When Should You Apply 3D Planar EM Simulation?

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1 When Should You Apply 3D Planar EM Simulation? Agilent EEsof EDA IMS 2010 MicroApps Andy Howard Agilent Technologies 1

2 3D planar EM is now much more of a design tool Solves bigger problems and runs faster due to: NlogN mesher and solver algorithms Quasi-static RF mode for complex but electrically small designs Faster computers with more RAM Support for multi-threading on multi-processor and multicore computers Support for 64-bit computers, enabling use of more RAM Support for parallel computing solutions, such as LSF 2

3 Planar EM (Momentum) now solves huge problems C-band, 64-element patch antenna array 4-layer SiP with 2 stacked die 329 ports 164 bond wires 165 solder balls Design supplied by Numonyx B.V. 3

4 When should you apply 3D planar EM? No model or need to extend valid range. Need to model coupling. Is it significant? Can you squeeze things together without degrading performance? Need to include physical structures within sweeps, optimizations or statistical analyses. 4

5 No model exists Co-planar waveguide bend RF board 5

6 A design flow without Advanced Model Composer 1 Electrical Design Physical Component Design n Modify Layout Component Design 2 Design Requirements Feasibility & Topology Yes EM - OK? More? Yes No No Using AMC eliminates this step Ideal Lumped Passive Design 3 Physical Layout Physical Design Full EM Verification OK? Done Yes n No Modify Layout 6

7 Advanced Model Composer for component design Generate libraries for wide array of custom-shaped, parameterized, passive models such as: Spiral inductors Thin film resistors MIM capacitors Arbitrarily-shaped matching networks Uses Multi-dimensional Adaptive Parameter Sampling (MAPS) Technology (patented.) Reference: A faster and Effective RF Module/LTCC Design Flow with AMC document # EN.pdf 7

8 Need to include parasitic coupling Microstrip elliptic filter Field plot helps show coupling 3D planar simulation took 37 minutes 8 years ago. Now takes 11 seconds. 8

9 Use as a design tool 69 seconds to simulate 5 swept values Sweep or optimize any physical dimensions Frequency response versus capacitance size 3-dB bandwidth versus capacitance size 9

10 Reduce cost by minimizing area - does spacing affect performance? Increasing spacing between spirals 10

11 An optimization Blue before optimization, design on left Red after optimization, design on right 25 random trials took 11 minutes. 11

12 Need to include coupling microstrip elliptic filter Blue using ideal L s, C s Red using distributed models Pink Momentum results Field plot shows coupling (8 GHz) 12

13 After optimizing frequency response Optimization (25 random trials) took 9m 11s. 13

14 Investigate sensitivity to substrate parameters Bandwidth varies substantially with substrate dielectric constant 14

15 Simulate layouts directly in Cadence Virtuoso RFIC power amplifier design Simulate all 11 spirals together in 11 m 16 s using 4 threads. Momentum substrate definitions exist for TSMC: 0.18u, 0.13u, 90n, 65n, & 45n UMC: 65n IBM: 8HP IHP & ST 15

16 Single dipole antenna with microstrip balun PCB substrate: Material = FR4 Thickness (h) = 1.6 mm E r = 4.6 Loss Tangent = Wd Dipole arm: Ld = 19 mm Wd = 6 mm g2 = 3 mm Via hole g2 Ld Microstrip balun: Lb = 16 mm, Lh = 3 mm Wf = 3 mm, Wb = 5 mm, Wh = 3 mm g1 = 1 mm h W g Wf g1 Lg W b Lb W h Lh Via hole: radius = mm Ground for feed: Lg = 10 mm Wg = 15 mm 16

17 Antenna dipole frequency response w/parameter sweep A Momentum layout component is generated to represent the EM structure in a schematic The dipole length is swept: 17, 19, 21, 23 mm (additional parameters could be swept) EM simulation model can be re-used EM/circuit co-simulation can be extended with antenna matching network together with tuning, optimization, etc. 17

18 Simulate dual dipole antenna and circuitry (with surface-mount components) together Reference: 18

19 Which 3D EM simulation technology should you choose? FDTD ( Finite Difference Time Domain ) FEM ( Finite Element Method ) MoM ( Method of Moments ) FDTD 3D arbitrary structures Full wave simulations Handles large problems (full size cell phone antennas) Time domain Not good for multiport structures GPU-based hardware acceleration 3D arbitrary structures Full wave simulations Direct & iterative solvers Frequency domain Good for multiport structures Good for high-q structures FEM MoM 3D Planar structures Full wave and quasi-static Dense & compressed solvers Frequency domain Good for multiport structures Good for high-q structures 19

20 More features and capabilities to consider Integration with ADS Visualization of fields and currents Optimization of parameterized geometries together with circuit and system components Adaptive frequency sampling Arbitrary polygonal meshing with adaptive mesh reduction Thick metal analysis including side wall currents EM excitation from any circuit or system simulation nodes Automatic selection of appropriate matrix solver based on given problem size (direct dense, iterative dense, or direct compressed) 20

21 For more information: Where to get this and other IMS 2010 MicroApps papers from Agilent: Other references and examples concerning Momentum: On the latest release of ADS: Search for Agilent+ADS+Momentum at: 21

22 Acknowledgements/References The research leading to the result in the large SiP example has received funding from the European Community's Seventh Framework Programme FP7-ICT under the MOCHA (Modeling and CHAracterization for SiP - Signal and Power Integrity Analysis) grant n

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