MediSpec SMI Non-Magnetic Transceiver

Transcription

1 The MediSpec SMI is an RCLED based 650nm solution enabling robust and reliable termination of Plastic Optical Fiber (POF) The optical transceiver is designed to provide up to 250 Mbps data communication link over 50 m link length [1] over Step Index POF (NA 0.5) and it operates over the temperature range of -20 to +85 C. The stand-out feature of this solution is the ability for it to be used in applications with exposure to strong magnetic fields. The transceiver is compatible with low-voltage differential signalling (LVDS) for seamless integration into existing logic bus structures and is ideal for use with an FPGA or ASIC. The electrical power saving feature puts driver IC into a sleep state and switches off the RCLED if there is no data or toning on the input bus to the transmitter. Similarly at the receiver side, if no optical toning or data signal is present, the receiver IC will switch into a sleep mode and power consumption is reduced to approximately 40μA. (1). Link length depends on the installation conditions MediSpec SMI Features and Benefits Specific non-ferrous lead frame 250 Mbps NRZ symbol rate and compatible with 8B/10B encoding Resonant Cavity LED (RCLED) at red 650 nm with small emission aperture suitable for POF RCLED reliability tested to over 400,000 hours lifetime Power saving features Integrated CMOS driver IC for RCLED Integrated optics to efficiently focus light for fiber coupling High sensitivity CMOS receiver IC and pin-diode Ideal for use in applications with exposure to strong magnetic fields Different encoding schemes possible Enhanced spectral and modulation behavior compared to conventional planar LEDs (due to the resonant optical cavity). Visual inspection of link functionality (red, visible light). Greater reliability than with conventional red LED Green product, lower power consumption More integration, less components on PCB Best-in class optical performances One-step light to digital conversion RoHS and REACH compliant Applications Medical: Diagnostic equipment (MRI, CAT scan, PET scan etc) Industry: Production of magnets and magnetic materials Research facilities: Particle accelerators Energy production plants Transportation Transmitter and Receiver Absolute Maximum Ratings MRI CT Scan Parameter Symbol Min. Max. Unit Storage Temperature T stg C Operating Temperature T op C Soldering Temperature [2] T sld 260 C Supply Voltage V cc V Receiver Optical Overload P OL 0 dbm Storage Conditions (Moisture Sensitivity Level) MSL 2a J-STD-020D Notes: 1. These are the absolute maximum ratings at or beyond which the FOT can be expected to be damaged. 2. Soldering temperature is recommended to be 260 C for 10 sec, one time only, at least 2.20mm away from lead root. Please see solder profile in this datasheet.

2 Transceiver pair electronic block diagram Transmitter Electrical and Optical Characteristics Parameter Symbol Min. Typical Max. Unit DC Supply Voltage V CC V Operating Current Consumption I CC ma Sleep State Current Consumption I SLEEP µa Data Rate Baud Rate Mbps Data Input Capacitance C IN 5 pf Data Input Resistance (Single-Ended) R IN 5 kω Input Common-Mode Range V IN-BIAS +0.8 V CC -0.8 V Input Voltage Swing V IN-SWING mv Minimum Differential Voltage Swing to Ensure Wake-Up Wake-up Input 50 mv Wake-Up Time Delay 5 80 µs Optical Power OFF Delay µs Peak Wavelength λ peak nm Spectral Bandwidth (FWHM) Δλ nm Average Optical Power [3] P dbm Optical Rise Time (20%-80%) t R ns Optical Fall Time (80%-20%) t F ns Optical Modulation Amplitude (OMA) OMA μw Total Jitter 1.6 ns Test Conditions: 1. Test data was validated over the full temperature range of -20 C to +85 C and over the supply range of 3V to 3.6V. 2. Test data represents operation at the maximum data rate of 250Mbps using a PRBS7 test pattern (8B/10B encoding) unless otherwise stated. 3. Optical power is measured when coupled into 0.5m of a 1mm diameter 0.5 NA plastic optical fiber with a large area optical detector.

3 Receiver Electrical and Optical Characteristics Parameter Symbol Min. Typical Max. Unit DC Supply Voltage V CC V Operating Current Consumption I CC ma Sleep State Current Consumption I SLEEP µa Output Impedance Between D and D 100 Ω Offset Common Mode Voltage V ocm 1.2 V Output Differential Voltage Swing V odvs mv Input Average Optical Power [2,3] dbm Rise Time (10%-90%) ns Fall Time (90%-10%) ns Wake-Up Time from Sleep State µs Note: Test Conditions: 1. Test data was validated over the full temperature range of -20 C to +85 C, and over the supply range of 3V to 3.6V. 2. Test data represents operation at the maximum data rate of 250Mbps using a PRBS7 test pattern (8B/10B encoding) unless otherwise stated. 3. Optical power is measured when coupled into 0.5m of a 1mm diameter 0.5 NA plastic optical fiber with a large area optical detector. Output differential voltage swing vs output voltage swing waveforms 12 Application Circuits RD+ 11 RD+ Application Circuit Notes: RD- 100R 10 RD- 1. The transmitter (Tx) and receiver (Rx) are electrically shielded from each other to prevent crosstalk. To be effective this shield must be grounded SIGNAL DETECT 22K 9 8 SD Rx IC 2. Both pins of the Tx must be connected to (they are not connected internally). 3. Power line capacitors should be located as close as possible to the FOT s DC power PINs. 4. The data lines are impedance-matched differential pairs. The PCB layout for these tracks must comply to IEEE/IEC standards for high-speed data and impedance matching. Rx Vcc [ 3.3V ] Tx Vcc [ 3.3V ] 1uH 1uH Vcc Vcc Tx IC TD+ 3 TD+ TD- 100R 2 TD- 1 Interface circuit schematic to AC couple to a PHY, FPGA or ASIC IC where the IC will not accept a common mode voltage of 1.2V

4 Transceiver SMI Non-magnetic Transceiver (Through Hole) Transceiver PIN Description: Transmitter PIN Name Symbol 1 EMI Shield - EMI 2 Data Input (Negative) TD- 3 Data Input (Positive) TD+ 4 Ground [1] 5 Input DC Power Pin V cc 6 Ground [1] Receiver PIN Name Symbol 7 Input DC Power Pin V cc 8 Ground [1] 9 Output Signal Detect SD 10 Data Output (Negative) RD- 11 Data Output (Positive) RD+ PCB Layout for SMI Transceiver Through-Hole 12 EMI Shield - EMI Note: 1. Ground pins must be connected to the ground plane on the PCB. These pins are not connected internally.

5 Regulatory Compliance Eye safety: Class 1 with compliance of IEC ESD: 2kV Human Body Model (HBM) with compliance of JESD22 A114 Solder Profile The SMI transceiver may be soldered to max 260 C for 10 seconds, one time only, at least 2.20mm away from lead root. Parts are suitable for wave soldering. They are not suitable for reflow soldering. Hand soldering is not recommended for production due to the uncontrolled nature of this process. Typical solder profile (maximum peak temperature 260 C), Handling SMI transceivers are tested for handling in static controlled assembly processes (HBM). Cleaning, degreasing and post solder washing should be carried out using standard solutions compatible with both plastics and the environment. For example, recommended solutions for degreasing are alcohols, (methyl, isopropyl and isobutyl). In the soldering process, non-halogenated water soluble fluxes are recommended. SMI transceivers are not suitable for use in reflow solder processes (infrared/vapor-phase reflow). The dust plug should be kept in place during soldering, washing and drying processes to avoid contamination of the active optical area. Storage conditions 1. Moisture sensitivity: parts must be stored in a sealed moisture barrier bag (MBB) at <40C and <90% R.H 2. Once removed from MBB, parts must be either used within 672 hours (4 weeks) of factory conditions <30C <60% R.H. Stored at <10% R.H Ordering Information Order No. Description SMI Order No EUR/0k/GF/ Molex