TC4423 TC4424 TC4425 3A DUAL HIGH-SPEED POWER MOSFET DRIVERS GENERAL DESCRIPTION FEATURES ORDERING INFORMATION
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1 TC3 FEATURES High Peak Output Current... 3A Wide Operating Range....5V to V High Capacitive Load Drive Capability... pf in 5nsec Short Delay Times... <nsec Typ. Matched Rise/Fall Times Low Supply Current With Logic "" Input mA With Logic "" Input... 35µA Low Output Impedance Ω Typ. Latch-Up Protected.. Will Withstand.5A Reverse Current Logic Input Will Withstand Negative Swing Up to 5V ESD Protected...kV Pinouts Same as TC/7/; TC/7/ ORDERING INFORMATION Temperature Part No. Package Range TC3COE -Pin SOIC (Wide) C to +7 C TC3CPA -Pin Plastic DIP C to +7 C TC3EOE -Pin SOIC (Wide) C to +5 C TC3EPA -Pin Plastic DIP C to +5 C TC3MJA -Pin CerDIP 55 C to +5 C COE -Pin SOIC (Wide) C to +7 C CPA -Pin Plastic DIP C to +7 C MJA -Pin CerDIP 55 C to +5 C GENERAL DESCRIPTION The TC3//5 are higher output current versions of the new TC/7/ buffer/drivers, which, in turn, are improved versions of the earlier TC/7/ series. All three families are pin-compatible. The TC3/ /5 drivers are capable of giving reliable service in far more demanding electrical environments than their antecedents. Although primarily intended for driving power MOSFETs, the TC3//5 drivers are equally well-suited to driving any other load (capacitive, resistive, or inductive) which requires a low impedance driver capable of high peak currents and fast switching times. For example, heavily loaded clock lines, coaxial cables, or piezoelectric transducers can all be driven from the TC3//5. The only known limitation on loading is the total power dissipated in the driver must be kept within the maximum power dissipation limits of the package. Temperature Part No Package Range EOE -Pin SO Wide C to +5 C EPA -Pin Plastic DIP C to +5 C MJA -Pin CerDIP 55 C to +5 C COE -Pin SO Wide C to +7 C CPA -Pin Plastic DIP C to +7 C EOE -Pin SO Wide C to +5 C EPA -Pin Plastic DIP C to +5 C FUTIONAL BLOCK DIAGRAM INVERTING 3 mv.7v GND EFFECTIVE C = pf (EACH ) TC3 NONINVERTING DUAL INVERTING DUAL NONINVERTING ONE INV., ONE NONINV. NOTES:. has one inverting and one noninverting driver.. Ground any unused driver input. Microchip Technology Inc. DSA TC3//5- //9
2 TC3 ABSOLUTE MAXIMUM RATINGS Supply Voltage... +V Input Voltage, IN A or IN B V to GND 5.V Maximum Chip Temperature C Storage Temperature Range... 5 C to +5 C Lead Temperature (Soldering, sec) C Package Thermal Resistance CerDIP R θj-a... 5 C/W CerDIP R θj-c C/W PDIP R θj-a... 5 C/W PDIP R θj-c... 5 C/W SOIC R θj-a C/W SOIC R θj-c C/W Operating Temperature Range C Version... C to +7 C I Version C to +5 C E Version...- C to +5 C M Version C to +5 C Package Power Dissipation (T A 7 C) Plastic DIP...73mW CerDIP...mW SOIC...7mW PIN CONFIGURATIONS -Pin SO Wide 3 5 IN A 5 -Pin DIP 3 5 GND GND 3 5 TC3 3 IN A GND IN B 3 TC3 7 5 IN B 7 9 = NO CONNECTION NOTE: Duplicate pins must both be connected for proper operation. ELECTRICAL CHARACTERISTICS: T A = +5 C with.5v V, unless otherwise specified. Symbol Parameter Test Conditions Min Typ Max Unit Input V OH Logic High Input Voltage. V V IL Logic Low Input Voltage. V I IN Input Current V V IN µa Output V OH High Output Voltage.5 V V OL Low Output Voltage.5 V R O Output Resistance, High I OUT = ma, = V. 5 Ω R O Output Resistance, Low I OUT = ma, = V Ω I PK Peak Output Current 3 A I REV Latch-Up Protection Duty Cycle %.5 A Withstand Reverse Current t 3 µsec Switching Time (Note ) t R Rise Time Figure, C L = pf 3 35 nsec t F Fall Time Figure, C L = pf 5 35 nsec t D Delay Time Figure, C L = pf nsec t D Delay Time Figure, C L = pf 3 75 nsec Power Supply I S Power Supply Current V IN = 3V (Both Inputs).5.5 ma V IN = V (Both Inputs).5.5 ma TC3//5- //9 Microchip Technology Inc. DSA
3 TC3 ELECTRICAL CHARACTERISTICS (Cont.) Over operating temperature range with.5v V, unless otherwise specified. Symbol Parameter Test Conditions Min Typ Max Unit Input V IH Logic High Input Voltage. V V IL Logic Low Input Voltage. V I IN Input Current V V IN µa Output V OH High Output Voltage.5 V V OL Low Output Voltage.5 V R O Output Resistance, High I OUT = ma, = V 3.7 Ω R O Output Resistance, Low I OUT = ma, = V.3 Ω I PK Peak Output Current 3 A I REV Latch-Up Protection Duty Cycle %.5 A Withstand Reverse Current t 3 µsec Switching Time (Note ) t R Rise Time Figure, C L = pf nsec t F Fall Time Figure, C L = pf 3 nsec t D Delay Time Figure, C L = pf 3 nsec t D Delay Time Figure, C L = pf 3 nsec Power Supply I S Power Supply Current V IN = 3V (Both Inputs) 3.5 ma V IN = V (Both Inputs)..3 ma NOTE:. Switching times guaranteed by design. Test Circuit = V µf WIMA MKS-. µf CERAMIC Test Circuit = V µf WIMA MKS-. µf CERAMIC : khz, square wave, t RISE = t FALL nsec TC3 (/ ) C = pf L : khz, square wave, trise = tfall nsec (/ ) C = pf L +5V 9% +5V 9% V V % t D 9% t F t D t R 9% V V % 9% t D t R t D 9% t F V % % V % % Figure. Inverting Driver Switching Time Microchip Technology Inc. DSA 3 Figure. Noninverting Driver Switching Time TC3//5- //9
4 TC3 TYPICAL CHARACTERISTICS Rise Time vs. Supply Voltage Fall Time vs. Supply Voltage 7 pf 7 pf t RISE (nsec) 33 pf pf t FALL (nsec) 33 pf pf 7 pf 5 pf pf 7 pf 5 pf pf Rise TIme vs. Capacitive Load Fall TIme vs. Capacitive Load 5V 5V t RISE (nsec) V 5V t FALL (nsec) V 5V,, TIME (nsec) 3 3 Rise and Fall Times vs. Temperature C LOAD = pf t FALL t RISE t RISE DELAY TIME (nsec) Propagation Delay vs. Input Amplitude t D C LOAD = pf = V t FALL t D T A ( C) (V) TC3//5- //9 Microchip Technology Inc. DSA
5 TC3 TYPICAL CHARACTERISTICS (Cont.) Propagation Delay Time vs. Supply Voltage 5 DELAY TIME (nsec) C LOAD = pf C LOAD = pf 5 td td DELAY TIME (nsec) Delay Time vs. Temperature td td T A ( C) I QUIESCENT (ma) Quiescent Current vs. Supply Voltage T A = +5 C BOTH S = BOTH S =. I QUIESCENT (ma) Quiescent Current vs. Temperature S =.. S = T A ( C) Output Resistance (Output High) vs. Supply Voltage Output Resistance (Output Low) vs. Supply Voltage R DS(ON) (Ω) WORST T J = +5 C R DS(ON) (Ω) WORST T J = +5 C T A = +5 C T A = +5 C Microchip Technology Inc. DSA 5 TC3//5- //9
6 TC3 SUPPLY CURRENT CHARACTERISTICS (Load on Single Output Only) 5 3 Supply Current vs. Capacitive Load 3 khz 355 khz khz, 9 7 = V.5 khz Supply Current vs. Capacitive Load 3. khz 35.5 khz khz 9 = V = V MHz Supply Current vs. Frequency = V, pf 33 pf pf FREQUEY (khz) pf Supply Current vs. Frequency 33 pf pf 5.5 MHz 3 3 khz khz 355 khz.5 khz 3. khz khz, 5 3, pf FREQUEY (khz) pf Supply Current vs. Capacitive Load = V Supply Current vs. Frequency = V, pf 7 pf 3.55 MHz.5 MHz 3 khz MHz 355 khz.5 khz khz, FREQUEY (khz) pf pf pf TC3//5- //9 Microchip Technology Inc. DSA
7 TC3 A sec 9 TC3 Crossover Energy V IN NOTE: The values on this graph represent the loss seen by both drivers in a package during one complete cycle. For a single driver, divide the stated values by. For a single transition of a single driver, divide the stated value by. Thermal Derating Curves Pin DIP Pin SOIC Pin CerDIP AMBIENT TEMPERATURE ( C) *Static-sensitive device. Unused devices must be stored in conductive material. Protect devices from static discharge and static fields. Stresses above those listed under Absolute Maximum Ratings (See page ) may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to Absolute Maximum Rating Conditions for extended periods may affect device reliability. PACKAGE DIMENSIONS -Pin Plastic DIP PIN. (.). (.).5 (.).3 (.7). (.).3 (.).7 (.7). (.).3 (7.7).9 (7.37). (5.). (3.5).5 (3.).5 (.9). (.). (.5).5 (.3). (.) 3 MIN.. (.79).9 (.9). (.5).5 (.3). (.).3 (7.7) Dimensions: inches (mm) Microchip Technology Inc. DSA 7 TC3//5- //9
8 TC3 PACKAGE DIMENSIONS (Cont.) -Pin CerDIP. (.79).9 (.9) PIN.3 (7.).3 (5.).55 (.) MAX.. (.5) MIN.. (.).37 (9.).3 (.3).9 (7.37). (5.). (.). (.). (.5). (5.).5 (3.).5 (3.) MIN..5 (.3). (.) 3 MIN..5 (.5).5 (.). (.5). (.). (.).3 (.3) -Pin Plastic SOIC (Wide) PIN.99 (7.59).9 (7.).9 (.5).39 (.).3 (.9).39 (.).5 (.7) TYP..9 (.). (.3). (.).97 (.).3 (.33) MAX..9 (.3). (.3). (.).5 (.7). (.) Dimensions: inches (mm) TC3//5- //9 Microchip Technology Inc. DSA
9 TC3 WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 355 West Chandler Blvd. Chandler, AZ 5-99 Tel: Fax: Technical Support: Web Address: Rocky Mountain 355 West Chandler Blvd. Chandler, AZ 5-99 Tel: Fax: Atlanta 5 Sugar Mill Road, Suite B Atlanta, GA 335 Tel: Fax: Austin Analog Product Sales 33 MoPac Expressway North Suite A- Austin, TX 7759 Tel: Fax: Boston Lan Drive, Suite Westford, MA Tel: Fax: Boston Analog Product Sales Unit A-- Millbrook Tarry Condominium 97 Lowell Road Concord, MA 7 Tel: Fax: Chicago 333 Pierce Road, Suite Itasca, IL 3 Tel: Fax: Dallas 57 Westgrove Drive, Suite Addison, TX 75 Tel: Fax: Dayton Two Prestige Place, Suite 3 Miamisburg, OH 53 Tel: Fax: Detroit Tri-Atria Office Building 355 Northwestern Highway, Suite 9 Farmington Hills, MI 33 Tel: Fax: -53- Los Angeles Von Karman, Suite 9 Irvine, CA 9 Tel: Fax: Mountain View Analog Product Sales 3 Terra Bella Avenue Mountain View, CA 93-3 Tel: Fax: New York 5 Motor Parkway, Suite Hauppauge, NY 7 Tel: Fax: San Jose Microchip Technology Inc. 7 North First Street, Suite 59 San Jose, CA 953 Tel: Fax: Toronto 5 Northam Drive, Suite Mississauga, Ontario LV X5, Canada Tel: Fax: ASIA/PACIFIC China - Beijing Microchip Technology Beijing Office Unit 95 New China Hong Kong Manhattan Bldg. No. Chaoyangmen Beidajie Beijing, 7, No. China Tel: --5 Fax: --5 China - Shanghai Microchip Technology Shanghai Office Room 7, Bldg. B Far East International Plaza No. 37 Xian Xia Road Shanghai, 5 Tel: Fax: Hong Kong Microchip Asia Pacific RM, Tower, Metroplaza 3 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 5-- Fax: India Microchip Technology Inc. India Liaison Office Divyasree Chambers Floor, Wing A (A3/A) No., OíShaugnessey Road Bangalore, 5 5, India Tel: 9--9 Fax: 9--9 Japan Microchip Technology Intl. Inc. Benex S- F 3--, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, -33, Japan Tel: Fax: Korea Microchip Technology Korea -, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea Tel: Fax: ASIA/PACIFIC (continued) Singapore Microchip Technology Singapore Pte Ltd. Middle Road #7- Prime Centre Singapore, 9 Tel: Fax: Taiwan Microchip Technology Taiwan F-3, No. 7 Tung Hua North Road Taipei, 5, Taiwan Tel: Fax: EUROPE Australia Microchip Technology Australia Pty Ltd Suite, Rawson Street Epping, NSW Australia Tel: Fax: Denmark Microchip Technology Denmark ApS Regus Business Centre Lautrup hoj -3 Ballerup DK-75 Denmark Tel: Fax: 5 99 France Arizona Microchip Technology SARL Parc díactivite du Moulin de Massy 3 Rue du Saule Trapu Batiment A - ler Etage 93 Massy, France Tel: Fax: Germany Arizona Microchip Technology GmbH Gustav-Heinemann Ring 5 D-739 Munich, Germany Tel: Fax: Germany Analog Product Sales Lochhamer Strasse 3 D-5 Martinsried, Germany Tel: Fax: Italy Arizona Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus V. Le Colleoni Agrate Brianza Milan, Italy Tel: Fax: United Kingdom Arizona Microchip Technology Ltd. 55 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG 5TU Tel: 9 59 Fax: All rights reserved. Microchip Technology Incorporated. Printed in the USA. / Printed on recycled paper. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchipís products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, except as maybe explicitly expressed herein, under any intellectual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights reserved. All other trademarks mentioned herein are the property of their respective companies. /9/ Microchip Technology Inc. DSA 9 TC3//5- //9
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