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1 Featuring Unitrode L9 and L9D Products Now From Texas Instruments Wide Supply-Voltage Range: 4.5 V to 6 V Separate Input-Logic Supply Internal ESD Protection Thermal Shutdown High-Noise-Immunity Inputs Functionally Similar to SGS L9 and SGS L9D Output Current A Per Channel (6 ma for L9D) Peak Output Current A Per Channel (. A for L9D) Output Clamp Diodes for Inductive Transient Suppression (L9D) description/ordering information The L9 and L9D are quadruple high-current half-h drivers. The L9 is designed to provide bidirectional drive currents of up to A at voltages from 4.5 V to 6 V. The L9D is designed to provide bidirectional drive currents of up to 6-mA at voltages from 4.5 V to 6 V. Both devices are designed to drive inductive loads such as relays, solenoids, dc and bipolar stepping motors, as well as other high-current/high-voltage loads in positive-supply applications. SLRS8C SEPTEMBER 986 REVISED NOVEMBER 4 All inputs are TTL compatible. Each output is a complete totem-pole drive circuit, with a Darlington transistor sink and a pseudo- Darlington source. Drivers are enabled in pairs, with drivers and enabled by,en and drivers and 4 enabled by,4en. When an enable input is high, the associated drivers are enabled, and their outputs are active and in phase with their inputs. When the enable input is low, those drivers are disabled, and their outputs are off and in the high-impedance state. With the proper data inputs, each pair of drivers forms a full-h (or bridge) reversible drive suitable for solenoid or motor applications. TA ORDERING INFORMATION PACKAGE,EN A Y HEAT SINK AND GROUND Y A V CC HEAT SINK AND GROUND L9...N OR NE PACKAGE L9D... NE PACKAGE (TOP VIEW) ORDERABLE PART NUMBER V CC 4A 4Y HEAT SINK AND GROUND TOP-SIDE MARKING HSOP (DWP) Tube of L9DWP L9DWP PDIP (N) Tube of 5 L9N L9N C to 7 C Tube of 5 L9NE L9NE PDIP (NE) Tube of 5 L9DNE L9DNE Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at Y A,4EN L9... DWP PACKAGE (TOP VIEW),EN A Y Y A V CC V CC 4A 4Y Y A,4EN HEAT SINK AND GROUND Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 4, Texas Instruments Incorporated POST OFFICE BOX 655 DALLAS, TEXAS 7565

2 SLRS8C SEPTEMBER 986 REVISED NOVEMBER 4 description/ordering information (continued) On the L9, external high-speed output clamp diodes should be used for inductive transient suppression. A V CC terminal, separate from V CC, is provided for the logic inputs to minimize device power dissipation. The L9and L9D are characterized for operation from C to 7 C. block diagram VCC M 4 M M VCC NOTE: Output diodes are internal in L9D. A FUTION TABLE (each driver) INPUTS OUTPUT EN Y H H H L H L X L Z H = high level, L = low level, X = irrelevant, Z = high impedance (off) In the thermal shutdown mode, the output is in the high-impedance state, regardless of the input levels. POST OFFICE BOX 655 DALLAS, TEXAS 7565

3 SLRS8C SEPTEMBER 986 REVISED NOVEMBER 4 logic diagram A,EN A A,4EN 4A ÁÁ Á Á Á Á ÁÁ 6 4 Y Y Y 4Y schematics of inputs and outputs (L9) EQUIVALENT OF EACH INPUT TYPICAL OF ALL OUTPUTS VCC VCC Current Source Input Output GND GND POST OFFICE BOX 655 DALLAS, TEXAS 7565

4 SLRS8C SEPTEMBER 986 REVISED NOVEMBER 4 schematics of inputs and outputs (L9D) EQUIVALENT OF EACH INPUT TYPICAL OF ALL OUTPUTS VCC VCC Current Source Input Output GND GND absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage, V CC (see Note ) V Output supply voltage, V CC V Input voltage, V I V Output voltage range, V O V to V CC + V Peak output current, I O (nonrepetitive, t 5 ms): L ± A Peak output current, I O (nonrepetitive, t µs): L9D ±. A Continuous output current, I O : L ± A Continuous output current, I O : L9D ±6 ma Package thermal impedance, θ JA (see Notes and ): DWP package TBD C/W N package C/W NE package TBD C/W Maximum junction temperature, T J C Storage temperature range, T stg C to 5 C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES:. All voltage values are with respect to the network ground terminal.. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) TA)/JA. Operating at the absolute maximum TJ of 5 C can affect reliability.. The package thermal impedance is calculated in accordance with JESD POST OFFICE BOX 655 DALLAS, TEXAS 7565

5 SLRS8C SEPTEMBER 986 REVISED NOVEMBER 4 recommended operating conditions VIH Supply voltage High-level input voltage MIN MAX UNIT VCC VCC VCC 6 V VCC 7 V. VCC V VCC 7 V. 7 V VIL Low-level output voltage..5 V TA Operating free-air temperature 7 C The algebraic convention, in which the least positive (most negative) designated minimum, is used in this data sheet for logic voltage levels. electrical characteristics, V CC = 5 V, V CC = 4 V, T A = 5 C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOH High-level output voltage L9: IOH = A L9D: IOH =.6 A VCC.8 VCC.4 V VOL Low-level output voltage L9: IOL = A L9D: IOL =.6 A..8 V VOKH High-level output clamp voltage L9D: IOK =.6 A VCC +. V VOKL Low-level output clamp voltage L9D: IOK =.6 A. V IIH High-level input current A EN VI = 7 V.. µaa IIL Low-level input current A EN VI = µaa All outputs at high level ICC Logic supply current IO = All outputs at low level 5 6 ma All outputs at high impedance 8 4 All outputs at high level 4 4 ICC Output supply current IO = All outputs at low level 6 ma All outputs at high impedance 4 switching characteristics, V CC = 5 V, V CC = 4 V, T A = 5 C PARAMETER TEST CONDITIONS L9NE, L9DNE MIN TYP MAX UNIT tplh Propagation delay time, low-to-high-level output from A input 8 ns tphl Propagation delay time, high-to-low-level output from A input 4 ns CL = pf, See Figure ttlh Transition time, low-to-high-level output ns tthl Transition time, high-to-low-level output ns switching characteristics, V CC = 5 V, V CC = 4 V, T A = 5 C PARAMETER TEST CONDITIONS L9DWP, L9N L9DN MIN TYP MAX tplh Propagation delay time, low-to-high-level output from A input 75 ns tphl Propagation delay time, high-to-low-level output from A input ns CL = pf, See Figure ttlh Transition time, low-to-high-level output ns tthl Transition time, high-to-low-level output 5 ns UNIT POST OFFICE BOX 655 DALLAS, TEXAS

6 SLRS8C SEPTEMBER 986 REVISED NOVEMBER 4 PARAMETER MEASUREMENT INFORMATION tf tr 9% 9% V Input 5 V 4 V Input 5% 5% Pulse Generator (see Note B) V VCC VCC A Y EN Output CL = pf (see Note A) Output tphl % % tw tplh 9% 9% VOH 5% 5% % % VOL tthl ttlh TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: tr ns, tf ns, tw = µs, PRR = 5 khz, ZO = 5 Ω. Figure. Test Circuit and Voltage Waveforms 6 POST OFFICE BOX 655 DALLAS, TEXAS 7565

7 APPLICATION INFORMATION SLRS8C SEPTEMBER 986 REVISED NOVEMBER 4 5 V 4 V kω VCC 6 8 VCC,EN Control A A Y Motor A 7 Y 6,4EN 9 Control B A Y 4A 5 4Y 4 Thermal Shutdown 4, 5,, GND Figure. Two-Phase Motor Driver (L9) POST OFFICE BOX 655 DALLAS, TEXAS

8 SLRS8C SEPTEMBER 986 REVISED NOVEMBER 4 APPLICATION INFORMATION 5 V 4 V kω VCC VCC 6 8,EN Control A A Y Motor A 7 Y 6,4EN 9 Control B A Y 4A 5 4Y 4 Thermal Shutdown 4, 5,, GND Figure. Two-Phase Motor Driver (L9D) 8 POST OFFICE BOX 655 DALLAS, TEXAS 7565

9 SLRS8C SEPTEMBER 986 REVISED NOVEMBER 4 APPLICATION INFORMATION VCC SES5 M SES5 M 8 A 4A 5 4 / L9 6 9 VCC EN EN A M 4A M H H Fast motor stop H Run H L Run L Fast motor stop L X Free-running motor stop L = low, H = high, X = don t care X Free-running motor stop GND 4, 5,, Figure 4. DC Motor Controls (connections to ground and to supply voltage) VCC SES5 M SES5 A A VCC / L9 4, 5,, EN GND Figure 5. Bidirectional DC Motor Control EN A A FUTION H L H Turn right H H L Turn left H L L Fast motor stop H H H Fast motor stop L X X Fast motor stop L = low, H = high, X = don t care POST OFFICE BOX 655 DALLAS, TEXAS

10 SLRS8C SEPTEMBER 986 REVISED NOVEMBER 4 IL/IL = ma APPLICATION INFORMATION C. µf L9 6 5 VCC D5 D + + D8 D4 4 4 VCC L IL 5 L IL 6 D6 D D7 D D D8 = SES5 Figure 6. Bipolar Stepping-Motor Control mounting instructions The Rthj-amp of the L9 can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board or to an external heat sink. Figure 9 shows the maximum package power P TOT and the θ JA as a function of the side of two equal square copper areas having a thickness of 5 µm (see Figure 7). In addition, an external heat sink can be used (see Figure 8). During soldering, the pin temperature must not exceed 6 C, and the soldering time must not exceed seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. POST OFFICE BOX 655 DALLAS, TEXAS 7565

11 APPLICATION INFORMATION SLRS8C SEPTEMBER 986 REVISED NOVEMBER 4 Copper Area 5-µm Thickness Printed Circuit Board Figure 7. Example of Printed Circuit Board Copper Area (used as heat sink) 7. mm.9 mm 8. mm Figure 8. External Heat Sink Mounting Example (θ JA = 5 C/W) POST OFFICE BOX 655 DALLAS, TEXAS 7565

12 SLRS8C SEPTEMBER 986 REVISED NOVEMBER 4 APPLICATION INFORMATION 4 MAXIMUM POWER AND JUTION vs THERMAL RESISTAE 8 5 MAXIMUM POWER DISSIPATION vs AMBIENT TEMPERATURE TOT Power Dissipation W P θja PTOT (TA = 7 C) θja Thermal Resistance C/W P TOT Power Dissipation W With Infinite Heat Sink 4 Heat Sink With θja = 5 C/W Free Air Side mm TA Ambient Temperature C Figure 9 Figure POST OFFICE BOX 655 DALLAS, TEXAS 7565

13 PACKAGE OPTION ADDENDUM -Sep-5 PACKAGING INFORMATION Orderable Device Status () Package Type Package Drawing Pins Package Qty Eco Plan () Lead/Ball Finish MSL Peak Temp () L9DDWP OBSOLETE SOIC DW 8 TBD Call TI Call TI L9DDWPTR OBSOLETE SOIC DW 8 TBD Call TI Call TI L9DN OBSOLETE PDIP N 6 TBD Call TI Call TI L9DNE ACTIVE PDIP NE 6 5 Pb-Free (RoHS) L9DNEE4 ACTIVE PDIP NE 6 5 Pb-Free (RoHS) CU NIPDAU CU NIPDAU L9DSP OBSOLETE 6 TBD Call TI Call TI L9DSP88B OBSOLETE 6 TBD Call TI Call TI L9DSP88C OBSOLETE UTR TBD Call TI Call TI L9DWP ACTIVE SO Power PAD L9DWPG4 ACTIVE SO Power PAD L9DWPTR OBSOLETE SO Power PAD DWP 8 Green (RoHS & no Sb/Br) CU NIPDAU DWP 8 TBD Call TI Call TI DWP 8 TBD Call TI Call TI L9N ACTIVE PDIP N 6 5 Green (RoHS & no Sb/Br) L9NE ACTIVE PDIP NE 6 5 Pb-Free (RoHS) L9NEE4 ACTIVE PDIP NE 6 5 Pb-Free (RoHS) Call TI CU NIPDAU CU NIPDAU Level--- Level--- Level--6C- YEAR Level--- Level--- Level--- () The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. () Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed.% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed.% by weight in homogeneous material) () MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page

14 PACKAGE OPTION ADDENDUM -Sep-5 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page

16 MECHANICAL DATA MPDI OCTOBER 994 NE (R-PDIP-T**) PIN SHOWN PLASTIC DUAL-IN-LINE PACKAGE.7 (,78) MAX DIM PINS ** 6 C A MIN MAX.78 (9,8).94 (,).975 (4,77) A. (,5) MIN B C MIN MAX MIN MAX.4 (6,).6 (6,6).9 (,6). (5,4).6 (6,6).8 (7,). (5,8) MAX Seating Plane.55 (,94).5 (,7). (,54). (,5).5 (,8). (,5) M B. (,5) MIN. (7,87).9 (7,7). (5,8) MAX Seating Plane.55 (,94).5 (,7). (,54). (,5). (,5) M 5.5 (,8). (,5) NOM 4454/ B 4/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS- (6 pin only) POST OFFICE BOX 655 DALLAS, TEXAS 7565

19 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio Data Converters dataconverter.ti.com Automotive DSP dsp.ti.com Broadband Interface interface.ti.com Digital Control Logic logic.ti.com Military Power Mgmt power.ti.com Optical Networking Microcontrollers microcontroller.ti.com Security Telephony Video & Imaging Wireless Mailing Address: Texas Instruments Post Office Box 655 Dallas, Texas 7565 Copyright 5, Texas Instruments Incorporated

L293, L293D QUADRUPLE HALF-H DRIVERS

L293, L293D QUADRUPLE HALF-H DRIVERS Featuring Unitrode L and LD Products Now From Texas Instruments Wide Supply-Voltage Range:.5 V to V Separate Input-Logic Supply Internal ESD Protection Thermal Shutdown High-Noise-Immunity Inputs Functional