BIPOLAR ANALOG INTEGRATED CIRCUITS

Transcription

1 DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUITS 3 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS DESCRIPTION The µpc275tb and µpc27tb are silicon monolithic integrated circuits designed as buffer amplifier for mobile communications. These low current amplifiers operate on 3. V ( V MIN.). These ICs are manufactured using NEC s 2 GHz ft NESAT III silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, these IC have excellent performance, uniformity and reliability. FEATURES Supply voltage : Recommended VCC = 2.7 to 3.3 V Circuit operation VCC = to 3.3 V Upper limit operating frequency : µpc275tb; fu = 2.7 GHz TYP.@3 db bandwidth µpc27tb; fu = 1.5 GHz TYP.@3 db bandwidth High isolation : µpc275tb; ISL = 38 db TYP.@f = 5 MHz µpc27tb; ISL = 5 db TYP.@f = 5 MHz Power gain : µpc275tb; GP = 12 db TYP.@f = 5 MHz µpc27tb; GP = 19 db TYP.@f = 5 MHz Saturated output power : µpc275tb; PO(sat) = 1 dbm TYP.@f = 5 MHz µpc27tb; PO(sat) = dbm TYP.@f = 5 MHz High-density surface mounting : -pin super minimold package ( mm) APPLICATION 1.5 GHz to 2.5 GHz communication system (PHS, wireless LAN; etc.): µpc275tb 8 MHz to 9 MHz cellular telephone (CT2, GSM, etc.) : µpc27tb ORDERING INFORMATION Part Number Package Marking Supplying Form µpc275tb-e3 -pin super minimold C1Q µpc27tb-e3 C1R Embossed tape 8 mm wide 1, 2, 3 pins face the perforation side of the tape Qty 3 kpcs/reel Remark To order evaluation samples, please contact your local NEC sales office. Part number: Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P11511EJ3VDS (3rd edition) Date Published February 21 N CP(K) Printed in Japan The mark shows major revised points. 199, 21

2 PIN CONNECTIONS (Top View) (Bottom View) Pin No. Pin Name C1Q INPUT 2 GND 3 GND OUTPUT Marking is an example of µpc275tb 5 GND VCC PRODUCT LINE-UP (TA = +25 C,, ZS = ZL = 5 Ω) Part No. fu (GHz) PO(sat) (dbm) GP (db) NF (db) ICC (ma) Package Making µpc275t pin minimold C1Q µpc275tb -pin super minimold µpc27t pin minimold C1R µpc27tb -pin super minimold µpc277t pin minimold C1S µpc277tb -pin super minimold µpc278t.2 to pin minimold C1T µpc278tb -pin super minimold µpc279t pin minimold C1U µpc279tb -pin super minimold Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. Caution The package size distinguish between minimold and super minimold. SYSTEM APPLICATION EXAMPLE DIGITAL CELLULAR SYSTEM BLOCK DIAGRAM RX DEMOD. I O SW PSC+PLL PLL I TX PA φ : µ PC275TB, µ PC27TB applicable O 2 Data Sheet P11511EJ3VDS

3 PIN EXPLANATION Pin No. Pin Name Applied Voltage (V) Pin Voltage Function and Applications Internal Equivalent Circuit (V) Note 1 INPUT Signal input pin. A internal matching circuit, configured with resistors, enables 5 Ω connection over a wide band. this pin must be coupled to signal source with capacitor for DC cut GND Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. 1 OUTPUT Signal output pin. A internal matching circuit, configured with resistors, enables 5 Ω connection over a wide band. This pin must be coupled to next stage with capacitor for DC cut VCC 2.7 to 3.3 Power supply pin. This pin should be externally equipped with bypass capacity to minimize ground impedance. Note Pin voltage is measured at. Above: µpc275tb, Below: µpc27tb Data Sheet P11511EJ3VDS 3

4 ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Ratings Unit Supply Voltage VCC TA = +25 C. V Circuit Current ICC TA = +25 C 1 ma Power Dissipation PD Mounted on double sided copper clad mm epoxy glass PWB, TA = +85 C 27 mw Operating Ambient Temperature TA to +85 C Storage Temperature Tstg 55 to +15 C Input Power Pin TA = +25 C dbm RECOMMENDED OPERATING RANGE Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC V ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 C,, ZS = ZL = 5 Ω) Parameter Symbol Test Conditions µpc275tb µpc27tb MIN. TYP. MAX. MIN. TYP. MAX. Unit Circuit Current ICC No signal ma Power Gain GP f = 5 MHz db Noise Figure NF f = 5 MHz db Upper Limit Operating Frequency fu 3 db down below from gain at f =.1 GHz GHz Isolation ISL f = 5 MHz db Input Return Loss RLin f = 5 MHz db Output Return Loss RLout f = 5 MHz db Saturated Output Power PO(sat) f = 5 MHz, Pin = dbm dbm Data Sheet P11511EJ3VDS

5 STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25 C,, ZS = ZL = 5 Ω) Parameter Symbol Test Conditions µpc275tb µpc27tb Unit Circuit Current ICC, No signal.5.5 ma Power Gain GP, f = 1. GHz, f = 2. GHz, f =.5 GHz db Noise Figure NF, f = 1. GHz, f = 2. GHz, f =.5 GHz db Upper Limit Operating Frequency fu, 3 db down below from gain at f =.1 GHz 1.1 GHz Isolation ISL, f = 1. GHz, f = 2. GHz, f =.5 GHz db Input Return Loss RLin, f = 1. GHz, f = 2. GHz, f =.5 GHz db Output Return Loss RLout, f = 1. GHz, f = 2. GHz, f =.5 GHz db Saturated Output Power PO(sat), f = 1. GHz, Pin = dbm, f = 2. GHz, Pin = dbm, f =.5 GHz, Pin = dbm dbm 3rd Order Intermodulation Distortion IM3, Pout = 2 dbm, f1 = 5 MHz, f2 = 52 MHz, Pout = 2 dbm, f1 = 1 MHz, f2 = 1 2 MHz, Pout = 2 dbm, f1 = 5 MHz, f2 = 52 MHz dbc Data Sheet P11511EJ3VDS 5

6 TEST CIRCUIT VCC 1 pf C3 5 Ω IN C1 1 pf 1 C2 1 pf 5 Ω OUT 2, 3, 5 EXAMPLE OF APPLICATION CIRCUIT VCC 1 pf 1 pf C3 C 5 Ω IN C1 1 pf 1 C 1 pf C5 1 pf 1 C2 1 pf 5 Ω OUT R1 5 to 2 Ω 2, 3, 5 To stabilize operation, please connect R1, C5 2, 3, 5 The application circuits and their parameters are for references only and are not intended for use in actual design-ins. CAPACITORS FOR THE VCC, INPUT, AND OUTPUT PINS Capacitors of 1 pf are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for the input and output pins. The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias can be supplied against VCC fluctuation. The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitance are therefore selected as lower impedance against a 5 Ω load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. To obtain a flat gain from MHz upwards, 1 pf capacitors are used in the test circuit. In the case of under MHz operation, increase the value of coupling capacitor such as pf. Because the coupling capacitors are determined by equation, C = 1/(2πRfc). Data Sheet P11511EJ3VDS

7 ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD AMP-2 Top View C1Q IN C C OUT 5 Mounting direction (Marking is an example for µ PC275TB) C VCC COMPONENT LIST Value C 1 pf Notes mm double sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern. : Through holes For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATIONS OF -PIN MINI-MOLD, -PIN SUPER MINI-MOLD SILICON HIGH-FREQUENCY WIDEBAND AMPLIFIER MMIC (P1197E). Data Sheet P11511EJ3VDS 7

8 TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 C) µpc275tb CIRCUIT CURRENT vs. SUPPLY VOLTAGE No signal CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE No signal Circuit Current ICC (ma) 8 2 Circuit Current ICC (ma) Supply Voltage VCC (V) Operating Ambient Temperature TA ( C) Noise Figure NF (db) NOISE FIGURE, POWER GAIN vs. FREQUENCY 15 5 GP 9 8 NF Frequency f (GHz) Power Gain GP (db) Power Gain GP (db) POWER GAIN vs. FREQUENCY TA = C TA = +85 C TA = +25 C Frequency f (GHz) ISOLATION vs. FREQUENCY INPUT RETURN LOSS, OUTPUT RETURN LOSS vs. FREQUENCY RLout Isolation ISL (db) Input Return Loss RLin (db) Output Return Loss RLout (db) 2 3 RLin Frequency f (GHz) Frequency f (GHz) 8 Data Sheet P11511EJ3VDS

9 µpc275tb Output Power Pout (dbm) OUTPUT POWER vs. INPUT POWER + f = 5 MHz 2 3 Output Power Pout (dbm) OUTPUT POWER vs. INPUT POWER + f = 5 MHz TA = +85 C TA = +25 C 2 3 TA = C TA = C TA = +25 C TA = +85 C Input Power Pin (dbm) Input Power Pin (dbm) Output Power Pout (dbm) OUTPUT POWER vs. INPUT POWER + f = 1. GHz 2 3 Output Power Pout (dbm) OUTPUT POWER vs. INPUT POWER + f = 2. GHz Input Power Pin (dbm) Input Power Pin (dbm) Saturated Output Power PO(sat) (dbm) SATURATED OUTPUT POWER vs. FREQUENCY Pin = dbm Frequency f (GHz) 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE f1 = 5 MHz f2 = 52 MHz 5 3rd Order Intermodulation Distortion IM3 (dbc) Output Power of Each Tone PO(each) (dbm) Remark The graphs indicate nominal characteristics. Data Sheet P11511EJ3VDS 9

10 S-PARAMETERS (TA = +25 C, ) µpc275tb S11-FREQUENCY ANGLE OF REFLECTION COEFFICIENT IN DEGREES WAVELENGTHS TOWARD GENERATOR Zo +JX POSITIVE REACTANCE COMPONENT RESISTANCE COMPONENT R Zo G G G 1. G NEGATIVE REACTANCE COMPONENT. JX Zo S22-FREQUENCY ANGLE OF REFLECTION COEFFICIENT IN DEGREES WAVELENGTHS TOWARD GENERATOR Zo +JX POSITIVE REACTANCE COMPONENT RESISTANCE COMPONENT R Zo G G G.5 G NEGATIVE REACTANCE COMPONENT JX Zo Data Sheet P11511EJ3VDS

11 TYPICAL S-PARAMETER VALUES (TA = +25 C) µpc275tb, ICC = 8. ma FREQUENCY S11 S21 S12 S22 K MHz MAG. ANG. MAG. ANG. MAG. ANG. MAG. ANG Data Sheet P11511EJ3VDS 11

12 TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 C) µpc27tb Circuit Current ICC (ma) CIRCUIT CURRENT vs. SUPPLY VOLTAGE No signal 8 2 Circuit Current ICC (ma) CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 8 2 No signal Supply Voltage VCC (V) Operating Ambient Temprature TA ( C) NOISE FIGURE, POWER GAIN vs. FREQUENCY POWER GAIN vs. FREQUENCY Noise Figure NF (db) Power Gain GP (db) GP NF 8.1 to 3.3 V Power Gain GP (db) TA = C 2 19 TA = +25 C TA = +85 C Frequency f (GHz) Frequency f (GHz) + ISOLATION vs. FREQUENCY INPUT RETURN LOSS, OUTPUT RETURN LOSS vs. FREQUENCY + Isolation ISL (db) Input Return Loss RLin (db) Output Return Loss RLout (db) Frequency f (GHz) Frequency f (GHz) RLout RLin 12 Data Sheet P11511EJ3VDS

13 µpc27tb OUTPUT POWER vs. INPUT POWER OUTPUT POWER vs. INPUT POWER Output Power Pout (dbm) f = 5 MHz Output Power Pout (dbm) f = 1. GHz Input Power Pin (dbm) Input Power Pin (dbm) Output Power Pout (dbm) OUTPUT POWER vs. INPUT POWER + TA f = 5 MHz = +85 C 2 3 TA = C TA = +25 C TA = C TA = +25 C TA = +85 C Output Power Pout (dbm) OUTPUT POWER vs. INPUT POWER + f = 1. GHz TA = +85 C 2 3 TA = +25 C TA = C TA = +85 C TA = +25 C TA = C Input Power Pin (dbm) Input Power Pin (dbm) Saturated Output Power PO(sat) (dbm) SATURATED OUTPUT POWER vs. FREQUENCY VCC = 2.7 to 3.3 V Pin = dbm Pin = dbm Frequency f (GHz) 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE f1 = 5 MHz f2 = 52 MHz 5 3rd Order Intermodulation Distortion IM3 (dbc) Output Power of Each Tone PO(each) (dbm) Remark The graphs indicate nominal characteristics. Data Sheet P11511EJ3VDS 13

14 S-PARAMETERS (TA = +25 C, ) µpc27tb S11-FREQUENCY ANGLE OF REFLECTION COEFFICIENT IN DEGREES WAVELENGTHS TOWARD GENERATOR JX Zo POSITIVE REACTANCE COMPONENT G RESISTANCE COMPONENT R Zo G G 1.5 G NEGATIVE REACTANCE COMPONENT. JX Zo S22-FREQUENCY ANGLE OF REFLECTION COEFFICIENT IN DEGREES WAVELENGTHS TOWARD GENERATOR JX Zo POSITIVE REACTANCE COMPONENT RESISTANCE COMPONENT R Zo G G 1. G G NEGATIVE REACTANCE COMPONENT JX Zo Data Sheet P11511EJ3VDS

15 TYPICAL S-PARAMETER VALUES (TA = +25 C) µpc27tb, ICC = 7.7 ma FREQUENCY S11 S21 S12 S22 K MHz MAG. ANG. MAG. ANG. MAG. ANG. MAG. ANG Data Sheet P11511EJ3VDS 15

16 PACKAGE DIMENSIONS -PIN SUPER MINIMOLD (UNIT: mm) 2.1±.1 5±.1.9±.1.7 to ± MIN. 1 Data Sheet P11511EJ3VDS

17 NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to the VCC pin. () The DC cut capacitor must be attached to input pin and output pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow VPS Wave Soldering Partial Heating Package peak temperature: 235 C or below Time: 3 seconds or less (at 2 C) Count: 3, Exposure limit: None Note Package peak temperature: 215 C or below Time: seconds or less (at 2 C) Count: 3, Exposure limit: None Note Soldering bath temperature: 2 C or below Time: seconds or less Count: 1, Exposure limit: None Note Pin temperature: 3 C or below Time: 3 seconds or less (per side of device) Exposure limit: None Note IR35--3 VP15--3 WS--1 Note After opening the dry pack, keep it in a place below 25 C and 5% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C535E). Data Sheet P11511EJ3VDS 17

18 [MEMO] 18 Data Sheet P11511EJ3VDS

19 [MEMO] Data Sheet P11511EJ3VDS 19

20 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. The information in this document is current as of February, 21. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E.