Low Distortion Down-converter + AGC Amplifier + Video Amplifier

Transcription

1 SiGe BiCMOS Integrated Circuit Low Distortion Down-converter + AGC Amplifier + Video Amplifier DESCRIPTION Preliminary Datasheet GET-SA-0 REJXXXXXX-000 Rev..0 Dec., 00 The is down-converter IC mainly designed for the Out of Band Tuner used CATV set top box and digital cable ready TV applications. The can operate by the low voltage of.v, and has a characteristic with excellent low power consumption and low distortions. In addition, it is an ecologically friendly product because it has the power down mode. This IC consists of RF-AGC amplifier, mixer and video amplifier. The package is 8-pin QFN (Quad Flat Non-lead) Package suitable for surface mount. This IC is manufactured using our latest SiGe BiCMOS process that shows superior high frequency characteristics. FEATURES.V single power supply operation. With power down function.. Power ON mode Low power consumptions Total performance - frf(bw) = 0 to 00MHz - flo(bw) = 80 to 00MHz - High gain CG = 8dB (with SAW filter loss) - Wide dynamic range GCR = 0dB - Low distortion IM = 9dBc - Low noise NF =. db. Power down mode - Icc VPD=.0V to Vcc APPLICATIONS - Out of Band Tuner IC for Digital CATV set top box - Digital cable ready TV ORDERING INFORMATION Part Number Order Number Package Marking Supplying Form -E -E-A 8-pin Embossed tape mm wide plastic QFN Pin 8, face the perforation side of the tape (Pb-Free) Qty. kpcs/reel Dry packing specification (MSL Equivalent) Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: -A REJxxxxxxx-000 Rev..0 Page of

2 PIN CONNECTION TOP VIEW BOTTOM VIEW PIN DESCRIPTION Pin Identifier Pin No. Pin Name Function Ground pin, Connect to the ground plane. VPD Power Down. N.C. Non connection. To be connected to the ground plane. Ground pin, Connect to the ground plane. Ground pin, Connect to the ground plane. Vcc-RF RF-block supply +.V. Ground pin, Connect to the ground plane. 8 RF-IN RF-AMP positive input. 9 RF-IN RF-AMP negative input. 0 Ground pin, Connect to the ground plane. VAGC Gain control terminal. Ground pin, Connect to the ground plane. N.C. Non connection. To be connected to the ground plane. Ground pin, Connect to the ground plane. LO-IN Local buffer positive input. LO-IN Local buffer negative input. Vcc-LO LO-block supply +.V. 8 Vcc-IF IF-block supply +.V. 9 IF-OUT IF-AMP negative output. 0 IF-OUT IF-AMP positive output. Ground pin, Connect to the ground plane. Ground pin, Connect to the ground plane. IF-IN IF-AMP negative input. IF-IN IF-AMP positive input. Ground pin, Connect to the ground plane. Ground pin, Connect to the ground plane. MIX-OUT MIXER positive output. 8 MIX-OUT MIXER negative output. The exposed thermal pad is also an electrical ground REJxxxxxxx-000 Rev..0 Page of

3 BLOCK DIAGRAM VPD N.C. VCC-RF MIX-OUT 8 8 RF-IN MIX-OUT 9 RF-IN MIXER RF AGC AMP REG Power 0 AGC VAGC IF-IN IF-IN IF AMP Lo AMP N.C IF-OUT IF-OUT VCC-IF VCC-LO LO-IN LO-IN REJxxxxxxx-000 Rev..0 Page of

4 ABSOLUTE MAXIMUM RATINGS Item Symbol Ratings Unit Supply Voltage VCC.0 V Power Dissipation * PD 00 mw Input Power Pin +0 dbm Operating Ambient Temperature* TA -0 to +80 Storage Temperature Tstg - to +0 * Mounted on double-sided copper-clad 0 0. mm epoxy glass PWB (TA=80 ) RECOMMENDED OPERATING RANGE (Unless otherwise specified, TA=+ ) Item Symbol Min Typ Max Unit Test Conditions Supply Voltage Vcc.0.. V Gain Voltage VAGC 0 - Vcc V Power Voltage VPD 0 - Vcc V Operating Ambient Temperature TA Vcc =.0 to.v POWER DOWN TABLE (Unless otherwise specified, TA=+,Vcc=.V ) VPD VPD Mode Circuit Current Gain L / Open 0/Open to 0.V Enable Icc=8mA typ. High H.0 to Vcc Disenable Icc<0μA Low REJxxxxxxx-000 Rev..0 Page of

5 ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA=+,Vcc=.V) Item Symbol Min Typ Max Unit Test Conditions DC Characteristics Circuit Current Icc 8 0 ma Vcc=.V(no input signal) Circuit Current (Power Down Mode) V PD =0V Note Icc μa Vcc=.V(no input signal) V PD =.0V Note Power ON Voltage VPD(ON) 0/open - 0. Enable Note Power OFF Voltage VPD(OFF).0 - Vcc Disenable Note AGC Voltage High Level VAGC(H).0 - Vcc Maximum gain Note AGC Voltage Low Level VAGC(L) 0-0. Minimum gain Note Total Block (RF AGC Amplifier + Mixer + SAW Filter + IF Amplifier) SAW Filter (TDK-EPC(EPCOS) X889M) frf=80mhz flo=9.mhz, Pin(LO) =-0dBm, fif=9.mhz, ZIN(RF)= ZIN(LO)=, ZOUT(IF)=0Ω RF Input Frequency Range frf(bw) 0-00 MHz Note LO Input Frequency Range flo(bw) MHz Pin(LO)=-0dBm Note Total Conversion Gain (with SAW filter) CGMAX. 8 8 db V AGC =.0V, SingleEnded-IN, Differential-Output,V in = -dbmv Note Gain Range GCR 0 - db V AGC =0 to. V Note rd Order Inter-modulation Distortion IM dbc f O =9.0MHz, f O = 9.MHz, V AGC =.0V, Differential-Output=dBmV/tone(V P- P/tone) V in = - dbmv/tone Note Noise Figure(DSB) NF -. - db V AGC =.0 V fout=9.mhz Single Ended-Output Note Output Voltage VOUT Vp-p Differential-Output Note LO-RF Leakage LORF dbmv V AGC=.0 V, Pin(LO)= -0dBm 8pin Ω Termination LO-IF Leakage LOIF dbc V AGC =.0 V, RF Block Characteristics flo=0 to 80MHz Note V out =.0Vpp Differential-Output frf=0,90,0,0mhz, flo=9, 9, 9, 9MHz Note (RF AGC Amplifier Block + Mixer Block + LO Amplifier; frf=80mhz, flo=0mhz, PLO=-0dBm,Zs=, ZL=00Ω//pF) Mixer Conversion Gain CGMAX db V AGC =.0V, SingleEnded-IN, IF Block Characteristics (IF Amplifier Block; fif =0MHz, ZIN(IF)=, ZOUT(IF)=0Ω) Differential-Output Note IF Amplifier Gain GV - - db V in(if) = -dbmv(-dbm), Notes. By measurement circuit. By measurement circuit. By measurement circuit. By measurement circuit Differential-IN/Output Note REJxxxxxxx-000 Rev..0 Page of

6 MEASUREMENT CIRCUIT Measurement circuit Power Down Mode Enable : 0~0.V &OPEN Disenable:.0~.V Power Down Measurement circuit (NF) NF Meter Power Down Noise Source VCC-RF PIN VCC-RF IN MIX-OUT RF-IN MIX-OUT RF-IN pf RFAGC AMP Ω SAW Filter MIXER 9 pf REG Power 0 MIXER EPCOS X889M AGC RFAGC AMP 9 REG Power 0 AGC SAW Filter EPCOS X889M IF-IN IF AMP Lo AMP VAGC: 0~.V IF-IN IF AMP Lo AMP pF IF-OUT LO-IN pF VCC IF-OUT://0pF Diff-OUT IF-OUT LO-IN VOUT 0Ω 0Ω Ω TOKO DB- BF (Double balanced type VCC OUT 0Ω 0Ω Ω TOKO DB- BF (Double balanced type VAGC: 0~.V REJxxxxxxx-000 Rev..0 Page of

7 Measurement circuit (LO-RF Leakage) Power Down VCC-RF RFIN(8pin): ΩTermination VOUT Spectrum Analyzer RF-IN MIX-OUT 8 8 SAW Filter EPCOS pf X889M REG Power MIXER RFAGC AMP Ω 9 0 AGC Measurement circuit (Mixer Gain, IF-AMP Gain) Spectrum Analyzer Power Down Mode Enable : 0~0.V &OPEN Disenable:.0~.V VOUT pf pf pf Power Down VCC-RF PIN RF-IN 8 8 MIX-OUT RFAGC AMP MIXER 9 0 REG Power AGC IF-IN IF AMP Lo AMP VAGC: 0~.V IF-IN IF AMP VAGC: 0~.V VCC OUT 0Ω 0pF IF-OUT 0Ω LO-IN Ω TOKO DB- BF (Double balanced type RF-Block : Zs=0ohm / RL=00Ω//pF Diff-OUT IF-Block : Zs=0ohm / RL=0Diff-OUT MIXER:RL=00Ω//pF Diff-OUT Lo AMP PIN LO- IN 0pF IF-OUT VCC VOUT 0Ω 0Ω TOKO DB- BF (Double balanced type REJxxxxxxx-000 Rev..0 Page of

8 ILLUSTRATION OF THE EVALUATON BOARD Remarks RF_IN. Back side: pattern. Solder plated on pattern. : Through hole Bill of Materials C C R R EPCOS X889M IF_OUT C L L C C C R L C C0 L C R R R IF_OUT TOKO DB- BF LO_IN No. Value Parts Maker Part Number Size SAW filter TDK-EPC (EPCOS) X889M Balun Transformer TOKO DB-BF (Double balanced type) R Ω resistor KOA RKB E series 00 R 0Ω resistor KOA RKB E series 00 R KΩ resistor KOA RKB E series 00 C0 0pF capacitor MURATA GRMCH series 00 C pf capacitor MURATA GRMCH series 00 C capacitor MURATA GRMCH series 00 capacitor MURATA GRMCH series 00 C capacitor MURATA GRMCH series 00 L Inductor MURATA LQW9ANR series 08 REJxxxxxxx-000 Rev..0 Page 8 of

9 PACKAGE DIMENSIONS 8 PIN PLASTIC QFN PACKAGE (Unit : mm) LASER Marked Index Top View Side View Bottom View LOT NO. SUB NO C Exposed thermal pad to be connected REJxxxxxxx-000 Rev..0 Page 9 of

10 MOUNTING PAD DIMENSIONS (Reference Only) 8 PIN PLASTIC QFN PACKAGE (Unit : mm) REJxxxxxxx-000 Rev..0 Page 0 of

11 RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Partial Heating Soldering Condition Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 0 C or higher Preheating time at 0 to 80 C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (terminal temperature) Soldering time Maximum chlorine content of rosin flux (% mass) :0 C or below :0 seconds or less : 0 seconds or less :0 ± 0 seconds : times :0.%(Wt.) or below :0 C or below : seconds or less :0.%(Wt.) or below Caution Do not use different soldering methods together (export for partial heating). Condition Symbol IR0 HS0 REJxxxxxxx-000 Rev..0 Page of