MSPP Page 1. MSPP Competencies in SiP Integration for Wireless Applications
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1 MSPP Page 1 MSPP Competencies in SiP Integration for Wireless Applications
2 MSPP Page 2 Outline Design, simulation and measurements tools MSPP competencies in electrical design and modeling Embedded passive integration Antenna integration
3 MSPP Page 3 MSPP competencies in electrical design and modeling Design, modeling and characterization of RF packages Power distribution modeling and characterization for high speed IC and mixed signal systems Signal integrity Design, modeling and characterization of embedded passives Small antennas design and modeling High frequency characterization of packaging materials (complex dielectric measurements) Characterization of high speed and RF sockets
4 MSPP Page 4 High Speed Digital and RF Design & Simulation Tools Design Circuit Simulator Quasi-static Electromagnetic Solver Full wave Electromagnetic Solver Cadence Advanced Package Designer / Allegro Applications: Package and PCB design Signal Delay Analysis Avanti HSPICE Agilent EEsof ADS/MDS Ansoft SPICELink Applications: Simulation of high speed digital and microwave circuits Design Optimisation Ansoft Quick3D Applications: Electrical Parasitic Extraction Ansoft HFSS ver 9.1 CST Microwave Studio Ver. 5 Applications: High Freq Characterisation of packages, PCBs, sockets/connectors, antennas. Passives design and optimization
5 MSPP Page 5 RF and Microwave Measurement Capabilities TDR / TDT S-parameters Measurements Material Characterization EM Field Strength Measurements Tektronix Digital Oscilloscope 11801C IPA 510 Software Applications: Characterisation of electronic packages and/or transmission line discontinuities Vector Network Analysers: HP8510, HP 8720 and HP8753 Cascade9000 Probe Station Cascade FPC GSSG, GSG probes Applications: High frequency characterisation of electronic packages Extraction of package parasitics (RLC) Impedance Analyzer : HP 4291B Dielectric Probe Fixture Applications: Measure permittivity and tangent delta of dielectric materials Measure impedance of materials Spectrum Analyzer: HP7404A Near Field Probe Log Periodic & bi-conical antenna Applications: Measurement of near field and far field emissions EMC Pre-compliance testing
6 MSPP Page 6 Embedded Passives Integration
7 MSPP Page 7 Embedded Passives Integration Source: Motorola
8 MSPP Page 8 Embedded Passives Integration Integral Capacitor on Organic Substrate (Low temperature process development and characterization) 50 mm2 Area Impedance Magnitude [Ohm] um Dielectric Thickness 10 8 um Dielectric Thickness um Dielectric Thickness Frequency [GHz] TypeA_6um TypeA_8um TypeA_16um Source: A*STAR ASIP Consortium (To be presented at ECTC 2004)
9 MSPP Page 9 Embedded Passives Integration Integral Inductors on Organic Substrate Source: A*STAR EPRC Consortium
10 MSPP Page 10 Embedded Passives Integration Integral passives networks on Organic Substrate (e.g:filter) Source: A*STAR EPRC Consortium
11 MSPP Page 11 Embedded Passives Integration Integral Inductor on Silicon Substrate (Process development and characterization) Source: A*STAR ASIP Consortium (Presented at InterPACK 2003)
12 MSPP Page 12 Antenna Integration
13 MSPP Page 13 Antenna Integration Patch antenna Source: Etenna
14 MSPP Page 14 Antenna Integration Dielectric resonator antenna Dielectric resonator RF in/out Feed substrate Ground planes RF chip Substrate Source: A*STAR
15 MSPP Page 15 Antenna Integration Dielectric resonator antenna Source: Antenova
16 MSPP Page 16 Antenna Integration 3D Helical Antenna on LTCC Source: National Cheng Kung University
17 MSPP Page 17 SiP with Antenna Integration Wireless Broadband LTCC Modules LTCC SiP (17 x 17 mm) Collaboration with NTU Antenna Array and Balun for WLAN and LMDS (SuPRIMA Consortium, Defence Technology Conference 2003) Bandpass Filter, Size: 3 x 4 mm LTCC Facilities
18 MSPP Page 18 MSPP has: Summary Design, modeling, optimization, testing and fabrication capabilities for high speed digital circuit & RF/ Microwave packaging including embedded passives Design, modeling, optimization, testing, fabrication and assembly capabilities for integrated small antennas MSPP has worked successfully with industry partners consortia and joint development projects Ultra Thin package for high frequency applications joint development project Wafer level package for RF and microwave application EPRC 6 Consortium Embedded passives ASIP Consortium Power delivery system for high speed IC analysis and optimization joint development project Broadband design methodologies and validation Broadband Consortium MSPP is well placed to take on to the challenges of the RF SiP front end integration
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