Pin Configuration. Surface Mount 9.10 x 4.80 x 1.24 mm SMP-35C

Transcription

1 Features For multiple applications Usable bandwidth 10 MHz Low loss High attenuation Balanced operation Ceramic Surface Mount Package (SMP) Hermetic RoHS compliant (2002/95/EC), Pbfree Pb Package Surface Mount 9.10 x 4.80 x 1.24 mm SMP35C Pin Configuration Bottom View NOM MAX Pin No. Description 9 Input + 10 Input 4 Output + 5 Output 1,2,3,6,7,8 Case Ground Dimensions shown are nominal in millimeters All tolerances are ±0.15mm except overall length and width ±0.10mm Body: Al 2O 3 ceramic Lid: Kovar, Ni plated Terminations: Au plating µm, over a 2 6µm Ni plating Subject to change or obsolescence without notice Rev B 0907 TriQuint Semiconductor, Inc. Page 1 of 6

2 Electrical Specifications (1) Operating Temperature Range: (2) to +85 C Parameter (3) Minimum Typical (5) Maximum Unit Center Frequency 1 MHz Minimum Insertion Loss Amplitude Variation MHz pp Phase Linearity MHz MHz Average Group Delay MHz µs Relative Attenuation (4) MHz MHz MHz MHz MHz MHz Triple Transit Suppression 30 Source Impedance (balanced) (6) Load Impedance (balanced) (6) Notes: º pp º pp 1. All specifications are based on the TriQuint matching schematic shown on page 5 2. In production, devices will be tested at room temperature to a guardbanded specification to ensure electrical compliance over temperature 3. Electrical margin has been built into the design to account for the variations due to temperature drift and manufacturing tolerances 4. Relative to minimum insertion loss 5. Typical values are based on average measurements at room temperature 6. This is the optimum impedance in order to achieve the performance shown Subject to change or obsolescence without notice Rev B 0907 TriQuint Semiconductor, Inc. Page 2 of 6

3 Electrical Specifications (1) Operating Temperature Range: (2) 20 to +85 C Parameter (3) Minimum Typical (5) Maximum Unit Center Frequency 1 MHz Minimum Insertion Loss Amplitude Variation MHz pp Phase Linearity MHz MHz Average Group Delay MHz µs Relative Attenuation (4) MHz MHz MHz MHz MHz MHz Triple transit suppression 30 Source Impedance (balanced) (6) Load Impedance (balanced) (6) Notes: º pp º pp 1. All specifications are based on the TriQuint matching schematic shown on page 5 2. In production, devices will be tested at room temperature to a guardbanded specification to ensure electrical compliance over temperature 3. Electrical margin has been built into the design to account for the variations due to temperature drift and manufacturing tolerances 4. Relative to minimum insertion loss 5. Typical values are based on average measurements at room temperature 6. This is the optimum impedance in order to achieve the performance shown Subject to change or obsolescence without notice Rev B 0907 TriQuint Semiconductor, Inc. Page 3 of 6

4 Typical Performance (at room temperature) Subject to change or obsolescence without notice Rev B 0907 TriQuint Semiconductor, Inc. Page 4 of 6

5 Matching Schematic Actual matching values may vary due to PCB layout and parasitics Balanced Input 18pF ,2,3 6,7, pF Balanced Output Marking PCB Footprint TriQuint JJJYHH 5.00 ID Dot Date Code The date code consists of: day of the current year (Julian, 3 digits), last digit of the year (1 digit) and hour (2 digits) Tape and Reel This footprint represents a recommendation only Dimensions shown are nominal in millimeters Ø330 ID dot Ø1.5 A Ø102 Ø20.2 Ø13.0 Direction of travel 1.6 Section AA Ø1.5 A Dimensions shown are nominal in millimeters Packaging quantity: 00 units/reel Subject to change or obsolescence without notice Rev B 0907 TriQuint Semiconductor, Inc. Page 5 of 6

6 Maximum Ratings Parameter Symbol Minimum Maximum Unit Operating Temperature Range T +85 o C Storage Temperature Range T stg o C Pyroelectric Voltage V Pyro mv pp Input Power P in +20 m Warnings Electrostatic Sensitive Device (ESD) Avoid ultrasonic exposure Important Notes RoHS Compliance This product complies with EU directive 2002/95/EC (RoHS) Pb Solderability Compatible with JEDEC JSTD020C Pbfree process, 260 C peak reflow temperature (see soldering profile) Links to Additional Technical Information PCB Layout Tips Qualification Flowchart Soldering Profile SParameters RoHS Information Other Technical Information TriQuint s liability is limited only to the Surface Acoustic Wave (SAW) component(s) described in this data sheet. TriQuint does not accept any liability for applications, processes, circuits or assemblies, which are implemented using any TriQuint component described in this data sheet. PO Box 6091 Orlando, FL USA Contact Information Phone: +1 (7) Fax: +1 (7) infoproduct@tqs.com Web: Or contact one of our worldwide Network of sales offices, Representatives or distributors Subject to change or obsolescence without notice Rev B 0907 TriQuint Semiconductor, Inc. Page 6 of 6