Implementation of Power Transmission Lines to Field Programmable Gate Array ICs for Managing Signal and Power Integrity
|
|
- Kory Benson
- 6 years ago
- Views:
Transcription
1 Implementation of Power Transmission Lines to Field Programmable Gate Array ICs for Managing Signal and Power Integrity Sang Kyu Kim, Satyanarayana Telikepalli, Sung Joo Park, Madhavan Swaminathan and David Keezer Department of Electrical and Computer Engineering Georgia Institute of Technology 266 Ferst Dr. Atlanta, GA Abstract As the operating frequencies of electronic devices increase, power and signal integrity have become a major issue. Simultaneous switching noise (SSN) is a major problem that restricts the performance of high speed digital systems. SSN leads to voltage fluctuations during data transitions which can induce excessive noise. SSN is caused by parasitic inductance components in the power delivery network (PDN) that manifest themselves through via transitions, apertures on reference plane, split planes and even solid planes. A new method has been proposed to address this problem, which employs power transmission lines (PTL) that supply power to integrated circuits instead of using the conventional power/ground plane pairs. This along with current balancing can be used to manage return path discontinuities and power supply noise. Many of the published work in this area have proved that the PTL concept is able to reduce SSN and enhance power and signal integrity. Pseudo-balanced power transmission line (PB-PTL) concept has been shown to improve performance and reduce power consumption. However, this has only been applied to relatively simple test vehicles. In this paper, the PB-PTL scheme has been extended for driving multiple I/O drivers in field programmable gate array (FPGA) ICs. This paper discusses the theory, simulation and measurement results for this implementation. I. INTRODUCTION In high speed digital systems with multiple I/O drivers, simultaneous switching noise (SSN) is a major factor that restricts system performance. SSN in the package and boards occurs wherein there is an interruption in the return current paths. This return path discontinuity (RPD) excites the cavity resonance between power and ground plane, which degenerates signal integrity. Via transitions, split planes and apertures on the reference plane are reasons for generating excessive SSN. Furthermore, SSN can be caused by solid voltage plane during data transitions as well [1]. Many of the methodologies prevent SSN using decoupling capacitors, stitching vias at RPD locations and differential signaling scheme [2]-[4]. Recently a new method for Youkeun Han DRAM technology, Memory Division Samsung Electronics Co. Ltd. Hwasung-city, Gyeonggi-do, Korea eliminating the RPDs has been proposed. This replaces the power plane with transmission lines when connecting the voltage regulator module (VRM) to the integrated circuits (ICs). The transmission line, which serves as the power delivery network (PDN), is referred to as power transmission line (PTL) in this paper [5]. There are several issues to be addressed for using PTL namely, 1) dc drop through the source termination resistor during data transitions, 2) impedance mismatch due to manufacturing variations, and 3) layout congestion due to increasing the number of PCB traces. The first two problems can be solved using the constant current power transmission line scheme (CC-PTL). The CC-PTL adds a data pattern detector, switching networks and dummy paths to the PTL so that it maintains constant amount of current flowing through the PTL at all time [6]. This scheme, however, doubles power consumption compared to the conventional PDN. To reduce power overhead, pseudo-balanced signaling scheme has been employed to PTL and called PB-PTL. This concept uses a balanced coding scheme, but some of the encoded bits are discarded when the bit sequences are transmitted to the receiver. The PB-PTL concept not only eliminates RPD, but also reduces inductive noise because it controls the number of high states of data patterns. The PB-PTL improves jitter characteristics, eye patterns and decreases power consumption compared to CC-PTL as well [7]. In the past a simple I/O driver with few output buffers has been used to demonstrate the PTL concept [6], [7]. In this paper we extend the PB-PTL concept to a more realistic application. In [8], we briefly explained the implementation of PTL in a Field Programmable Gate Arrays (FPGA) IC. In this paper, we provide details on the layout and measurements. This work was sponsored by Samsung under award number 2106CHU
2 II. LAYOUT DESIGN A. Description of FPGA Board The Xilinx Spartan-6 LX45 FG(G) 484 has 338 I/O drivers. Collection I/O drivers is called a bank and the Xilinx chip consists of 4 banks (bank 0 ~ bank 3), which is shown in Fig. 1 [9]. In order to power to bank 3, a power transmission line (PTL) is inserted instead of the conventional power/ground pairs. Bank 3 has 88 I/O drivers and in this paper 30 of them are used for single-ended signaling. Inner1 layer in the board. The focus of the two test vehicles is to compare and contrast the two designs in terms of eye diagrams. The total thickness of the PTL board is mil while the conventional board is 44.9 mil. The difference in thickness is due to the additional layer of the PTL and the fabrication process. Copper (thickness 1.35 mil.) and FR-4 (εr = 4.5) are used for both boards. Once again, it is important to note that in actual implementation, the PTL board would be thinner since it will contains fewer layers. Figure 1. Diagram of I/O banks in Xilinx Spartan 6 IC Layout designs for two test vehicles are shown in Fig. 2. Fig. 2(a) and (b) represents the layout for the test vehicle using PTL while Fig. 2(c) and (d) shows the design using conventional power/ground pairs. A strip line in Fig. 2(a) is the PTL and the characteristic impedance of this line is designed to be 10Ω. In Fig. 2(b), the PTL is magnified to show how its connection to power supply pins of FPGA IC. It is important to note that the impedance is much higher than the conventional PDN structure. The shaded region in Fig. 2(c) represents the power plane. Similarly, the same region for the conventional design is enlarged in Fig. 2(d). The characteristic impedance of signal transmission lines for output drivers is 50Ω. (a) (b) PTL B. Stack-up layer of FPGA Board Stack-up layer designs for both test vehicles are shown in Fig 3. The board using the PTL has 5 layers (Fig. 3(a)), which are signal(top)-ground(gnd1)-signal(inner1)-power(pwr1)- signal(bottom). The ICs including the FPGA, power supply, user interfaces, inputs and 18 of 30 output signal transmission lines are on the Top layer. The others such as 12 output signal transmission lines and some passive components are placed on the Bottom layer. Note that the PTL is inserted into Inner1 layer and this was intentionally done to demonstrate the concept in this paper. It is important to note that with PTL, the layers typically decrease and not increase since the PTL can be placed on the same layer as the signal transmission lines [5]. For the test vehicle using power/ground planes which we call as the conventional design, here it has 4 layers, which are signal(top)-ground(gnd1)-power(pwr1)-signal(bottom). In conventional designs signal integrity is invariably affected by RPDs [1]. However, for the stack-up in Fig. 3(b) there are no RPDs. Hence, in this paper, the effect on signal integrity comes purely from power supply noise and other discontinuities. The components for the conventional design on each layer are the same as the PTL board, except for no (c) (d) Power Plane Figure 2. Layout design (a) power transmission line (b) power transmission line (enlarged) (c) conventional design (d) conventional design (enlarged)
3 C. Fabrication of FPGA Board The fabricated boards are shown in Fig. 4 with some important functionality are briefly described in this section. Both test vehicles have 6 outputs connected to SMA connectors and the others are terminated (50Ω) to ground. In addition to 80 pin input connectors, there are 4 input SMA connectors on the board. Figure 5 shows a cross section in which the PTL is connected from the power supply connector (Top layer) to the FPGA IC (Inner1 layer). (a) (b) Figure 3. Stack-up layer (a) power transmission line (b) conventional design III. CIRCUIT MODELING The circuit model of the PB-PTL is shown in Fig. 6. The output drivers of FPGA ICs are represented as transistors. The directions of current show pull-up states (right direction) and pull-down states (left direction) respectively. Note that there is a source termination resistor between the PTL and VDD for series-parallel termination scheme. With pseudo-balanced signaling, however, impedance mismatch effect can be minimized regardless of the termination resistors. When 4-to-6 pseudo-balanced signaling is used, 3 transistors are always turned-on out of 6 drivers. Therefore, the amount of current flowing through the PTL is constant at any time and this eliminates impedance mismatch. Moreover, the pseudo-balanced signaling can be uniquely decoded at receiver. In Fig. 6, the 6 th bit is used as the balancing bit and it is not transmitted to the receiver. Figure 4. Fabricated board Figure 5. Cross section of power transmission line Figure 6. Circuit model of pesudo-balanced signaling scheme in the power transmission line
4 A. Power Transmission Line Simulation The schematic of the PTL was simulated using Agilent ADS. The resulting eye diagram is shown in Figure 9. The eye height is 0.926V, which is an 11% decrease from the PTL scheme. In addition, the eye width is 2.47ns and the peak-topeak jitter is ps. The peak-to-peak jitter is a 52% increase compared with the PTL circuit [8]. Figure 7. Simulated eye diagram for PTL case The eye diagram from simulation is shown in Fig. 7. The eye height is V and the eye width is 2.51ns. The peakto-peak jitter is 155.2ps [8]. IV. PROGRAMMING The pseudo-balanced coding scheme is illustrated in Fig. 10. In 4-to-6 coding, 3 output drivers are always turned on, thereby keeping the current through the power distribution network constant. With 20-to-30 coding in Fig. 10, 15 output drivers are always turned on at any time. The total current was 500mA when using 20-to-30 coding. The input signal consists of a clock signal and a reset signal. The clock signal is connected to the pseudo-random bit sequence generator, which uses a linear feedback shift register (LFSR) and two registers for synchronizing each output stage, as shown in Fig. 10. The reset signal is connected to the pseudo random bit sequence (PRBS) block. B. Conventional PDN Simulation The conventional design simulated in SONNET is shown in Fig. 8. Figure 8. Simulated power and ground plane for conventinal board Figure 10. Block diagram of programming In the simulation, ports were placed in 12 locations, 1 port at the power supply voltage location, and the other 11 ports at the V CCO pins of the FPGA IC. The resulting S-parameters were then simulated with the Spartan-6 IBIS models provided by Xilinx. Figure 9. Simulated eye diagram for conventional power plane case Figure 11. Block diagram of testing setup
5 Rs) corresponds to the PTL board without source resistors (uses same voltage as the conventional board). Similarly, the conventional design using PRBS is shown as Conventional (W/O Coding) while Conventional (W/ Coding) employed pseudo-balanced signaling. The objective for removing the source resistor is to check if there are changes in the signal integrity of the waveform. The conventional board refers to the board using power and ground planes with PRBS and pseudo-balanced signaling as the input signal. Figure 13 and 14 shows the waveform comparison between the PTL board without source resistors and the conventional board without using the pseudo-balanced coding for 600MHz frequency. The eye diagrams of the PTL without termination resistors and the conventional board using PRBS are similar to Fig. 13, so they are not included. Figure 12. Testing setup V. MEASUREMENT RESULTS Fig. 11 is the block diagram of the testing configuration and Fig. 12 is the measurement setup. Three power supplies (E3610A) were used. The voltage of one power supply was set to 1.2V, which was connected to the supply voltage for the FPGA core. The other two power supplies were of voltage 2.5V, where one was connected to the auxiliary supply voltage and the other to supply voltages for bank 0-bank 3. For the PTL board, however, an additional power supply was used to provide voltage for bank 3. A signal generator (81133A) and an oscilloscope (DCA-X86100D) were connected to the board for providing the input source and measuring the output waveform. Since each output driver requires 1.55V and 31mA, it consumes a large amount of power. Therefore, the pseudobalanced coding scheme was reduced to 8-to-12 and 12-to-18 instead of 20-to-30. For the test vehicle using PTL, pseudobalanced coding scheme was employed and the output was measured with (Fig. 6) and without the series source termination resistors. For the conventional board consisting of power and ground planes, the PRBS was used as the input signal. In other words, when using 12-to-18 coding scheme, the number of I/O drivers for the PTL board was 18 as compared to the conventional board, which was 12. To maintain 2.5V at the power supply pin of the FPGA, the power supply voltage for the PTL with source termination resistors was adjusted. This is shown in Table I for 12-to-18 coding and in Table II for 8-to-12 scheme. As frequency increases, the FPGA draws more current which results in an increase in the supply voltage. For 12-to-18 coding, the total amount of constant current was 300mA and for 8-to-12 coding, 200mA. Table III shows the measured peak-to-peak jitter of both test vehicles when using 12-to-18 coding scheme. Table IV shows when 8-to-12 coding scheme is used. In the tables, the PTL (W/ Rs) stands for the PTL s test vehicle when the series source termination resistors were used while the PTL (W/O TABLE I. ADJUSTED VOLTAGE FOR THE PTL WITH THE TERMINATION RESISTORS AND 12-TO-18 CODING SCHEME Clock Frequency [MHz] Adjusted Voltage [V] TABLE II. ADJUSTED VOLTAGE FOR THE PTL WITH THE TERMINATION RESISTORS AND 8-TO-12 CODING SCHEME Clock Frequency [MHz] Adjusted Voltage [V] TABLE III. PEAK-TO-PEAK JITTER (12-TO-18 CODING SCHEME) Clock Peak-to-Peak jitter [ps] Freq. PB-PTL PB-PTL Conventional Conventional [MHz] (W/O Rs) (W/ Rs) (W/ Coding) (W/O Coding) TABLE IV. PEAK-TO-PEAK JITTER (8-TO-12 CODING SCHEME) Clock Peak-to-Peak jitter [ps] Freq. PB-PTL PB-PTL Conventional Conventional [MHz] (W/O Rs) (W/ Rs) (W/ Coding) (W/O Coding)
6 Peak-to-peak jitter ps Eye height 1.37V Figure 13. Output eye diagram of PB-PTL without source termination resistors for 12-to-18 coding scheme VI. CONCLUSIONS Pseudo-balanced signaling using PTL (PB-PTL) was implemented and compared to a conventional board for FPGA ICs. The PTL board was measured both with and without source termination resistors. For conventional board, Pseudobalanced signaling was applied to the conventional board design as well. Since the RPD is not present in the conventional board, the reason for the deterioration in the eye diagram is due to power supply noise. The PB-PTL provided wider eye diagram with pseudo-balanced signaling than the conventional board. This result indicates that the PTL can be used to replace the voltage plane and can be used to service several drivers. With the introduction of RPDs in the board, PB-PTL will provide better performance as compared to conventional design using voltage plane, even if the source coding is used for both, as shown in [6], [7]. In addition, there was no appreciable difference in signal integrity in the PTL board with and without the source termination resistor since the far end of the transmission lines were terminated. Hence, the source termination resistor has a small role to play in improving the waveforms and therefore can be removed. This results in power savings. Peak-to-peak jitter ps Eye height 1.34V Figure 14. Output eye diagram of conventional design without pesudobalanced signaling for 12-to-18 coding scheme The improvement in Peak to Peak jitter between PB-PTL without source resistor and conventional board using PRBS is 50% - 84% for 12-to-18 coding and 40% - 89% for 8-to-12 coding, over a frequency range of MHz. This improvement in jitter is caused due to a reduction in power supply noise which impacts deterministic jitter. Although the measurement data of root-mean-square (RMS) jitter, eye height and eye width are not provided in this paper, the PB- PTL provided broader eye diagram and reduced RMS jitter. For instance, the improvement in RMS jitter between PB-PTL without source resistor and conventional board is 52% 87% for 12-to-18 coding and 50% - 84% for 8-to12 coding, over a frequency range of MHz. The jitter characteristics and eye patterns between the PTL with and without source resistors are similar to each other. This is because pseudobalanced coding scheme decreases inductive noise by restricting the number of high states during data transitions. Moreover, the impedance mismatch effect is minimized since the PTL is kept charged all the time. Comparing PB-PTL board and conventional board with coding, the PB-PTL scheme provided better signal integrity with reduced jitter at most frequencies. REFERENCES [1] M. Swaminathan, D. Chung, S. Grivet-Talocia, K. Bharath, V. Laddha, and J. Xie, Designing and Modeling for Power Integrity, IEEE Transactions on Electromagnetic Compatibility, vol. 52, no. 2, pp , May [2] M. M. Pajovic, J. Yu, Z. Potocnik, and A. Bhobe, Gigahertz-Range Analysis of Impedance Profile and Cavity Resonances in Multilayered PCBs, IEEE Transactions on Electromagnetic Compatibility, vol. 52, no. 1, pp , Feb [3] I. Ndip, F. Ohnimus, K. Löbbicke, M. Bierwirth, C. Tschoban, S. Guttowski, H. Reichl, K.-D. Lang, and H. Henke, Modeling, Quantification, and Reduction of the Impact of Uncontrolled Return Currents of Vias Transiting Multilayered Packages and Boards, IEEE Transactions on Electromagnetic Compatibility, vol. 52, no. 2, pp , May [4] X. Wang and D. Su, The Influence of Power/Ground Resonance to Via s SSN Noise Coupling in Multilayer Package and Three Mitigating Ways, in 2006 International Conference on Electronic Materials and Packaging, 2006, pp [5] A. Ege Engin and M. Swaminathan, Power transmission lines: A new interconnect design to eliminate simultaneous switching noise, in th Electronic Components and Technology Conference, 2008, pp [6] S. L. Huh, M. Swaminathan, and D. Keezer, Constant Current Power Transmission Line-Based Power Delivery Network for Single-Ended Signaling, IEEE Transactions On Electromagnetic Compatibility, vol. 53, no. 4, pp , [7] S. Huh, M. Swaminathan, and D. Keezer, Design of power delivery networks using power transmission lines and pseudo-balanced signaling for multiple I/Os, in 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, 2011, pp [8] Satyanarayana Telikepalli, Sang Kyu Kim, Sung Joo Park, Madhavan Swaminathan and and Youkeun Han, Managing signal and power integrity using power transmission lines and alternative signaling schemes, IEEE Latin American Symposium on Circuts and Systems, March [9] XA Spartan-6 FPGA Family Internet: 6/index.htm
Characterization of Alternate Power Distribution Methods for 3D Integration
Characterization of Alternate Power Distribution Methods for 3D Integration David C. Zhang, Madhavan Swaminathan, David Keezer and Satyanarayana Telikepalli School of Electrical and Computer Engineering,
More informationMinimizing Coupling of Power Supply Noise Between Digital and RF Circuit Blocks in Mixed Signal Systems
Minimizing Coupling of Power Supply Noise Between Digital and RF Circuit Blocks in Mixed Signal Systems Satyanarayana Telikepalli, Madhavan Swaminathan, David Keezer Department of Electrical & Computer
More informationWelcome to the Signal Integrity Column! In this issue, you will
Signal Integrity Jun Fan, Associate Editor Welcome to the Signal Integrity Column! In this issue, you will find a very interesting paper on power integrity. In modern high-speed digital designs, power
More informationAre Power Planes Necessary for High Speed Signaling?
DesignCon 2012 Are Power Planes Necessary for High Speed Signaling? Suzanne L. Huh, Intel Corporation [suzanne.l.huh@intel.com] Madhavan Swaminathan, Georgia Institute of Technology [madhavan.swaminathan@ece.gatech.edu]
More informationA10-Gb/slow-power adaptive continuous-time linear equalizer using asynchronous under-sampling histogram
LETTER IEICE Electronics Express, Vol.10, No.4, 1 8 A10-Gb/slow-power adaptive continuous-time linear equalizer using asynchronous under-sampling histogram Wang-Soo Kim and Woo-Young Choi a) Department
More informationCORRELATION OF PDN IMPEDANCE WITH JITTER AND VOLTAGE MARGIN IN HIGH SPEED CHANNELS
CORRELATION OF PDN IMPEDANCE WITH JITTER AND VOLTAGE MARGIN IN HIGH SPEED CHANNELS A Thesis Presented to The Academic Faculty By Vishal Laddha In Partial Fulfillment of the Requirements for the Degree
More informationDESIGN OF POWER DELIVERY NETWORKS USING POWER TRANSMISSION LINES FOR HIGH SPEED I/O SIGNALING IN COMPLEX ELECTRONIC SYSTEMS
DESIGN OF POWER DELIVERY NETWORKS USING POWER TRANSMISSION LINES FOR HIGH SPEED I/O SIGNALING IN COMPLEX ELECTRONIC SYSTEMS A Dissertation Presented to The Academic Faculty by David C. Zhang In Partial
More informationEngineering the Power Delivery Network
C HAPTER 1 Engineering the Power Delivery Network 1.1 What Is the Power Delivery Network (PDN) and Why Should I Care? The power delivery network consists of all the interconnects in the power supply path
More information3D IC-Package-Board Co-analysis using 3D EM Simulation for Mobile Applications
3D IC-Package-Board Co-analysis using 3D EM Simulation for Mobile Applications Darryl Kostka, CST of America Taigon Song and Sung Kyu Lim, Georgia Institute of Technology Outline Introduction TSV Array
More informationSignal Integrity Design of TSV-Based 3D IC
Signal Integrity Design of TSV-Based 3D IC October 24, 21 Joungho Kim at KAIST joungho@ee.kaist.ac.kr http://tera.kaist.ac.kr 1 Contents 1) Driving Forces of TSV based 3D IC 2) Signal Integrity Issues
More informationPractical Limitations of State of the Art Passive Printed Circuit Board Power Delivery Networks for High Performance Compute Systems
Practical Limitations of State of the Art Passive Printed Circuit Board Power Delivery Networks for High Performance Compute Systems Presented by Chad Smutzer Mayo Clinic Special Purpose Processor Development
More informationSINCE the performance of personal computers (PCs) has
334 IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II: EXPRESS BRIEFS, VOL. 57, NO. 5, MAY 2010 Multi-Slot Main Memory System for Post DDR3 Jaejun Lee, Sungho Lee, and Sangwook Nam, Member, IEEE Abstract This
More informationChapter 16 PCB Layout and Stackup
Chapter 16 PCB Layout and Stackup Electromagnetic Compatibility Engineering by Henry W. Ott Foreword The PCB represents the physical implementation of the schematic. The proper design and layout of a printed
More informationLow-Jitter, Precision Clock Generator with Two Outputs
19-2456; Rev 0; 11/07 E V A L U A T I O N K I T A V A I L A B L E Low-Jitter, Precision Clock Generator Ethernet Networking Equipment General Description The is a low-jitter precision clock generator optimized
More informationA NOISE SUPPRESSION TECHNIQUE USING DUAL LAYER SPIRALS WITH VARIOUS GROUND STRUC- TURE FOR HIGH-SPEED PCBS
Progress In Electromagnetics Research B, Vol. 46, 337 356, 2013 A NOISE SUPPRESSION TECHNIQUE USING DUAL LAYER SPIRALS WITH VARIOUS GROUND STRUC- TURE FOR HIGH-SPEED PCBS Tong-Ho Chung, Hee-Do Kang, Tae-Lim
More informationDDR4 memory interface: Solving PCB design challenges
DDR4 memory interface: Solving PCB design challenges Chang Fei Yee - July 23, 2014 Introduction DDR SDRAM technology has reached its 4th generation. The DDR4 SDRAM interface achieves a maximum data rate
More informationThe data rates of today s highspeed
HIGH PERFORMANCE Measure specific parameters of an IEEE 1394 interface with Time Domain Reflectometry. Michael J. Resso, Hewlett-Packard and Michael Lee, Zayante Evaluating Signal Integrity of IEEE 1394
More informationMyoung Joon Choi, Vishram S. Pandit Intel Corp.
Myoung Joon Choi, Vishram S. Pandit Intel Corp. IBIS Summit at DesignCon 2010 Acknowledgements: Woong Hwan Ryu, Joe Salmon Copyright 2010, Intel Corporation. All rights reserved. Need for SI/PI Co-analysis
More informationRelationship Between Signal Integrity and EMC
Relationship Between Signal Integrity and EMC Presented by Hasnain Syed Solectron USA, Inc. RTP, North Carolina Email: HasnainSyed@solectron.com 06/05/2007 Hasnain Syed 1 What is Signal Integrity (SI)?
More informationEffective Routing of Multiple Loads
feature column BEYOND DESIGN Effective Routing of Multiple Loads by Barry Olney In a previous Beyond Design, Impedance Matching: Terminations, I discussed various termination strategies and concluded that
More informationA Simulation Study of Simultaneous Switching Noise
A Simulation Study of Simultaneous Switching Noise Chi-Te Chen 1, Jin Zhao 2, Qinglun Chen 1 1 Intel Corporation Network Communication Group, LOC4/19, 9750 Goethe Road, Sacramento, CA 95827 Tel: 916-854-1178,
More informationHV739 ±100V 3.0A Ultrasound Pulser Demo Board
HV79 ±00V.0A Ultrasound Pulser Demo Board HV79DB Introduction The HV79 is a monolithic single channel, high-speed, high voltage, ultrasound transmitter pulser. This integrated, high performance circuit
More informationModelling electromagnetic field coupling from an ESD gun to an IC
Modelling electromagnetic field coupling from an ESD gun to an IC Ji Zhang #1, Daryl G Beetner #2, Richard Moseley *3, Scott Herrin *4 and David Pommerenke #5 # EMC Laboratory, Missouri University of Science
More informationHow to anticipate Signal Integrity Issues: Improve my Channel Simulation by using Electromagnetic based model
How to anticipate Signal Integrity Issues: Improve my Channel Simulation by using Electromagnetic based model HSD Strategic Intent Provide the industry s premier HSD EDA software. Integration of premier
More informationDesign of the Power Delivery System for Next Generation Gigahertz Packages
Design of the Power Delivery System for Next Generation Gigahertz Packages Madhavan Swaminathan Professor School of Electrical and Computer Engg. Packaging Research Center madhavan.swaminathan@ece.gatech.edu
More informationTECHNICAL REPORT: CVEL Parasitic Inductance Cancellation for Filtering to Chassis Ground Using Surface Mount Capacitors
TECHNICAL REPORT: CVEL-14-059 Parasitic Inductance Cancellation for Filtering to Chassis Ground Using Surface Mount Capacitors Andrew J. McDowell and Dr. Todd H. Hubing Clemson University April 30, 2014
More informationLow Jitter, Low Emission Timing Solutions For High Speed Digital Systems. A Design Methodology
Low Jitter, Low Emission Timing Solutions For High Speed Digital Systems A Design Methodology The Challenges of High Speed Digital Clock Design In high speed applications, the faster the signal moves through
More informationDesign Considerations for Highly Integrated 3D SiP for Mobile Applications
Design Considerations for Highly Integrated 3D SiP for Mobile Applications FDIP, CA October 26, 2008 Joungho Kim at KAIST joungho@ee.kaist.ac.kr http://tera.kaist.ac.kr Contents I. Market and future direction
More informationICS PCI-EXPRESS CLOCK SOURCE. Description. Features. Block Diagram DATASHEET
DATASHEET ICS557-0 Description The ICS557-0 is a clock chip designed for use in PCI-Express Cards as a clock source. It provides a pair of differential outputs at 00 MHz in a small 8-pin SOIC package.
More informationA 6 : 1 UNEQUAL WILKINSON POWER DIVIDER WITH EBG CPW
Progress In Electromagnetics Research Letters, Vol. 8, 151 159, 2009 A 6 : 1 UNEQUAL WILKINSON POWER DIVIDER WITH EBG CPW C.-P. Chang, C.-C. Su, S.-H. Hung, and Y.-H. Wang Institute of Microelectronics,
More informationElectrical Characteristics Analysis and Comparison between Through Silicon Via(TSV) and Through Glass Via(TGV)
Electrical Characteristics Analysis and Comparison between Through Silicon Via(TSV) and Through Glass Via(TGV) Jihye Kim, Insu Hwang, Youngwoo Kim, Heegon Kim and Joungho Kim Department of Electrical Engineering
More informationBASIS OF ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUIT Chapter VI - MODELLING PCB INTERCONNECTS Corrections of exercises
BASIS OF ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUIT Chapter VI - MODELLING PCB INTERCONNECTS Corrections of exercises I. EXERCISE NO 1 - Spot the PCB design errors Spot the six design errors in
More informationPI3DPX1207B Layout Guideline. Table of Contents. 1 Layout Design Guideline Power and GROUND High-speed Signal Routing...
PI3DPX1207B Layout Guideline Table of Contents 1 Layout Design Guideline... 2 1.1 Power and GROUND... 2 1.2 High-speed Signal Routing... 3 2 PI3DPX1207B EVB layout... 8 3 Related Reference... 8 Page 1
More informationPI3HDMIxxx 4-Layer PCB Layout Guideline for HDMI Products
PI3HDMIxxx 4-Layer PCB Layout Guideline for HDMI Products Introduction The differential trace impedance of HDMI is specified at 100Ω±15% in Test ID 8-8 in HDMI Compliance Test Specification Rev.1.2a and
More informationEffect of Power Distribution Network Design on RF circuit performance for 900MHz RFID Reader
Effect of Power Distribution Network Design on RF circuit performance for 900MHz RFID Reader Youngwon Kim, Chunghyun Ryu, Jongbae Park, and Joungho Kim Terahertz Interconnection and Package Laboratory,
More informationPCI-EXPRESS CLOCK SOURCE. Features
DATASHEET ICS557-01 Description The ICS557-01 is a clock chip designed for use in PCI-Express Cards as a clock source. It provides a pair of differential outputs at 100 MHz in a small 8-pin SOIC package.
More information1Gbps to 12.5Gbps Passive Equalizer for Backplanes and Cables
19-46; Rev 2; 2/8 EVALUATION KIT AVAILABLE 1Gbps to 12.Gbps General Description The is a 1Gbps to 12.Gbps equalization network that compensates for transmission medium losses encountered with FR4 and cables.
More informationif the conductance is set to zero, the equation can be written as following t 2 (4)
1 ECEN 720 High-Speed Links: Circuits and Systems Lab1 - Transmission Lines Objective To learn about transmission lines and time-domain reflectometer (TDR). Introduction Wires are used to transmit clocks
More information/14/$ IEEE 470
Analysis of Power Distribution Network in Glass, Silicon Interposer and PCB Youngwoo Kim, Kiyeong Kim Jonghyun Cho, and Joungho Kim Department of Electrical Engineering, KAIST Daejeon, South Korea youngwoo@kaist.ac.kr
More informationHigh Speed Design Issues and Jitter Estimation Techniques. Jai Narayan Tripathi
High Speed Design Issues and Jitter Estimation Techniques Jai Narayan Tripathi (jainarayan.tripathi@st.com) Outline Part 1 High-speed Design Issues Signal Integrity Power Integrity Jitter Power Delivery
More informationLSI and Circuit Technologies for the SX-8 Supercomputer
LSI and Circuit Technologies for the SX-8 Supercomputer By Jun INASAKA,* Toshio TANAHASHI,* Hideaki KOBAYASHI,* Toshihiro KATOH,* Mikihiro KAJITA* and Naoya NAKAYAMA This paper describes the LSI and circuit
More informationDL-150 The Ten Habits of Highly Successful Designers. or Design for Speed: A Designer s Survival Guide to Signal Integrity
Slide -1 Ten Habits of Highly Successful Board Designers or Design for Speed: A Designer s Survival Guide to Signal Integrity with Dr. Eric Bogatin, Signal Integrity Evangelist, Bogatin Enterprises, www.bethesignal.com
More informationLVDS Flow Through Evaluation Boards. LVDS47/48EVK Revision 1.0
LVDS Flow Through Evaluation Boards LVDS47/48EVK Revision 1.0 January 2000 6.0.0 LVDS Flow Through Evaluation Boards 6.1.0 The Flow Through LVDS Evaluation Board The Flow Through LVDS Evaluation Board
More informationOn Chip Active Decoupling Capacitors for Supply Noise Reduction for Power Gating and Dynamic Dual Vdd Circuits in Digital VLSI
ELEN 689 606 Techniques for Layout Synthesis and Simulation in EDA Project Report On Chip Active Decoupling Capacitors for Supply Noise Reduction for Power Gating and Dynamic Dual Vdd Circuits in Digital
More informationA Co-design Methodology of Signal Integrity and Power Integrity
DesignCon 2006 A Co-design Methodology of Signal Integrity and Power Integrity Woong Hwan Ryu, Intel Corporation woong.hwan.ryu@intel.com Min Wang, Intel Corporation min.wang@intel.com 1 Abstract As PCB
More informationCoupling Noise Analysis and High Frequency Design Optimization of Power/Ground Plane Stack-up in Embedded Chip Substrate Cavities
Coupling Noise Analysis and High Frequency Design Optimization of Power/Ground Plane Stack-up in Embedded Chip Substrate Cavities Nithya Sankaran,Venkatesh Chelukka Ramdas +, Baik-Woo Lee, Venky Sundaram,
More informationECEN 720 High-Speed Links: Circuits and Systems. Lab3 Transmitter Circuits. Objective. Introduction. Transmitter Automatic Termination Adjustment
1 ECEN 720 High-Speed Links: Circuits and Systems Lab3 Transmitter Circuits Objective To learn fundamentals of transmitter and receiver circuits. Introduction Transmitters are used to pass data stream
More informationTITLE. Image. Topic: Topic: Hee-Soo o LEE, Keysight Technologies Cindy Cui, Keysight Technologies
TITLE Topic: Accurate o Nam elementum Statistical-Based commodo mattis. Pellentesque DDR4 Margin Estimation using malesuada SSN blandit Induced euismod. Jitter Model Topic: Hee-Soo o LEE, Keysight Technologies
More informationThe number of layers The number and types of planes (power and/or ground) The ordering or sequence of the layers The spacing between the layers
PCB Layer Stackup PCB layer stackup (the ordering of the layers and the layer spacing) is an important factor in determining the EMC performance of a product. The following four factors are important with
More informationMicrocircuit Electrical Issues
Microcircuit Electrical Issues Distortion The frequency at which transmitted power has dropped to 50 percent of the injected power is called the "3 db" point and is used to define the bandwidth of the
More informationWhere Did My Signal Go?
Where Did My Signal Go? A Discussion of Signal Loss Between the ATE and UUT Tushar Gohel Mil/Aero STG Teradyne, Inc. North Reading, MA, USA Tushar.gohel@teradyne.com Abstract Automatic Test Equipment (ATE)
More informationSignal Integrity, Part 1 of 3
by Barry Olney feature column BEYOND DESIGN Signal Integrity, Part 1 of 3 As system performance increases, the PCB designer s challenges become more complex. The impact of lower core voltages, high frequencies
More informationA 10-Gb/s Multiphase Clock and Data Recovery Circuit with a Rotational Bang-Bang Phase Detector
JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, VOL.16, NO.3, JUNE, 2016 ISSN(Print) 1598-1657 http://dx.doi.org/10.5573/jsts.2016.16.3.287 ISSN(Online) 2233-4866 A 10-Gb/s Multiphase Clock and Data Recovery
More informationCourse Introduction. Content: 19 pages 3 questions. Learning Time: 30 minutes
Course Introduction Purpose: This course discusses techniques that can be applied to reduce problems in embedded control systems caused by electromagnetic noise Objectives: Gain a basic knowledge about
More informationTOP VIEW TCNOM 1 PB1 PB2 PB3 VEEOUT. Maxim Integrated Products 1
19-3252; Rev 0; 5/04 270Mbps SFP LED Driver General Description The is a programmable LED driver for fiber optic transmitters operating at data rates up to 270Mbps. The circuit contains a high-speed current
More informationDevelopment and Validation of a Microcontroller Model for EMC
Development and Validation of a Microcontroller Model for EMC Shaohua Li (1), Hemant Bishnoi (1), Jason Whiles (2), Pius Ng (3), Haixiao Weng (2), David Pommerenke (1), and Daryl Beetner (1) (1) EMC lab,
More informationLoad Transient Tool User Manual
Figure 1: Richtek connections and functions The Richtek contains a micro controller that switches a MOSFET on and off with a certain duty-cycle. When connected to a voltage regulator output, the MOSFET
More informationTo learn S-parameters, eye diagram, ISI, modulation techniques and their simulations in MATLAB and Cadence.
1 ECEN 720 High-Speed Links: Circuits and Systems Lab2- Channel Models Objective To learn S-parameters, eye diagram, ISI, modulation techniques and their simulations in MATLAB and Cadence. Introduction
More information5Gbps Serial Link Transmitter with Pre-emphasis
Gbps Serial Link Transmitter with Pre-emphasis Chih-Hsien Lin, Chung-Hong Wang and Shyh-Jye Jou Department of Electrical Engineering,National Central University,Chung-Li, Taiwan R.O.C. Abstract- High-speed
More informationA Low-Jitter Phase-Locked Loop Based on a Charge Pump Using a Current-Bypass Technique
JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, VOL.14, NO.3, JUNE, 2014 http://dx.doi.org/10.5573/jsts.2014.14.3.331 A Low-Jitter Phase-Locked Loop Based on a Charge Pump Using a Current-Bypass Technique
More informationANSYS CPS SOLUTION FOR SIGNAL AND POWER INTEGRITY
ANSYS CPS SOLUTION FOR SIGNAL AND POWER INTEGRITY Rémy FERNANDES Lead Application Engineer ANSYS 1 2018 ANSYS, Inc. February 2, 2018 ANSYS ANSYS - Engineering simulation software leader Our industry reach
More informationAnalysis on the Effectiveness of Clock Trace Termination Methods and Trace Lengths on a Printed Circuit Board
Analysis on the Effectiveness of Clock Trace Termination Methods and Trace Lengths on a Printed Circuit Board Mark I. Montrose Montrose Compliance Services 2353 Mission Glen Dr. Santa Clara, CA 95051-1214
More informationEMI. Chris Herrick. Applications Engineer
Fundamentals of EMI Chris Herrick Ansoft Applications Engineer Three Basic Elements of EMC Conduction Coupling process EMI source Emission Space & Field Conductive Capacitive Inductive Radiative Low, Middle
More informationAN-1370 APPLICATION NOTE
APPLICATION NOTE One Technology Way P.O. Box 9106 Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.461.3113 www.analog.com Design Implementation of the ADF7242 Pmod Evaluation Board Using the
More informationTOP VIEW. Maxim Integrated Products 1
19-2213; Rev 0; 10/01 Low-Jitter, Low-Noise LVDS General Description The is a low-voltage differential signaling (LVDS) repeater, which accepts a single LVDS input and duplicates the signal at a single
More informationApplication of Generalized Scattering Matrix for Prediction of Power Supply Noise
Application of Generalized Scattering Matrix for Prediction of Power Supply Noise System Level Interconnect Prediction 2010 June 13, 2010 K. Yamanaga (1),K. Masu (2), and T. Sato (3) (1) Murata Manufacturing
More informationSignal/Power Integrity Analysis of High-Speed Memory Module with Meshed Reference Plane 1
, pp.119-128 http//dx.doi.org/10.14257/ijca.2018.11.7.10 Signal/Power Integrity Analysis of High-Speed Memory Module with Meshed Reference Plane 1 Moonjung Kim Institute of IT Convergence Technology, Dept.
More informationPower Distribution Network Design for Stratix IV GX and Arria II GX FPGAs
Power Distribution Network Design for Stratix IV GX and Arria II GX FPGAs Transceiver Portfolio Workshops 2009 Question What is Your PDN Design Methodology? Easy Complex Historical Full SPICE simulation
More informationCHAPTER 6 IMPLEMENTATION OF FPGA BASED CASCADED MULTILEVEL INVERTER
8 CHAPTER 6 IMPLEMENTATION OF FPGA BASED CASCADED MULTILEVEL INVERTER 6.1 INTRODUCTION In this part of research, a proto type model of FPGA based nine level cascaded inverter has been fabricated to improve
More informationNoise Figure Degradation Analysis of Power/Ground Noise on 900MHz LNA for UHF RFID
Noise Figure Degradation Analysis of Power/Ground Noise on 900MHz LNA for UHF RFID Kyoungchoul Koo, Hyunjeong Park, Yujeong Shim and Joungho Kim Terahertz Interconnection and Package Laboratory, Dept.
More informationPI3HDMI231-A/B PI3HDMI231-A/B Demo Board Rev.B User Manual by Ada Yip
PI3HDMI231-A/B PI3HDMI231-A/B Demo Board Rev.B User Manual by Ada Yip Introduction Pericom s PI3HDMI231-A and B are 3:1 active HDMI switches with electrical idle detect. Other than offering different DDC
More informationSystem Co-Design and Co-Analysis Approach to Implementing the XDR Memory System of the Cell Broadband Engine Processor
System Co-Design and Co-Analysis Approach to Implementing the XDR Memory System of the Cell Broadband Engine Processor Realizing 3.2 Gbps Data Rate per Memory Lane in Low Cost, High Volume Production Wai-Yeung
More informationPower integrity is more than decoupling capacitors The Power Integrity Ecosystem. Keysight HSD Seminar Mastering SI & PI Design
Power integrity is more than decoupling capacitors The Power Integrity Ecosystem Keysight HSD Seminar Mastering SI & PI Design Signal Integrity Power Integrity SI and PI Eco-System Keysight Technologies
More informationDesign and Analysis of Novel Compact Inductor Resonator Filter
Design and Analysis of Novel Compact Inductor Resonator Filter Gye-An Lee 1, Mohamed Megahed 2, and Franco De Flaviis 1. 1 Department of Electrical and Computer Engineering University of California, Irvine
More informationFreescale Semiconductor, I
Order this document by /D Noise Reduction Techniques for Microcontroller-Based Systems By Imad Kobeissi Introduction With today s advancements in semiconductor technology and the push toward faster microcontroller
More informationSimulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material
Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material April 28, 2010 Yu Xuequan, Yanhang, Zhang Gezi, Wang Haisan Huawei Technologies CO., LTD. Shanghai, China Tony_yu@huawei.com
More informationProgress In Electromagnetics Research, Vol. 119, , 2011
Progress In Electromagnetics Research, Vol. 119, 253 263, 2011 A VALIDATION OF CONVENTIONAL PROTECTION DEVICES IN PROTECTING EMP THREATS S. M. Han 1, *, C. S. Huh 1, and J. S. Choi 2 1 INHA University,
More informationDL-150 The Ten Habits of Highly Successful Designers. or Design for Speed: A Designer s Survival Guide to Signal Integrity
Slide -1 Ten Habits of Highly Successful Board Designers or Design for Speed: A Designer s Survival Guide to Signal Integrity with Dr. Eric Bogatin, Signal Integrity Evangelist, Bogatin Enterprises, www.bethesignal.com
More informationTexas Instruments DisplayPort Design Guide
Texas Instruments DisplayPort Design Guide April 2009 1 High Speed Interface Applications Introduction This application note presents design guidelines, helping users of Texas Instruments DisplayPort devices
More informationDP Array DPAM/DPAF Final Inch Designs in Serial ATA Generation 1 Applications 10mm Stack Height. REVISION DATE: January 11, 2005
Application Note DP Array DPAM/DPAF Final Inch Designs in Serial ATA Generation 1 Applications 10mm Stack Height REVISION DATE: January 11, 2005 Copyrights and Trademarks Copyright 2005 Samtec, Inc. Developed
More informationEVALUATION KIT AVAILABLE +3.3V, Low-Jitter Crystal to LVPECL Clock Generator QA_C. 125MHz QA QA. 125MHz MAX3679A QB0 QB MHz QB1 QB
19-4858; Rev 0; 8/09 EVALUATION KIT AVAILABLE +3.3V, Low-Jitter Crystal to LVPECL General Description The is a low-jitter precision clock generator with the integration of three LVPECL and one LVCMOS outputs
More informationAnaren 0805 (B0809J50ATI) balun optimized for Texas Instruments CC1100/CC1101 Transceiver
(ANN-2005) Rev B Page 1 of 13 Anaren 0805 (B0809J50ATI) balun optimized for Texas Instruments CC1100/CC1101 Transceiver Trong N Duong RF Co-Op Nithya R Subramanian RF Engineer Introduction The tradeoff
More informationApplication Note 5525
Using the Wafer Scale Packaged Detector in 2 to 6 GHz Applications Application Note 5525 Introduction The is a broadband directional coupler with integrated temperature compensated detector designed for
More informationA Random and Systematic Jitter Suppressed DLL-Based Clock Generator with Effective Negative Feedback Loop
A Random and Systematic Jitter Suppressed DLL-Based Clock Generator with Effective Negative Feedback Loop Seong-Jin An 1 and Young-Shig Choi 2 Department of Electronic Engineering, Pukyong National University
More informationDesign for Guaranteed EMC Compliance
Clemson Vehicular Electronics Laboratory Reliable Automotive Electronics Automotive EMC Workshop April 29, 2013 Design for Guaranteed EMC Compliance Todd Hubing Clemson University EMC Requirements and
More informationExclusive Technology Feature. Integrated Driver Shrinks Class D Audio Amplifiers. Audio Driver Features. ISSUE: November 2009
ISSUE: November 2009 Integrated Driver Shrinks Class D Audio Amplifiers By Jun Honda, International Rectifier, El Segundo, Calif. From automotive entertainment to home theater systems, consumers are demanding
More informationEMI Reduction on an Automotive Microcontroller
EMI Reduction on an Automotive Microcontroller Design Automation Conference, July 26 th -31 st, 2009 Patrice JOUBERT DORIOL 1, Yamarita VILLAVICENCIO 2, Cristiano FORZAN 1, Mario ROTIGNI 1, Giovanni GRAZIOSI
More informationBroadband Methodology for Power Distribution System Analysis of Chip, Package and Board for High Speed IO Design
DesignCon 2009 Broadband Methodology for Power Distribution System Analysis of Chip, Package and Board for High Speed IO Design Hsing-Chou Hsu, VIA Technologies jimmyhsu@via.com.tw Jack Lin, Sigrity Inc.
More information3 GHz Wide Frequency Model of Surface Mount Technology (SMT) Ferrite Bead for Power/Ground and I/O Line Noise Simulation of High-speed PCB
3 GHz Wide Frequency Model of Surface Mount Technology (SMT) Ferrite Bead for Power/Ground and I/O Line Noise Simulation of High-speed PCB Tae Hong Kim, Hyungsoo Kim, Jun So Pak, and Joungho Kim Terahertz
More informationA Self-Contained Large-Scale FPAA Development Platform
A SelfContained LargeScale FPAA Development Platform Christopher M. Twigg, Paul E. Hasler, Faik Baskaya School of Electrical and Computer Engineering Georgia Institute of Technology, Atlanta, Georgia 303320250
More informationCLK_EN CLK_SEL. Q3 THIN QFN-EP** (4mm x 4mm) Maxim Integrated Products 1
19-2575; Rev 0; 10/02 One-to-Four LVCMOS-to-LVPECL General Description The low-skew, low-jitter, clock and data driver distributes one of two single-ended LVCMOS inputs to four differential LVPECL outputs.
More informationElectromagnetic Bandgap Design for Power Distribution Network Noise Isolation in the Glass Interposer
2016 IEEE 66th Electronic Components and Technology Conference Electromagnetic Bandgap Design for Power Distribution Network Noise Isolation in the Glass Interposer Youngwoo Kim, Jinwook Song, Subin Kim
More informationMediSpec SMI Non-Magnetic Transceiver
The MediSpec SMI is an RCLED based 650nm solution enabling robust and reliable termination of Plastic Optical Fiber (POF) The optical transceiver is designed to provide up to 250 Mbps data communication
More informationA 5-8 Gb/s Low-Power Transmitter with 2-Tap Pre-Emphasis Based on Toggling Serialization
A 5-8 Gb/s Low-Power Transmitter with 2-Tap Pre-Emphasis Based on Toggling Serialization Sung-Geun Kim, Tongsung Kim, Dae-Hyun Kwon, and Woo-Young Choi Department of Electrical and Electronic Engineering,
More informationModeling of Power Planes for Improving EMC in High Speed Medical System
Modeling of Power Planes for Improving EMC in High Speed Medical System Surender Singh, Dr. Ravinder Agarwal* *Prof : Dept of Instrumentation Engineering Thapar University, Patiala, India Dr. V. R. Singh
More informationINVENTION DISCLOSURE- ELECTRONICS SUBJECT MATTER IMPEDANCE MATCHING ANTENNA-INTEGRATED HIGH-EFFICIENCY ENERGY HARVESTING CIRCUIT
INVENTION DISCLOSURE- ELECTRONICS SUBJECT MATTER IMPEDANCE MATCHING ANTENNA-INTEGRATED HIGH-EFFICIENCY ENERGY HARVESTING CIRCUIT ABSTRACT: This paper describes the design of a high-efficiency energy harvesting
More informationOptimization of Wafer Level Test Hardware using Signal Integrity Simulation
June 7-10, 2009 San Diego, CA Optimization of Wafer Level Test Hardware using Signal Integrity Simulation Jason Mroczkowski Ryan Satrom Agenda Industry Drivers Wafer Scale Test Interface Simulation Simulation
More information2 TO 4 DIFFERENTIAL CLOCK MUX ICS Features
DATASHEET 2 TO 4 DIFFERENTIAL CLOCK MUX ICS557-06 Description The ICS557-06 is a two to four differential clock mux designed for use in PCI-Express applications. The device selects one of the two differential
More informationPDN Probes. P2100A/P2101A Data Sheet. 1-Port and 2-Port 50 ohm Passive Probes
P2100A/P2101A Data Sheet PDN Probes 1-Port and 2-Port 50 ohm Passive Probes power integrity PDN impedance testing ripple PCB resonances transient step load stability and NISM noise TDT/TDR clock jitter
More informationEUP V/12V Synchronous Buck PWM Controller DESCRIPTION FEATURES APPLICATIONS. Typical Application Circuit. 1
5V/12V Synchronous Buck PWM Controller DESCRIPTION The is a high efficiency, fixed 300kHz frequency, voltage mode, synchronous PWM controller. The device drives two low cost N-channel MOSFETs and is designed
More information