Smart High-Side Power Switch BTS740S2

Transcription

1 Ω Ω Ω P-DSO-2-9 PG-DSO2 Data Sheet 1 V1.,

2 Pin Definitions and Functions Control and protection circuit of channel 2 Channel 1 PROFET Pin configuration Pin Symbol Function 1,1, 11,12, 15,16, 19,2 V bb Positive power supply voltage. Design the wiring for the simultaneous max. short circuit currents from channel 1 to 2 and also for low thermal resistance 3 IN1 Input 1,2, activates channel 1,2 in case of 7 IN2 logic high signal 17,18 OUT1 Output 1,2, protected high-side power output 13,14 OUT2 of channel 1,2. Both pins of each output have to be connected in parallel for operation according ths spec (e.g. k ilis ). Design the wiring for the max. short circuit current 4 ST1 Diagnostic feedback 1,2 of channel 1,2, 8 ST2 open drain, invers to input level 2 GND1 Ground 1 of chip 1 (channel 1) 6 GND2 Ground 2 of chip 2 (channel 2) 5 IS1 9 IS2 Sense current output 1,2; proportional to the load current, zero in the case of current limitation of the load current (top view) V bb 1 2 V bb GND V bb IN OUT1 ST OUT1 IS V bb GND V bb IN OUT2 ST OUT2 IS V bb V bb 1 11 V bb Data Sheet 2 V1.,

3 Maximum Ratings at T j = 25 C unless otherwise specified Parameter Symbol Values Unit Supply voltage (overvoltage protection see page 5) V bb 43 V Supply voltage for full short circuit protection T j,start = C V bb 34 V Load current (Short-circuit current, see page 5) I L self-limited A Load dump protection 1) V LoadDump = V A + V s, V A = 13.5 V V 3) Load dump 6 V R 2) I = 2 Ω, td = 2 ms; IN = low or high, each channel loaded with R L = 7. Ω, Operating temperature range Storage temperature range T j T stg C Power dissipation (DC) 4) T a = 25 C: P tot 3.8 W (all channels active) T a = 85 C: 2. Maximal switchable inductance, single pulse V bb = 12V, T j,start = 15 C 4), I L = 5.5 A, E AS = 37 mj, Ω one channel: Z L 18 mh I L = 8.5 A, E AS = 79 mj, Ω two parallel channels: 16 see diagrams on page 1 Electrostatic discharge capability (ESD) (Human Body Model) IN: ST, IS: out to all other pins shorted: acc. MIL-STD883D, method and ESD assn. std. S R=1.5kΩ; C=1pF V ESD nput voltage (DC) V IN V Current through input pin (DC) Current through status pin (DC) Current through current sense pin (DC) see internal circuit diagram page 9 I IN I ST I IS ±2. ±5. ±14 ma Thermal Characteristics Parameter and Conditions Symbol Values Unit min typ Max Thermal resistance junction - soldering point 4),5) each channel: R thjs 12 K/W junction - ambient 4) one channel active: all channels active: R thja 4 33 kv ) Supply voltages higher than V bb(az) require an external current limit for the GND and status pins (a 15Ω resistor for the GND connection is recommended. ) R I = internal resistance of the load dump test pulse generator ) V Load dump is setup without the DUT connected to the generator per ISO and DIN 4839 ) Device on 5mm*5mm*1.5mm epoxy PCB FR4 with 6cm 2 (one layer, 7µm thick) copper area for V bb connection PCB is vertical without blown air See page 15 Data Sheet 3 V1.,

4 Parameter and Conditions, each of the two channels Symbol Values Unit at Tj = C, V bb = 12 V unless otherwise specified min typ max Load Switching Capabilities and Characteristics On-state resistance (V bb to OUT); IL = 5 A each channel, T j = 25 C: T j = 15 C: R ON mω two parallel channels, T j = 25 C: Output voltage drop limitation at small load currents, see page 14 IL =.5 A Nominal load current Tj = C: one channel active: two parallel channels active: Device on PCB 6), Ta = 85 C, Tj 15 C Output current while GND disconnected or pulled up 7) ; Vbb = 3 V, VIN =, see diagram page 1 Turn-on time 8) IN to 9% V OUT : Turn-off time IN to 1% V OUT : R L =12Ω Slew rate on 8) 1 to 3% V OUT, R L =12Ω: Slew rate off 8) 7 to 4% V OUT, R L =12Ω: V ON(NL) 5 mv I L(NOM) A I L(GNDhigh) 8 ma t on 25 t off µs dv/dt on.1 1 V/µs -dv/dt off.1 1 V/µs Operating Parameters Operating voltage 9) V bb(on) V Undervoltage shutdown V bb(under) V Undervoltage restart T j = C: T j =+15 C: V bb(u rst) V Undervoltage restart of charge pump see diagram page 13 T j = C: T j =15 C: Undervoltage hysteresis Vbb(under) = Vbb(u rst) - Vbb(under) V bb(ucp) V bb(under).5 V Overvoltage shutdown V bb(over) V Overvoltage restart V bb(o rst) 33 V V 6) Device on 5mm*5mm*1.5mm epoxy PCB FR4 with 6cm 2 (one layer, 7µm thick) copper area for V bb connection. PCB is vertical without blown air. See page 15 7) not subject to production test, specified by design 8) See timing diagram on page 11. 9) At supply voltage increase up to V bb = 4.7 V typ without charge pump, V OUT V bb - 2 V Data Sheet 4 V1.,

5 Parameter and Conditions, each of the two channels Symbol Values Unit at Tj = C, V bb = 12 V unless otherwise specified min typ max Overvoltage hysteresis V bb(over) 1 V Overvoltage protection 1) T j =-4: V bb(az) 41 V Ibb=4 ma T j = C: Standby current 11) T j =-4 C...25 C: I bb(off) 8 3 µa V IN = ; T j =15 C: 24 5 Leakage output current (included in I bb(off) ) I L(off) 2 µa VIN = Operating current 12), V IN = 5V, I GND = I GND1 + I GND2, Protection Functions 13) Current limit, (see timing diagrams, page 12) one channel on: two channels on: Tj =-4 C: Tj =25 C: Tj =+15 C: Repetitive short circuit current limit, T j = T jt each channel two parallel channels (see timing diagrams, page 12) Initial short circuit shutdown time T j,start =25 C: (see timing diagrams on page 12) I GND I L(lim) I L(SCr) ma t off(sc) 2. ms Output clamp (inductive load switch off) 14) at VON(CL) = Vbb - VOUT, IL= 4 ma Tj =-4 C: Tj =25 C...15 C: V ON(CL) V Thermal overload trip temperature T jt 15 C Thermal hysteresis T jt 1 K A A 1) Supply voltages higher than V bb(az) require an external current limit for the GND and status pins (a 15 Ω resistor in the GND connection is recommended). See also VON(CL) in table of protection functions and circuit diagram page 9. 11) Measured with load; for the whole device; all channels off 12) Add IST, if I ST > 13 Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous repetitive operation. 14) If channels are connected in parallel, output clamp is usually accomplished by the channel with the lowest V ON(CL) Data Sheet 5 V1.,

6 Parameter and Conditions, each of the two channels Symbol Values Unit at Tj = C, V bb = 12 V unless otherwise specified min typ max Reverse Battery Reverse battery voltage 15) -V bb 32 V Drain-source diode voltage (Vout > Vbb) IL = - 4. A, Tj = +15 C -V ON 6 mv Diagnostic Characteristics Current sense ratio 16), static on-condition, VIS =...5 V, Vbb(on) = )...27V, kilis = IL / IIS T j = -4 C, I L = 5 A: k ILIS T j = -4 C, I L =.5 A: T j = C, I L = 5 A: T j = C, I L =.5 A: Current sense output voltage limitation Tj = C IIS =, IL = 5 A: V IS(lim) V Current sense leakage/offset current Tj = C VIN=, VIS =, IL = : I IS(LL) 1 µa VIN=5 V, VIS =, IL = : I IS(LH) 15 VIN=5 V, VIS =, VOUT = (short circuit) I IS(SH) 18) 1 Current sense settling time to I IS static ±1% after positive input slope 18), IL = 5 A t son(is) 3 µs Current sense settling time to 1% of I IS static after negative input slope 18), IL = 5 A t soff(is) 3 1 µs Current sense rise time (6% to 9%) after change of load current 18) IL = A t slc(is) 1 µs Open load detection voltage 19) (off-condition) V OUT(OL) V Internal output pull down (pin 17,18 to 2 resp. 13,14 to 6), VOUT=5 V R O kω 15) Requires a 15 Ω resistor in GND connection. The reverse load current through the intrinsic drain-source diode has to be limited by the connected load. Power dissipation is higher compared to normal operating conditions due to the voltage drop across the drain-source diode. The temperature protection is not active during reverse current operation! Input and Status currents have to be limited (see max. ratings page 3 and circuit page 9). 16) This range for the current sense ratio refers to all devices. The accuracy of the k ILIS can be raised at least by a factor of two by matching the value of k ILIS for every single device. In the case of current limitation the sense current I IS is zero and the diagnostic feedback potential V ST is High. See figure 2c, page ) Valid if V bb(u rst) was exceeded before. 18) not subject to production test, specified by design 19) External pull up resistor required for open load detection in off state Data Sheet 6 V1.,

7 Parameter and Conditions, each of the two channels Symbol Values Unit at Tj = C, V bb = 12 V unless otherwise specified min typ max Input and Status Feedback 2) Input resistance R I kω (see circuit page 9) Input turn-on threshold voltage V IN(T+) 3.5 V Input turn-off threshold voltage V IN(T-) 1.5 V Input threshold hysteresis V IN(T).5 V Off state input current V IN =.4 V: I IN(off) 1 5 µa On state input current V IN = 5 V: I IN(on) µa Delay time for status with open load t d(st OL3) 4 µs after Input neg. slope (see diagram page 13) Status delay after positive input slope (not subject to production test, specified by design) t don(st) 13 µs Status delay after negative input slope (not subject to production test, specified by design) t doff(st) 1 µs Status output (open drain) Zener limit voltage T j = C, I ST = +1.6 ma: V ST(high) V ST low voltage T j = C, I ST = +1.6 ma: T j = +15 C, I ST = +1.6 ma: V ST(low).4.7 Status leakage current, VST = 5 V, Tj= C: I ST(high) 2 µa 2) If ground resistors R GND are used, add the voltage drop across these resistors. Data Sheet 7 V1.,

8 Truth Table Input 1 Output 1 Status 1 Input 2 Output 2 Status 2 Current Sense 1 Current Sense 2 Normal operation Currentlimitation Short circuit to GND Overtemperature Short circuit to V bb Open load Undervoltage Overvoltage level level level I IS L L H H H L nominal L L H H H H L L H H L 21 ) H L L H H L H L H L 22) H H L <nominal 23) L L 24 ) H (L 25) ) H H L L L H H L L L L H H L L L L H Negative output voltage clamp L = "Low" Level X = don't care Z = high impedance, potential depends on external circuit H = "High" Level Status signal after the time delay shown in the diagrams (see fig 5. page 13) Parallel switching of channel 1 and 2 is possible by connecting the inputs and outputs in parallel. The status outputs ST1 and ST2 have to be configured as a 'Wired OR' function with a single pull-up resistor. The current sense outputs IS1 and IS2 have to be connected with a single pull-down resistor. Terms Leadframe (V bb ) is connected to pin 1,1,11,12,15,16,19,2 External R GND optional; two resistors R GND1, R GND2 = 15 Ω or a single resistor R GND =75 Ω for reverse battery protection up to the max. operating voltage. 21) The voltage drop over the power transistor is V bb -V OUT > 3V typ. Under this condition the sense current I IS is zero 22) An external short of output to V bb, in the off state, causes an internal current from output to ground. If R GND is used, an offset voltage at the GND and ST pins will occur and the V ST low signal may be errorious. 23) Low ohmic short to V bb may reduce the output current I L and therefore also the sense current I IS. 24) Power Transistor off, high impedance Data Sheet 8 V1.,

9 Input circuit (ESD protection), IN1 or IN2 Inductive and overvoltage output clamp, OUT1 or OUT2 The use of ESD zener diodes as voltage clamp at DC conditions is not recommended. Status output, ST1 or ST2 VON clamped to VON(CL) = 47 V typ. Overvoltage and reverse batt. protection ESD-Zener diode: 6.1 V typ., max 5. ma; R ST(ON) < 375 Ω at 1.6 ma. The use of ESD zener diodes as voltage clamp at DC conditions is not recommended. Current sense output ESD-Zener diode: 6.1 V typ., max 14 ma; R IS = 1 kω nominal V Z1 = 6.1 V typ., V Z2 = 47 V typ., R GND = 15 Ω, R ST =15kΩ, R I =4.5kΩ typ., R IS =1kΩ, R V =15kΩ, In case of reverse battery the current has to be limited by the load. Temperature protection is not active Open-load detection OUT1 or OUT2 OFF-state diagnostic condition: V OUT > 3 V typ.; IN low Data Sheet 9 V1.,

10 GND disconnect Inductive load switch-off energy dissipation Any kind of load. In case of IN= high is VOUT VIN - VIN(T+). Due to VGND >, no VST = low signal available. GND disconnect with GND pull up Energy stored in load inductance: E L = 1 /2 L I 2 L While demagnetizing load inductance, the energy dissipated in PROFET is E AS = E bb + E L - E R = VON(CL) i L (t) dt, with an approximate solution for R L > Ω: E AS = IL L IL RL (V 2 R bb + V OUT(CL) ) (1+ L V OUT(CL) ) Any kind of load. If VGND > VIN - VIN(T+) device stays off Due to VGND >, no VST = low signal available. Vbb disconnect with energized inductive load Maximum allowable load inductance for a single switch off (one channel) 4) T j,start = 15 C, V bb = 12 V, R L =Ω Z L [mh] For inductive load currents up to the limits defined by Z L (max. ratings and diagram on page 1) each switch is protected against loss of V bb. Consider at your PCB layout that in the case of Vbb disconnection with energized inductive load all the load current flows through the GND connection. Data Sheet 1 V1.,

11 Timing diagrams Both channels are symmetric and consequently the diagrams are valid for channel 1 and channel 2 Figure 1a: Switching a resistive load, change of load current in on-condition: Figure 2a: Switching a resistive load, turn-on/off time and slew rate definition: don(st) doff(st) on off on slc(is) slc(is) off son(is) soff(is) The sense signal is not valid during settling time after turn or change of load current. Figure 1b: V bb turn on: Figure 2b: Switching a lamp: proper turn on under all conditions Data Sheet 11 V1.,

12 Figure 2c: Switching a lamp with current limit: Figure 3a: Turn on into short circuit: shut down by overtemperature, restart by cooling Figure 2d: Switching an inductive load Heating up of the chip may require several milliseconds, depending on external conditions Figure 3b: Turn on into short circuit: shut down by overtemperature, restart by cooling (two parallel switched channels 1 and 2) *) if the time constant of load is too large, open-load-status may occur ST1 and ST2 have to be configured as a 'Wired OR' function ST1/2 with a single pull-up resistor Data Sheet 12 V1.,

13 Figure 4a: Overtemperature: Reset if T j <T jt Figure 6a: Undervoltage: V bb(under) V bb(u cp) bb(u rst) Figure 5a: Open load: detection (with REXT), turn on/off to open load Figure 6b: Undervoltage restart of charge pump charge pump starts at V bb(ucp) =4.7 V typ. Data Sheet 13 V1.,

14 Figure 7a: Overvoltage: Figure 8b: Current sense ratio: bb V ON(CL) V bb(over) V bb(o rst) Figure 8a: Current sense versus load current 26 :: Figure 9a: Output voltage drop versus load current: 26 This range for the current sense ratio refers to all devices. The accuracy of the k ILIS can be raised at Data Sheet 14 V1.,

15 Package Outlines.35 x max 1) max ).2 24x ± GPS594 Index Marking ) 1) Does not include plastic or metal protrusions of.15 max per side 2) Does not include dambar protrusion of.5 max per side Figure 1 PG-DSO-2 (Plastic Dual Small Outline Package) (RoHS-compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pbfree finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-2). Please specify the package needed (e.g. green package) when placing an order You can find all of our packages, sorts of packing and others in our Infineon Internet Page Products : Dimensions in mm Data Sheet 17 V1.,

16 Revision History Version Date Changes Creation of the green datasheet. Data Sheet 18 V1.,

17 Edition Published by Infineon Technologies AG Munich, Germany Infineon Technologies AG 5/13/7. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics ( Beschaffenheitsgarantie ). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.