FODM452, FODM453 5-Pin Mini Flat Package High Speed Transistor Optocoupler

Transcription

1 FODM452, FODM453 5-Pin Mini Flat Package High Speed Transistor Optocoupler Features Compact 5-pin mini flat package High speed- MBit/s Superior CMR-5kV/µs at V CM = 5V (FODM453) Performance guaranteed over temperature ( 7 C) U.L. recognized (File # E97) VDE884 recognized (File # 3648) Ordering option V, e.g., FODM452V 26 C reflow capability for Pb-free assembly Applications Line receivers Pulse transformer replacement Output interface to CMOS-LSTTL-TTL Wide bandwidth analog coupling Functional Schematic ANODE 6 V CC 5 V O Description July 2 The FODM452 and FODM453 optocouplers consist of an AlGaAs LED optically coupled to a high speed photodetector transistor. The devices are housed in a compact 5-pin mini flat package for optimum mounting density. The FODM453 features a high CMR rating for optimum common mode transient immunity. Related Resources Truth Table LED Off On Output High Low CATHODE 3 4 GND FODM452, FODM453 Rev...5

2 Pin Definitions Number Name Function Description ANODE Anode 3 CATHODE Cathode 4 GND Output Ground 5 V O Output Voltage 6 V CC Output Supply Voltage Safety and Insulation Ratings for Mini-Flat Package (SO5 Pin) As per IEC (Pending Certification). This optocoupler is suitable for safe electrical insulation only within the safety limit data. Compliance with the safety ratings shall be ensured by means of protective circuits. Symbol Parameter Min. Typ. Max. Unit Installation Classifications per DIN VDE /.89 Table For rated main voltage < 5Vrms I-IV For rated main voltage < 3Vrms I-III Climatic Classification 4/85/2 Pollution Degree (DIN VDE /.89) 2 CTI Comparative Tracking Index 75 V PR Input to Output Test Voltage, Method b, VIORM x.875 = V PR, % Production Test with t m = sec, Partial Discharge < 5 pc 6 V PR Input to Output Test Voltage, Method a, VIORM x.5 = V PR, Type and Sample Test with t m = 6 sec, Partial Discharge < 5 pc V IORM Max Working Insulation Voltage 565 V peak V IOTM Highest Allowable Over Voltage 4 V peak External Creepage 5. mm External Clearance 5. mm Insulation thickness.5 mm T Case Safety Limit Values, Maximum Values allowed in the event 5 C of a failure, Case Temperature R IO Insulation Resistance at T S, V IO = 5V 9 Ω 848 FODM452, FODM453 Rev...5 2

3 Absolute Maximum Ratings (T A = 25 C unless otherwise noted) Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Value Units T STG Storage Temperature -4 to +25 C T OPR Operating Temperature -4 to +85 C EMITTER I F (avg) DC/Average Forward Input Current 25 ma I F (pk) Peak Forward Input Current (5% duty cycle, ms P.W.) 5 ma I F (trans) Peak Transient Input Current ( µs P.W., 3pps). A V R Reverse Input Voltage 5 V P D Input Power Dissipation (No derating required over specified operating temp range) 45 mw DETECTOR I O (avg) Average Output Current 8 ma I O (pk) Peak Output Current 6 ma V CC Supply Voltage -.5 to 3 V V O Output Voltage -.5 to 2 V P D Output Power Dissipation (No derating required over specified operating temp range) mw FODM452, FODM453 Rev...5 3

4 Electrical Characteristics (T A = to 7 C unless otherwise specified) Individual Component Characteristics Symbol Parameter Test Conditions Min. Typ.* Max. Unit EMITTER V F Input Forward Voltage I F = 6mA, T A = 25 C.6.7 V I F = 6mA.8 B VR Input Reverse Breakdown Voltage I R = µa 5. V V F / T A Temperature Coefficient of Forward Voltage I F = 6mA -.8 mv/ C DETECTOR I OH Logic High Output Current I F = ma, V O = V CC = 5.5V, T A =25 C..5 µa I F = ma, V O = V CC = 5V, T A =25 C. I F = ma, V O = V CC = 5V 5 I CCL Logic Low Supply Current I F = 6mA, V O = Open, V CC = 5V 2 µa I CCH Logic high supply current I F = ma, V O = Open, V CC = 5V,.5 µa T A = 25 C I F = ma, V O = Open, V CC = 5V 2 Transfer Characteristics Symbol Parameter Test Conditions Min. Typ.* Max Unit COUPLED CTR Current Transfer Ratio () I F = 6mA, V CC = 4.5V T A = 25 C V OL =.4V 2 5 % V OL =.5V 5 V OL Logic LOW Output I F = 6mA, I O = 3mA, V CC = 4.5V, T A =2 5 C.4 V Voltage I F = 6mA, I O = 2.4mA, V CC = 4.5 V.5 Switching Characteristics (V CC = 5V) Symbol Parameter Test Conditions Device Min. Typ.* Max. Unit T PHL Propagation Delay R L =.9kΩ, I F = 6mA, T A = 25 C (2) (Fig. 9).4.8 µs Time to Logic LOW R L =.9kΩ, I F = 6mA (2) (Fig. 9). µs T PLH Propagation Delay R L =.9kΩ, I F = 6mA, T A = 25 C (2) (Fig. 9).35.8 µs Time to Logic HIGH R L =.9kΩ, I F = 6mA (2) (Fig. 9). µs CM H Common Mode I F = ma, V CM = V P-P, R L =.9kΩ, FODM KV/µs Transient Immunity T A = 25 C (3) (Fig. ) at Logic HIGH I F = ma, V CM = 5V P-P, R L =.9kΩ FODM KV/µs T A = 25 C (3) (Fig. ) CM L Common Mode Transient Immunity at Logic LOW I F = 6mA, V CM = V P-P, R L =.9kΩ, T A = 25 C (3) (Fig. ) I F = 6mA, V CM = 5V P-P, R L =.9kΩ, T A = 25 C (3) (Fig. ) FODM KV/µs FODM KV/µs BW Bandwidth R L = Ω 3 MHz Isolation Characteristics Symbol Characteristics Test Conditions Min. Typ.* Max. Unit V ISO Withstand Insulation Test Voltage RH 5%, T A = 25 C, t = min. (4) 375 V RMS C I-O Capacitance (Input to Output) f = MHz (4).2 pf *All Typicals at T A = 25 C FODM452, FODM453 Rev...5 4

5 Notes:. Current Transfer Ratio is defined as a ratio of output collector current, I O, to the forward LED input current, I F, times %. 2. The.9kΩ load represents TTL unit load of.6ma and 5.6kΩ pull-up resistor. 3. Common mode transient immunity in logic high level is the maximum tolerable (positive) dv cm /dt on the leading edge of the common mode pulse signal V CM, to assure that the output will remain in a logic high state (i.e., V O > 2.V). Common mode transient immunity in logic low level is the maximum tolerable (negative) dv cm /dt on the trailing edge of the common mode pulse signal, V CM, to assure that the output will remain in a logic low state (i.e., V O <.8V). 4. Device is considered a two terminal device: Pins, and 3 are shorted together and Pins 4, 5, and 6 are shorted together. FODM452, FODM453 Rev...5 5

6 NORMALIZED CURRENT TRANSFER RATIO NORMALIZED CURRENT TRANSFER RATIO Typical Performance Curves IF FORWARD CURRENT (ma) IO - OUTPUT CURRENT (ma).. Fig. Input Forward Current vs Forward Voltage V F FORWARD CURRENT (ma) Fig. 3 Normalized Current Transfer Ratio vs. Ambient Temperature T A = 25 C IF = 6mA V O =.4V V CC = 5V Normalized to T A = 25 C T A AMBIENT TEMPERATURE Fig. 5 DC and Pulsed Transfer Characteristics T A = 25 C V CC = 5V I F = 4mA 35mA 3mA 25mA 2mA 5mA ma 5mA IOH LOGIC HIGH OUTPUT CURRENT (na) tp PROPAGATION DELAY (µs) Fig. 2 Normalized Current Transfer Ratio vs. Input Current V O =.4V V CC = 5V T A = 25 C Normalized to IF = 6mA V O = V CC = 5V I F = V I F INPUT CURRENT (ma) Fig. 4 Logic High Output Current vs. Ambient Temperature T A TEMPERATURE ( C) Fig. 6 Propagation Delay vs. Load Resistance T A = 25 C V CC = 5V I F = 6mA I F = ma t PLH t PHL V O OUTPUT VOLTAGE (V) R L LOAD RESISTANCE (kω) FODM452, FODM453 Rev...5 6

7 Typical Performance Curves (Continued) tp PROPAGATION DELAY (ns) Fig. 7 Propagation Delay vs. Ambient Temperature I F = 6mA V CC = 5V R L =.9kΩ t PLH t PHL T A AMBIENT TEMPERATURE ( C) NORMALIZED RESPONSE (db) I F = 6mA V CC = 5V T A = 25 C Fig. 8 Frequency Response R L = 47Ω R L = kω f FREQUENCY (MHz) R L = 22Ω R L = Ω FODM452, FODM453 Rev...5 7

8 V FF Pulse Generator I tr = 5ns F Z O= 5 Ω % D.C. I/f < µs I Monitor F B A R m I F I F V O + T PHL Noise Shield.5 V Noise Shield V CM + - Pulse Gen V CC VO 4 GND V CC V 5 O 4 GND.5 V TPLH R L. µf Fig. 9 Switching Time Test Circuit V OL R L. µf +5 V V O - 5 V +5 V V O C L =.5 µf V CM V 9% 9% % % V t r t f V O Switch at A : I = ma F 5 V V O Switch at A : I = 6 ma F V OL Fig. Common Mode Immunity Test Circuit FODM452, FODM453 Rev...5 8

9 Package Dimensions Notes:. No standard applies to this package. 2. All dimensions are in millimeters. 3. Dimensions are exclusive of burrs, mold flash, and tie bar extrusion. 4. Drawings filesname and revision: MKT-MFP5A. Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor s online packaging area for the most recent package drawings: FODM452, FODM453 Rev...5 9

10 Footprint Drawing for PCB Layout Device A Pin 2.54 Dimensions in millimeters Device B Pin End Stacking Configuration Unutilized Solder Pad FODM452, FODM453 Rev...5

11 Tape and Reel Dimensions K t d W Description Tape Width Tape Thickness Sprocket Hole Pitch Sprocket Hole Diameter Sprocket Hole Location Pocket Location Pocket Pitch Pocket Dimension Pocket Hole Diameter Cover Tape Width Cover Tape Thickness Max. Component Rotation or Tilt Devices Per Reel Reel Diameter P Symbol W t P D E F P P A B K D W d 2 A P P 2 B D D F 2.54 Pitch Dimensions (mm) / -..3 ±.5 4. ± / ±. 5.5 ±. 2. ±. 8. ±. 4.4 ±. 7.3 ±. 2.3 ±..5 Min ±. Max mm (3") E W FODM452, FODM453 Rev...5

12 Ordering Information Option Order Entry Identifier (example) Description R2 FODM452R2 Tape and Reel (25 per reel) V FODM452V IEC R2V FODM452R2V IEC , Tape and Reel (25 per reel) Marking Information Definitions Fairchild logo 2 Device number V IEC mark (Note: Only appears on parts ordered 3 with VDE option See order entry table) 4 One digit year code, e.g., 7 5 Two digit work week ranging from to 53 6 Assembly package code X M452 YY M 2 6 FODM452, FODM453 Rev...5 2

13 Reflow Profile Temperature ( C) TP TL Tsmax Tsmin Max. Ramp-up Rate = 3 C/S Max. Ramp-down Rate = 6 C/S Preheat Area Time 25 C to Peak Time (seconds) Profile Freature Pb-Free Assembly Profile Temperature Min. (Tsmin) 5 C Temperature Max. (Tsmax) 2 C Time (t S ) from (Tsmin to Tsmax) 6 2 seconds Ramp-up Rate (t L to t P ) 3 C/second max. Liquidous Temperature (T L ) 27 C Time (t L ) Maintained Above (T L ) 6 5 seconds Peak Body Package Temperature 26 C + C / 5 C Time (t P ) within 5 C of 26 C 3 seconds Ramp-down Rate (T P to T L ) 6 C/second max. Time 25 C to Peak Temperature 8 minutes max. ts tl tp FODM452, FODM453 Rev...5 3

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PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Product Status Definition Identification Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I49 FODM452, FODM453 Rev...5 4