CD54HC221, CD74HC221, CD74HCT221. High-Speed CMOS Logic Dual Monostable Multivibrator with Reset. Features. Description

Transcription

1 Data sheet acquired from Harris Semiconductor SCHS166F November Revised October 2003 CD54HC221, CD74HC221, CD74HCT221 High-Speed CMOS Logic Dual Monostable Multivibrator with Reset Features Description [ /Title (CD74 HC221, CD74 HCT22 1) /Subject (High Speed CMOS Logic Dual Monos table Multi- Overriding RESET Terminates Output Pulse Triggering from the Leading or Trailing Edge Q and Q Buffered Outputs Separate Resets Wide Range of Output-Pulse Widths Schmitt Trigger on B Inputs Fanout (Over Temperature Range) - Standard Outputs LSTTL Loads - Bus Driver Outputs LSTTL Loads Wide Operating Temperature Range o C to 125 o C Balanced Propagation Delay and Transition Times Significant Power Reduction Compared to LSTTL Logic ICs HC Types - 2V to 6V Operation - High Noise Immunity: N IL = 30%, N IH = 30% of V CC at V CC = 5V HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, V IL = 0.8V (Max), V IH = 2V (Min) - CMOS Input Compatibility, I l 1µA at V OL, V OH Pinout CD54HC221 (CERDIP) CD74HC221 (PDIP, SOIC, SOP, TSSOP) CD74HCT221 (PDIP, SOIC) TOP VIEW 1A 1B 1R 1Q 2Q 2C X 2C X R X GND V CC 15 1C X R X 14 1C X 13 1Q 12 2Q 11 2R 10 2B 9 2A The HC221 and CD74HCT221 are dual monostable multivibrators with reset. An external resistor (R X ) and an external capacitor (C X ) control the timing and the accuracy for the circuit. Adjustment of R X and C X provides a wide range of output pulse widths from the Q and Q terminals. Pulse triggering on the B input occurs at a particular voltage level and is not related to the rise and fall time of the trigger pulse. Once triggered, the outputs are independent of further trigger inputs on A and B. The output pulse can be terminated by a LOW level on the Reset (R) pin. Trailing Edge triggering (A) and leading-edge-triggering (B) inputs are provided for triggering from either edge of the input pulse. On power up, the IC is reset. If either Mono is not used each input (on the unused device) must be terminated either high or low. The minimum value of external resistance, R X, is typically 500Ω. The minimum value of external capacitance, C X, is 0pF. The calculation for the pulse width is t W = 0.7 R X C X at V CC = 4.5V. Ordering Information PART NUMBER TEMP. RANGE ( o C) PACKAGE CD54HC221F3A -55 to Ld CERDIP CD74HC221E -55 to Ld PDIP CD74HC221M -55 to Ld SOIC CD74HC221MT -55 to Ld SOIC CD74HC221M96-55 to Ld SOIC CD74HC221NSR -55 to Ld SOP CD74HC221PW -55 to Ld TSSOP CD74HC221PWR -55 to Ld TSSOP CD74HC221PWT -55 to Ld TSSOP CD74HCT221E -55 to Ld PDIP CD74HCT221M -55 to Ld SOIC CD74HCT221MT -55 to Ld SOIC CD74HCT221M96-55 to Ld SOIC NOTE: When ordering, use the entire part number. The suffixes 96 and R denote tape and reel. The suffix T denotes a small-quantity reel of 250. CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright 2003, Texas Instruments Incorporated 1

2 CD54HC221, CD74HC221, CD74HCT221 Functional Diagram 1C X 1R X V CC 1A 1B 1 2 1C X 1C X R X MONO Q 1Q 1R 3 2R 11 2A 9 5 2Q 2B 10 MONO Q 2C X 2C X R X 6 7 V CC 2C X 2R X TRUTH TABLE INPUTS OUTPUTS A B R Q Q H X H L H X L H L H L H H H X X L L H L H (Note 3) (Note 3) H = High Voltage Level, L = Low Voltage Level, X = Irrelevant, = Transition from Low to High Level, = Transition from High to Low Level, = One High Level Pulse, = One Low Level Pulse NOTE: 1. For this combination the reset input must be low and the following sequence must be used: pin 1 (or 9) must be set high or pin 2 (or 10) set low; then pin 1 (or 9) must be low and pin 2 (or 10) set high. Now the reset input goes from lowto-high and the device will be triggered. 2

3 CD54HC221, CD74HC221, CD74HCT221 Logic Diagram V CC C P 16 N R X A 1 (9) B 2 (10) R 3 (11) P RESET FF R D C V CC P OP AMP + - R2 15 (7) S R V CC Q C R X C X QM QM PP MIRROR VOLTAGE R3 C X MASK FF S Q R Q MAIN FF R1 R4 N V CC PULLDOWN FF D C Q N 14 (6) C X 8 GND 4 (12) (13) 5 C R Q Q Q + - OP AMP 3

4 CD54HC221, CD74HC221, CD74HCT221 Absolute Maximum Ratings DC Supply Voltage, V CC V to 7V DC Input Diode Current, I IK For V I < -0.5V or V I > V CC + 0.5V ±20mA DC Output Diode Current, I OK For V O < -0.5V or V O > V CC + 0.5V ±20mA DC Drain Current, per Output, I O For -0.5V < V O < V CC + 0.5V ±25mA DC Output Source or Sink Current per Output Pin, I O For V O > -0.5V or V O < V CC + 0.5V ±25mA DC V CC or Ground Current, I CC ±50mA Thermal Information Package Thermal Impedance, θ JA (see Note 2): E (PDIP) Package o C/W M (SOIC) Package o C/W NS (SOP) Package o C/W PW (TSSOP) Package o C/W Maximum Junction Temperature (Plastic Package) o C Maximum Storage Temperature Range o C to 150 o C Maximum Lead Temperature (Soldering 10s) o C (SOIC - Lead Tips Only) Operating Conditions Temperature Range, T A o C to 125 o C Supply Voltage Range, V CC HC Types V to 6V HCT Types V to 5.5V DC Input or Output Voltage, V I, V O V to V CC Input Rise and Fall Time, t r, t f on Inputs A and R 2V ns (Max) 4.5V ns (Max) 6V ns (Max) Input Rise and Fall Time, t r, t f on Input B 2V Unlimited ns (Max) 4.5V Unlimited ns (Max) 6V Unlimited ns (Max) CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 2. The package thermal impedance is calculated in accordance with JESD DC Electrical Specifications PARAMETER HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads Low Level Output Voltage TTL Loads SYMBOL TEST CONDITIONS V CC 25 o C -40 o C TO 85 o C -55 o C TO 125 o C V I (V) I O (ma) (V) MIN TYP MAX MIN MAX MIN MAX V IH V V V V IL V V V V OH V IH or V IL V V V UNITS V V V V OL V IH or V IL V V V V V V 4

5 CD54HC221, CD74HC221, CD74HCT221 DC Electrical Specifications (Continued) PARAMETER Input Leakage Current Quiescent Device Current HCT TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load SYMBOL I I I CC V CC or GND V CC or GND V IH to 5.5 V IL to ±0.1 - ±1 - ±1 µa µa V V V OH V IH or V IL V V V OL V IH or V IL V I I I CC I CC (Note 3) TEST CONDITIONS V CC 25 o C -40 o C TO 85 o C -55 o C TO 125 o C V I (V) I O (ma) (V) MIN TYP MAX MIN MAX MIN MAX V CC and GND V CC or GND V CC V ±0.1 - ±1 - ±1 µa µa to 5.5 NOTE: 3. For dual-supply systems theoretical worst case (V I = 2.4V, V CC = 5.5V) specification is 1.8mA. HCT Input Loading Table UNITS µa INPUT UNIT LOADS All Inputs 0.3 NOTE: Unit Load is I CC limit specified in DC Electrical Table, e.g., 360µA max at 25 o C. Prerequisite For Switching Function 25 o C -40 o C TO 85 o C -55 o C TO 125 o C PARAMETER SYMBOL V CC (V) MIN TYP MAX MIN MAX MIN MAX UNITS HC TYPES Input Pulse Width t WL ns A ns ns Input Pulse Width t WH ns B ns ns 5

6 CD54HC221, CD74HC221, CD74HCT221 Prerequisite For Switching Function (Continued) Input Pulse Width Reset Recovery Time R to A or B Output Pulse Width Q or Q C X = 0.1µF R X = 10kΩ Output Pulse Width Q or Q C X = 28pF, R X = 2kΩ t WL ns ns ns t SU ns ns ns t W µs t W ns C X = 1000pF, R X = 2kΩ t W µs C X = 1000pF, R X = 10kΩ t W µs HCT TYPES Input Pulse Width A t WL ns Input Pulse Width B Input Pulse Width Reset Recovery Time R to A or B PARAMETER SYMBOL V CC (V) Output Pulse Width Q or Q C X = 0.1µF R X = 10kΩ Output Pulse Width Q or Q C X = 28pF, R X = 2kΩ t WH ns t WL ns t SU ns t W µs t W ns C X = 1000pF, R X = 2kΩ t W µs C X = 1000pF, R X = 10kΩ t W µs Switching Specifications Input t r, t f = 6ns 25 o C -40 o C TO 85 o C -55 o C TO 125 o C MIN TYP MAX MIN MAX MIN MAX UNITS PARAMETER SYMBOL TEST CONDITIONS V CC (V) 25 o C -40 o C TO 85 o C -55 o C TO 125 o C MIN TYP MAX MIN MAX MIN MAX UNITS HC TYPES Propagation Delay, Trigger A, B, R to Q t PLH C L = 50pF ns C L = 50pF ns C L = 50pF ns C L = 15pF ns Propagation Delay, Trigger A, B, R to Q t PHL C L = 50pF ns C L = 50pF ns C L = 50pF ns C L = 15pF ns 6

7 CD54HC221, CD74HC221, CD74HCT221 Switching Specifications Input t r, t f = 6ns (Continued) PARAMETER SYMBOL TEST CONDITIONS V CC (V) 25 o C -40 o C TO 85 o C -55 o C TO 125 o C MIN TYP MAX MIN MAX MIN MAX UNITS Propagation Delay, R to Q t PLH C L = 50pF ns ns ns Propagation Delay, R to Q t PHL C L = 50pF ns ns ns Output Transition Time t TLH, t THL C L = 50pF ns ns ns Input Capacitance C IN pf Pulse Width Match Between Circuits in the Same Package C X = 1000pF, R X = 10kΩ to ± % Power Dissipation Capacitance (Notes 4, 5) HCT TYPES Propagation Delay, Trigger A, B, R to Q Propagation Delay, Trigger A, B, R to Q Propagation Delay, R to Q Propagation Delay, R to Q CPD pf t PLH C L = 50pF ns C L = 15pF ns t PHL C L = 50pF ns C L = 15pF ns t PLH C L = 50pF ns t PHL C L = 50pF ns Output Transition Time t TLH, t THL C L = 50pF ns ns ns Input Capacitance C IN pf Pulse Width Match Between Circuits in the Same Package C X = 1000pF, R X = 10kΩ to ± % Power Dissipation Capacitance (Notes 4, 5) CPD pf NOTES: 4. C PD is used to determine the dynamic power consumption, per multivibrator. 5. P D = (C PD + C L ) V 2 CC f i + Σ where f i = input frequency, f o = output frequency, C L = output load capacitance, V CC = supply voltage. 7

8 CD54HC221, CD74HC221, CD74HCT221 Test Circuits and Waveforms t r C L CLOCK t f C L I t WL + t WH = fcl V CC 90% 50% 50% 50% 10% 10% GND t r C L = 6ns CLOCK t f C L = 6ns I t WL + t WH = fcl 3V 2.7V 1.3V 1.3V 1.3V 0.3V 0.3V GND t WL t WH t WL t WH NOTE: Outputs should be switching from 10% V CC to 90% V CC in accordance with device truth table. For f MAX, input duty cycle = 50%. FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH NOTE: Outputs should be switching from 10% V CC to 90% V CC in accordance with device truth table. For f MAX, input duty cycle = 50%. FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH t r = 6ns t f = 6ns t r = 6ns t f = 6ns INPUT 90% 50% 10% V CC GND INPUT 2.7V 1.3V 0.3V 3V GND t THL t TLH t THL t TLH INVERTING OUTPUT t PHL t PLH 90% 50% 10% INVERTING OUTPUT t PHL t PLH 90% 1.3V 10% FIGURE 3. HC TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 8

9 CD54HC221, CD74HC221, CD74HCT221 Typical Performance Curves 685 R X = 10K R X = 10K V CC = 5V T A = 25 o C t W, PULSE WIDTH (µs) C X = 1µF K FACTOR HCT T A, AMBIENT TEMPERATURE ( o C) V CC, SUPPLY VOLTAGE (V) FIGURE 5. HC/HCT221 OUTPUT PULSE WIDTH vs TEMPERATURE FIGURE 6. HC/HCT221 K FACTOR vs SUPPLY VOLTAGE V CC = 2V V CC = 4.5V t W, PULSE WIDTH (µs) R X = 100K R X = 50K R X = 10K R X = 2K t W, PULSE WIDTH (µs) R X = 100K R X = 50K R X = 10K R X = 2K C X, TIMING CAPACITANCE (pf) C X, TIMING CAPACITANCE (pf) FIGURE 7. HC221 OUTPUT PULSE WIDTH vs C X FIGURE 8. HC/HCT221 OUTPUT PULSE WIDTH vs C X 9

10 CD54HC221, CD74HC221, CD74HCT221 10

11 PACKAGE OPTION ADDENDUM 9-May-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp ( C) Device Marking EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to EA CD54HC221F3A CD54HC221F ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 CD54HC221F (4/5) Samples CD54HC221F3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to EA CD54HC221F3A CD74HC221-W ACTIVE WAFERSALE YS 0 TBD Call TI Call TI CD74HC221E ACTIVE PDIP N Pb-Free (RoHS) CD74HC221EE4 ACTIVE PDIP N Pb-Free (RoHS) CD74HC221M ACTIVE SOIC D Green (RoHS CD74HC221M96 ACTIVE SOIC D Green (RoHS CD74HC221M96E4 ACTIVE SOIC D Green (RoHS CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC221E CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC221E CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC221M CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC221M CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC221M CD74HC221M96G4 ACTIVE SOIC D 16 TBD Call TI Call TI -55 to 125 HC221M CD74HC221ME4 ACTIVE SOIC D 16 TBD Call TI Call TI -55 to 125 HC221M CD74HC221MG4 ACTIVE SOIC D Green (RoHS CD74HC221MT ACTIVE SOIC D Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC221M CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC221M CD74HC221MTE4 ACTIVE SOIC D 16 TBD Call TI Call TI -55 to 125 HC221M CD74HC221MTG4 ACTIVE SOIC D 16 TBD Call TI Call TI -55 to 125 HC221M CD74HC221NSR ACTIVE SO NS Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC221M CD74HC221NSRE4 ACTIVE SO NS 16 TBD Call TI Call TI -55 to 125 HC221M CD74HC221NSRG4 ACTIVE SO NS 16 TBD Call TI Call TI -55 to 125 HC221M Addendum-Page 1

12 PACKAGE OPTION ADDENDUM 9-May-2014 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan CD74HC221PW ACTIVE TSSOP PW Green (RoHS (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp ( C) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HJ221 CD74HC221PWE4 ACTIVE TSSOP PW 16 TBD Call TI Call TI -55 to 125 HJ221 Device Marking (4/5) Samples CD74HC221PWG4 ACTIVE TSSOP PW Green (RoHS CD74HC221PWR ACTIVE TSSOP PW Green (RoHS CD74HC221PWRE4 ACTIVE TSSOP PW Green (RoHS CD74HC221PWRG4 ACTIVE TSSOP PW Green (RoHS CD74HC221PWT ACTIVE TSSOP PW Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HJ221 CU NIPDAU Level-1-260C-UNLIM -55 to 125 HJ221 CU NIPDAU Level-1-260C-UNLIM -55 to 125 HJ221 CU NIPDAU Level-1-260C-UNLIM -55 to 125 HJ221 CU NIPDAU Level-1-260C-UNLIM -55 to 125 HJ221 CD74HC221PWTE4 ACTIVE TSSOP PW 16 TBD Call TI Call TI -55 to 125 HJ221 CD74HC221PWTG4 ACTIVE TSSOP PW 16 TBD Call TI Call TI -55 to 125 HJ221 CD74HCT221E ACTIVE PDIP N Pb-Free (RoHS) CD74HCT221EE4 ACTIVE PDIP N Pb-Free (RoHS) CD74HCT221M ACTIVE SOIC D Green (RoHS CD74HCT221M96 ACTIVE SOIC D Green (RoHS CD74HCT221M96E4 ACTIVE SOIC D Green (RoHS CD74HCT221M96G4 ACTIVE SOIC D Green (RoHS CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT221E CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT221E CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT221M CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT221M CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT221M CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT221M CD74HCT221ME4 ACTIVE SOIC D 16 TBD Call TI Call TI -55 to 125 HCT221M CD74HCT221MG4 ACTIVE SOIC D Green (RoHS CD74HCT221MT ACTIVE SOIC D Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT221M CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT221M CD74HCT221MTE4 ACTIVE SOIC D 16 TBD Call TI Call TI -55 to 125 HCT221M Addendum-Page 2

13 PACKAGE OPTION ADDENDUM 9-May-2014 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp ( C) CD74HCT221MTG4 ACTIVE SOIC D 16 TBD Call TI Call TI -55 to 125 HCT221M Device Marking (4/5) Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS - please check for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS : TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF CD54HC221, CD74HC221 : Addendum-Page 3

14 PACKAGE OPTION ADDENDUM 9-May-2014 Catalog: CD74HC221 Military: CD54HC221 NOTE: Qualified Version Definitions: Catalog - TI's standard catalog product Military - QML certified for Military and Defense Applications Addendum-Page 4

15 PACKAGE MATERIALS INFORMATION 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant CD74HC221M96 SOIC D Q1 CD74HC221NSR SO NS Q1 CD74HC221PWR TSSOP PW Q1 CD74HC221PWT TSSOP PW Q1 CD74HCT221M96 SOIC D Q1 Pack Materials-Page 1

16 PACKAGE MATERIALS INFORMATION 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74HC221M96 SOIC D CD74HC221NSR SO NS CD74HC221PWR TSSOP PW CD74HC221PWT TSSOP PW CD74HCT221M96 SOIC D Pack Materials-Page 2

17

18

19

20

21

22

23

24 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as components ) are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS Products Applications Audio Automotive and Transportation Amplifiers amplifier.ti.com Communications and Telecom Data Converters dataconverter.ti.com Computers and Peripherals DLP Products Consumer Electronics DSP dsp.ti.com Energy and Lighting Clocks and Timers Industrial Interface interface.ti.com Medical Logic logic.ti.com Security Power Mgmt power.ti.com Space, Avionics and Defense Microcontrollers microcontroller.ti.com Video and Imaging RFID OMAP Applications Processors TI E2E Community e2e.ti.com Wireless Connectivity Mailing Address: Texas Instruments, Post Office Box , Dallas, Texas Copyright 2014, Texas Instruments Incorporated