Consumer Electronics: from chip to system

Transcription

1 Consumer Electronics: from chip to system Kees Revenberg Co-founder/MD June 6 th 2018 APC, University of Warwick, UK NMI Techworks

2 CONTENT Introduction Consumer Electronics Definition Trends and concequences Chip manufacturing & Test flow Manufacturing flow Chip specific test procedures and standards System manufacturing & Test flow Manufacturing flow System specific test procedures and standards Interaction between Chip and System functions Failure Analysis from system to chip Summary 2

3 INTRODUCTION MASER Engineering is an Independent Service Provider, founded in 1993 and privately held by Hans Kemper and Kees Revenberg 25 years experience in test and analysis of semiconductors, electronic components and electronic systems 2,900 m² office & laboratory at Capitool 56, Enschede, The Netherlands Staff 49 employees (42 FTE), half with PhD/MSc/BSc degree Quality system certification and Accreditation ISO-9001:2008 certification by Lloyds ISO-17025:2005 accreditation according to scope L388 Customer project communication (CMIDS) MIDS internal track and trace system Secure customer interface for project tracking Download function for large result files and images (cmids.maser.nl) 3

4 INTRODUCTION Failure Analysis Non Destructive Analysis Fault Localization Sample Preparation Imaging and Analysis First Silicon Circuit Edit Reliability Test ESD/LU Test Accelerated Life Test Climate and Corrosion Test Temperature Cycling and Shock Mechanical Vibration and Shock 4

5 Consumer Electronics Definition by Wikipedia Consumer electronics or home electronics are equipment intended for everyday use, typically in private homes. Consumer electronics include devices used for entertainment (flat screen TVs, DVD players, video games, remote control cars, etc.), communications (telephones, cell phones, -capable laptops, etc.) and home-office activities (e.g., desktop computers, printers, paper shredders, etc.) Trends and consequences Smart home, outdoor sports and personal medical devices Mobility becomes an electronic gadget with wheels or propeller Long list of topics at the 2019 Consumer Electronics Show in Las Vegas Consumer Electronics Market to hit $1,500bn by 2024: GMI, Inc. 5

6 Consumer Electronics Advertising, Entertainment & Content Gaming Marketing & Advertising Music Virtual Reality & Augmented Reality Automotive Self-Driving Cars Vehicle Technology Health & Wellness Accessibility Digital Health Fitness & Wearables Sleep Technology Sports esports Sports Technology Home & Family Home Entertainment Family & Lifestyle Smart Home Internet of Things (IoT) Smart Cities Product Design & Manufacturing 3D Printing Design, Sourcing & Packaging Sustainability Robotics & Machine Intelligence Artificial Intelligence Drones Robotics Topics CES Las Vegas

7 CE IC design and manufacturing IC design with DFT circuits included and partial simulation Embedded software and Test program development First silicon debug and prototype assembly IC release Qualification lot manufacturing IC qualification Production release IC endurance and monitoring Due to high quantities of CE applications, yield is important The device technology is at edge, both chip and package Application environment and expected life is getting more complex CE IC s are exposed to more stringent test procedures 7

8 Chip Manufacturing & Test flow Manufacturing flow Nowadays >400 steps Semi nodes >7nm Metal layers >10 Complex WL packaging Process monitoring Materials & Chemicals Automatic Inspection In-line Xsie and TEM Monitoring circuit test Wafer test Assembly Singulation and packaging WL packaging and stacking Final product test 8

9 Chip Qualification programs Chip specific test procedures and standards Automotive industry AEC- Q100 to AEC-Q200 Industry standardization organizations like JEDEC JEDEC-47 Application specific and Customer specific ESA-SCC or MIL-STD 883 ESDA + JEDEC 9

10 CE chip life test setup High end CE application processors high pin count + high power Dynamic Vector driver based on ATE program conversion Individual temperature control by socket heating/cooling Individual function monitoring including PS currents 10

11 CE system design and manufacturing System design with application mission study and FME(C)A Embedded software and Test program development First prototype assembly HALT design evaluation Qualification lot manufacturing system qualification Safety tests and legislation release (CE marking) Production release endurance and HASS monitoring Due to high quantities of CE applications, yield is important Application environment and expected life is getting more complex CE systems are exposed to more stringent test procedures 11

12 HALT: Product Margins definition Lower Destruct Limit Lower Operating Limit Product Specs Upper Operating Limit Upper Destruct Limit Operating Margin Destruct Margin Operating Margin Destruct Margin Stress NMI Techworks

13 HALT: Product Margin Aging Lower Destruct Limit Lower Operating Limit Product Specs Upper Operating Limit Upper Destruct Limit Stress NMI Techworks

14 HALT: process overview Temperature ( C) Vibration (Grms) Time (minutes) 0 Temperature Vibration NMI Techworks

15 HALT essential: Preparation meeting HALT can only be successful after proper preparation At what stage of design process HALT to be performed Preparation meeting with Design, Test and HALT engineer System description Sample size definition, based on cost and availability Functional and Parametric E-test definition Mechanical / Thermal construction assessment Mechanical fixture design directive Parts list scan for destruct limits Initial HALT limits estimation Spare parts and repair guideline Onsite and Standby crew definition during HALT sequence testing HALT planning and quotation NMI Techworks

16 HALT: systems under stress Multiple small units for redundant behavior study Larger systems in partly open position NMI Techworks

17 HALT DEFECT EXAMPLES Electrical detectable Visual detectable Hardware and Embedded Software NMI Techworks

18 Interaction between Chip & System Rapid growth in handheld / portable CE Systems Consumers do drop them or misuse them RMA procedures do not get all defects returned for review Interconnection issues due to dense assembly and lead-free solder EXAMPLE Board Level Reliability Test for Consumers that drop their Electronics 18

19 FAILURE ANALYSIS Failure Analysis flow in the electronics industry Non Destructive Analysis E-test OPTICAL 2D/3D XRAY SAM LIT - EOTPR Fault localization Sample preparation Microscopic Imaging Material Analysis EMMI OBIRCH Thermograph Laser NIR I/V Probing Volt contrast EBIC/EBAC Nano-probing Contact AFM other Laser decap Chemical decap Plasma decap Mechanical Xsie Planar polish Plasma etching FIB Slice+View TEM lamella other Stereo Optical HP Optical Interferometer W-SEM FEG-SEM FEG-sTEM Dual Beam Ion Beam other SEM/EDX stem/edx FTIR Chemical SIMS XPS/ETCA Scanning Auger µ XRF XRD other Report 19

20 CE IC & system test tool examples 20

21 SUMMARY Consumer Electronics is a major part of the electronics market Fast development cycles, high-end technology and large volume High yield is essential in both IC and system level production Preventive test method on IC level DFT and system level HALT More system aspects enter the System in Package IC world CE applications are still a strong growing potential Thank you for your attention! and keep consuming electronics Contact NL: kees.revenberg@maser.nl T: Contact UK: john.watkins@redcroftuk.com T: