Open Innovation to Manage Risks in Technology The Business of Breakthroughs
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1 Open Innovation to Manage Risks in Technology The Business of Breakthroughs Janos Veres, Program Manager 2016 PARC, All rights reserved.
2 PARC Legacy: A Storied History of Inventing the Future Xerox PARC PC - Alto WYSIWYG GUI Multi-beam lasers Blue laser Biomedical systems Energy Content-centric networking Laser printing Ethernet Programming languages Ubiquitous computing Electronic reusable paper PARC, a Xerox Company Printed, flexible electronics PARC, All rights reserved.
3 Challenges of Open Innovation Not invented here Concern for control Not my market What if successful? 3
4 Focus Areas Printed Electronics Photonics Cleantech & Energy Digital Design & Manufacturing Contextual Intelligence Big Data Analytics Video & Image Analytics Content-Centric Networking Security & Privacy Innovation Services
5 PARC Business Model Internal R&D Public Sector Sponsors Ecosystem Partners Market-Facing Clients 5
6 PARC Innovation Model Multi-Disciplinary Research Human Context Understanding Holistic Business Models 6
7 Future electronics Any form factor, anywhere Flexible, conformal, 3D application specific smart labels, wearables, structural electronics New levels of complexity Seamlessly integrate micro and macro; logic, chips, batteries, sensors, MEMS, photonics Easy to fabricate, on-demand Accessible, low capital, local, additive, green
8 Creating opportunities Transportation Personalized health Interactive Entertain Educate Printed Electronics Structural monitoring Supply chain Smart packaging
9 PARC s explorations into the future Large Area Electronics x-ray; fingerprints, IR imaging, thin film sensors for bio-sensing Flexible Printed and Hybrid Electronics IOT, smart labels, wearables, digital electronics fabrication System Prototyping Structural Electronics New form factors, complex integration, sensors in structures, design and workflow Morphing Electronics Moving chiplets, Vanishing electronics, Self-configuring circuits
10 Vanishing Electronics Funded by DARPA 2016 Palo Alto Research Center Incorporated; all rights PARC reserved 10
11 Gas sensor networks Outline: PARC s open innovation model Technologies accelerate and merge The future of electronics & photonics Integration Unique examples 11
12 transmission reflection reflection Embedded Fiber-Optic Sensing for Battery Packs Fiber sensors in batteries white light Photonic readout Fiber Bragg grating sensor mirror gain medium Laser cavity se n 1 λ 1 λ 1 +Δλ λ 1 stimulus n 2 fluidic channel wavelength Su Red: UDDS cycles Blue: Static cycles Photonic crystal sensor λ 1 λ 1 +Δλ wavelength λ 1 white light Silicon micro-sphere sensor 12 stimulus white light wavelength
13 Printing with microchip inks
14 Summary Future electronics is ubiquitous Increasingly merging with photonics, MEMs and its environment Serves myriads of custom use cases Opportunity to add intelligence to new product domains Open Innovation is key to navigate the unknown Technology + Human context + Business models Embedded temperature sensor Structure heath monitoring sensor Solid, low strength light weight area Optical transceiver for Optical encoder Solid, high strength area Flexible area Embedded control/ communication IC Plastic structural material Jetted and cured on the fly Embedded Ultrasonic Motor for motion PARC 14 Pre-fabbed Metal wire bone structure Assembled and welded on the fly
15 Engage with us contact PARC website sign up for updates PARC 15
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