General Description. Features. Applications. Ordering and Marking Information. Dual Operational Amplifier

Transcription

1 Dual Operational Amplifier Features General Description Power Supply Range: - Signal Supply : 3V to V - Dual Supply : ±.V to ± V Large DC Voltage Gain : db Large Output Swing : V ~ -.V Bandwidth(unity gain) : MHz Internally Frequency Compensated for Unity Gain Low Input Offset Voltage : mv Lead Free Available (RoHS Compliant) Applications Amplifiers The consists of two independent, high gain, internally frequency compensated operational amplifiers which were designed specifically to operate from a single power supply up to volts. Operation from dual power supplies is also possible and the power supply current drain is essentially independent of the magnitude of the power supply voltage. Application areas include transducer amplifiers, DC gain blocks and all the conventional OP amplifier circuits which can be more easily implemented in single power supply systems. (For example, the can be directly operated from the standard +V power supply voltage which is normally used in digital systems). Filters Analog Circuit Ordering and Marking Information ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders.

2 Block Diagram Output A + Inverting Input A A - + Output B Non-inverting Input A 3 + B - Inverting Input B - Non-inverting Input B Absolute Maximum Ratings ( = C) Symbol Parameter Rating Unit Supply Voltage V V ID Differential Input Voltage V V I Input Voltage -.3V to +V V P D Power Dissipation mw Operating Free-air Temperature Range to C T STG Storage Temperature Range - to + C Electrical Characteristics ( = ±V, = C) Symbol Parameter Test Conditions Min. Typ. Max. V IO Input Offset Voltage R S kω mv I IO Input Offset Current na I BIAS Input Bias Current na R IN Input Resistance.3 MΩ A V Large Signal Voltage Gain R L kω, V O =±V db V OM Maximum Output Voltage Swing R L kω ± 9 ± 9. V V OM Maximum Output Voltage Swing R L kω ±. ± 9. V V ICM Input Common-Mode Voltage Range ±9 ± 9. V CMRR Common-Mode Rejection Ratio R S kω 9 db SVRR Supply Voltage Rejection Ratio R S kω, V P-P =mv, db f IN =HZ I CC Operating Current 3. ma V NI Equivalent Input Noise Voltage RIAA, R S =kω,3khz, LPF Unit. µvrms SR Slew Rate mv/µs GBWP Gain Bandwidth Product MHz

3 Typical Characteristics Open Loop Voltage Gain - db Open Loop Voltage Gain vs Frequency = C = ±V R L =kω k k k M M Figure : Frequency (Hz) Maximum Output Voltage Swing vs Frequency Maximum Output Voltage Swing -V = C = ±V R L =kω k k k M Figure : Frequency (Hz) Maximum Output Voltage Swing vs Load Resistance Operating Current vs Temperature Maximum Output Voltage Swing - V = C = ±V... Operating Current - ma 9 3 = ±V - - Figure 3 : Load Resistance - kω Figure : Temperature - C 3

4 Typical Characteristics Cont. Maximum Output Voltage Swing vs Temperature Input Offset Voltage vs Temperature Maximum Output Voltage Swing - V Input Bias Current - na = ±V R L =kω Figure : Temperature - C Input Bias Current vs Temperature = ±V - - Maximum Output Voltage Swing - V Input Offset Voltage - mv. = Figure : Temperature - C Maximum Output Voltage Swing vs Operating Voltage = C R L =kω - - ± ± 3 ± ± ± ± ± ± 9 ± Figure : Temperature - C Figure : Operating Voltage - V

5 Typical Characteristics Cont. Operating Current vs Operating Voltage Voltage Follower pulse Response Operating Current -ma 9 3 = C ± ± ±3 ± ± ± ± ± ±9 ± Input Voltage - V Output Voltage - V.... Figure : Operating Voltage - V Figure 9 : Time µs

6 Packaging Information SOP--P pin ( Reference JEDEC Registration MS-) E E H.X D e e D A A.max. L Dim Millimeters Inches Min. Max. Min. Max. A A.. D D 3.REF.REF E E.REF.REF H.... L.... e e.bsc.bsc φ

7 Packaging Information TSSOP- e x E / E E S ( ) GAUGE PLANE e/ D A. L (L) A ( 3) b A Dim Millimeters Inches Min. Max. Min. Max. A.. A.... A...3. b D e. BSC. BSC E. BSC. BSC E L....3 L. REF.39REF R.9. R.9. S.. φ φ REF REF φ3 REF REF

8 Packaging Information PDIP- pin ( Reference JEDEC Registration MS-) D E E A L A A E3 e e 3 e Dim Millimeters Inches Min. Max. Min. Max. A.33. A.3. A D e. BSC. BSC e.3... e3.... E. BSC.3 BSC E.... E3.9.3 L φ REF REF

9 Physical Specifications Terminal Material Solder-Plated Copper (Solder Material : 9/ or 3/3 SnPb), %Sn Lead Solderability Meets EIA Specification RSI-9, ANSI/J-STD- Category 3. Reflow Condition (IR/Convection or VPR Reflow) T P Ramp-up tp Critical Zone T L to T P T L Temperature Tsmax Tsmin t L Ramp-down ts Preheat t C to Peak Time Classificatin Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (T L to T P ) 3 C/second max. 3 C/second max. Preheat C C - Temperature Min (Tsmin) - Temperature Max (Tsmax) C C - - seconds - seconds Time (min to max) (ts) Time maintained above: - Temperature (T L ) - Time (t L ) 3 C - seconds C - seconds Peak/Classificatioon Temperature (Tp) See table See table Time within C of actual Peak Temperature (tp) -3 seconds - seconds Ramp-down Rate C/second max. C/second max. Time C to Peak Temperature minutes max. minutes max. Notes: All temperatures refer to topside of the package.measured on the body surface. 9