CD54/74HC10, CD54/74HCT10

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1 Data sheet acquired from Harris Semiconductor SCHS128A August Revised May 2000 CD54/74HC10, CD54/74HCT10 High Speed CMOS Logic Triple 3-Input NAND Gate [ /Title (CD74 HC10, CD74 HCT10 ) /Subject High peed MOS ogic riple -Input AND ate) /Autho () /Keyords High peed MOS ogic riple -Input AND ate, igh peed MOS ogic riple -Input AND ate, arris emi- Features Buffered Inputs Typical Propagation Delay: 8ns at = 5V, C L = 15pF, T A = 25 o C Fanout (Over Temperature Range) - Standard Outputs LS - Bus Driver Outputs LS Wide Operating Temperature Range o C to 125 o C Balanced Propagation Delay and Transition Times Significant Power Reduction Compared to LSTTL Logic ICs HC Types - 2V to 6V Operation - High Noise Immunity: N IL = 30%, N IH = 30% of at = 5V HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, = 0.8V (Max), V IH = 2V (Min) - CMOS Input Compatibility, I l 1µA at V OL, V OH Pinout Description CD54HC10, CD54HCT10 (CERDIP) CD74HC10, CD74HCT10 (PDIP, SOIC) TOP VIEW 1A 1B 2A 2B 2C The HC10 and HCT10 logic gates utilize silicon gate CMOS technology to achieve operating speeds similar to LSTTL gates with the low power consumption of standard CMOS integrated circuits. All devices have the ability to drive 10 LSTTL loads. The HCT logic family is functionally pin compatible with the standard LS logic family. Ordering Information PART NUMBER TEMP. RANGE ( o C) PACKAGE CD54HC10F -55 to Ld CERDIP CD54HC10F3A -55 to Ld CERDIP CD74HC10E -55 to Ld PDIP CD74HC10M -55 to Ld SOIC CD74HC10M96-55 to Ld SOIC CD54HCT10F3A -55 to Ld CERDIP CD74HCT10E -55 to Ld PDIP CD74HCT10M -55 to Ld SOIC CD74HCT10M96-55 to Ld SOIC NOTES: 1. When ordering, use the entire part number. Add the suffix 96 to obtain the variant in the tape and reel. 2. Die for this part number is available which meets all electrical specifications. Please contact your local TI sales office or customer service for ordering information C 1Y 3C 3B 2Y 6 9 3A 7 8 3Y CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright 2000, Texas Instruments Incorporated 1

2 Functional Diagram 1A B C 2A Y 2B C 2C B 2Y 6 9 3A 7 8 3Y TRUTH TABLE INPUTS OUTPUT na nb nc ny L L L H L L H H L H L H L H H H H L L H H L H H H H L H H H H L NOTE: H = High Level, L = Low Level Logic Symbol na nb ny nc 2

3 Absolute Maximum Ratings DC Supply, V to 7V DC Input Diode, I IK For V I < -0.5V or V I > + 0.5V ±20mA DC Output Diode, I OK For V O < -0.5V or V O > + 0.5V ±20mA DC Output Source or Sink per Output Pin, I O For V O > -0.5V or V O < + 0.5V ±25mA DC or Ground, I CC or I ±50mA Thermal Information Thermal Resistance (Typical, Note 3) θ JA ( o C/W) PDIP Package SOIC Package Maximum Junction Temperature o C Maximum Storage Temperature Range o C to 150 o C Maximum Lead Temperature (Soldering 10s) o C (SOIC - Lead Tips Only) Operating Conditions Temperature Range (T A ) o C to 125 o C Supply Range, HC Types V to 6V HCT Types V to 5.5V DC Input or Output, V I, V O V to Input Rise and Fall Time 2V ns (Max) 4.5V ns (Max) 6V ns (Max) CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 3. θ JA is measured with the component mounted on an evaluation PC board in free air. DC Electrical Specifications HC TYPES V I (V) I O (ma) (V) MIN TYP MAX MIN MAX MIN MAX High Level Input V IH V V V Low Level Input V V V OH V OL V V IH or V V V V V V V IH or V V V V V V Input Leakage I I or ±0.1 - ±1 - ±1 µa 3

4 DC Electrical Specifications (Continued) Quiescent Device HCT TYPES High Level Input Low Level Input Input Leakage Quiescent Device Additional Quiescent Device Per Input Pin: 1 Unit Load (Note 4) I CC or V IH to to 5.5 V OH V OL I I I CC I CC V I (V) I O (ma) (V) MIN TYP MAX MIN MAX MIN MAX µa V V V IH or V V V IH or V and or V ±0.1 - ±1 - ±1 µa µa to 5.5 NOTE: 4. For dual-supply systems theoretical worst case (V I = 2.4V, = 5.5V) specification is 1.8mA µa HCT Input Loading Table INPUT UNIT LOADS All 0.6 NOTE: Unit Load is I CC limit specified in DC Electrical Specifications table, e.g. 360µA max at 25 o C. Switching Specifications Input t r, t f = 6ns HC TYPES Propagation Delay, Input to Output (Figure 1) Propagation Delay, Data Input to Output Y (V) MIN TYP MAX MIN MAX MIN MAX t PLH, t PHL C L = 50pF ns ns ns t PLH, t PHL C L = 15pF ns 4

5 Switching Specifications Input t r, t f = 6ns (Continued) Transition Times (Figure 1) t TLH, t THL C L = 50pF ns ns ns Input Capacitance C I pf Power Dissipation Capacitance (Notes 5, 6) C PD pf HCT TYPES Propagation Delay, Input to Output (Figure 2) Propagation Delay, Data Input to Output Y t PLH, t PHL C L = 50pF ns t PLH, t PHL C L = 15pF ns Transition Times (Figure 2) t TLH, t THL C L = 50pF ns Input Capacitance C I pf Power Dissipation Capacitance (Notes 5, 6) C PD pf NOTES: 5. C PD is used to determine the dynamic power consumption, per gate. 6. P D = V 2 CC f i (C PD + C L ) where f i = input frequency, C L = output load capacitance, = supply voltage. (V) MIN TYP MAX MIN MAX MIN MAX Test Circuits and Waveforms t r = 6ns t f = 6ns t r = 6ns t f = 6ns INPUT 90% 50% 10% INPUT 2.7V 1.3V 0.3V 3V t THL t TLH t THL t TLH INVERTING OUTPUT t PHL t PLH 90% 50% 10% INVERTING OUTPUT t PHL t PLH 90% 1.3V 10% FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGA- TION DELAY TIMES, COMBINATION LOGIC FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 5

6 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI s publication of information regarding any third party s products or services does not constitute TI s approval, warranty or endorsement thereof. Copyright 2000, Texas Instruments Incorporated

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