Acknowledgements. o Stephen Tobin. o Jason Malik. o Dr. Dragan Djurdjanovic. o Samsung Austin Semiconductor, Machine Learning

Transcription

1 Semicon West 2016

2 Acknowledgements o Stephen Tobin o Samsung Austin Semiconductor, Machine Learning o Jason Malik o Samsung Austin Semiconductor, Metrology o Dr. Dragan Djurdjanovic o University of Texas, Mechanical Engineering

3 Outline Introduction Undersensitivity: We need more data! Oversensitivity: Whoa, too much data! Incongruity: Wow, too many formats! IP Security: Hey, whom can I trust? Summary

4 Daily Fab Concerns Data sampling rate is not 100% Sometimes not even close! Sample set analyses are not real time Sometimes not even close! Primary Goal/Question: Right now, is my tool/process running such that there will be no adverse yield or throughput impact on the next wafer?

5 Yield-Up Complexity Short Ramp Time Typical Yield Improvement Dynamics Yield Random Systematic Errors Parametric Quarters (1990s) Months (Today) Need more actionable information in real time now

6 Metrology Complexity 3D Structure Planar to Vertical Transistor Architecture Gate Source Drain Planar MOSFET Vertical FinFET Need more 3D structural information now

7 Material Complexity IC Periodic Table Need more monitoring and control info now Today, nearly two thirds of the non-radioactive elements are used in every chip! 70s 80s- 90s

8 UP Defect Complexity Photomask Cleanliness Particulates Ultrapure Water needs >50nm Max defect size on mask ~7% of wafer CD Size spec needs to track with node shrinks 14nm: 1.0nm 10nm: 0.7nm (7Å) Mask Mask Wafer Wafer Need more and better inspection information now

9 Process Complexity: Double Patterning Spacer Type: Litho-Etch-Litho-Etch: Ref: Brian Wang Ref: Paul Zimmerman Previously took only one lithography step Need more inline SPC results information now

10 Immersion Technology 1.0 The IC Lithographer s Paradox g-line 436 Resolution = Minimum Feature Size i-line 365 k 1 NA k 2 (NA) 2 = Depth of Focus Numerical Aperture KrF 248 Sub-Wavelength! ArF 193 F Lord Rayleigh Sn Need a working lithography solution now V UV DUV 1 DUV 2 VUV EUV

11 EUV: Only 1-2 years away since 2005 o Pros o Cons o Resolution o Source Power Inadequate o Cheaper than Octuple Patterning o Resist Maturity (RLS) o Mask Defectivity (No Pellicle) Are we there yet?! o Tin Drop Generation Weak o Vacuum (High Maintenance) o High Cost of Consumables o Subwavelength at 10nm Source: Google Images Need to get off my soapbox now

12 Data Analysis in the Past: Isolated Focus Test Wafers Input Settings -Mach Constants -FDC Parameters Process Recipes Output Values -SPC Results -Log Files -Sensor Data Individual tools and processes only

13 Massive Amounts of Data Ignored Only small quantities of data could be collected, analyzed, and acted upon

14 Equipment Complexity: TMI (too much info) But more information Sensory Overload! was ignored (>100,000 than sensors) used!

15 Goal: 100% of Data Analyzed and Applied Use all data to produce actionable info for: o like tools/processes o prior and following tools/processes o facilities conditions

16 # Sensors Too Much For Humans To Digest! High Commercial Jet Life-Death Important Not Life-Death Important Semiconductor Process Med Bars of Soap Low log # Products Toward high end of Sensors AND Products!

17 Back To The Future! Year # Variable Interactions Sensors Per Wafer Analysis Method # People Needed to Review All Data Review All Data Test Hypotheses Model Based Problem Solving ,000 Model Based 250 Problem Solving Today 1-4 >1,000,000 Machine Learning 5000 Reduces the set of variables to the significant few

18 Compatibility & Security Issues o Legacy systems not designed to collaborate o Unequal security levels vs. o Some data are proprietary to each party: Vendor [chamber+frame] User [fab+enterprise] Customer o Attached directly to Mfg floor control systems o High risk to production schedule impact o Data are stored in different formats o Product throughput/output planning & analysis o Yield/Quality analysis and control o Financials We have lots of data, but much is not yet in a format that can be used as information.

19 Summary & Help Needed o Undersensitivity o More sensors/data on critical tools, processes, etc. o Oversensitivity o More data compute horsepower and memory o More efficient analysis techniques (move only select data) o Incongruity o More capability to combine & analyze unstructured data o IP Security o More clarification of what data are truly proprietary o More sharing of what data remains

20 Thank You!