Device Modeling for Analog and RF CMOS Circuit Design

Size: px
Start display at page:

Download "Device Modeling for Analog and RF CMOS Circuit Design"

Transcription

1 Device Modeling for Analog and RF CMOS Circuit Design Trond Ytterdal Norwegian University of Science and Technology Yuhua Cheng Skyworks Solutions Inc., USA Tor A. Fjeldly Norwegian University of Science and Technology

2

3 Device Modeling for Analog and RF CMOS Circuit Design

4

5 Device Modeling for Analog and RF CMOS Circuit Design Trond Ytterdal Norwegian University of Science and Technology Yuhua Cheng Skyworks Solutions Inc., USA Tor A. Fjeldly Norwegian University of Science and Technology

6 Copyright 2003 John Wiley & Sons Ltd, The Atrium, Southern Gate, Chichester, West Sussex PO19 8SQ, England Telephone (+44) (for orders and customer service enquiries): Visit our Home Page on or All Rights Reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted in any form or by any means, electronic, mechanical, photocopying, recording, scanning or otherwise, except under the terms of the Copyright, Designs and Patents Act 1988 or under the terms of a licence issued by the Copyright Licensing Agency Ltd, 90 Tottenham Court Road, London W1T 4LP, UK, without the permission in writing of the Publisher. Requests to the Publisher should be addressed to the Permissions Department, John Wiley & Sons Ltd, The Atrium, Southern Gate, Chichester, West Sussex PO19 8SQ, England, or ed to permreq@wiley.co.uk, or faxed to (+44) This publication is designed to provide accurate and authoritative information in regard to the subject matter covered. It is sold on the understanding that the Publisher is not engaged in rendering professional services. If professional advice or other expert assistance is required, the services of a competent professional should be sought. Other Wiley Editorial Offices John Wiley & Sons Inc., 111 River Street, Hoboken, NJ 07030, USA Jossey-Bass, 989 Market Street, San Francisco, CA , USA Wiley-VCH Verlag GmbH, Boschstr. 12, D Weinheim, Germany John Wiley & Sons Australia Ltd, 33 Park Road, Milton, Queensland 4064, Australia John Wiley & Sons (Asia) Pte Ltd, 2 Clementi Loop #02-01, Jin Xing Distripark, Singapore John Wiley & Sons Canada Ltd, 22 Worcester Road, Etobicoke, Ontario, Canada M9W 1L1 Wiley also publishes its books in a variety of electronic formats. Some content that appears in print may not be available in electronic books. British Library Cataloguing in Publication Data A catalogue record for this book is available from the British Library ISBN Typeset in 10/12pt Times by Laserwords Private Limited, Chennai, India Printed and bound in Great Britain by Antony Rowe Ltd, Chippenham, Wiltshire This book is printed on acid-free paper responsibly manufactured from sustainable forestry in which at least two trees are planted for each one used for paper production.

7 Contents Preface xi 1 MOSFET Device Physics and Operation Introduction The MOS Capacitor Interface Charge Threshold Voltage MOS Capacitance MOS Charge Control Model Basic MOSFET Operation Basic MOSFET Modeling Simple Charge Control Model The Meyer Model Velocity Saturation Model Capacitance Models Comparison of Basic MOSFET Models Basic Small-signal Model Advanced MOSFET Modeling Modeling Approach Nonideal Effects Unified MOSFET C V Model 37 References 44 2 MOSFET Fabrication Introduction Typical Planar Digital CMOS Process Flow RF CMOS Technology 60 References 67 3 RF Modeling Introduction Equivalent Circuit Representation of MOS Transistors High-frequency Behavior of MOS Transistors and AC Small-signal Modeling 78

8 vi CONTENTS Requirements for MOSFET Modeling for RF Applications Modeling of the Intrinsic Components HF Behavior and Modeling of the Extrinsic Components Non-quasi-static Behavior Model Parameter Extraction RF Measurement and De-embedding Techniques Parameter Extraction NQS Model for RF Applications 113 References Noise Modeling Noise Sources in a MOSFET Flicker Noise Modeling The Physical Mechanisms of Flicker Noise Flicker Noise Models Future Work in Flicker Noise Modeling Thermal Noise Modeling Existing Thermal Noise Models HF Noise Parameters Analytical Calculation of the Noise Parameters Simulation and Discussions Induced Gate Noise Issue 138 References Proper Modeling for Accurate Distortion Analysis Introduction Basic Terminology Nonlinearities in CMOS Devices and Their Modeling Calculation of Distortion in Analog CMOS Circuits 149 References The BSIM4 MOSFET Model An Introduction to BSIM Gate Dielectric Model Enhanced Models for Effective DC and AC Channel Length and Width Threshold Voltage Model Enhanced Model for Nonuniform Lateral Doping due to Pocket (Halo) Implant Improved Models for Short-channel Effects Model for Narrow Width Effects Complete Threshold Voltage Model in BSIM Channel Charge Model Mobility Model Source/Drain Resistance Model 169

9 CONTENTS vii 6.8 I V Model I V Model When rdsmod = 0(R DS (V ) 0) I V Model When rdsmod = 1(R DS (V ) = 0) Gate Tunneling Current Model Gate-to-substrate Tunneling Current I GB Gate-to-channel and Gate-to-S/D Currents Substrate Current Models Model for Substrate Current due to Impact Ionization of Channel Current Models for Gate-induced Drain Leakage (GIDL) and Gate-induced Source Leakage (GISL) Currents Capacitance Models Intrinsic Capacitance Models Fringing/Overlap Capacitance Models High-speed (Non-quasi-static) Model The Transient NQS Model The AC NQS Model RF Model Gate Electrode and Intrinsic-input Resistance (IIR) Model Substrate Resistance Network Noise Model Flicker Noise Models Channel Thermal Noise Model Other Noise Models Junction Diode Models Junction Diode I V Model Junction Diode Capacitance Model Layout-dependent Parasitics Model Effective Junction Perimeter and Area Source/drain Diffusion Resistance Calculation 204 References The EKV Model Introduction Model Features Long-channel Drain Current Model Modeling Second-order Effects of the Drain Current Velocity Saturation and Channel-length Modulation Mobility Degradation due to Vertical Electric Field Effects of Charge-sharing Reverse Short-channel Effect (RSCE) SPICE Example: The Effect of Charge-sharing Modeling of Charge Storage Effects Non-quasi-static Modeling 218

10 viii CONTENTS 7.8 The Noise Model Temperature Effects Version 3.0 of the EKV Model 220 References Other MOSFET Models Introduction MOS Model The Drain Current Model Temperature and Geometry Dependencies The Intrinsic Charge Storage Model The Noise Model The MOSA1 Model The Unified Charge Control Model Unified MOSFET I V Model Unified C V Model 241 References Bipolar Transistors in CMOS Technologies Introduction Device Structure Modeling the Parasitic BJT The Ideal Diode Equation Nonideal Effects 246 References Modeling of Passive Devices Introduction Resistors Well Resistors Metal Resistors Diffused Resistors Poly Resistors Capacitors Poly poly Capacitors Metal insulator metal Capacitors MOSFET Capacitors Junction Capacitors Inductors 260 References Effects and Modeling of Process Variation and Device Mismatch Introduction The Influence of Process Variation and Device Mismatch The Influence of LPVM on Resistors The Influence of LPVM on Capacitors The Influence of LPVM on MOS Transistors 269

11 CONTENTS ix 11.3 Modeling of Device Mismatch for Analog/RF Applications Modeling of Mismatching of Resistors Mismatching Model of Capacitors Mismatching Models of MOSFETs 273 References Quality Assurance of MOSFET Models Introduction Motivation Benchmark Circuits Leakage Currents Transfer Characteristics in Weak and Moderate Inversion Gate Leakage Current Automation of the Tests 285 References 286 Index 287

12

13 Preface We are fortunate to live in an age in which microelectronics still enjoy an accelerating growth in performance and complexity. Fortunate, since we are experiencing a remarkable progress in science, in communication technology, in our ability to acquire new knowledge, and in the many other wonderful amenities of modern society, all of which are permeated by and made possible by modern microelectronics. This exponential evolutionary trend, as described by Moore s Law, has now lasted for more than three decades, and is still on track, fueled by a seemingly unending demand for ever better performance and by fierce global competition. A driving force behind this fantastic progress is the long-term commitment to a steady downscaling of MOSFET/CMOS technology needed to meet the requirements on speed, complexity, circuit density, and power consumption posed by the many advanced applications relying on this technology. The degree of scaling is measured in terms of the half-pitch size of the first-level interconnect in DRAM technology, also termed the technology node by the International Technology Roadmap for Semiconductors. At the time of the 2001 ITRS update, the technology node had reached 130 nm, while the smallest features, the MOSFET gate lengths, were a mere 65 nm. Within a decade, these numbers are expected to be close to 40 nm and 15 nm, respectively. Very important issues in this development are the increasing levels of complexity of the fabrication process and the many subtle mechanisms that govern the properties of deep submicrometer FETs. These mechanisms, dictated by device physics, have to be described and implemented into circuit design tools to empower the circuit designers with the ability to fully utilize the potential of existing and future technologies. Hence, circuit designers are faced with the relentless challenge of staying updated on the properties, potentials, and the limitations of the latest device technology and device models. This is especially true for designers of analog and radio frequency (RF) integrated circuits, where the sensitivity to the modeling details and the interplay between individual devices is more acute than for digital electronics. A deeper insight into these issues is therefore crucial for gaining the competitive edge needed to ensure first-time-right silicon and to reduce time-to-market for new products. Existing textbooks on analog and RF CMOS circuit design traditionally lack a thorough treatment of the device modeling challenges outlined above. Our primary objectives with the present book is to bridge the gap between device modeling and analog circuit design by presenting the state-of-the-art MOSFET models that are available in analog and SPICEtype circuit simulators today, together with related modeling issues of importance to both circuit designers and students, now and in the future.

14 xii PREFACE This book is intended as a main or supplementary text for senior and graduate-level courses in analog integrated circuit design, as well as a reference and a text for self or group studies by practicing design engineers. Especially in student design projects, we foresee that this book will be a valuable handbook as well as a reference, both on basic modeling issues and on specific MOSFET models encountered in circuit simulators. Likewise, practicing engineers can use the book to enhance their insight into the principles of MOSFET operation and modeling, thereby improving their design skills. We assume that the reader already has a basic knowledge of common electronic devices and circuits, and fundamental concepts such as small-signal operation and equivalent circuits. The book is organized into twelve chapters. In Chapter 1, the reader is introduced to the basic physics, the principles of operation, and the modeling of MOS structures and MOSFETs. This chapter also discusses many of the issues that are important in the modeling of modern-day MOSFETs. Chapter 2 walks the reader through the fabrication steps of modern MOSFET and CMOS technology. In Chapter 3, the special concerns and the challenges of accurate modeling of MOSFETs operating at radio frequencies are discussed. Chapter 4 deals with modeling of noise in MOSFETs. Distortion analysis, discussed in Chapter 5, is of special concern for analog MOSFET circuit design. In Chapters 6, 7, and 8, we present the state-of-the-art MOSFET models that are commonly used by the analog design community today. The models covered are BSIM4, EKV, MOS Model 9 and MOSA1. These chapters are written in a reference style to provide quick lookup when the book is used like a handbook. Chapters 9 and 10 are devoted to the modeling of other devices that are of importance in typical analog CMOS circuits, such as bipolar transistors (Chapter 9) and passive devices, including resistors, capacitors, and inductors (Chapter 10). The remaining two chapters deal with essential industry-related issues of circuit design. Chapter 11 discusses the important topic of modeling of process variations and device mismatch effects and Chapter 12 deals with the quality assurance of the device models used by the design houses. The book is accompanied by two software application tools, AIM-Spice and MOSCalc. AIM-Spice is a version of SPICE with standard SPICE parameters, very familiar to many electrical engineers and electrical engineering students. Running under the Microsoft Windows family of operating systems, it takes full advantage of the available graphics user interface. The AIM-Spice software will run on all PCs equipped with Windows 95, 98, ME, NT 4, 2000, or XP. In addition to all the models included into Berkeley SPICE (Version 3e.1), AIM-Spice incorporates BSIM4, EKV, and MOSA1, which were covered in Chapters 6, 7, and 8. A limited version of AIM-Spice can be downloaded from The second tool, MOSCalc, is a Web-based calculator for rapid estimates of MOSFET large- and small-signal parameters. The designer enters the gate length and width, and a range of biasing voltages and/or the transistor currents, whereupon quantities such as gate overdrive voltage, effective threshold voltage, drain-source saturation voltage, all terminal currents, transconductance, channel conductance, and all small signal intrinsic capacitances are calculated. MOSCalc is available at ngl.fysel.ntnu.no. These dedicated software tools allow students to solve real engineering problems, which brings semiconductor device physics and modeling home to the user at a very practical level, bridging the gap between theory and practice. AIM-Spice and MOSCalc can be used routinely by practicing engineers during the design phase of analog integrated circuits.

15 PREFACE xiii We are grateful to the following colleagues for their suggestions and/or for reviewing portions of this book: Matthias Bucher and Bjørnar Hernes. We would also like to express our appreciation to the staff at Wiley, UK, and in particular to Kathryn Sharples, for making possible the timely production of the book. Finally, we would like to thank our families for their great support, patience, and understanding provided throughout the period of writing.

Ultra Wideband Signals and Systems in Communication Engineering M. Ghavami King s College London, UK L. B. Michael Japan R. Kohno Yokohama National University, Japan John Wiley & Sons, Ltd Ultra Wideband

More information

Device Modeling for Analog and RF CMOS Circuit Design

Device Modeling for Analog and RF CMOS Circuit Design Device Modeling for Analog and RF CMOS Circuit Design Device Modeling for Analog and RF CMOS Circuit Design Trond Ytterdal Norwegian University of Science and Technology Yuhua Cheng Skyworks Solutions

More information

Contents. Contents... v. Preface... xiii. Chapter 1 Introduction...1. Chapter 2 Significant Physical Effects In Modern MOSFETs...

Contents. Contents... v. Preface... xiii. Chapter 1 Introduction...1. Chapter 2 Significant Physical Effects In Modern MOSFETs... Contents Contents... v Preface... xiii Chapter 1 Introduction...1 1.1 Compact MOSFET Modeling for Circuit Simulation...1 1.2 The Trends of Compact MOSFET Modeling...5 1.2.1 Modeling new physical effects...5

More information

Wideband TDD. WCDMA for the Unpaired Spectrum. Prabhakar Chitrapu. InterDigital Communications Corporation, USA. With a Foreword by Alain Briancon

Wideband TDD. WCDMA for the Unpaired Spectrum. Prabhakar Chitrapu. InterDigital Communications Corporation, USA. With a Foreword by Alain Briancon Wideband TDD WCDMA for the Unpaired Spectrum Prabhakar Chitrapu InterDigital Communications Corporation, USA With a Foreword by Alain Briancon Wideband TDD Wideband TDD WCDMA for the Unpaired Spectrum

More information

Broadband Wireless Communications Business

Broadband Wireless Communications Business Broadband Wireless Communications Business Broadband Wireless Communications Business An Introduction to the Costs and Benefits of New Technologies Riaz Esmailzadeh IPMobile Inc., Japan Copyright 2006

More information

ESD. Circuits and Devices. Steven H. Voldman Vermont, USA

ESD. Circuits and Devices. Steven H. Voldman Vermont, USA ESD Circuits and Devices Steven H. Voldman Vermont, USA ESD ESD Circuits and Devices Steven H. Voldman Vermont, USA Copyright ß 2006 John Wiley & Sons Ltd, The Atrium, Southern Gate, Chichester, West

More information

Microwave Electronics

Microwave Electronics Microwave Electronics Microwave Electronics: Measurement and Materials Characterization 2004 John Wiley & Sons, Ltd ISBN: 0-470-84492-2 L. F. Chen, C. K. Ong, C. P. Neo, V. V. Varadan and V. K. Varadan

More information

ANALYSIS AND DESIGN OF ANALOG INTEGRATED CIRCUITS

ANALYSIS AND DESIGN OF ANALOG INTEGRATED CIRCUITS ANALYSIS AND DESIGN OF ANALOG INTEGRATED CIRCUITS Fourth Edition PAUL R. GRAY University of California, Berkeley PAUL J. HURST University of California, Davis STEPHEN H. LEWIS University of California,

More information

WCDMA -- Requirements and Practical Design

WCDMA -- Requirements and Practical Design WCDMA -- Requirements and Practical Design Edited by Rudolf Tanner and Jason Woodard UbiNetics Ltd, UK WCDMA -- Requirements and Practical Design WCDMA -- Requirements and Practical Design Edited by

More information

Pulse-Width Modulated DC-DC Power Converters Second Edition

Pulse-Width Modulated DC-DC Power Converters Second Edition Pulse-Width Modulated DC-DC Power Converters Second Edition Marian K. Kazimierczuk Pulse-Width Modulated DC DC Power Converters Pulse-Width Modulated DC DC Power Converters Second Edition MARIAN K. KAZIMIERCZUK

More information

FUNDAMENTALS OF MODERN VLSI DEVICES

FUNDAMENTALS OF MODERN VLSI DEVICES 19-13- FUNDAMENTALS OF MODERN VLSI DEVICES YUAN TAUR TAK H. MING CAMBRIDGE UNIVERSITY PRESS Physical Constants and Unit Conversions List of Symbols Preface page xi xiii xxi 1 INTRODUCTION I 1.1 Evolution

More information

Tradeoffs and Optimization in Analog CMOS Design

Tradeoffs and Optimization in Analog CMOS Design Tradeoffs and Optimization in Analog CMOS Design David M. Binkley University of North Carolina at Charlotte, USA A John Wiley & Sons, Ltd., Publication Contents Foreword Preface Acknowledgmerits List of

More information

PHYSICS OF SEMICONDUCTOR DEVICES

PHYSICS OF SEMICONDUCTOR DEVICES PHYSICS OF SEMICONDUCTOR DEVICES PHYSICS OF SEMICONDUCTOR DEVICES by J. P. Colinge Department of Electrical and Computer Engineering University of California, Davis C. A. Colinge Department of Electrical

More information

ANALYSIS AND DESIGN OF ANALOG INTEGRATED CIRCUITS

ANALYSIS AND DESIGN OF ANALOG INTEGRATED CIRCUITS ANALYSIS AND DESIGN OF ANALOG INTEGRATED CIRCUITS Fourth Edition PAUL R. GRAY University of California, Berkeley PAUL J. HURST University of California, Davis STEPHEN H. LEWIS University of California,

More information

RFID HANDBOOK THIRD EDITION

RFID HANDBOOK THIRD EDITION RFID HANDBOOK THIRD EDITION RFID HANDBOOK FUNDAMENTALS AND APPLICATIONS IN CONTACTLESS SMART CARDS, RADIO FREQUENCY IDENTIFICATION AND NEAR-FIELD COMMUNICATION, THIRD EDITION Klaus Finkenzeller Giesecke

More information

MOSFET MODELING & BSIM3 USER S GUIDE

MOSFET MODELING & BSIM3 USER S GUIDE MOSFET MODELING & BSIM3 USER S GUIDE MOSFET MODELING & BSIM3 USER S GUIDE by Yuhua Cheng Conexant Systems, Inc. and Chenming Hu University of California, Berkeley KLUWER ACADEMIC PUBLISHERS NEW YORK, BOSTON,

More information

Semiconductor Devices

Semiconductor Devices Semiconductor Devices Modelling and Technology Source Electrons Gate Holes Drain Insulator Nandita DasGupta Amitava DasGupta SEMICONDUCTOR DEVICES Modelling and Technology NANDITA DASGUPTA Professor Department

More information

1286 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 52, NO. 7, JULY MOSFET Modeling for RF IC Design

1286 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 52, NO. 7, JULY MOSFET Modeling for RF IC Design 1286 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 52, NO. 7, JULY 2005 MOSFET Modeling for RF IC Design Yuhua Cheng, Senior Member, IEEE, M. Jamal Deen, Fellow, IEEE, and Chih-Hung Chen, Member, IEEE Invited

More information

Conduction Characteristics of MOS Transistors (for fixed Vds)! Topic 2. Basic MOS theory & SPICE simulation. MOS Transistor

Conduction Characteristics of MOS Transistors (for fixed Vds)! Topic 2. Basic MOS theory & SPICE simulation. MOS Transistor Conduction Characteristics of MOS Transistors (for fixed Vds)! Topic 2 Basic MOS theory & SPICE simulation Peter Cheung Department of Electrical & Electronic Engineering Imperial College London (Weste&Harris,

More information

Topic 2. Basic MOS theory & SPICE simulation

Topic 2. Basic MOS theory & SPICE simulation Topic 2 Basic MOS theory & SPICE simulation Peter Cheung Department of Electrical & Electronic Engineering Imperial College London (Weste&Harris, Ch 2 & 5.1-5.3 Rabaey, Ch 3) URL: www.ee.ic.ac.uk/pcheung/

More information

Conduction Characteristics of MOS Transistors (for fixed Vds) Topic 2. Basic MOS theory & SPICE simulation. MOS Transistor

Conduction Characteristics of MOS Transistors (for fixed Vds) Topic 2. Basic MOS theory & SPICE simulation. MOS Transistor Conduction Characteristics of MOS Transistors (for fixed Vds) Topic 2 Basic MOS theory & SPICE simulation Peter Cheung Department of Electrical & Electronic Engineering Imperial College London (Weste&Harris,

More information

Statistical DNA Forensics Theory, Methods and Computation

Statistical DNA Forensics Theory, Methods and Computation Statistical DNA Forensics Theory, Methods and Computation Wing Kam Fung and Yue-Qing Hu Department of Statistics and Actuarial Science, The University of Hong Kong, Hong Kong Statistical DNA Forensics

More information

Theory and Applications of OFDM and CDMA Wideband Wireless Communications Henrik Schulze and Christian Lüders Both of Fachhochschule Südwestfalen Meschede, Germany Theory and Applications of OFDM and

More information

444 Index. F Fermi potential, 146 FGMOS transistor, 20 23, 57, 83, 84, 98, 205, 208, 213, 215, 216, 241, 242, 251, 280, 311, 318, 332, 354, 407

444 Index. F Fermi potential, 146 FGMOS transistor, 20 23, 57, 83, 84, 98, 205, 208, 213, 215, 216, 241, 242, 251, 280, 311, 318, 332, 354, 407 Index A Accuracy active resistor structures, 46, 323, 328, 329, 341, 344, 360 computational circuits, 171 differential amplifiers, 30, 31 exponential circuits, 285, 291, 292 multifunctional structures,

More information

PREDICTIVE CONTROL OF POWER CONVERTERS AND ELECTRICAL DRIVES

PREDICTIVE CONTROL OF POWER CONVERTERS AND ELECTRICAL DRIVES PREDICTIVE CONTROL OF POWER CONVERTERS AND ELECTRICAL DRIVES PREDICTIVE CONTROL OF POWER CONVERTERS AND ELECTRICAL DRIVES Jose Rodriguez and Patricio Cortes Universidad Tecnica Federico Santa Maria, Valparaiso,

More information

RF AND MICROWAVE ENGINEERING

RF AND MICROWAVE ENGINEERING RF AND MICROWAVE ENGINEERING RF AND MICROWAVE ENGINEERING FUNDAMENTALS OF WIRELESS COMMUNICATIONS Frank Gustrau Dortmund University of Applied Sciences and Arts, Germany A John Wiley & Sons, Ltd., Publication

More information

Transient Electronics

Transient Electronics Transient Electronics Pulsed Circuit Technology Paul W. Smith Fellow of Pembroke College, Oxford, UK Transient Electronics Transient Electronics Pulsed Circuit Technology Paul W. Smith Fellow of Pembroke

More information

Power Electronics Semiconductor Switches

Power Electronics Semiconductor Switches Power Electronics Semiconductor Switches Power Electronics Semiconductor Switches R.S. Ramshaw Department of Electrical and Computer Engineering University of Waterloo Ontario Canada SPRINGER-SCIENCE+BUSINESS

More information

Three Terminal Devices

Three Terminal Devices Three Terminal Devices - field effect transistor (FET) - bipolar junction transistor (BJT) - foundation on which modern electronics is built - active devices - devices described completely by considering

More information

CHAPTER 6 DIGITAL CIRCUIT DESIGN USING SINGLE ELECTRON TRANSISTOR LOGIC

CHAPTER 6 DIGITAL CIRCUIT DESIGN USING SINGLE ELECTRON TRANSISTOR LOGIC 94 CHAPTER 6 DIGITAL CIRCUIT DESIGN USING SINGLE ELECTRON TRANSISTOR LOGIC 6.1 INTRODUCTION The semiconductor digital circuits began with the Resistor Diode Logic (RDL) which was smaller in size, faster

More information

CONTENTS. 2.2 Schrodinger's Wave Equation 31. PART I Semiconductor Material Properties. 2.3 Applications of Schrodinger's Wave Equation 34

CONTENTS. 2.2 Schrodinger's Wave Equation 31. PART I Semiconductor Material Properties. 2.3 Applications of Schrodinger's Wave Equation 34 CONTENTS Preface x Prologue Semiconductors and the Integrated Circuit xvii PART I Semiconductor Material Properties CHAPTER 1 The Crystal Structure of Solids 1 1.0 Preview 1 1.1 Semiconductor Materials

More information

Fundamentals of Power Semiconductor Devices

Fundamentals of Power Semiconductor Devices В. Jayant Baliga Fundamentals of Power Semiconductor Devices 4y Spri ringer Contents Preface vii Chapter 1 Introduction 1 1.1 Ideal and Typical Power Switching Waveforms 3 1.2 Ideal and Typical Power Device

More information

Field-Effect Transistor (FET) is one of the two major transistors; FET derives its name from its working mechanism;

Field-Effect Transistor (FET) is one of the two major transistors; FET derives its name from its working mechanism; Chapter 3 Field-Effect Transistors (FETs) 3.1 Introduction Field-Effect Transistor (FET) is one of the two major transistors; FET derives its name from its working mechanism; The concept has been known

More information

Coding Theory. Algorithms, Architectures, and Applications. André Neubauer Münster University of Applied Sciences, Germany

Coding Theory. Algorithms, Architectures, and Applications. André Neubauer Münster University of Applied Sciences, Germany Coding Theory Coding Theory Algorithms, Architectures, and Applications André Neubauer Münster University of Applied Sciences, Germany Jürgen Freudenberger HTWG Konstanz, University of Applied Sciences,

More information

FIELD EFFECT TRANSISTOR (FET) 1. JUNCTION FIELD EFFECT TRANSISTOR (JFET)

FIELD EFFECT TRANSISTOR (FET) 1. JUNCTION FIELD EFFECT TRANSISTOR (JFET) FIELD EFFECT TRANSISTOR (FET) The field-effect transistor (FET) is a three-terminal device used for a variety of applications that match, to a large extent, those of the BJT transistor. Although there

More information

INTRODUCTION: Basic operating principle of a MOSFET:

INTRODUCTION: Basic operating principle of a MOSFET: INTRODUCTION: Along with the Junction Field Effect Transistor (JFET), there is another type of Field Effect Transistor available whose Gate input is electrically insulated from the main current carrying

More information

Design of Analog CMOS Integrated Circuits

Design of Analog CMOS Integrated Circuits Design of Analog CMOS Integrated Circuits Behzad Razavi Professor of Electrical Engineering University of California, Los Angeles H Boston Burr Ridge, IL Dubuque, IA Madison, WI New York San Francisco

More information

EE301 Electronics I , Fall

EE301 Electronics I , Fall EE301 Electronics I 2018-2019, Fall 1. Introduction to Microelectronics (1 Week/3 Hrs.) Introduction, Historical Background, Basic Consepts 2. Rewiev of Semiconductors (1 Week/3 Hrs.) Semiconductor materials

More information

a leap ahead in analog

a leap ahead in analog Analog modeling requirements for HV CMOS technology Ehrenfried Seebacher 2011-12-15 a leap ahead in analog Presentation Overview Design perspective on High Performance Analog HV CMOS Analog modeling requirements

More information

Gennady Gildenblat. Editor. Compact Modeling. Principles, Techniques and Applications. Springer

Gennady Gildenblat. Editor. Compact Modeling. Principles, Techniques and Applications. Springer Gennady Gildenblat Editor Compact Modeling Principles, Techniques and Applications Springer Contents Part I Compact Models of MOS Transistors 1 Surface-Potential-Based Compact Model of Bulk MOSFET 3 Gennady

More information

Photoalignment of Liquid Crystalline Materials

Photoalignment of Liquid Crystalline Materials Photoalignment of Liquid Crystalline Materials Wiley-SID Series in Display Technology Series Editor: Anthony C. Lowe Consultant Editor: Michael A. Kriss Display Systems: Design and Applications Lindsay

More information

UNIT-VI FIELD EFFECT TRANSISTOR. 1. Explain about the Field Effect Transistor and also mention types of FET s.

UNIT-VI FIELD EFFECT TRANSISTOR. 1. Explain about the Field Effect Transistor and also mention types of FET s. UNIT-I FIELD EFFECT TRANSISTOR 1. Explain about the Field Effect Transistor and also mention types of FET s. The Field Effect Transistor, or simply FET however, uses the voltage that is applied to their

More information

THE POWER OF JAPANESE CANDLESTICK CHARTS

THE POWER OF JAPANESE CANDLESTICK CHARTS THE POWER OF JAPANESE CANDLESTICK CHARTS Founded in 1807, John Wiley & Sons is the oldest independent publishing company in the United States. With offi ces in North America, Europe, Australia and Asia,

More information

40nm Node CMOS Platform UX8

40nm Node CMOS Platform UX8 FUKAI Toshinori, IKEDA Masahiro, TAKAHASHI Toshifumi, NATSUME Hidetaka Abstract The UX8 is the latest process from NEC Electronics. It uses the most advanced exposure technology to achieve twice the gate

More information

Semiconductor Device Physics and Simulation

Semiconductor Device Physics and Simulation Semiconductor Device Physics and Simulation MICRODEVICES Physics and Fabrication Technologies Series Editors: Ivor Brodie and Arden Sher SRI International Menlo Park, California Recent volumes in the series:

More information

Power MOSFET Zheng Yang (ERF 3017,

Power MOSFET Zheng Yang (ERF 3017, ECE442 Power Semiconductor Devices and Integrated Circuits Power MOSFET Zheng Yang (ERF 3017, email: yangzhen@uic.edu) Evolution of low-voltage (

More information

Lecture 13. Technology Trends and Modeling Pitfalls: Transistors in the real world

Lecture 13. Technology Trends and Modeling Pitfalls: Transistors in the real world Lecture 13 Technology Trends and Modeling Pitfalls: Transistors in the real world Guest lecturer: Jared Zerbe Rambus Inc jared@rambus.com Copyright 2003 by Mark Horowitz 1 Overview CMOS technology trends

More information

Lecture #29. Moore s Law

Lecture #29. Moore s Law Lecture #29 ANNOUNCEMENTS HW#15 will be for extra credit Quiz #6 (Thursday 5/8) will include MOSFET C-V No late Projects will be accepted after Thursday 5/8 The last Coffee Hour will be held this Thursday

More information

Jack Keil Wolf Lecture. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Lecture Outline. MOSFET N-Type, P-Type.

Jack Keil Wolf Lecture. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Lecture Outline. MOSFET N-Type, P-Type. ESE 570: Digital Integrated Circuits and VLSI Fundamentals Jack Keil Wolf Lecture Lec 3: January 24, 2019 MOS Fabrication pt. 2: Design Rules and Layout http://www.ese.upenn.edu/about-ese/events/wolf.php

More information

ANALOG INTEGRATED CIRCUITS FOR COMMUNICATION Principles, Simulation and Design

ANALOG INTEGRATED CIRCUITS FOR COMMUNICATION Principles, Simulation and Design ANALOG INTEGRATED CIRCUITS FOR COMMUNICATION Principles, Simulation and Design ANALOG INTEGRATED CIRCUITS FOR COMMUNICATION Principles, Simulation and Design by Donald 0. Pederson University of California

More information

ECE520 VLSI Design. Lecture 2: Basic MOS Physics. Payman Zarkesh-Ha

ECE520 VLSI Design. Lecture 2: Basic MOS Physics. Payman Zarkesh-Ha ECE520 VLSI Design Lecture 2: Basic MOS Physics Payman Zarkesh-Ha Office: ECE Bldg. 230B Office hours: Wednesday 2:00-3:00PM or by appointment E-mail: pzarkesh@unm.edu Slide: 1 Review of Last Lecture Semiconductor

More information

UOTFT: Universal Organic TFT Model for Circuit Design

UOTFT: Universal Organic TFT Model for Circuit Design UOTFT: Universal Organic TFT Model for Circuit Design S. Mijalković, D. Green, A. Nejim Silvaco Europe, St Ives, Cambridgeshire, UK A. Rankov, E. Smith, T. Kugler, C. Newsome, J. Halls Cambridge Display

More information

UNIT 3: FIELD EFFECT TRANSISTORS

UNIT 3: FIELD EFFECT TRANSISTORS FIELD EFFECT TRANSISTOR: UNIT 3: FIELD EFFECT TRANSISTORS The field effect transistor is a semiconductor device, which depends for its operation on the control of current by an electric field. There are

More information

ECEN474: (Analog) VLSI Circuit Design Fall 2011

ECEN474: (Analog) VLSI Circuit Design Fall 2011 ECEN474: (Analog) VLSI Circuit Design Fall 2011 Lecture 1: Introduction Sebastian Hoyos Analog & Mixed-Signal Center Texas A&M University Analog Circuit Sequence 326 2 Why is Analog Important? [Silva]

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 3: January 24, 2019 MOS Fabrication pt. 2: Design Rules and Layout Penn ESE 570 Spring 2019 Khanna Jack Keil Wolf Lecture http://www.ese.upenn.edu/about-ese/events/wolf.php

More information

CELLULAR TECHNOLOGIES FOR EMERGING MARKETS

CELLULAR TECHNOLOGIES FOR EMERGING MARKETS CELLULAR TECHNOLOGIES FOR EMERGING MARKETS 2G, 3G AND BEYOND Ajay R. Mishra Nokia Siemens Networks A John Wiley and Sons, Ltd., Publication CELLULAR TECHNOLOGIES FOR EMERGING MARKETS CELLULAR TECHNOLOGIES

More information

Lecture 6. Technology Trends and Modeling Pitfalls: Transistors in the real world

Lecture 6. Technology Trends and Modeling Pitfalls: Transistors in the real world Lecture 6 Technology Trends and Modeling Pitfalls: Transistors in the real world Guest lecturer: Jared Zerbe Rambus Inc jared@rambus.com Copyright 2004 by Mark Horowitz Some Figures courtesy of C. Enz,

More information

1 FUNDAMENTAL CONCEPTS What is Noise Coupling 1

1 FUNDAMENTAL CONCEPTS What is Noise Coupling 1 Contents 1 FUNDAMENTAL CONCEPTS 1 1.1 What is Noise Coupling 1 1.2 Resistance 3 1.2.1 Resistivity and Resistance 3 1.2.2 Wire Resistance 4 1.2.3 Sheet Resistance 5 1.2.4 Skin Effect 6 1.2.5 Resistance

More information

L MOSFETS, IDENTIFICATION, CURVES. PAGE 1. I. Review of JFET (DRAW symbol for n-channel type, with grounded source)

L MOSFETS, IDENTIFICATION, CURVES. PAGE 1. I. Review of JFET (DRAW symbol for n-channel type, with grounded source) L.107.4 MOSFETS, IDENTIFICATION, CURVES. PAGE 1 I. Review of JFET (DRAW symbol for n-channel type, with grounded source) 1. "normally on" device A. current from source to drain when V G = 0 no need to

More information

Microelectronic Circuits

Microelectronic Circuits SECOND EDITION ISHBWHBI \ ' -' Microelectronic Circuits Adel S. Sedra University of Toronto Kenneth С Smith University of Toronto HOLT, RINEHART AND WINSTON HOLT, RINEHART AND WINSTON, INC. New York Chicago

More information

AIRCRAFT CONTROL AND SIMULATION

AIRCRAFT CONTROL AND SIMULATION AIRCRAFT CONTROL AND SIMULATION AIRCRAFT CONTROL AND SIMULATION Third Edition Dynamics, Controls Design, and Autonomous Systems BRIAN L. STEVENS FRANK L. LEWIS ERIC N. JOHNSON Cover image: Space Shuttle

More information

KOM2751 Analog Electronics :: Dr. Muharrem Mercimek :: YTU - Control and Automation Dept. 1 6 FIELD-EFFECT TRANSISTORS

KOM2751 Analog Electronics :: Dr. Muharrem Mercimek :: YTU - Control and Automation Dept. 1 6 FIELD-EFFECT TRANSISTORS KOM2751 Analog Electronics :: Dr. Muharrem Mercimek :: YTU - Control and Automation Dept. 1 6 FIELD-EFFECT TRANSISTORS Most of the content is from the textbook: Electronic devices and circuit theory, Robert

More information

CMOS Test and Evaluation

CMOS Test and Evaluation CMOS Test and Evaluation Manjul Bhushan Mark B. Ketchen CMOS Test and Evaluation A Physical Perspective Manjul Bhushan OctEval Hopewell Junction, NY, USA Mark B. Ketchen OcteVue Hadley, MA, USA ISBN 978-1-4939-1348-0

More information

Introducing Technology Computer-Aided Design (TCAD)

Introducing Technology Computer-Aided Design (TCAD) Chinmay K. Maiti Introducing Technology Computer-Aided Design (TCAD) Fundamentals, Simulations, and Applications Introducing Technology Computer-Aided Design (TCAD) Introducing Technology Computer-Aided

More information

Active Technology for Communication Circuits

Active Technology for Communication Circuits EECS 242: Active Technology for Communication Circuits UC Berkeley EECS 242 Copyright Prof. Ali M Niknejad Outline Comparison of technology choices for communication circuits Si npn, Si NMOS, SiGe HBT,

More information

Drive performance of an asymmetric MOSFET structure: the peak device

Drive performance of an asymmetric MOSFET structure: the peak device MEJ 499 Microelectronics Journal Microelectronics Journal 30 (1999) 229 233 Drive performance of an asymmetric MOSFET structure: the peak device M. Stockinger a, *, A. Wild b, S. Selberherr c a Institute

More information

Chapter 4. CMOS Cascode Amplifiers. 4.1 Introduction. 4.2 CMOS Cascode Amplifiers

Chapter 4. CMOS Cascode Amplifiers. 4.1 Introduction. 4.2 CMOS Cascode Amplifiers Chapter 4 CMOS Cascode Amplifiers 4.1 Introduction A single stage CMOS amplifier cannot give desired dc voltage gain, output resistance and transconductance. The voltage gain can be made to attain higher

More information

Analog IC Design. Lecture 1,2: Introduction & MOS transistors. Henrik Sjöland. Dept. of Electrical and Information Technology

Analog IC Design. Lecture 1,2: Introduction & MOS transistors. Henrik Sjöland. Dept. of Electrical and Information Technology Analog IC Design Lecture 1,2: Introduction & MOS transistors Henrik.Sjoland@eit.lth.se Part 1: Introduction Analogue IC Design (7.5hp, lp2) CMOS Technology Analog building blocks in CMOS Single- and multiple

More information

6. Field-Effect Transistor

6. Field-Effect Transistor 6. Outline: Introduction to three types of FET: JFET MOSFET & CMOS MESFET Constructions, Characteristics & Transfer curves of: JFET & MOSFET Introduction The field-effect transistor (FET) is a threeterminal

More information

Electronic Devices and Circuits

Electronic Devices and Circuits Electronic Devices and Circuits I.J. Nagrath Electronic Devices and Circuits I.J. NAGRATH Adjunct Professor Former Deputy Director Birla Institute of Technology & Science Pilani New Delhi-110001 2012 ELECTRONIC

More information

NAME: Last First Signature

NAME: Last First Signature UNIVERSITY OF CALIFORNIA, BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences EE 130: IC Devices Spring 2003 FINAL EXAMINATION NAME: Last First Signature STUDENT

More information

ECEN474/704: (Analog) VLSI Circuit Design Fall 2016

ECEN474/704: (Analog) VLSI Circuit Design Fall 2016 ECEN474/704: (Analog) VLSI Circuit Design Fall 2016 Lecture 1: Introduction Sam Palermo Analog & Mixed-Signal Center Texas A&M University Announcements Turn in your 0.18um NDA form by Thursday Sep 1 No

More information

Semiconductor Devices

Semiconductor Devices Semiconductor Devices - 2014 Lecture Course Part of SS Module PY4P03 Dr. P. Stamenov School of Physics and CRANN, Trinity College, Dublin 2, Ireland Hilary Term, TCD 3 th of Feb 14 MOSFET Unmodified Channel

More information

Wiley-SID Series in Display Technology. Editor: Anthony C. Lowe The Lambent Consultancy, Braishfield, UK

Wiley-SID Series in Display Technology. Editor: Anthony C. Lowe The Lambent Consultancy, Braishfield, UK COLOUR ENGINEERING Achieving Device Independent Colour Edited by Phil Green Colour Imaging Group, London College of Printing, UK and Lindsay MacDonald Colour & Imaging Institute, University of Derby, UK

More information

In this lecture we will begin a new topic namely the Metal-Oxide-Semiconductor Field Effect Transistor.

In this lecture we will begin a new topic namely the Metal-Oxide-Semiconductor Field Effect Transistor. Solid State Devices Dr. S. Karmalkar Department of Electronics and Communication Engineering Indian Institute of Technology, Madras Lecture - 38 MOS Field Effect Transistor In this lecture we will begin

More information

Design and Performance Analysis of SOI and Conventional MOSFET based CMOS Inverter

Design and Performance Analysis of SOI and Conventional MOSFET based CMOS Inverter I J E E E C International Journal of Electrical, Electronics ISSN No. (Online): 2277-2626 and Computer Engineering 3(2): 138-143(2014) Design and Performance Analysis of SOI and Conventional MOSFET based

More information

EE 42/100 Lecture 23: CMOS Transistors and Logic Gates. Rev A 4/15/2012 (10:39 AM) Prof. Ali M. Niknejad

EE 42/100 Lecture 23: CMOS Transistors and Logic Gates. Rev A 4/15/2012 (10:39 AM) Prof. Ali M. Niknejad A. M. Niknejad University of California, Berkeley EE 100 / 42 Lecture 23 p. 1/16 EE 42/100 Lecture 23: CMOS Transistors and Logic Gates ELECTRONICS Rev A 4/15/2012 (10:39 AM) Prof. Ali M. Niknejad University

More information

UNIVERSITY OF CALIFORNIA AT BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences.

UNIVERSITY OF CALIFORNIA AT BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences. UNIVERSITY OF CALIFORNIA AT BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences Discussion #9 EE 05 Spring 2008 Prof. u MOSFETs The standard MOSFET structure is shown

More information

cost and reliability; power considerations were of secondary importance. In recent years. however, this has begun to change and increasingly power is

cost and reliability; power considerations were of secondary importance. In recent years. however, this has begun to change and increasingly power is CHAPTER-1 INTRODUCTION AND SCOPE OF WORK 1.0 MOTIVATION In the past, the major concern of the VLSI designer was area, performance, cost and reliability; power considerations were of secondary importance.

More information

! Review: MOS IV Curves and Switch Model. ! MOS Device Layout. ! Inverter Layout. ! Gate Layout and Stick Diagrams. ! Design Rules. !

! Review: MOS IV Curves and Switch Model. ! MOS Device Layout. ! Inverter Layout. ! Gate Layout and Stick Diagrams. ! Design Rules. ! ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 3: January 21, 2017 MOS Fabrication pt. 2: Design Rules and Layout Lecture Outline! Review: MOS IV Curves and Switch Model! MOS Device Layout!

More information

Design cycle for MEMS

Design cycle for MEMS Design cycle for MEMS Design cycle for ICs IC Process Selection nmos CMOS BiCMOS ECL for logic for I/O and driver circuit for critical high speed parts of the system The Real Estate of a Wafer MOS Transistor

More information

INTRODUCTION TO MOS TECHNOLOGY

INTRODUCTION TO MOS TECHNOLOGY INTRODUCTION TO MOS TECHNOLOGY 1. The MOS transistor The most basic element in the design of a large scale integrated circuit is the transistor. For the processes we will discuss, the type of transistor

More information

60 GHz TECHNOLOGY FOR GBPS WLAN AND WPAN

60 GHz TECHNOLOGY FOR GBPS WLAN AND WPAN 60 GHz TECHNOLOGY FOR GBPS WLAN AND WPAN FROM THEORY TO PRACTICE Su-Khiong (SK) Yong Marvell Semiconductor, USA Pengfei Xia Broadcom Corporation, USA Alberto Valdes-Garcia IBM, USA A John Wiley and Sons,

More information

Pramoda N V Department of Electronics and Communication Engineering, MCE Hassan Karnataka India

Pramoda N V Department of Electronics and Communication Engineering, MCE Hassan Karnataka India Advanced Low Power CMOS Design to Reduce Power Consumption in CMOS Circuit for VLSI Design Pramoda N V Department of Electronics and Communication Engineering, MCE Hassan Karnataka India Abstract: Low

More information

Higher School of Economics, Moscow, Russia. Zelenograd, Moscow, Russia

Higher School of Economics, Moscow, Russia. Zelenograd, Moscow, Russia Advanced Materials Research Online: 2013-07-31 ISSN: 1662-8985, Vols. 718-720, pp 750-755 doi:10.4028/www.scientific.net/amr.718-720.750 2013 Trans Tech Publications, Switzerland Hardware-Software Subsystem

More information

EE301 Electronics I , Fall

EE301 Electronics I , Fall EE301 Electronics I 2018-2019, Fall 1. Introduction to Microelectronics (1 Week/3 Hrs.) Introduction, Historical Background, Basic Consepts 2. Rewiev of Semiconductors (1 Week/3 Hrs.) Semiconductor materials

More information

Accuracy and Speed Performance of HiSIM Versions 231 and 240

Accuracy and Speed Performance of HiSIM Versions 231 and 240 Accuracy and Speed Performance of HiSIM Versions 231 and 240 H.J. Mattausch, M. Miura-Mattausch, N. Sadachika, M. Miyake Graduate School of Advanced Sciences of Matter, Hiroshima University T. Iizuka NEC

More information

2.8 - CMOS TECHNOLOGY

2.8 - CMOS TECHNOLOGY CMOS Technology (6/7/00) Page 1 2.8 - CMOS TECHNOLOGY INTRODUCTION Objective The objective of this presentation is: 1.) Illustrate the fabrication sequence for a typical MOS transistor 2.) Show the physical

More information

Chapter 1. Introduction

Chapter 1. Introduction EECS3611 Analog Integrated Circuit esign Chapter 1 Introduction EECS3611 Analog Integrated Circuit esign Instructor: Prof. Ebrahim Ghafar-Zadeh, Prof. Peter Lian email: egz@cse.yorku.ca peterlian@cse.yorku.ca

More information

MEASUREMENT AND INSTRUMENTATION STUDY NOTES UNIT-I

MEASUREMENT AND INSTRUMENTATION STUDY NOTES UNIT-I MEASUREMENT AND INSTRUMENTATION STUDY NOTES The MOSFET The MOSFET Metal Oxide FET UNIT-I As well as the Junction Field Effect Transistor (JFET), there is another type of Field Effect Transistor available

More information

Layout-based Modeling Methodology for Millimeter-Wave MOSFETs

Layout-based Modeling Methodology for Millimeter-Wave MOSFETs Layout-based Modeling Methodology for Millimeter-Wave MOSFETs Yan Wang Institute of Microelectronics, Tsinghua University, Beijing, P. R. China, 184 wangy46@tsinghua.edu.cn Outline of Presentation Motivation

More information

Backgammon. by Chris Bray. FOR DUMmIES. A John Wiley and Sons, Ltd, Publication

Backgammon. by Chris Bray. FOR DUMmIES. A John Wiley and Sons, Ltd, Publication Backgammon FOR DUMmIES by Chris Bray A John Wiley and Sons, Ltd, Publication Backgammon For Dummies Published by John Wiley & Sons, Ltd The Atrium Southern Gate Chichester West Sussex PO19 8SQ England

More information

CIRCUITS. Raj Nair Donald Bennett PRENTICE HALL

CIRCUITS. Raj Nair Donald Bennett PRENTICE HALL POWER INTEGRITY ANALYSIS AND MANAGEMENT I CIRCUITS Raj Nair Donald Bennett PRENTICE HALL Upper Saddle River, NJ Boston Indianapolis San Francisco New York Toronto Montreal London Munich Paris Madrid Capetown

More information

Practical Forensic Microscopy

Practical Forensic Microscopy Practical Forensic Microscopy A Laboratory Manual Barbara P. Wheeler and Lori J. Wilson Department of Chemistry, Eastern Kentucky University Richmond, KY, USA Practical Forensic Microscopy A Laboratory

More information

Analog and Telecommunication Electronics

Analog and Telecommunication Electronics Politecnico di Torino - ICT School Analog and Telecommunication Electronics F2 Active power devices»mos»bjt» IGBT, TRIAC» Safe Operating Area» Thermal analysis 30/05/2012-1 ATLCE - F2-2011 DDC Lesson F2:

More information

Integrated diodes. The forward voltage drop only slightly depends on the forward current. ELEKTRONIKOS ĮTAISAI

Integrated diodes. The forward voltage drop only slightly depends on the forward current. ELEKTRONIKOS ĮTAISAI 1 Integrated diodes pn junctions of transistor structures can be used as integrated diodes. The choice of the junction is limited by the considerations of switching speed and breakdown voltage. The forward

More information

improving further the mobility, and therefore the channel conductivity. The positive pattern definition proposed by Hirayama [6] was much improved in

improving further the mobility, and therefore the channel conductivity. The positive pattern definition proposed by Hirayama [6] was much improved in The two-dimensional systems embedded in modulation-doped heterostructures are a very interesting and actual research field. The FIB implantation technique can be successfully used to fabricate using these

More information

METHODOLOGY FOR THE DIGITAL CALIBRATION OF ANALOG CIRCUITS AND SYSTEMS

METHODOLOGY FOR THE DIGITAL CALIBRATION OF ANALOG CIRCUITS AND SYSTEMS METHODOLOGY FOR THE DIGITAL CALIBRATION OF ANALOG CIRCUITS AND SYSTEMS METHODOLOGY FOR THE DIGITAL CALIBRATION OF ANALOG CIRCUITS AND SYSTEMS with Case Studies by Marc Pastre Ecole Polytechnique Fédérale

More information

Basic Electronics. Introductory Lecture Course for. Technology and Instrumentation in Particle Physics Chicago, Illinois June 9-14, 2011

Basic Electronics. Introductory Lecture Course for. Technology and Instrumentation in Particle Physics Chicago, Illinois June 9-14, 2011 Basic Electronics Introductory Lecture Course for Technology and Instrumentation in Particle Physics 2011 Chicago, Illinois June 9-14, 2011 Presented By Gary Drake Argonne National Laboratory Session 3

More information

Lecture 16: MOS Transistor models: Linear models, SPICE models. Context. In the last lecture, we discussed the MOS transistor, and

Lecture 16: MOS Transistor models: Linear models, SPICE models. Context. In the last lecture, we discussed the MOS transistor, and Lecture 16: MOS Transistor models: Linear models, SPICE models Context In the last lecture, we discussed the MOS transistor, and added a correction due to the changing depletion region, called the body

More information