3D Printing for Electronics Manufacturing

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Brandon Simmons
6 years ago
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1 3D Printing for Electronics Manufacturing IEEE CPMT Webinar Mike O Reilly Aerosol Jet Product Manager

2 3D Printing for Electronics Adding Value to Conventional Manufacturing Scalable for production not just prototyping Complimentary to and integrated with existing manufacturing processes Adding material to existing components not just building parts from scratch Finding value where 3DP is Better + Cheaper + Faster than conventional process steps 2

3 3 Printed Electronics In Manufacturing

4 Evolving to Mainstream Production Source: John Rayeski 4

Jumpers Energy Storage Hermetic Seals 3D

5 Smart Device Core Components and PE Possibilities Shrinking package size and/or increased functionality 3D Main Antenna Edge Circuits GPS Antenna ITO Jumpers Energy Storage Hermetic Seals 3D Interconnects LED Packaging Multi-Layer PCB Tactile Feedback 5

6 3D Printed Antenna: Market Drivers SmartPhone Antenna Count has grown to 5-7+ Antenna per device BT-WLAN GPS Combo MIMO LTE* Antenna 7-band MIMO LTE* Antenna 9-band WLAN MMO NFC / FM Tx&Rx / Digital TV Combo BT-WLAN GPS Combo WLAN 2xMMO WLAN 3xMMO NFC / FM Tx&Rx / Digital TV Combo WLAN GPS Combo WPAN 60GHz Main 3-G Antenna 5-Band Main LTE Antenna 7-Band Main LTE Antenna 9-Band Counts will continue to grow with 5G concepts of up to 20+ Antenna. 6

7 Example Direct Write Printed Antennas T-Slot Dual Loop Near Field Conformal Main Antenna Phased Array RFID 7

- LDS Direct Write LDS Additive 2 Shot Hot Foil < 50 um 150 um 400 um 1000 um Direct Write Advantages Fewer

8 Competing 3D Antenna Mfg. Technologies Aerosol Jet - DW Process 2D Antenna 3D Antenna Digital Common Plastics No Plating Feature Size LPKF - LDS Direct Write LDS Additive 2 Shot Hot Foil < 50 um 150 um 400 um 1000 um Direct Write Advantages Fewer Steps, Less Floor Space, Simplified Logistics Standard Plastics, No Additives or Special Coatings No Plating, No Nickel, Environment Friendly Projected cost savings as much as 15% or more compared to LDS 8

9 3D Printed Antenna: Video of Production System Coordinated 5-axis capability, based on commercial CNC Machine Tool. Software Utilities to assist with multi axes toolpath generation. Typically 2+1 or 3+2 Axes mode, enabled by AJ s insensitivity to stand-off/angle. 9

Complex Device Packaging More functionality into smaller,

solder connections not possible Wire bond in 3D not

interconnects Die interconnect spacing - <60µm cross talk

10 Complex Device Packaging More functionality into smaller, complex packages IC s with sidewall interconnects Tradition solder connections not possible Wire bond in 3D not possible New interconnect method required Stacked Die interconnects Die interconnect spacing - <60µm cross talk Die thickness - <30µm - cracking New interconnect method required TSV? 10

with interconnect pitch of <60 µm Package heights of <4mm require no Z-axis

11 3D Interconnect Printing for Stacked Die ~ 30µm wide traces x ~7 µm tall Two print passes required to build up print height Staggered interconnect package with interconnect pitch of <60 µm Package heights of <4mm require no Z-axis (typical package height <1mm) Typically print speeds of 10-20mm/s 3D Interconnects 11

12 Direct Write s Fit within the 3DIC Value Chain Incumbent Process + 80,000 Wire Bonders + 20 um wires/ 35 um pitch + Fast/Accurate/Cost Effective - impedance/cross talk/micro crack on thin die/ Direct Write 3D Process + fine line/fine pitch + non-contact + shorter interconnects Emerging Process + 50 TSV Research Org + Sensors/MEMS/amps in prod. + Best for elec. performance - Time/Cost/Yield Bottom Line: Device manufacturers may need fast track path to market Device manufacturers may need flexible methods to introduce new technology DW can fill the gap between WB and TSV to meet high performance time to market requirements 12

Power Circuits on Wing Demonstrated at DMC Conference Advantages Lighter Weight, Higher Performance Conformal

13 Functionalized 3D Plastic Parts: Aerospace Joint Project with Aurora Flight Sciences & Stratasys Fully Printed Wing Structure & Electronics FDM Process Prints Wing using Aerospace Grade Material Process Prints Sensor, RF Antenna and Power Circuits on Wing Demonstrated at DMC Conference Advantages Lighter Weight, Higher Performance Conformal Electronics, More Payload Fully Functional RP & RM Simplified Electro-Mechanical Integration Point of Use Repair + Reconfiguration 13

were easily repaired Signal Circuit <30Ω Lit surface mounted

14 Printed Signal & Power Circuit Printed circuit in <30 minutes CTE miss-match cracked circuits during sintering process, but were easily repaired Signal Circuit <30Ω Lit surface mounted LED Power Circuit <1Ω Powered a motor at volts 14

15 3D Printed Electronic Drivers Form, Fit, Function(ality) 15

16 Reliability Standards Look-Ahead Systems Must remain clear during winter driving Clear polycarbonate Low temperature curing - <120⁰C Distribute enough thermal energy to defrost snow and ice 16

17 Functionalized 3D Plastic Parts: Defense EMI Shielding Printed onto a Dome 17

Provides Gage IP, readers & software IP includes unique serialization for each gage Enabled by Direct Write

18 Functionalized 3D Metal Parts: GTE Health Monitoring for High-Value Components High Temp (>1800 F) In-Situ Creep Sensors Detects fatigue and creep Direct Measurement Inc. Provides Gage IP, readers & software IP includes unique serialization for each gage Enabled by Direct Write Printing 3D Conformal Printing directly onto parts. Digital input enables Serialization Supports High Temp YSZ Ceramic Ink Working with multiple Gas Turbine Engine OEMs 18

19 PE Challenges

20 Meeting Manufacturing Requirements Material Supply Volume nanoparticle manufacturers Mechanical Properties Adhesion Corrosion General duration Electrical Meeting performance objectives On various substrates Environmental standards Meeting Hast/Bhast, High/Low Accelerated tests, Shock tests and other required manufacturing standards Process Development 2, 3, 5 Axis toolpath generation Matching material to substrates Safety Standards OSHA, IPC, EU standards just emerging 20

21 Material Availability Metal Inks Resistor Inks Non-Metallic Conductors An Cuig (Pt) Acheson (carbon) Brewer Science (SWCNTs) Applied Nanotech (Ag, Cu, Ni, and Al) Asahi (carbon) Heraeus (PEDOT:PSS) Clariant (Ag) DuPont (carbon and ruthenate) NanoIntegris (SWCNTs / MWCNTs) DuPont (Ag) Lord (carbon) SouthWest Nano (SWCNTs / MWCNTs) Henkel (AG) Methode Development (carbon) Semiconductors Intrinsiq (Cu) Dielectrics and Adhesives Aldrich (organic semiconductors) Novacentrix (Ag, Cu) Aldrich (polyimide) Alfa (organic semiconductors) Paru (Ag) BASF (PVP) Merck (organic semiconductors) Resin Designs (AgE) DuPont (Teon AF) NanoIntegris (SWCNTs) Sun Chemical (Ag) Henkel (adhesives) Reactive Chemistries UTDots (Ag, Au, Pt) Loctite (adhesives) Rohm & Hass (Enlight) Xerox (Ag) Norland (UV adhesives) Shipley (photo and etch resists) Partial Listing

22 3D Printing for Electronics 3D Printing Adding Value to Conventional Manufacturing Scalable for production not just prototyping Complimentary to and integrated with existing manufacturing processes Adding material to existing components not just building parts from scratch Finding value where 3DP is Better+Cheaper+Faster than conventional process steps 22

23 Thank You For More Information on Aerosol Jet Products Contact: Mike O Reilly moreilly@optomec.com Or Visit Our Web Site:

Fully Printed Conformal Antenna and Sensors on 3D Plastic, Ceramic, and Metallic Substrates. Mike O Reilly

Fully Printed Conformal Antenna and Sensors on 3D Plastic, Ceramic, and Metallic Substrates Mike O Reilly imaps NE 2016 Antenna and sensor printing via Aerosol Jet Optomec has developed high volume 3D