FOD0708 Single Channel CMOS Optocoupler, FOD0738 Dual Channel CMOS Optocoupler
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1 FOD00 Single Channel CMOS Optocoupler, FOD0 Dual Channel CMOS Optocoupler Features +V CMOS compatibility ns typical pulse width distortion 0ns max. pulse width distortion 0ns max. propagation delay skew High speed: MBd 0ns max. propagation delay 0kV/µs minimum common mode rejection 0 C to 00 C temperature range UL approved (file #E9000) Applications Line receivers Pulse transformer replacement Output interface to CMOS-LSTTL-TTL Wide bandwidth analog coupling Schematics NC ANODE CATHODE NC FOD00 V DD NC V O GND ANODE CATHODE CATHODE ANODE General Description April 009 The FOD00 and FOD0 optocouplers consist of an AlGaAs LED optically coupled to a high speed transimpedance amplifier and voltage comparator. These optocouplers utilize the latest CMOS IC technology to achieve outstanding performance with very low power consumption. The devices are housed in a compact -pin SOIC package for optimum mounting density. FOD0 V DD V O V O GND TRUTH TABLE LED OFF ON V O OUTPUT H L Note: A 0.µF bypass capacitor must be connected between pins and. FOD00, FOD0 Rev..0.
2 Absolute Maximum Ratings (T A = C unless otherwise specified) Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Units T S Storage Temperature 0 + C T A Ambient Operating Temperature C V DD Supply Voltages 0 Volts V O Output Voltage 0. V DD + 0. Volts I O Average Output Current ma I F Average Forward Input Current 0 ma Lead Solder Temperature 0 C for 0 sec.,. mm below seating plane Solder Reflow Temperature Profile See Solder Reflow Temperature Profile Section LED Power Dissipation Single Channel Dual Channel Detector Power Dissipation Single Channel Dual Channel Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Electrical Characteristics (T A = 0 C to +00 C) and. V V DD. V *All typicals at T A = C and V DD = V unless otherwise noted. 0mW (derate above 9 C,.mW/ C) 0mW per channel (derate above 90 C,.mW/ C) mw (derate above C,.mW/ C) mw per channel (derate above 90 C,.0mW/ C) Symbol Parameter Min. Max. Units T A Ambient Operating Temperature C V DD Supply Voltages.. Volts I F Input Current (ON) 0 ma Symbol Parameter Test Conditions Min. Typ.* Max. Units Fig. V F Input Forward Voltage I F = ma... V 9 BV R Input Reverse Breakdown Voltage I R = 0µA V V OH Logic High Output Voltage I F = 0, I O = 0µA.0.0 V V OL Logic Low Output Voltage I F = ma, I O = 0µA V I TH Input Threshold Current (FOD00) (FOD0) I DDL Logic Low Output Supply Current (FOD00) (FOD0) I DDH Logic High Output Supply Current (FOD00) (FOD0) I OL = 0µA.0. I F = ma..9 I F = ma, ma, ma, FOD00, FOD0 Rev..0.
3 Switching Characteristics Over recommended temperature (T A = 0 C to +00 C) and. V V DD. V. All typical specifications are at T A = C, V DD = + V. Symbol Parameter Test Conditions Min. Typ.* Max. Units t PHL t PLH Propagation Delay Time to Logic Low Output Propagation Delay Time to Logic High Output *All typicals at T A = C and V DD = V unless otherwise noted. Isolation Characteristics (T A = -0 C to +00 C Unless otherwise specified.) *All typical values are at V CC = V, T A = C I F = ma, C L = pf CMOS Signal Levels (Note ) (Fig. 0) I F = ma, C L = pf CMOS Signal Levels, (Note ) (Fig. 0) 0 0 ns FOD00 0 ns FOD0 0 PW Pulse Width 00 ns PWD Pulse Width Distortion I F = ma, C L = pf, 0 0 ns CMOS Signal Levels (Note ) t PSK Propagation Delay Skew I F = ma, C L = pf, CMOS Signal Levels (Note ) 0 ns t R Output Rise Time (0% 90%) I F = ma, C L = pf, CMOS Signal Levels ns t F Output Fall Time (90% 0%) I F = ma, C L = pf, CMOS Signal Levels ns CM H Common Mode Transient Immunity at Logic High Output CM L Common Mode Transient Immunity at Logic Low Output V CM = 000V, T A = C, I F = 0mA, (Note ) (Fig. ) V CM = 000V, T A = C, I F = ma, (Note ) (Fig. ) 0 kv/µs 0 kv/µs Characteristics Test Conditions Symbol Min Typ.* Max Unit Input-Output Insulation Leakage Current Withstand Insulation Test Voltage Relative humidity = %, T A = C, t = s, V I-O = 000 VDC (Note ) I I-O 0µA, R H < 0%, T A = C, t = min. (Note ) I I-O.0 µa V ISO 00 V RMS Resistance (Input to Output) V I-O = 00V (Note ) R I-O 0 Ω Capacitance (Input to Output) f = MHz (Note ) C I-O 0. pf Notes:. Propagation delay time, high to low (t PHL ), is measured from the 0% level on the rising edge of the input pulse to the.v level of the falling edge of the output voltage signal. Propagation delay time, low to high (t PLH ), is measured from the 0% level on the falling edge of the input pulse to the.v level of the rising edge of the output voltage signal.. Pulse width distoration is defined as the absolute difference between the high to low and low to high propagation delay times, t PHL t PLH.. Propagation delay skew, t PSK, is defined as the worst case difference in t PHL or t PLH between units within the recommended operating range of the device.. CM H The maximum tolerated rate of rise of the common mode voltage to ensure the output will remain in the high state, (i,e., V OUT >.0V) Measured in kilovolts per microsecond (kv/µs).. CM L The maximum tolerated rate of fall of the common mode voltage to ensure the output will remain in the low state, (i,e., V OUT < 0.V). Measured in kilovolts per microsecond (kv/µs).. Isolation voltage, V ISO, is an internal device dielectric breakdown rating. For this test, pins,,, are common, and pins,,, are common. FOD00, FOD0 Rev..0.
4 Typical Performance Curves I TH -Input Threshold Current (ma) I DDL -LogicLow Output Supply Current (ma) V DD =V I OL =0µA Figure. FOD00 Typical Logic Low Output Supply Current vs Ambient Temperature V DD =V I F = ma Figure. FOD00 Typical Input Threshold Current vs Ambient Temperature T A -Ambient Temperature ( o C) T A -AmbientTemperature ( o C) t P -Propagation Delay (ns) I DDH -LogicHighOutput Supply Current (ma) Figure. FOD00 Typical Switching Speed vs Pulse Input Current t PHL t PLH PWD I F -Pulse Input Current (ma) V DD =V T A = o C Figure. FOD00 Typical Logic High Output Supply Current vs Ambient Temperature V DD =V T A -AmbientTemperature ( o C) FOD00, FOD0 Rev..0.
5 Typical Performance Curves (Continued) I TH -Input Threshold Current (ma) I DDL -LogicLow Output Supply Current (ma) V DD =V I OL =0µA Figure. FOD0 Typical Logic Low Output Supply Current vs Ambient Temperature V DD =V I F = ma Figure. FOD0 Typical Input Threshold Current vs Ambient Temperature T A -Ambient Temperature ( o C) T A -AmbientTemperature ( o C) Channel Channel t P -Propagation Delay (ns) I DDH -LogicHighOutput Supply Current (ma) Figure. FOD0 Typical Switching Speed vs Pulse Input Current V DD =V T A = o C 0 9 Figure. FOD0 Typical Logic High Output Supply Current vs Ambient Temperature V DD =V t PHL t PLH PWD I F -Pulse Input Current (ma) T A -AmbientTemperature ( o C) Channel Channel FOD00, FOD0 Rev..0.
6 Typical Performance Curves (Continued) I F -Forward Current (ma) Figure 9. Input Forward Current vs. Forward Voltage 00 0 T A =00 o C T A = o C T A =-0 o C T A =0 o C T A = o C V F -Forward Voltage (V) FOD00, FOD0 Rev..0.
7 Pulse Gen. t f = t r = ns Z O = 0 Ω Input Monitor Node I F R IN V FF Test Circuit for FOD00 A B VCM 0V VOH VO I F Vcc Pulse Gen. Z O = 0 Ω t f = t r = ns I F Input 0.µF Monitoring Node Output Monitoring Node R IN Fig. 0 Test Circuit and Waveforms for t PLH, t PHL, t r and t f. GND V CM Pulse Gen V CC Test Circuit for FOD00 0.µF bypass Test Circuit for FOD0 Peak Switching Pos. (A), I = 0 F V O (Min) +V Output (V O) I F V FF Vcc Output Monitoring Node 0.µF Bypass B A Input Output t PHL 90% Dual Channel V CM + Pulse Generator Z O = 0Ω t f Test Circuit for FOD0 0% 0% Waveforms t PLH 0.µF Bypass t r +V Output V O Monitoring Node CM H I F = ma 0% 90%.V CMOS V OL V O (Max) VO VOL Switching Pos. (B), I = ma F CM L Fig. Test Circuit Common Mode Transient Immunity (FOD00 and FOD0) FOD00, FOD0 Rev..0.
8 Package Dimensions -pin SOIC Surface Mount SEATING PLANE 0. (.) 0. (.) Recommended Pad Layout 0.0 (0.) 0.0 (0.) 0.00 (.) Typ. 0.0 (.) 0. (.) Lead Coplanarity: 0.00 (0.0) MAX 0. (.99) 0. (.9) 0. (.) 0. (.) 0.00 (0.0) 0.00 (0.0) 0.0 (0.) 0.00 (.) 0. (.9) 0. (.9) 0.00 (0.) 0.00 (0.) 0.00 (.) Dimensions in inches (mm). Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor s online packaging area for the most recent package drawings: FOD00, FOD0 Rev..0.
9 Ordering Information Option Order Entry Identifier Description No Suffix FOD00 Shipped in tubes (0 units per tube) R FOD00R Tape and Reel (00 units per reel) Marking Information V X YY 00 Definitions Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option See order entry table) One digit year code, e.g., Two digit work week ranging from 0 to Assembly package code S FOD00, FOD0 Rev..0. 9
10 Carrier Tape Specification.0 ± ± ± MAX.0 ± 0.0. ± MAX.0 ± 0.0 User Direction of Feed Dimensions in mm Ø. MIN. ± 0.0. ± ± 0..0 ± 0.0 Ø. ± 0. FOD00, FOD0 Rev..0. 0
11 Reflow Profile Temperature ( C) TP TL Tsmax Tsmin Max. Ramp-up Rate = C/S Max. Ramp-down Rate = C/S Preheat Area Time C to Peak Time (seconds) Profile Freature Pb-Free Assembly Profile Temperature Min. (Tsmin) 0 C Temperature Max. (Tsmax) 00 C Time (t S ) from (Tsmin to Tsmax) 0 0 seconds Ramp-up Rate (t L to t P ) C/second max. Liquidous Temperature (T L ) C Time (t L ) Maintained Above (T L ) 0 0 seconds Peak Body Package Temperature 0 C +0 C / C Time (t P ) within C of 0 C 0 seconds Ramp-down Rate (T P to T L ) C/second max. Time C to Peak Temperature minutes max. ts tl tp FOD00, FOD0 Rev..0.
12 TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries,and is not intended to be an exhaustive list of all such trademarks. Auto-SPM Build it Now CorePLUS CorePOWER CROSSVOLT CTL Current Transfer Logic EcoSPARK EfficentMax EZSWITCH * * Fairchild Fairchild Semiconductor FACT Quiet Series FACT FAST FastvCore FETBench FlashWriter * FPS F-PFS FRFET Global Power Resource SM Green FPS Green FPS e-series Gmax GTO IntelliMAX ISOPLANAR MegaBuck MICROCOUPLER MicroFET MicroPak MillerDrive MotionMax Motion-SPM OPTOLOGIC OPTOPLANAR PDP SPM Power-SPM PowerTrench PowerXS Programmable Active Droop QFET QS Quiet Series RapidConfigure * Trademarks of System General Corporation, used under license by Fairchild Semiconductor. Saving our world, mw/w/kw at a time SmartMax SMART START SPM STEALTH SuperFET SuperSOT - SuperSOT - SuperSOT - SupreMOS SyncFET Sync-Lock * The Power Franchise TinyBoost TinyBuck TinyLogic TINYOPTO TinyPower TinyPWM TinyWire TriFault Detect TRUECURRENT * µserdes UHC Ultra FRFET UniFET VCX VisualMax XS DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERSTHESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. ANTI-COUNTERFEITING POLICY. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical andproduct information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Preliminary No Identification Needed Obsolete Formative / In Design First Production Full Production Not In Production Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. FOD00, FOD0 Rev..0. Rev. I0
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