1.5 C Accurate Digital Temperature Sensor with SPI Interface

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1 TMP TMP SBOS7B JUNE 00 REVISED SEPTEMBER 00. C Accurate Digital Temperature Sensor with SPI Interface FEATURES DIGITAL OUTPUT: SPI-Compatible Interface RELUTION: -Bit + Sign, 0.0 C ACCURACY: ±. C from C to +8 C (max) LOW QUIESCENT CURRENT: 0µA (max) WIDE SUPPLY RANGE:.7V to.v TINY T- PACKAGE OPERATION TO 0 C APPLICATIONS POWER-SUPPLY TEMPERATURE MONITORING COMPUTER PERIPHERAL THERMAL PROTECTION NOTEBOOK COMPUTERS CELL PHONES BATTERY MANAGEMENT OFFICE MACHINES DESCRIPTION The TMP and TMP are SPI-compatible temperature sensors available in the tiny T- package. Requiring no external components, the TMP and TMP are capable of measuring temperatures within C of accuracy over a temperature range of 0 C to + C. Low supply current, and a supply range from.7v to.v, make the TMP and TMP excellent candidates for low-power applications. The TMP and TMP are ideal for extended thermal measurement in a variety of communication, computer, consumer, environmental, industrial, and instrumentation applications. Temperature Temperature NC Diode Temp. Sensor Control Logic Diode Temp. Sensor Control Logic Σ A/D Converter Serial Interface NC Σ A/D Converter Serial Interface OSC Config. and Temp. Register OSC Config. and Temp. Register TMP TMP Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 00, Texas Instruments Incorporated

2 ABLUTE MAXIMUM RATINGS () Power Supply,... 7V Input Voltage ()... 0.V to 7V Input Current... 0mA Operating Temperature Range... C to +0 C Storage Temperature Range... 0 C to +0 C Junction Temperature (T J Max) C Lead Temperature (soldering) C NOTES: () Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. () Input voltage rating applies to all TMP and TMP input voltages. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION SPECIFIED PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT PRODUCT PACKAGE-LEAD DESIGNATOR () RANGE MARKING NUMBER MEDIA, QUANTITY TMP T- DBV 0 C to + C T TMPAIDBVT Tape and Reel, 0 " " " " " TMPAIDBVR Tape and Reel, 000 TMP T- DBV 0 C to + C T TMPAIDBVT Tape and Reel, 0 " " " " " TMPAIDBVR Tape and Reel, 000 NOTE: () For the most current specifications and package information, refer to our web site at. PIN CONFIGURATIONS Top View T- NC T NC T TMP, TMP SBOS7B

3 ELECTRICAL CHARACTERISTI At T A = 0 C to + C, and =.7V to.v, unless otherwise noted. PARAMETER CONDITION MIN TYP MAX UNITS TEMPERATURE INPUT Range 0 + C Accuracy (Temperature Error) C to +8 C ±0. ±. C 0 C to + C ±.0 ±.0 C 0 C to +0 C ±. C vs Supply C/V Resolution ±0.0 C DIGITAL INPUT/OUTPUT Input Logic Levels: V IH 0.7() V V IL 0.() V Input Current,,, I IN 0V V IN ± µa Output Logic Levels: V OL I SINK = ma 0. V V OH I URCE = ma () 0. V Resolution Bits Input Capacitance,,. pf Conversion Time -Bit 0 0 ms Conversion Period () -Bit 80 0 ms POWER SUPPLY Operating Range.7. V Quiescent Current I Q Serial Bus Inactive 0 µa Shutdown Current (TMP) I SD Serial Bus Inactive 0. µa Shutdown Current (TMP) I SD Serial Bus Inactive 0. µa TEMPERATURE RANGE Specified Range 0 + C Operating Range +0 C Storage Range 0 +0 C Thermal Resistance, θ JA T- Surface-Mount 0 C/W NOTE: () Period indicates time between conversion starts. TMP, TMP TMP, TMP SBOS7B

4 TYPICAL CHARACTERISTI At T A = + C, and =.0V, unless otherwise noted. 0 QUIESCENT CURRENT vs TEMPERATURE.0 SHUTDOWN CURRENT vs TEMPERATURE = V I Q (µa) 0 =.7V I SD (µa) Serial Bus Inactive Temperature ( C) Temperature ( C) 00 CONVERSION TIME vs TEMPERATURE.0 TEMPERATURE ACCURACY vs TEMPERATURE. Conversion Time (ms) = V =.7V Temperature Error ( C) bit resolution Temperature ( C). typical units -bit resolution Temperature ( C) TMP, TMP SBOS7B

5 APPLICATIONS INFORMATION The TMP and TMP are -bit plus sign read-only digital temperature sensors optimal for thermal management and thermal protection applications. The TMP and the TMP communicate through a serial interface that is SPI compatible. Temperature is converted to a -bit plus sign data word with 0.0 C resolution. The TMP and TMP are specified for a temperature range of 0 C to + C, with operation extending from C to 0 C. The TMP and TMP are optimal for low power applications, with a 0.s conversion period for reduced power consumption. The TMP and TMP are specified for a supply voltage range of.7v to.v, and also feature a hardware shutdown to provide additional power savings. The TMP and TMP require no external components for operation, though a 0.µF supply bypass capacitor is recommended. Figure shows typical connections for the TMP and TMP. TMP 0.µF NC () FIGURE. Typical Connections of the TMP and TMP. The sensing device of both the TMP and TMP is the chip itself; the die flag of the lead frame is connected to pin of the TMP, and of the TMP. Thermal paths run through the package leads as well as the plastic package, and the lower thermal resistance of metal causes the leads to provide the primary thermal path. The pins of the TMP and TMP are directly connected to the metal lead frame, and are the best choice for thermal input. To maintain accuracy in applications requiring air or surface temperature measurement, care should be taken to isolate the package and leads from ambient air temperature. TEMPERATURE REGISTER The Temperature Register of the TMP and TMP is a -bit, signed read-only register that stores the output of the most recent conversion. Up to bits can be read to obtain data and are described in Table I. The first bits are used to indicate temperature with bits D = 0, and D, D0 in a high impedance state. Data format for temperature is summarized in Table II. Following power-up or reset, the Temperature Register will read 0 C until the first conversion is complete. TMP 0.µF NOTE: () Pins labeled NC should be left floating or connected to. NC () D D D D D D0 D9 D8 T T T0 T9 T8 T7 T T D7 D D D D D D D0 T T T T T0 0 Z Z TABLE I. Temperature Register. TEMPERATURE DIGITAL OUTPUT () ( C) (BINARY) HEX B E C FFF F E80 NOTE: () The last bits are high impedance and are shown as 00 in the table. TABLE II. Temperature Data Format. COMMUNICATING WITH THE TMP The TMP and TMP continuously convert temperatures to digital data while is high. must be high for a minimum of one conversion time (0ms max) to update the temperature data. Reading temperature data from the TMP and TMP is initiated by pulling low, which will cause any conversion in progress to terminate, and place the device into analog shutdown. Quiescent current is reduced to µa during analog shutdown. Once is pulled low, temperature data from the last completed conversion prior to dropping is latched into the shift register and clocked out at on the falling edge. The -bit data word is clocked out sign bit first, followed by the MSB. Any portion of the -bit word can be read before raising. The TMP and TMP typically require 0.s to complete a conversion and consume 0µA of current during this period. If is held high for longer than one conversion time period the TMP and TMP will go into idle mode for 0.s, requiring only 0µA of current. A new conversion begins every 0.s. Figure describes the conversion timing for the TMP and TMP. 0.s 0.s FIGURE. Conversion Time and Period. 0µA (active) 0µA (idle) The serial data of the TMP and TMP consists of -bit plus sign temperature data followed by a confirmation bit and two high impedance bits. Data is transmitted in two s complement format. Figure describes the output data of the TMP and TMP. TMP, TMP SBOS7B

6 D D D D D D0 D9 D8 D7 D D D D 0 Z Z FIGURE. Data READ. Timing Diagrams The TMP and TMP are SPI compatible. Figures and describe the various timing requirements, with parameters defined in Table III. PARAMETER MIN MAX UNITS Period t 00 ns Falling Edge to Output Data Delay t 0 ns to Rising Edge Set-Up Time t 0 ns to Output Data Delay t 0 ns Rising Edge to Output High Impedance t 0 ns TABLE III. Timing Description. t t t t FIGURE. Output Data Timing Diagram. t t FIGURE. High Impedance Output Timing Diagram. TMP, TMP SBOS7B

7 PACKAGE OPTION ADDENDUM -Jan-00 PACKAGING INFORMATION ORDERABLE DEVICE STATUS() PACKAGE TYPE PACKAGE DRAWING PINS PACKAGE QTY TMPAIDBVR ACTIVE P DBV 000 TMPAIDBVT ACTIVE P DBV 0 TMPAIDBVR ACTIVE P DBV 000 TMPAIDBVT ACTIVE P DBV 0 () The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBLETE: TI has discontinued the production of the device.

9 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio /audio Data Converters dataconverter.ti.com Automotive /automotive DSP dsp.ti.com Broadband /broadband Interface interface.ti.com Digital Control /digitalcontrol Logic logic.ti.com Military /military Power Mgmt power.ti.com Optical Networking /opticalnetwork Microcontrollers microcontroller.ti.com Security /security Telephony /telephony Video & Imaging /video Wireless /wireless Mailing Address: Texas Instruments Post Office Box 0 Dallas, Texas 7 Copyright 00, Texas Instruments Incorporated

2 C Accurate Digital Temperature Sensor with SPI Interface

TMP125 2 C Accurate Digital Temperature Sensor with SPI Interface FEATURES DIGITAL OUTPUT: SPI-Compatible Interface RELUTION: 10-Bit, 0.25 C ACCURACY: ±2.0 C (max) from 25 C to +85 C ±2.5 C (max) from