TQM BC1/B2 BAW Duplexer

Transcription

1 QM2 Not for New Design as an alternative. Applications CDMA / UMTS Handsets Data Cards Mobile Routers PCS Band Class 1 and Band 2 8 Pin 2.6 x 2.1 x 0.0 mm Product Features Functional Block Diagram Excellent Triple Beat Performance: 88 c Highly Selective BAW Duplexer Achieving Low Insertion Loss Over Full Bandwidth & Operating Conditions. Rx Isolation Of + imum & GPS Rejection Of > Eliminating The Need For A Transmit Filter Single-Ended (SE) Ω Receive & Transmit Ports Performance to +85 C RoHS Compliant, Pb-Free Module Package General Description GND GND Antenna GND GND Receive GND Transmit Top View Pin Configuration The is a high-performance Bulk Acoustic Wave (BAW) duplexer designed to meet the strict CDMA / UMTS requirements for use in the PCS band, known as Band Class 1 (BC1), and B2. is specifically designed to meet the high performance expectations of insertion loss, isolation and triple beat for CDMA systems over the bandwidth of BC1 / B2 applications under all operating conditions. Due to the exceptional receive isolation & GPS rejection performance, no transmit SAW filter is required. This duplexer exhibits excellent power handling capabilities Pin # Label , 4, 5, 7, Receive Transmit Antenna N/C (internal to GND) GND* *See application section for details on optimal grounding. The uses common module packaging techniques to achieve the industry standard 2.6 x 2.1 x 0. mm footprint of 11 -

2 QM2 as an alternative. Not for New Design Absolute Maximum Ratings Recommended Operating Conditions Parameter Parameter Typ Max Units TCASE Rating to +85 C Storage Temperature Input Power, operating (CW, 00 hr Ta=+ C) +85 C The duplexer will function over the recommended range without degradation in reliability or permanent change in performance. +2 m Operation of this device outside the parameter ranges given above may cause permanent damage. Electrical Specifications(1,2) :TX Antenna C Max Parameter Conditions Insertion Loss Return Loss Attenuation Amplitude Variation MHz +25 C Typ (3) +85 C Max Max Units (UMTS)(4) MHz (NCDMA)(5) MHz (Antenna Port) MHz (Tx Port) MHz MHz MHz MHz (GPS) MHz (Glonass) MHz (Glonass) MHz (BC1/B2 Rx) MHz (AWS Rx) MHz (ISM) MHz (2 fo ) 26 MHz (Wi-Fi ) MHz (3 fo ) MHz (4 fo ) MHz (UMTS) (6) of p-p

3 Not For New Designs. Consider QM2 as an alternative. Not for New Designs Electrical Specifications(1,2) : RX Antenna C Parameter Insertion Loss Max Conditions Attenuation Typ (3) +85 C Max Max Units MHz (UMTS) (4) MHz (NCDMA) (5) 1 10 MHz (GSM Rx) Return Loss +25 C 1 10 MHz (Antenna Port) MHz (Rx Port) MHz (BC0 Tx) MHz (BC1/B2 Tx) MHz (ISM band) MHz Linearity - Triple Ratio of CW jammer to triple beat Beat Test[6] product at Rx port 88 (7) 7 c Electrical Specifications(1,2) :TX RX C Parameter Max Conditions MHz +25 C Typ (3) Max +85 C (UMTS) (4) MHz (NCDMA) (5) 63 (UMTS) (4) 54 (NCDMA) (5) MHz Isolation MHz MHz (GPS) MHz (2 fo ) MHz (3 fo ) 5 Max Units Notes: 1. All specifications are based on the TriQuint schematic for the main reference design shown on page In production, devices will be tested at room temperature to a guard-banded specification to ensure electrical compliance over temperature. 3. Typical values are averages over specified band, unless otherwise noted. 4. Integrated over any 3.84 MHz channel within band. 5. Integrated over any 1.25 MHz channel within band 6. Integrated over any 5 MHz channel within band 7. Worst case over specified frequencies. 8. Test conditions defined as follow: Tx port: two CW tones at ftx and ftx+1mhz and m each measured at the DUT antenna port; Antenna port: CW jammer at frx=ftx+80 MHz and - m. Triple Beat Ratio is defined as the ratio of CW jammer to triple-beat product at Rx port for ftx=1851 MHz, 1882 MHz and 113 MHz. - 3 of 11 -

4 QM2 Designsas an alternative. Not for New Reference Design Ω SE Input, Ω SE Output PC Board PCB routing detail Notes: Top, middle & bottom layers: 1 oz. copper Substrates: FR4 dielectric,.031 thick Finish plating: Nickel: 3-8 µm thick, Gold:.03-.2µm thick Hole plating: Copper min.0008 µm thick Notes: Light grey indicates metalized area Dark grey indicates pad areas This footprint represents a recommendation only For solder pad recommendation see mechanical information Schematic Note: 1. Pin 8 can be connected to ground or left floating - 4 of 11 -

5 Not For New Designs. QM2 as an alternative. NotConsider for New Designs Typical RX Performance Test conditions unless otherwise noted: Temp.=+25 C - 5 of 11 -

6 Not For New Designs. Not Consider QM2 for New Designs as an alternative. Typical TX Performance Test conditions unless otherwise noted: Temp.=+25 C - 6 of 11 -

7 Not forqm2 New Designs as an alternative. Isolation And Antenna Return Loss (At Room Temperature) Test conditions unless otherwise noted: Temp.=+25 C - 7 of 11 -

8 QM2 Not for New Designsas an alternative. Package Marking and Dimensions Package Marking 2X.10 C 2.6±0.1 Product Identifier Assembly Code A 4X 0. B (8X) 0.4x X 0.4y C A B 4X 0.1±0.10 TERMINAL #1 IDENTIFIER 2X 6002 XXXX 4X ±0.1 4X 0.0 (1X) shape.10 C 0.10 C A B 0.00 Top View TERMINAL #1 IDENTIFIER Bottom View.10 C 0.88±0.08 Side View C PCB Mounting Pattern Recommended Land Pattern Metallization Recommended Land Pattern, Solder Mask Opening Oversize Pads: um (2mil) per side Center Ground: 100% of module Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We recommend a 0.mm (#80/.01") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10 ). 3. Ensure good package backside paddle solder attach for reliable operation and best electrical performance. - 8 of 11 -

9 QM2 as an alternative. Not for New Designs Tape and Reel Information Carrier and Cover Tape Dimensions Tape and reel specifications for this part are also available on the TriQuint website. P1 Ø /-0.0 P2 Ø1.00 MIN ±0.05 A 1.75±0.10 R 0. MAX. F C W Bo Ao Ko A 0.12 COVER TAPE SECTION A-A 0.12 Feature Symbol Size (in) Size (mm) Length A (0.02 alt.) 2. (2.34 alt.) Width B (0.112 alt.) 2.0 (5 alt.) Depth K Pitch P Centerline Distance Cavity to Perforation - Length Direction P Cavity to Perforation - Width Direction F Cover Tape Width C Carrier Tape Width W Cavity Measure R of 11 -

10 Not for New Designsas an alternative. QM2 Tape and Reel Information Reel Dimensions 7 inch Reel for 8 mm Tape Packaging reels are used to prevent damage to devices during shipping and storage, loaded carrier tape is typically wound onto a plastic take-up reel. The reels are made from high-impact injection-molded polystyrene (HIPS), which offers mechanical and ESD protection to packaged devices. Feature Symbol Size (in) Size (mm) Reel Diameter A Reel Thickness W Flange Spacing W Hub Outer Dia. N Arbor Hole Dia. C Key Slit Width B Key Slit Dia. D Tape and Reel Information Tape Length and Label Placement Note 2 Notes: 1. Empty part cavities at the trailing and leading ends are sealed with cover tape. See EIA A. 2. Labels are placed on the flange opposite the sprockets in the carrier tape of 11 -

11 Not For New Designs.Not Consider for NewQM2 Designs as an alternative. Product Compliance Information ESD Sensitivity Ratings Solderability Compatible with both lead-free (260 C max. reflow temperature) and tin/lead (2 C max. reflow temperature) soldering processes. Caution! ESD-Sensitive Device Contact plating: ENIG (Electroless Nickel Immersion Gold) ESD Rating: Value: Test: Standard: 1B 0 V Human Body Model (HBM) JEDEC Standard JS ESD Rating: Value: Test: Standard: B > 0 V to < 0 V Machine Model (MM) JEDEC Standard JESD22-A1 RoHs Compliance This part is compliant with EU 02/5/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). MSL Rating MSL Rating: Level 3 Test: 260 C convection reflow Standard: JEDEC Standard IPC/JEDEC J-STD-0 This product also has the following attributes: Lead Free Halogen Free (Chlorine, Bromine) Antimony Free TBBP-A (CH12Br2) Free PFOS Free SVHC Free Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: info-sales@triquint.com Tel: Fax: For technical questions and application information: fl.product.engineering@triquint.com Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or lifesustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death of 11 -