Collaboration between University and Mentor Graphics HyperLynx SI

Transcription

1 Collaboration between University and Mentor Graphics HyperLynx SI Raul Blečić and Adrijan Barić University of Zagreb Faculty of Electrical Engineering and Computing IC&EMC Lab Zagreb, June 1th 215 1/25

2 Contents 1 Introduction About IC&EMC Lab at FER 2 HyperLynx SI Mentor Graphics tools at IC&EMC Lab Example - LIN (Local Interconnect Network) Example - design of RF amplifier More applications 3 Conclusion 2/25

3 1 Introduction About IC&EMC Lab at FER 2 HyperLynx SI 3 Conclusion 3/25

4 About IC&EMC Lab at FER About IC&EMC Lab at Faculty of Electrical Engineering and Computing, University of Zagreb: Members: Prof. dr. sc. Adrijan Barić, Prof. dr. sc. Željko Butković, Associate prof. dr. sc. Igor Krois, Assistant prof. dr. sc. Vladimir Čeperić, Senior assistant, dr. sc. Tvrtko Mandić, Niko Bako, dipl. ing. (PhD student), Raul Blečić, dipl. ing. (PhD student), Josip Bačmaga, mag. ing. el. (PhD student), Marko Magerl, mag. ing. el. (PhD student), Hrvoje Štimac, mag. ing. el. (researcher). 4/25

5 About IC&EMC Lab at FER Industrial partners: ON Semiconductor, Belgium, Bosch, Germany, Philips, Germany, Infineon, Germany, NXP, Netherlands/Belgium, ams, Unterpremstaetten, Austria, Henkel, Belgium, CRP, Italy, Hanita, Israel, Cadence, France, CamSemi, Cambridge, UK, Locus d.o.o. Zagreb, Croatia. 5/25

6 About IC&EMC Lab at FER Collaboration with universities: KU Leuven, Belgium, IMEC, Belgium, Portland State University, Oregon, USA, INSA, Toulouse, France, University of Cambridge, UK. 6/25

7 1 Introduction 2 HyperLynx SI Mentor Graphics tools at IC&EMC Lab Example - LIN (Local Interconnect Network) Example - design of RF amplifier More applications 3 Conclusion 7/25

8 Mentor Graphics tools at IC&EMC Lab Usage of Mentor Graphics tools at IC&EMC Lab: Design of printed circuit boards: Xpedition Enterprise, PADS. Analysis of printed circuit boards: HyperLynx SI. 2-D field solver. SPICE simulations: Eldo, EZwave. 8/25

9 Mentor Graphics tools at IC&EMC Lab Simple PCB design in Xpedition PCB: high-frequency characterisation of RF transistors. 9/25

10 Mentor Graphics tools at IC&EMC Lab Complex PCB design in Xpedition PCB: system for characterisation of power transistors. 1/25

11 Introduction HyperLynx SI Conclusion Contact Example - LIN (Local Interconnect Network) Example - LIN (Local Interconnect Network) Communication between components in vehicles: speed up to 2 kbit/s, automotive - tests up to 1 GHz. Simple analytical solution does not exist: PCB during measurements: 11/25 Blec ic and Baric University of Zagreb, FER, IC&EMC Lab

12 Example - LIN (Local Interconnect Network) Analysis in HyperLynx SI: HyperLynx SI (boardsim): HyperLynx SI (linesim): Netlist is generated from HyperLynx SI: models of passive components and connectors added to the netlist, complete test case is simulated in Eldo. 12/25

13 Example - LIN (Local Interconnect Network) Comparison to measurements - return and insertion loss: very good agreement up to 3 GHz. Return loss (S 11): Magnitude [db] Phase [deg] Measurements Circuit model Measurements Circuit model Insertion loss (S 12): Magnitude [db] Phase [deg] Analyzed path: P2 P1 13/25

14 Example - LIN (Local Interconnect Network) Comparison to measurements - coupling: good agreement up to 3 GHz. Return loss (S 11): Magnitude [db] Phase [deg] 2 4 Measurements Circuit model Measurements Circuit model Coupling (S 12): Magnitude [db] Phase [deg] Analyzed path: P1 P2 14/25

15 Example - design of RF amplifier Example - design of RF amplifier: 2.5-GHz amplifier, GaN transistor Nitronex NPTB4, V DS = 14 V, I D = 5 ma. Designed in Xpedition PCB: Analyzed in HyperLynx SI (boardsim): 15/25

16 Example - design of RF amplifier Extracted to HyperLynx SI (linesim): each interconnect is modelled by a transmission line element. Netlist is generated from HyperLynx SI: models of components added to the netlist (transistor, passive components and connectors), complete test case is simulated in Eldo. 16/25

17 Example - design of RF amplifier Comparison to measurements - return loss and gain: Return loss (S 11): Gain (S 21): 2 Magnitude [db] 1 2 Measurements Circuit model Magnitude [db] 2 4 Measurements Circuit model Circuit model consists of: transistor model, model of interconnects, Phase [deg] 1 1 Phase [deg] 1 1 ideal model of passive components /25

18 Example - design of RF amplifier Comparison to measurements - return loss and gain: Return loss (S 11): Gain (S 21): Magnitude [db] Phase [deg] 1 2 Measurements Circuit model Magnitude [db] Phase [deg] Measurements Circuit model Circuit model consists of: transistor model, model of interconnects, model of passive components which includes package parasitics. 18/25

19 Example - design of RF amplifier Comparison to measurements - return loss and gain: very good agreement up to 4 GHz. Return loss (S 11): Magnitude [db] Phase [deg] 1 2 Measurements Circuit model Gain (S 21): Magnitude [db] Phase [deg] Measurements Circuit model Circuit model consists of: transistor model, model of interconnects, model of passive components which includes package parasitics, model of RF connectors. 19/25

20 More applications More applications of Mentor Graphics tools at IC&EMC Lab: Test case: HyperLynx PI: analysis of the impedance profile of the power distribution network. Simulation results: MHz 1 MHz 1 MHz 1 GHz 2/25

21 More applications More applications of Mentor Graphics tools at IC&EMC Lab: Electromagnetic properties of interconnects: analysis (Z, coupling), visualization (field distribution, loss vs frequency), extraction of RLGC matrices from geometry, extraction of S-parameter matrix of boards. Field distribution: Loss vs frequency: 21/25

22 More applications Xpedition PCB: design of PCBs. HyperLynx SI: signal integrity and EMC analysis of PCBs. HyperLynx PI: power integrity analysis of PCBs. FloTHERM and HyperLynx Thermal: thermal analysis of PCBs, packages and ICs. HyperLynx 3D EM: 3D analysis of interconnects, integrated within the HyperLynx environment. HyperLynx DRC: PCB design verification, design rule checks for EMI/EMC, signal and power integrity. Calibre: DRC, LVS, PEX, industry standard for verification of IC designs. 22/25

23 1 Introduction 2 HyperLynx SI 3 Conclusion 23/25

24 Mentor Graphics - more than PCB design: PCB design (Xpedition Enterprise/PADS), analysis of signal integrity (HyperLynx SI), analysis of power integrity (HyperLynx PI), analysis of thermal properties of PCBs (FloTHERM and HyperLynx Thermal), EM analysis of PCBs (HyperLynx 3D EM), PCB design verification (HyperLynx DRC), IC design verification (Calibre). Poveznica na HyperLynx: 24/25

25 Prof. dr. sc. Adrijan Barić University of Zagreb Faculty of Electrical Engineering and Computing Unska 3, 1 Zagreb Croatia Tel adrijan.baric@fer.hr 25/25