μa)..8.. Ta=- Ta=.. Ta=8.. VIN (V) VIN (V) XCx XCx. VIN=VCE CIN=.μF(ceramic),CL=.μF(ceramic). VIN=VCE CIN=.μF(ceramic),CL=.μF(ceramic).. Supply Current I SS (μa) Ta=- Ta= Ta=8 Supply Current I SS (μa) Ta=- Ta= Ta=8.. VIN (V) VIN (V) /9

16 XC Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) () vs. Ambient Temperature..9 XCx9 VIN=VCE=.9V CIN=.μF(ceramic),CL=.μF(ceramic) IOUT=mA IOUT=mA IOUT=mA.. XCx VIN=VCE=.V CIN=.μF(ceramic),CL=.μF(ceramic) IOUT=mA IOUT=mA IOUT=mA Ambient Temperature Ta ( )....8 XCx VIN=VCE=.V CIN=.μF(ceramic),CL=.μF(ceramic) IOUT=mA IOUT=mA IOUT=mA Ambient Temperature Ta ( )....7 XCx VIN=VCE=.V CIN=.μF(ceramic),CL=.μF(ceramic) IOUT=mA IOUT=mA IOUT=mA Ambient Temperature Ta ( ) Ambient Temperature Ta ( ) () Supply Current vs. Ambient Temperature. XCx9 VIN=VCE=.9V CIN=.μF(ceramic),CL=.μF(ceramic). XCx VIN=VCE=.V CIN=.μF(ceramic),CL=.μF(ceramic) Supply Current I SS (μa)..9.. Supply Current I SS (μa) Ambient Temperature Ta ( ) Ambient Temperature Ta ( ) /9

17 XC Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) () Supply Current vs. Ambient Temperature (Continued) XCx XCx. VIN=VCE=.V CIN=.μF(ceramic),CL=.μF(ceramic).8 VIN=VCE=.V CIN=.μF(ceramic),CL=.μF(ceramic).. Supply Current I SS (μa).9.. Supply Current I SS (μa) Ambient Temperature Ta ( ) Ambient Temperature Ta ( ) (7) CE Threshold Voltage vs. Ambient Temperature.9 XCx9 VIN=.9V, IOUT=mA CIN=.μF(ceramic),CL=.μF(ceramic).9 XCx VIN=.V, IOUT=mA CIN=.μF(ceramic),CL=.μF(ceramic) CE Threshold Voltage V CEH,V CEL (V).8.7. High Level Voltage Low Level Voltage CE Threshold Voltage V CEH,V CEL (V).8.7. High Level Voltage Low Level Voltage Ambient Temperature Ta ( ) XCx Ambient Temperature Ta ( ) XCx.9 VIN=.V, IOUT=mA CIN=.μF(ceramic),CL=.μF(ceramic).9 VIN=.V, IOUT=mA CIN=.μF(ceramic),CL=.μF(ceramic) CE Threshold Voltage V CEH,V CEL (V).8.7. High Level Voltage Low Level Voltage CE Threshold Voltage V CEH,V CEL (V).8.7. High Level Voltage Low Level Voltage Ambient Temperature Ta ( ) Ambient Temperature Ta ( ) 7/9

18 XC Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) Input Transient Response XCx9 tr=tf=μsec VIN=VCE, IOUT=mA, CL=.μF(ceramic). XCx9 tr=tf=μsec, VIN=VCE, IOUT=mA, CL=.μF(ceramic)... V IN (V) V IN (V) Time (μsec/div). - Time (μsec/div). XCx9 XCx9 tr=tf=μsec VIN=VCE, IOUT=mA, CL=.μF(ceramic). tr=tf=μsec, VIN=VCE, IOUT=mA, CL=.μF(ceramic). V IN (V).... V IN (V) Time (μsec/div) Time (μsec/div) XCx9 XCx9 tr=tf=μsec VIN=VCE, IOUT=mA, CL=.μF(ceramic). tr=tf=μsec, VIN=VCE, IOUT=mA, CL=.μF(ceramic)... V IN (V)... V IN (V) Time (μsec/div) Time (μsec/div) 8/9

19 XC Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) Input Transient Response (Continued). XCx tr=tf=μsec VIN=VCE, IOUT=mA, CL=.μF(ceramic).. XCx tr=tf=μsec, VIN=VCE, IOUT=mA, CL=.μF( セラミック )..... V IN (V) V IN (V) Time (μsec/div). -. Time (μsec/div).. XCx tr=tf=μsec VIN=VCE, IOUT=mA, CL=.μF(ceramic).. XCx tr=tf=μsec, VIN=VCE, IOUT=mA, CL=.μF(ceramic)..... V IN (V) V IN (V) Time (μsec/div). -. Time (μsec/div).. XCx tr=tf=μsec, VIN=VCE, IOUT=mA, CL=.μF(ceramic).. XCx tr=tf=μsec, VIN=VCE, IOUT=mA, CL=.μF(ceramic)..... V IN (V) V IN (V) Time (μsec/div). -. Time (μsec/div). 9/9

20 XC Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) Input Transient Response (Continued) XCx XCx tr=tf=μsec VIN=VCE, IOUT=mA, CL=.μF(ceramic). tr=tf=μsec, VIN=VCE, IOUT=mA, CL=.μF(ceramic). V IN (V).... V IN (V) Time (μsec/div) Time (μsec/div) XCx XCx tr=tf=μsec, VIN=VCE, IOUT=mA, CL=.μF(ceramic). tr=tf=μsec, VIN=VCE, IOUT=mA, CL=.μF(ceramic)... V IN (V)... V IN (V) Time (μsec/div) Time (μsec/div) XCx XCx tr=tf=μsec VIN=VCE, IOUT=mA, CL=.μF(ceramic). tr=tf=μsec, VIN=VCE, IOUT=mA, CL=.μF(ceramic)... V IN (V)... V IN (V) Time (μsec/div) Time (μsec/div) /9

21 XC Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) Input Transient Response (Continued) XCx XCx 7 tr=tf=μsec, VIN=VCE, IOUT=mA, CL=.μF(ceramic) 7. 7 tr=tf=μsec, VIN=VCE, IOUT=mA, CL=.μF(ceramic) 7... V IN (V).... V IN (V).... Time (μsec/div). Time (μsec/div). XCx XCx 7 tr=tf=μsec, VIN=VCE, IOUT=mA, CL=.μF(ceramic) 7. 7 tr=tf=μsec, VIN=VCE, IOUT=mA, CL=.μF(ceramic) 7... V IN (V)... V IN (V)..... Time (μsec/div). Time (μsec/div). XCx XCx 7 tr=tf=μsec, VIN=VCE, IOUT=mA, CL=.μF(ceramic) 7. 7 tr=tf=μsec, VIN=VCE, IOUT=mA, CL=.μF(ceramic) 7... V IN (V)... V IN (V)..... Time (μsec/div). Time (μsec/div). /9

22 XC Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (9) Load Transient Response XCx9 XCx9 tr=tf=μsec, VIN=VCE=.9V, CIN=.μF(ceramic),CL=.μF(ceramic). tr=tf=μsec, VIN=VCE=.9V, CIN=.μF(ceramic),CL=.μF(ceramic). Output Current I OUT (ma) Output Current Output Current I OUT (ma) Output Current Time (μsec/div) -. Time (μsec/div) -. XCx XCx tr=tf=μsec, VIN=VCE=.V, CIN=.μF(ceramic),CL=.μF(ceramic). tr=tf=μsec, VIN=VCE=.V, CIN=.μF(ceramic), CL=.μF(ceramic). Output Current I OUT (ma) Output Current.... Output Current I OUT (ma) Output Current.... Time (μsec/div) -. Time (μsec/div) -. XCx XCx tr=tf=μsec, VIN=VCE=.V, CIN=.μF(ceramic),CL=.μF(ceramic). tr=tf=μsec, VIN=VCE=.V, CIN=.μF(ceramic), CL=.μF(ceramic). Output Current I OUT (ma) Output Current.... Output Current I OUT (ma) Output Current.... Time (μsec/div) -. Time (μsec/div) -. /9

23 XC Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (9) Load Transient Response (Continued) XCx tr=tf=μsec, VIN=VCE=.V, CIN=.μF(ceramic), CL=.μF(ceramic). XCx tr=tf=μsec, VIN=VCE=.V, CIN=.μF(ceramic),CL=.μF(ceramic). Output Current I OUT (ma) Output Current.... Output Current I OUT (ma) Output Current.... Time (μsec/div). Time (μsec/div). XCx XCx tr=tf=μsec, VIN=VCE=.V, CIN=.μF(ceramic), CL=.μF(ceramic). tr=tf=μsec, VIN=VCE=.V, CIN=.μF(ceramic),CL=.μF(ceramic). Output Current I OUT (ma) Output Current.... Output Current I OUT (ma) Output Current.... VOUT (V) Time (μsec/div). Time (μsec/div). XCx XCx tr=tf=μsec, VIN=VCE=.V, CIN=.μF(ceramic),CL=.μF(ceramic). tr=tf=μsec, VIN=VCE=.V, CIN=.μF(ceramic), CL=.μF(ceramic). Output Current I OUT (ma) Output Current.... Output Current I OUT (ma) Output Current.... Time (μsec/div). Time (μsec/div). /9

24 XC Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (9) Load Transient Response (Continued) XCx XCx tr=tf=μsec, VIN=VCE=.V, CIN=.μF(ceramic),CL=.μF(ceramic). tr=tf=μsec, VIN=VCE=.V, CIN=.μF(ceramic),CL=.μF(ceramic). Output Current I OUT (ma) Output Current.... Output Current I OUT (ma) Output Current.... Time (μsec/div). Time (μsec/div). () Rising Response Time XCx9 tr=μsec VIN=VCE =V.9V, IOUT=mA, CL=.μF(ceramic) XCx9 tr=μsec VIN=VCE =V.9V, IOUT=mA, CL=.μF(ceramic) VIN (V) - - V IN (V) Time (μsec/div) - Time (μsec/div) XCx9 tr=μsec VIN=VCE =V.9V, IOUT=mA, CL=.μF(ceramic) XCx tr=μsec VIN=VCE =V.V, IOUT=mA, CL=.μF(ceramic) V IN (V) - - V IN (V) Time (μsec/div) - Time (μsec/div) /9

25 XC Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) () Rising Response Time (Continued) XCx tr=μse c VIN=VCE =V.V, IOUT=mA, CL=.μF(ceramic) XCx tr=μsec VIN=VCE =V.V, IOUT=mA, CL=.μF(ceramic) V IN (V) - V IN (V) Time (μsec/div) - Time (μsec/div) XCx tr=μsec VIN=VCE =V.V, IOUT=mA, CL=.μF(ceramic) 9 XCx tr=μsec VIN=VCE =V.V, IOUT=mA, CL=.μF(ceramic) V IN (V) -. V IN (V) Time (μsec/div) - Time (μsec/div) XCx tr=μsec VIN=VCE =V.V, IOUT=mA, CL=.μF(ceramic) 9 9 XCx tr=μsec VIN=VCE =V.V, IOUT=mA, CL=.μF(ceramic) 7.. V IN (V) V IN (V) Time (μsec/div) -9 Time (μsec/div) /9

26 XC Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) () Rising Response Time (Continued) 9 XCx tr=μsec VIN=VCE =V.V, IOUT=mA, CL=.μF(ceramic) 9 XCx tr=μsec VIN=VCE =V.V, IOUT=mA, CL=.μF(ceramic).. V IN (V) V IN (V) Time (μsec/div) () CE Rising Response Time (For XCB Type) XCB9 tr=μsec,vin=.9v VCE =.9V, IOUT=mA, CL=.μF(ceramic) -9 Time (μsec/div) XCB9 tr=μsec,vin=.9v VCE =.9V, IOUT=mA, CL=.μF(ceramic) CE V CE (V ) - - CE CE V CE (V ) - - CE - Time (μsec/div) - Time (μsec/div) XCB9 XCB tr=μsec,vin=.9v VCE =.9V, IOUT=mA, CL=.μF(ceramic) tr=μsec,vin=.v VCE =.V, IOUT=mA, CL=.μF(ceramic) CE V CE (V) - - CE CE V CE (V ) - - CE - Time (μsec/div) - Time (μsec/div) /9

27 XC Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) () CE Rising Response Time (Continued) XCB XCB tr=μsec,vin=.v VCE =.V, IOUT=mA, CL=.μF(ceramic) tr=μsec,vin=.v VCE =.V, IOUT=mA, CL=.μF(ceramic) CE V CE (V) - - CE V OUT (V ) CE V CE (V ) - - CE V OUT (V ) - Time (μsec/div) - Time (μsec/div) XCB XCB tr=μsec,vin=.v VCE =.V, IOUT=mA, CL=.μF(ceramic) tr=μsec,vin=.v VCE =.V, IOUT=mA, CL=.μF(ceramic) CE V CE (V) - - CE CE V CE (V) - - CE - Time (μsec/div) - Time (μsec/div) XCB XCB tr=μsec,vin=.v VCE =.V, IOUT=mA, CL=.μF(ceramic) 8 tr=μsec,vin=.v VCE =.V, IOUT=mA, CL=.μF(ceramic) CE V CE (V) - - CE CE V CE (V) - CE 8 - Time (μsec/div) - Time (μsec/div) 7/9

28 XC Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) () CE Rising Response Time (For XC Type) XCB XCB 8 tr=μsec,vin=.v VCE =.V, IOUT=mA, CL=.μF(ceramic) 8 tr=μsec,vin=.v VCE =.V, IOUT=mA, CL=.μF(ceramic) CE V CE (V ) - CE 8 V OUT (V ) CE V CE (V ) - CE 8 V OUT (V ) - Time (μsec/div) - Time (μsec/div) () Ripple Rejection Rate XCx9 XCx 7 VIN=VCE=.VDC+.Vp-pAC IOUT=mA, CL=.μF(ceramic) 7 VIN=VCE=.VDC+.Vp-pAC IOUT=mA, CL=.μF(ceramic) Ripple Rejection Rate RR (db) Ripple Rejection Rate RR (db).. Ripple Frequency f (khz) XCx.. Ripple Frequency f (khz) XCx 7 VIN=VCE=.VDC+.Vp-pAC IOUT=mA, CL=.μF(ceramic) 7 VIN=VCE=.VDC+.Vp-pAC IOUT=mA, CL=.μF(ceramic) Ripple Rejection Rate RR (db) Ripple Rejection Rate RR (db).. Ripple Frequency f (khz).. Ripple Frequency f (khz) 8/9

29 XC Series PACKAGING INFORMATION USP- Reference pattern Layout Reference metal mask design (Unit : mm) USP- Reference pattern Layout Reference metal mask design (Unit : mm) 9/9

30 XC Series PACKAGING INFORMATION (Continued) SOT- SSOT-.9± ~ ±..MIN (.9) ±..±..MAX (Unit : mm) (Unit : mm) USPN- Reference pattern Layout Reference metal mask design (Unit: mm) /9

31 XC Series PACKAGING INFORMATION (Continued) USP-B pin INDENT.8±. Reference pattern Layout Reference metal mask design..±. (.8) (.) /9

32 XC Series MARKING RULE SSOT- SSOT- (TOP VIEW) USP-, USP- USP- (TOP VIEW) USP- (TOP VIEW) represents type of regulator and output voltage range MARK TYPE OUTPUT VOLTAGE RANGE PRODUCT SERIES T CE pin, High Active with no.9v ~.V XCBxxxxx U pull-down resistor built in.v ~.V represents decimal point of output voltage MARK OUTPUT VOLTAGE (V) MARK OUTPUT VOLTAGE (V) -. - F H K L M N P R S T. - - A.. - U. - - B.. - V C.. - X D.. - Y E.. - Z. - - represents production lot number to 9, A to Z repeated. (G, I, J, O, Q, W excluded) NOTE: No character inversion used. represents product series MARK PRODUCT SERIES E XCxxxxxx represents type of regulator and output voltage range MARK TYPE OUTPUT VOLTAGE RANGE PRODUCT SERIES T CE pin, High Active with no.9v ~.V XCxxxxxx U pull-down resistor built in.v ~.V represents output voltage MARK OUTPUT VOLTAGE (V) MARK OUTPUT VOLTAGE (V) -. - F H K L M N P R S T. - - A.. - U. - - B.. - V C.. - X D.. - Y E.. - Z. - - represents production lot number to 9, A to Z repeated. (G, I, J, O, Q, W excluded) NOTE: No character inversion used. /9

33 XC Series MARKING RULE (Continued) SOT- represents product series MARK E PRODUCT SERIES XCxxxxxx SOT- (TOP VIEW) USPN- USPN- (TOP VIEW) USP-B USP-B (TOP VIEW) represents type of regulators and output voltage range MARK TYPE OUTPUT VOLTAGE RANGE PRODUCT SERIES T CE pin, High Active with no.9v~.v XCxxxxxx U pull-down resistor built in.v~.v represents output voltage MARK OUTPUT VOLTAGE (V) MARK OUTPUT VOLTAGE (V) -. - F H K L M N P R S T. - - A.. - U. - - B.. - V C.. - X D.. - Y E.. - Z. - - represents production lot number to 9, A to Z repeated. (G, I, J, O, Q, W excluded) NOTE: No character inversion used. /9

34 XC Series SOT- Power Dissipation Power dissipation data for the SOT- is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition.. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions x mm ( mm in one side) Copper (Cu) traces occupy % of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT- is used.) Material: Glass Epoxy (FR-) Thickness:. mm Through-hole: x.8 Diameter. Power Dissipation vs. Ambient temperature 評価基板レイアウト Evaluation Board (Unit: mm) ( 単位 :mm) Board Mount (Tj max = ) Ambient Temperature( ) Power Dissipation Pd(mW) Thermal Resistance ( /W) 8.7 Power Dissipation Pd (mw) 許容損失 Pd(mW) Pd-Ta 特性グラフ Pd vs. Ta 7 8 Ambient 周辺温度 Temperature Ta( ) ( ) /9

35 XC Series SSOT- Power Dissipation Power dissipation data for the SSOT- is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition.. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions x mm ( mm in one side) Copper (Cu) traces occupy % of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-) Thickness:. mm Through-hole: x.8 Diameter Evaluation Board (Unit: mm). Power Dissipation vs. Ambient temperature Board Mount (Tj max = ) Ambient Temperature( ) Power Dissipation Pd(mW) Thermal Resistance ( /W). 8 /9

36 XC Series USP- Power Dissipation Power dissipation data for the USP- is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions x mm ( mm in one side) Copper (Cu) traces occupy % of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-) Thickness:. mm Through-hole: x.8 Diameter Evaluation Board (Unit: mm). Power Dissipation vs. Ambient temperature Board Mount (Tj max = ) Ambient Temperature( ) Power Dissipation Pd(mW) Thermal Resistance ( /W). 8 /9

37 XC Series USPN- Power Dissipation Power dissipation data for the USPN- is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition..measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions x mm ( mm in one side) Copper (Cu) traces occupy % of the front and % of the back. The copper area is divided into four block, one block is.% of total. The USPN- package has for terminals. Each terminal connects one copper block in the front and one in the back. Material: Glass Epoxy (FR-) Thickness:. mm Through-hole: x.8 Diameter Evaluation Board (Unit: mm). Power Dissipation vs. Ambient temperature Board Mount (Tj max = ) Ambient Temperature( ) Power Dissipation Pd(mW) Thermal Resistance ( /W).7 8 7/9

38 XC Series USP-B Power Dissipation Power dissipation data for the USP-B is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition.. Measurement Condition Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions x mm ( mm in one side) Copper (Cu) traces occupy % of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-) Thickness:. mm Through-hole: x.8 Diameter Evaluation Board (Unit: mm). Power Dissipation vs. Ambient Temperature Board Mount (Tj max = ) Ambient Temperature( ) Power Dissipation Pd(mW) Thermal Resistance ( /W) /9

39 XC Series. The product and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date.. The information in this datasheet is intended to illustrate the operation and characteristics of our products. We neither make warranties or representations with respect to the accuracy or completeness of the information contained in this datasheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet.. Applicable export control laws and regulations should be complied and the procedures required by such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported.. The product is neither intended nor warranted for use in equipment of systems which require extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious property damage including but not limited to devices or equipment used in ) nuclear facilities, ) aerospace industry, ) medical facilities, ) automobile industry and other transportation industry and ) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance.. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention features.. Our products are not designed to be Radiation-resistant. 7. Please use the product listed in this datasheet within the specified ranges. 8. We assume no responsibility for damage or loss due to abnormal use. 9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex Semiconductor Ltd in writing in advance. TOREX SEMICONDUCTOR LTD. 9/9