QPD W, 28V, GHz, GaN RF Input-Matched Transistor

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1 Product Overview The Qorvo is a W (P3dB), 50Ω-input matched discrete GaN on SiC HEMT which operates from 30MHz to 1.2 GHz. The integrated input matching network enables wideband gain and power performance, while the output can be matched on board to optimize power and efficiency for any region within the band. The device is housed in a 5 x 6 mm leadless SMT package that saves real estate of already space-constrained handheld radios. Lead-free and ROHS compliant Evaluation boards are available upon request. Functional Block Diagram Key Features 5 x 6 x 1.09 mm QFN Frequency: 30 MHz to 1.2 GHz Output Power (P3dB) 1 : 24 W Linear Gain 1 : db Typical PAE3dB 1 : 78.2% Operating Voltage: 28 V Low thermal resistance package CW and Pulse capable 5 x 6 mm package Note 1 GHz Applications Military radar Civilian radar Land mobile and military radio communications Test instrumentation Wideband or narrowband amplifiers Jammers Ordering info Part No. ECCN Description EAR GHz RF Transistor PCB401 EAR GHz EVB PCB402 EAR GHz EVB Datasheet Rev. A, June 23, Subject to change without notice - 1 of

2 Absolute Maximum Ratings 1 Parameter Rating Units Breakdown Voltage,BVDG +0 V Gate Voltage Range, VG -7 to +1.5 V Drain Current 3 A Gate Current Range, IG See page 4. ma Power Dissipation, CW, PDISS 32.4 W RF Input Power, CW, 1 GHz, T = 25 C +30 dbm Channel Temperature, TCH 275 C Mounting Temperature (30 Seconds) 3 C Storage Temperature 65 to +0 C 1. Operation of this device outside the parameter ranges given above may cause permanent damage. Recommended Operating Conditions 1 Parameter Min Typ Max Units Operating Temp. Range C Drain Voltage Range, VD V Drain Bias Current, IDQ 50 ma Drain Current, ID 8 ma Gate Voltage, VG V Channel Temperature (TCH) 5 C Power Dissipation, CW (PD) 2 26 W Power Dissipation, Pulsed (PD) 2, W 1. Electrical performance is measured under conditions noted in the electrical specifications table. Specifications are not guaranteed over all recommended operating conditions. 2. Package base at 85 C 3. Pulse Width = 557 us, Duty Cycle = % 4. To be adjusted to desired IDQ Pulsed Characterization Load-Pull Performance Power Tuned 1 Parameters Typical Values Unit Frequency, F GHz Linear Gain, GLIN db Output Power at 3dB compression point, P3dB dbm Power-Added-Efficiency at 3dB compression point, PAE3dB % Gain at 3dB compression point db 1. Test conditions unless otherwise noted: VD = +28 V, IDQ = 50 ma, Temp = +25 C Pulsed Characterization Load-Pull Performance Efficiency Tuned 1 Parameters Typical Values Unit Frequency, F GHz Linear Gain, GLIN db Output Power at 3dB compression point, P3dB dbm Power-Added-Efficiency at 3dB compression point, PAE3dB % Gain at 3dB compression point, db G3dB 1. Test conditions unless otherwise noted: VD = +28 V, IDQ = 50 ma, Temp = +25 C Datasheet Rev. A, June 23, Subject to change without notice - 2 of

3 RF Characterization GHz EVB Performance At 0.2 GHz 1 Parameter Min Typ Max Units Linear Gain, GLIN 21.2 db Output Power at 3dB compression point, P3dB 40.7 dbm Power-Added Efficiency at 3dB compression point, 83.9 % PAE3dB Gain at 3dB compression point, G3dB.2 db 1. VD = +28 V, IDQ = 50 ma, Temp = +25 C, CW RF Characterization GHz EVB Performance At 0.5 GHz 1 Parameter Min Typ Max Units Linear Gain, GLIN.5 db Output Power at 3dB compression point, P3dB 42.6 dbm Power-Added Efficiency at 3dB compression point, 68.5 % PAE3dB Gain at 3dB compression point, G3dB.5 db 1. VD = +28 V, IDQ = 50 ma, Temp = +25 C, CW RF Characterization GHz EVB Performance At 0.9 GHz 1 Parameter Min Typ Max Units Linear Gain, GLIN.3 db Output Power at 3dB compression point, P3dB 43.3 dbm Power-Added Efficiency at 3dB compression point, 73.8 % PAE3dB Gain at 3dB compression point, G3dB.3 db 1. VD = +28 V, IDQ = 50 ma, Temp = +25 C, CW RF Characterization Mismatch Ruggedness at 1 GHz 1 Symbol Parameter db Compression Typical VSWR Impedance Mismatch Ruggedness 1 :1 1. Test conditions unless otherwise noted: TA = 25 C, VD = 28 V, IDQ = 50 ma, CW Driving input power is determined at CW compression under matched condition at EVB output connector. Datasheet Rev. A, June 23, Subject to change without notice - 3 of

4 RF Maximum Characterization Gate Current GHz EVB Performance At 0.4 GHz 1 Parameter Min Typ Max Units Linear Gain, GLIN I Gmax vs. T CH db Output Power 35 at 3dB compression point, P3dB 42.5 dbm Drain Efficiency at 3dB compression point, DEFF3dB 78.8 % Gain at 3dB compression point, G3dB db VD = +28 V, IDQ = 50 ma, Temp = +25 C, CW 25 I Gmax [ma] T CH [ C] Datasheet Rev. A, June 23, Subject to change without notice - 4 of

5 Median Lifetime 1 Median Lifetime, T M (Hours) 1.00E+ 1.00E+ 1.00E+ 1.00E+ 1.00E+ 1.00E+ 1.00E+ 1.00E E+ 1.00E E E E E E+04 Median Lifetime vs. Channel Temperature Channel Temperature, T CH ( C) 1. For pulsed signals, average lifetime is average lifetime at maximum channel temperature divided by duty cycle. Datasheet Rev. A, June 23, Subject to change without notice - 5 of

6 Thermal and Reliability Information Pulsed Maximum Channel Temperature [ o C] % Duty Cycle % Duty Cycle % Duty Cycle 50% Duty Cycle Maximum Channel Temperature QFN base fixed at 85 o C, Pdiss = 28.8W E E E E E-02 Pulse Width [Sec] Parameter Conditions Values Units Thermal Resistance (θjc) 3.09 C/W 85 C back side temperature Maximum Channel Temperature (TCH) 4 C 28.8 W Pdiss, 0 us PW, 5% DC Median Lifetime I 3.7E9 Hrs Thermal Resistance (θjc) 3. C/W 85 C back side temperature Maximum Channel Temperature (TCH) 7 C 28.8 W Pdiss, 0 us PW, % DC Median Lifetime I 1.4E9 Hrs Thermal Resistance (θjc) 3.40 C/W 85 C back side temperature Maximum Channel Temperature (TCH) 3 C 28.8 W Pdiss, 0 us PW, % DC Median Lifetime I 3.9E8 Hrs Thermal Resistance (θjc) 4. C/W 85 C back side temperature Maximum Channel Temperature (TCH) 3 C 28.8 W Pdiss, 0 us PW, 50% DC Median Lifetime I 2.4E7 Hrs Datasheet Rev. A, June 23, Subject to change without notice - 6 of

7 Thermal and Reliability Information CW Temperature [ C] Max Channel Temperature vs. CW Power Surface of QFN Package Fixed at 85 C Maximum Channel Temperature 1E6 Hours Operating Limit CW Power Dissipation [W] Parameter Conditions Values Units Thermal Resistance (θjc) 4.44 C/W 85 C back side temperature Maximum Channel Temperature (TCH) 1 C 7.2 W Pdiss, CW Median Lifetime I 1.4E11 Hrs Thermal Resistance (θjc) 4.72 C/W 85 C back side temperature Maximum Channel Temperature (TCH) 3 C.4 W Pdiss, CW Median Lifetime I 1.8E9 Hrs Thermal Resistance (θjc) 5.05 C/W 85 C back side temperature Maximum Channel Temperature (TCH) 4 C 21.6 W Pdiss, CW Median Lifetime I 2.7E7 Hrs Thermal Resistance (θjc) 5.56 C/W 85 C back side temperature Maximum Channel Temperature (TCH) 245 C 28.8 W Pdiss, CW Median Lifetime I 3.8E5 Hrs Thermal Resistance (θjc) 6.06 C/W 85 C back side temperature Maximum Channel Temperature (TCH) 303 C 36 W Pdiss, CW Median Lifetime I 7.0E3 Hrs Datasheet Rev. A, June 23, Subject to change without notice - 7 of

8 1, 2, 3 Load-Pull Smith Charts 1. VD = 28 V, IDQ = 50 ma, 0 us PW, % DC pulsed. Performance is at 3dB gain compression referenced to peak gain. 2. See page for load-pull and source-pull reference planes. 50-Ω load-pull TRL fixtures are built with -mil RO4350B material. 3. NaN means the impedances are either undefined or varying in load-pull system. 0.6 GHz, Load Pull Zs(fo) = iΩ Zs(2fo) = iΩ Zs(3fo) = NaNΩ Zl(2fo) = iΩ Zl(3fo) = NaNΩ Max Power is 43.7dBm at Z = iΩ Γ = i Perfect input match at Zs = iΩ Max Gain is.5db at Z = iΩ Γ = i Perfect input match at Zs = iΩ Max PAE is 72.4% at Z = iΩ Γ = i Perfect input match at Zs = iΩ Zo = 50Ω Power Gain PAE Datasheet Rev. A, June 23, Subject to change without notice - 8 of

9 1, 2, 3 Load-Pull Smith Charts 1. VD = 28 V, IDQ = 50 ma, 0 us PW, % DC pulsed. Performance is at 3dB gain compression referenced to peak gain. 2. See page for load-pull and source-pull reference planes. 50-Ω load-pull TRL fixtures are built with -mil RO4350B material. 3. NaN means the impedances are either undefined or varying in load-pull system. 0.8 GHz, Load Pull Zs(fo) = iΩ Zs(2fo) = iΩ Zs(3fo) = NaNΩ Zl(2fo) = iΩ Zl(3fo) = NaNΩ 0.4 Max Power is 43.8dBm at Z = iΩ Γ = i Perfect input match at Zs = iΩ Max Gain is.3db at Z = iΩ Γ = i Perfect input match at Zs = iΩ Max PAE is 74.6% at Z = iΩ Γ = i Perfect input match at Zs = iΩ Zo = 50Ω Power Gain PAE Datasheet Rev. A, June 23, Subject to change without notice - 9 of

10 1, 2, 3 Load-Pull Smith Charts 1. VD = 28 V, IDQ = 50 ma, 0 us PW, % DC pulsed. Performance is at 3dB gain compression referenced to peak gain. 2. See page for load-pull and source-pull reference planes. 50-Ω load-pull TRL fixtures are built with -mil RO4350B material. 3. NaN means the impedances are either undefined or varying in load-pull system. 1 GHz, Load Pull Zs(fo) = iΩ Zs(2fo) = iΩ Zs(3fo) = NaNΩ Zl(2fo) = iΩ Zl(3fo) = NaNΩ 0.4 Max Power is 43.8dBm at Z = iΩ Γ = i Perfect input match at Zs = iΩ Max Gain is.8db at Z = iΩ Γ = i Perfect input match at Zs = iΩ Max PAE is 78.2% at Z = iΩ Γ = i Perfect input match at Zs = iΩ Zo = 50Ω Power Gain PAE Datasheet Rev. A, June 23, Subject to change without notice - of

11 1, 2, 3 Load-Pull Smith Charts 1. VD = 28 V, IDQ = 50 ma, 0 us PW, % DC pulsed. Performance is at 3dB gain compression referenced to peak gain. 2. See page for load-pull and source-pull reference planes. 50-Ω load-pull TRL fixtures are built with -mil RO4350B material. 3. NaN means the impedances are either undefined or varying in load-pull system. 1.2 GHz, Load Pull Zs(fo) = iΩ Zs(2fo) = iΩ Zs(3fo) = NaNΩ Zl(2fo) = iΩ Zl(3fo) = NaNΩ 0.4 Max Power is 43.8dBm at Z = iΩ Γ = i Perfect input match at Zs = iΩ Max Gain is.7db at Z = iΩ Γ = i Perfect input match at Zs = iΩ Max PAE is 71.1% at Z = iΩ Γ = i Perfect input match at Zs = iΩ Zo = 50Ω Power Gain PAE Datasheet Rev. A, June 23, Subject to change without notice - 11 of

12 Typical Performance Load-Pull Drive-up 1, us PW, % DC pulsed signal, VD = 28 V, IDQ = 50 ma 2. See page for load-pull and source-pull reference planes where the performance was measured. Gain [db] Gain and PAE vs. Output Power 0.6 GHz, Power Tuned Zs = iΩ Zl = iΩ Gain PAE Output Power [dbm] PAE [%] Gain [db] Gain and PAE vs. Output Power 0.6 GHz, Efficiency Tuned Zs = iΩ Zl = iΩ Gain PAE Output Power [dbm] PAE [%] Gain [db] Gain and PAE vs. Output Power 0.8 GHz, Power Tuned Zs = iΩ Zl =.67+6.iΩ Gain PAE Output Power [dbm] PAE [%] Gain [db] Gain and PAE vs. Output Power 0.8 GHz, Efficiency Tuned Zs = iΩ Zl = iΩ Gain PAE Output Power [dbm] PAE [%] Datasheet Rev. A, June 23, Subject to change without notice - of

13 Typical Performance Load-Pull Drive-up 1, us PW, % DC pulsed signal, VD = 28 V, IDQ = 50 ma 2. See page for load-pull and source-pull reference planes where the performance was measured. Gain [db] 21 Gain and PAE vs. Output Power 1 GHz, Power Tuned Zs = iΩ Zl = iΩ Gain PAE Output Power [dbm] PAE [%] Gain [db] 21 Gain and PAE vs. Output Power 1 GHz, Efficiency Tuned Zs = iΩ Zl = iΩ Gain PAE Output Power [dbm] PAE [%] Gain [db] 11 Gain and PAE vs. Output Power 1.2 GHz, Power Tuned Zs = iΩ Zl = iΩ Gain PAE Output Power [dbm] PAE [%] Gain [db] 11 Gain and PAE vs. Output Power 1.2 GHz, Efficiency Tuned Zs = iΩ Zl = iΩ Gain PAE Output Power [dbm] PAE [%] Datasheet Rev. A, June 23, Subject to change without notice - of

14 Power Drive-up Performance Over Temperatures Of GHz EVB 1 1. VD = 28 V, IDQ = 50 ma, CW P3dB [W] C - C 0 C 25 C 45 C 65 C 85 C P3dB Over Temperatures Frequency [GHz] G3dB [W] G3dB Over Temperatures -40 C - C 0 C 25 C 45 C 65 C 85 C Frequency [GHz] PAE3dB [%] PAE3dB Over Temperatures -40 C - C 0 C 25 C 45 C 65 C 85 C Frequency [GHz] Pdiss3dB [W] Dissipation 3dB Compression Over Temperatures -40 C - C 0 C 25 C 45 C 65 C 85 C CW limit Frequency [GHz] Datasheet Rev. A, June 23, Subject to change without notice - of

15 Power Drive-up Performance At 25 C Of GHz EVB 1 1. VD = 28 V, IDQ = 50 ma, CW P3dB [W] P3dB at 25 C Frequency [GHz] G3dB [db] G3dB at 25 C Frequency [GHz] 0 PAE3dB at 25 C Dissipation 3dB compression at 25 C PAE3dB [%] Pdiss3dB [W] Frequency [GHz] Frequency [GHz] Datasheet Rev. A, June 23, Subject to change without notice - of

16 Two-Tone Performance At 25 C Of GHz EVB Lower IM3, 50 ma Lower IM3, 2 ma Lower IM3, 2 ma Upper IM3, 88 ma Upper IM3, 6 ma IMD3 vs. Output PEP vs I DQ, V D = 28 V, F center = 450 MHz, Tone Spacing = 1 MHz Lower IM3, 88 ma Lower IM3, 6 ma Upper IM3, 50 ma Upper IM3, 2 ma Upper IM3, 2 ma -25 IMD3 [dbc] PEP [dbm] Lower IM5, 50 ma Lower IM5, 2 ma Lower IM5, 2 ma Upper IM5, 88 ma Upper IM5, 6 ma IMD5 vs. Output PEP vs I DQ, V D = 28 V, F center = 450 MHz, Tone Spacing = 1 MHz Lower IM5, 88 ma Lower IM5, 6 ma Upper IM5, 50 ma Upper IM5, 2 ma Upper IM5, 2 ma -30 IMD5 [dbc] PEP [dbm] Datasheet Rev. A, June 23, Subject to change without notice - of

17 Two-Tone Performance At 25 C Of GHz EVB - IMD vs. Tone Spacing, V D = 28 V, I DQ = 2 ma, F center = 450 MHz, PEP = 40.8 dbm Lower IM3 Upper IM3 - Lower IM5 Upper IM5 - IMD [dbc] Tone Spacing [MHz] Datasheet Rev. A, June 23, Subject to change without notice - of

18 Power Drive-up Performance At 25 C Of GHz EVB 1 1. VD = 28 V, IDQ = 50 ma, CW P3dB [W] P3dB vs. Frequency at 25 C Frequency [GHz] G3dB [db] G3dB vs. Frequency at 25 C Frequency [GHz] 0 PAE3dB vs. Frequency at 25 C Dissipation 3dB compression vs. Frequency at 25 C PAE3dB [%] Frequency [GHz] Pdiss3dB [W] Frequency [GHz] Datasheet Rev. A, June 23, Subject to change without notice - of

19 Pin Configuration and Description 1 1. The will be marked with the 00 designator and a lot code marked below the part designator. The YY represents the last two digits of the calendar year the part was manufactured, the WW is the work week of the assembly lot start, the MXXX is the production lot number. Pin Description Pin Symbol Description 2, 3 RF IN Gate voltage / RF Input 6, 7 VD / RF OUT Drain voltage / RF Output 1 VGQ Gate bias supply 4, 5, 8 N/C Not connected 9 Source Source to be connected to ground Datasheet Rev. A, June 23, Subject to change without notice - of

20 Package Marking and Dimensions 1 1. All dimensions are in mm. Otherwise noted, the tolerance is ±0.1 mm. Datasheet Rev. A, June 23, Subject to change without notice - of

21 Schematic GHz EVB Bias-up Procedure Bias-down Procedure 1. Set V G to -4 V. 1. Turn off RF signal. 2. Set I D current limit to 60 ma. 2. Turn off V D 3. Apply 28 V V D. 3. Wait 2 seconds to allow drain capacitor to discharge 4. Slowly adjust V G until I D is set to 50 ma. 4. Turn off V G 5. Set I D current limit to 2 A 6. Apply RF. Datasheet Rev. A, June 23, Subject to change without notice - 21 of

22 Schematic GHz EVB Bias-up Procedure Bias-down Procedure 2. Set V G to -4 V. 3. Turn off RF signal. 4. Set I D current limit to 60 ma. 4. Turn off V D 5. Apply 28 V V D. 5. Wait 2 seconds to allow drain capacitor to discharge 6. Slowly adjust V G until I D is set to 50 ma. 7. Turn off V G 8. Set I D current limit to 2 A 9. Apply RF. Datasheet Rev. A, June 23, Subject to change without notice - of

23 GHz Reference Design 1. PCB Material: RO4350B, mil thickness, 1 oz copper cladding Bill Of material GHz EVB Ref Des Value Qty Manufacturer Part Number R1 Ω 1 Vishay CRCW0603R0JNEA C2 nf 1 AVX 0603YC3KAT2A C3 uf 1 Murata GRM21BR71A6KE51L C4 7.5 pf 1 ATC 600S7R5BT250XT C1, C pf 2 Dielectric Labs C08BL242X-5UN-X0T C5 3.3 pf 1 ATC 600S3R3BT250XT C7 4.7 uf 1 Murata GRM55ER72A475KA01L L1 900 nh 1 Coilcraft 08AF-901XJLC L2 3.9 nh 1 Coilcraft 0603HC-3N9XGLW L3 7.5 nh 1 Coilcraft 0603HC-7N5XGLW L4 00 nh 1 Coilcraft 0603LS-2XGLC Datasheet Rev. A, June 23, Subject to change without notice - 23 of

24 0. 1. GHz Reference Design 1. PCB Material: RO4350B, mil thickness, 1 oz copper cladding Bill Of material GHz EVB Ref Des Value Qty Manufacturer Part Number C2 nf 1 AVX 0603YC3KAT2A C3 uf 1 Murata GRM21BR71A6KE51L C4 3.3 pf 1 ATC 600S3R3AT250XT C1, C pf 2 Dielectric Labs C08BL242X-5UN-X0T C5 4.7 uf 1 Murata GRM55ER72A475KA01L L2 3.9 nh 1 Coilcraft 0603HC-3N9XGLW L3 900 nh 1 Coilcraft 08AF-901XJLC L1 00 nh 1 Coilcraft 0603LS-2XGLC Datasheet Rev. A, June 23, Subject to change without notice - 24 of

25 Recommended Solder Temperature Profile Datasheet Rev. A, June 23, Subject to change without notice - 25 of

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