FOD814 Series, FOD617 Series, FOD817 Series 4-Pin High Operating Temperature Phototransistor Optocouplers
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1 FOD84 Series, FOD67 Series, FOD87 Series 4-Pin High Operating Temperature Phototransistor Optocouplers Features AC input response (FOD84 only) Applicable to Pb-free IR reflow soldering Compact 4-pin package Current transfer ratio in selected groups: FOD67A: 4 8% FOD87: 5 6% FOD67B: 63 25% FOD87A:8 6% FOD67C: 2% FOD87B: 3 26% FOD67D: 6 32% FOD87C:2 4% FOD84: 2 3% FOD87D:3 6% FOD84A: 5 5% C-UL, UL and VDE approved High input-output isolation voltage of 5Vrms Minimum BV CEO of 7V guaranteed Higher operating temperatures (versus HAXXX counterparts) Applications FOD84 Series AC line monitor Unknown polarity DC sensor Telephone line interface FOD67 and FOD87 Series Power supply regulators Digital logic inputs Microprocessor inputs Functional Block Diagram ANODE, CATHODE CATHODE, ANODE 2 FOD84 4 COLLECTOR 3 EMITTER ANODE CATHODE 2 Description December 28 The FOD84 consists of two gallium arsenide infrared emitting diodes, connected in inverse parallel, driving a silicon phototransistor output in a 4-pin dual in-line package. The FOD67/87 Series consists of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a 4-pin dual in-line package. FOD67/87 4 COLLECTOR 3 EMITTER 4 FOD84 Series, FOD67 Series, FOD87 Series Rev...
2 Absolute Maximum Ratings (T A = 25 C Unless otherwise specified.) Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol TOTAL DEVICE Parameter FOD84 Value FOD67/87 T STG Storage Temperature -55 to +5 C T OPR Operating Temperature -55 to to + C T SOL Lead Solder Temperature 26 for sec C P TOT Total Power Dissipation 2 mw EMITTER I F Continuous Forward Current ±5 5 ma V R Reverse Voltage 6 P D DETECTOR Power Dissipation Derate above C V CEO Collector-Emitter Voltage 7 V V ECO Emitter-Collector Voltage 6 6 (FOD87) 7 (FOD67) 7.7 Units mw mw/ C I C Continuous Collector Current 5 ma P C Collector Power Dissipation Derate above 9 C V mw mw/ C FOD84 Series, FOD67 Series, FOD87 Series Rev... 2
3 Electrical Characteristics (T A = 25 C Unless otherwise specified.) Individual Component Characteristics Symbol Parameter Device Test Conditions Min. Typ.* Max. Unit EMITTER V F Forward Voltage FOD84 I F = ±2mA.2.4 V Transfer Characteristics *Typical values at T A = 25 C FOD67 I F = 6mA FOD87 I F = 2mA.2.4 I R Reverse Leakage Current FOD67 V R = 6.V. µa FOD87 V R = 4.V C t Terminal Capacitance FOD84 V =, f = khz 5 25 pf DETECTOR FOD67 V =, f = khz 3 25 FOD87 V =, f = khz 3 25 I CEO Collector Dark Current FOD84 V CE = 2V, I F = na BV CEO BV ECO Symbol CTR V CE (sat) Collector-Emitter Breakdown Voltage Emitter-Collector Breakdown Voltage FOD67C/D V CE = V, I F = FOD67A/B V CE = V, I F = 5 FOD87 V CE = 2V, I F = FOD84 I C =.ma, I F = 7 V FOD67 I C = µa, I F = 7 FOD87 I C =.ma, I F = 7 FOD84 I E = µa, I F = 6 V FOD67 I E = µa, I F = 7 FOD87 I E = µa, I F = 6 DC Characteristic Device Test Conditions Min. Typ.* Max. Unit Current Transfer Ratio Collector-Emitter Saturation Voltage FOD84 I F = ±ma, V CE = 5V () 2 3 % FOD84A 5 5 FOD67A I F = ma, V CE = 5V () 4 8 FOD67B FOD67C 2 FOD67D 6 32 FOD67A I F = ma, V CE = 5V () 3 FOD67B 22 FOD67C 34 FOD67D 56 FOD87 I F = 5mA, V CE = 5V () 5 6 FOD87A 8 6 FOD87B 3 26 FOD87C 2 4 FOD87D 3 6 FOD84 I F = ±2mA, I C = ma..2 V FOD67 I F = ma, I C = 2.5mA.4 FOD87 I F = 2mA, I C = ma..2 FOD84 Series, FOD67 Series, FOD87 Series Rev... 3
4 Electrical Characteristics (T A = 25 C Unless otherwise specified.) (Continued) Transfer Characteristics (Continued) Symbol AC Characteristic Device Test Conditions Min. Typ.* Max. Unit f C Cut-Off Frequency FOD84 V CE = 5V, I C = 2mA, R L = Ω, -3dB Isolation Characteristics *Typical values at T A = 25 C Notes:. Current Transfer Ratio (CTR) = I C /I F x %. 2. For test circuit setup and waveforms, refer to page For this test, Pins and 2 are common, and Pins 3 and 4 are common. 5 8 khz t r Response Time (Rise) FOD84 V CE = 2 V, I C = 2mA, R L = Ω (2) 4 8 µs FOD67 FOD87 t f Response Time (Fall) FOD µs FOD67 FOD87 Symbol Characteristic Device Test Conditions Min. Typ.* Max. Units V ISO Input-Output Isolation FOD84 f = 6Hz, t = min, Voltage (3) FOD67 I I-O 2µA FOD87 5 Vac(rms) R ISO Isolation Resistance FOD84 V I-O = 5VDC 5x x Ω FOD67 FOD87 C ISO Isolation Capacitance FOD84 V I-O =, f = MHz.6. pf FOD67 FOD87 FOD84 Series, FOD67 Series, FOD87 Series Rev... 4
5 Typical Electrical/Optical Characteristics (T A = 25 C Unless otherwise specified.) COLLECTOR POWER DISSIPATION PC (mw) COLLECTOR-EMITTER SATURATION VOLTAGE VCE (sat) (V) FORWARD CURRENT IF (ma) Fig. Collector Power Dissipation vs. Ambient Temperature (FOD84) Fig. 3 Collector-Emitter Saturation Voltage vs. Forward Current 2.5 Ic=.5mA m A 3m A 5m A 5. 7m A 7.5. Ta = 25 C 2.5 FORWARD CURRENT I F (ma) Fig. 5 Forward Current vs. Forward Voltage (FOD67/87) T A = o C 75 o C 5 o C 25 o C o C -3 o C -55 o C FORWARD VOLTAGE V F (V) COLLECTOR POWER DISSIPATION PC (mw) FORWARD CURRENT IF (ma) CURRENT TRANSFER RATIO CTR ( %) Fig. 2 Collector Power Dissipation vs. Ambient Temperature (FOD67/87) Fig. 4 Forward Current vs. Forward Voltage (FOD84) T A = 5 o C 75 o C 5 o C V = 5V Ta= 25 C FORWARD VOLTAGE V F (V) Fig. 6 Current Transfer Ratio vs. Forward Current FOD67/87 FOD84 25 o C o C -3 o C -55 o C FORWARD CURRENT I F (ma) FOD84 Series, FOD67 Series, FOD87 Series Rev... 5
6 Typical Electrical/Optical Characteristics (Continued) (T A = 25 C Unless otherwise specified.) COLLECTOR CURRENT IC (ma) RELATIVE CURRENT TRANSFER RATIO (%) LED POWER DISSIPATION PLED (mw) Fig. 7 Collector Current vs. Collector-Emitter Voltage (FOD84) I F = 3mA 2mA Fig. 9 Relative Current Transfer Ratio vs. Ambient Temperature FOD67/87 I F = 5mA V CE = 5V m A FOD84 I F = ma V CE = 5V 5m A Pc(MAX.) m A Ta= 25 C COLLECTOR-EMITTER VOLTAGE V CE (V) Fig. LED Power Dissipation vs. Ambient Temperature (FOD84) COLLECTOR-EMITTER SATURATION VOLTAGE V CE (sat) (V) LED POWER DISSIPATION PLED (mw) COLLECTOR CURRENT IC (ma) Fig. Collector-Emitter Saturation Voltage vs. Ambient Temperature.2 I = 2mA F I C = ma I I F = 3mA Fig. 8 Collector Current vs. Collector-Emitter Voltage (FOD67/87) 5 2mA ma 5mA Ta = 25 C Pc(MAX.) COLLECTOR-EMITTER VOLTAGE V CE (V) Fig. 2 LED Power Dissipation vs. Ambient Temperature (FOD67/87) FOD84 Series, FOD67 Series, FOD87 Series Rev... 6
7 Typical Electrical/Optical Characteristics (Continued) (T A = 25 C Unless otherwise specified.) RESPONSE TIME (µs) Test Circuit for Response Time Input R D Fig. 3 Response Time vs. Load Resistance V CE = 2V Ic= 2mA Ta= 25 C LOAD RESISTANCE R L (kω) R Vcc L tr td Output ts tf COLLECTOR DARK CURRENT I CEO (na) Input Output td. tr ts tf % 9% VOLTAGE GAIN A V (db) Fig. 5 Collector Dark Current vs. Ambient Temperature V CE = 2V Fig. 4 Frequency Response R L=k k FREQUENCY f (khz) Test Circuit for Frequency Response Vcc R D V CE = 2V Ic = 2mA Ta = 25 C RL Output FOD84 Series, FOD67 Series, FOD87 Series Rev... 7
8 Package Dimensions Through Hole SEATING PLANE.5 (3.8). (2.8).3 (3.3).9 (2.3). (2.79).9 (2.29).4" Lead Spacing SEATING PLANE.5 (3.8). (2.8).2 (5.).6 (4.).2 (5.).6 (4.).3 (3.3).9 (2.3).24 (.6).6 (.4).57 (4.).8 (3.).2 (.5) TYP.24 (.6).6 (.4).57 (4.).8 (3.). (2.79).9 (2.29) Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor s online packaging area for the most recent package drawings: (7.92).288 (7.32).276 (7.).236 (6.). (.26).393 (9.98).3 (7.62).32 (7.92).288 (7.32).276 (7.).236 (6.). (2.8). (.8).42 (.66).38 (9.66) Note: All dimensions are in inches (millimeters).29 (7.4).252 (6.4). (.26) Surface Mount SEATING PLANE.5 (.3).43 (.). (2.79).9 (2.29).2 (5.).6 (4.).57 (4.).8 (3.).24 (.6).4 (.) Lead Coplanarity.4 (.) MAX.32 (7.92).288 (7.32).276 (7.).236 (6.).49 (.25).3 (.76).42 (.46).388 (9.86) Surface Mount (Footprint Dimensions) (.26) FOD84 Series, FOD67 Series, FOD87 Series Rev... 8
9 Ordering Information Option Part Number Example Description S FOD84S Surface Mount Lead Bend SD FOD84SD Surface Mount; Tape and reel W FOD84W.4" Lead Spacing 3 FOD843 VDE Approved 3W FOD843W VDE Approved,.4" Lead Spacing 3S FOD843S VDE Approved, Surface Mount 3SD FOD843SD VDE Approved, Surface Mount, Tape & Reel Marking Information Definitions 3 Fairchild logo 2 Device number V 4 3 VDE mark (Note: Only appears on parts ordered with VDE option See order entry table) 4 One digit year code 5 Two digit work week ranging from to 53 X 6 Assembly package code 5 ZZ 84 Y 6 2 FOD84 Series, FOD67 Series, FOD87 Series Rev... 9
10 Carrier Tape Specifications Ø.55±.5 Note: All dimensions are in millimeters. Symbol Description Dimensions in mm (inches) W Tape wide 6 ±.3 (.63) P Pitch of sprocket holes 4 ±. (.5) F Distance of compartment 7.5 ±. (.295) P 2 2 ±. (.79) P Distance of compartment to compartment 2 ±. (.472) A Compartment.45 ±. (.4) B 5.3 ±. (.29) K 4.25 ±. (.67) P 2 P A P.75±. F B W.3±.5 K FOD84 Series, FOD67 Series, FOD87 Series Rev...
11 Lead Free Recommended IR Reflow Condition Temperature ( C) Profile Feature Pb-Sn solder assembly Lead Free assembly Preheat condition (Tsmin-Tsmax / ts) C ~ 5 C 6 ~ 2 sec Melt soldering zone 83 C 6 ~ 2 sec Recommended Wave Soldering condition 5 C ~ 2 C 6 ~2 sec 27 C 3 ~ 9 sec Peak temperature (Tp) 24 +/-5 C 26 +/-5 C Ramp-down rate 6 C/sec max. 6 C/sec max. Profile Feature Tp Tsmax Tsmin 25 C Peak temperature (Tp) ts (Preheat) Time (sec) For all solder assembly Max 26 C for sec Ramp-down Soldering zon FOD84 Series, FOD67 Series, FOD87 Series Rev...
12 TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. Build it Now CorePLUS CorePOWER CROSSVOLT CTL Current Transfer Logic EcoSPARK EfficentMax EZSWITCH * Fairchild Fairchild Semiconductor FACT Quiet Series FACT FAST FastvCore FlashWriter * FPS F-PFS FRFET Global Power Resource SM Green FPS Green FPS e-series GTO IntelliMAX ISOPLANAR MegaBuck MICROCOUPLER MicroFET MicroPak MillerDrive MotionMax Motion-SPM OPTOLOGIC OPTOPLANAR PDP SPM Power-SPM PowerTrench PowerXS Programmable Active Droop QFET QS Quiet Series RapidConfigure Saving our world, mw/w/kw at a time SmartMax SMART START SPM STEALTH SuperFET SuperSOT -3 SuperSOT -6 SuperSOT -8 SupreMOS SyncFET The Power Franchise * EZSWITCH and FlashWriter are trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER TinyBoost TinyBuck TinyLogic TINYOPTO TinyPower TinyPWM TinyWire µserdes UHC Ultra FRFET UniFET VCX VisualMax XS FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILDíS WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILDíS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. ANTI-COUNTERFEITING POLICY 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Fairchild Semiconductor Corporation s Anti-Counterfeiting Policy. Fairchild s Anti-Counterfeiting Policy is also stated on our external website, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild s qualitystandards for handling and storage and provide access to Fairchild s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Preliminary No Identification Needed Obsolete Formative / In Design First Production Full Production Not In Production Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I37 FOD84 Series, FOD67 Series, FOD87 Series Rev... 2
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