FODM V/5V Logic Gate Output Optocoupler with High Noise Immunity
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- Philip Martin Charles
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1 FODM V/5V Logic Gate Output Optocoupler with High Noise Immunity Features High noise immunity characterized by common mode rejection 2kV/µs minimum common mode rejection High speed 2Mbit/sec date rate (NRZ) 55ns max. propagation delay 2ns max. pulse width distortion 3ns max. propagation delay skew 3.3V and 5V CMOS compatibility Specifications guaranteed over 3V to 5.5V supply voltage and -4 C to +11 C temperature range Safety and regulatory approvals UL1577, 375 VAC RMS for 1 min. IEC (pending) Applications Microprocessor system interface SPI, I 2 C Industrial fieldbus communications DeviceNet, CAN, RS485 Programmable logic control Isolated data acquisition system Voltage level translator Description May 21 The FODM871 is a 3.3V/5V high-speed logic gate output Optocoupler, which supports isolated communications allowing digital signals to communicate between systems without conducting ground loops or hazardous voltages. It utilizes Fairchild s proprietary coplanar packaging technology, Optoplanar, and optimized IC design to achieve high noise immunity, characterized by high common mode rejection specifications. This high-speed logic gate output optocoupler, housed in a compact 5-Pin Mini-Flat package, consists of a highspeed AlGaAs LED at the input coupled to a CMOS detector IC at the output. The detector IC comprises an integrated photodiode, a high-speed transimpedance amplifier and a voltage comparator with an output driver. The CMOS technology coupled with a high efficiency LED achieves low power consumption as well as very high speed (55ns propagation delay, 2ns pulse width distortion). Related Resources Functional Schematic ANODE 1 6 Truth Table LED Output 5 V O Off On High Low CATHODE 3 4 GND FODM871 Rev. 1..7
2 Pin Definitions Number Name Function Description 1 ANODE Anode 3 CATHODE Cathode 4 GND Output Ground 5 V O Output Voltage 6 Output Supply Voltage Safety and Insulation Ratings for Mini-Flat Package (SO5 Pin) As per IEC (Pending Certification). This optocoupler is suitable for safe electrical insulation only within the safety limit data. Compliance with the safety ratings shall be ensured by means of protective circuits. Symbol Parameter Min. Typ. Max. Unit Installation Classifications per DIN VDE 11/1.89 Table 1 For rated main voltage < 15Vrms I-IV For rated main voltage < 3Vrms I-III Climatic Classification 4/11/21 Pollution Degree (DIN VDE 11/1.89) 2 CTI Comparative Tracking Index 175 V PR Input to Output Test Voltage, Method b, VIORM x = V PR, 1% Production Test with t m = 1 sec, Partial Discharge < 5 pc 16 V V PR Input to Output Test Voltage, Method a, VIORM x 1.5 = V PR, Type and Sample Test with t m = 6 sec, Partial Discharge < 5 pc 848 V V IORM Max Working Insulation Voltage 565 V peak V IOTM Highest Allowable Over Voltage 4 V peak External Creepage 5. mm External Clearance 5. mm Insulation Thickness.5 mm T Case Safety Limit Values, Maximum Values allowed in the event 15 C of a failure, Case Temperature R IO Insulation Resistance at T STG,V IO = 5V 1 9 Ω FODM871 Rev
3 Absolute Maximum Ratings ( = 25ºC unless otherwise specified) Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.. Symbol Parameter Value Units T STG Storage Temperature -4 to +125 ºC T OPR Operating Temperature -4 to +11 ºC T J Junction Temperature -4 to +125 ºC T SOL Lead Solder Temperature (Refer to Reflow 26 for 1sec ºC Temperature Profile) I F Forward Current 2 ma V R Reverse Voltage 5 V Supply Voltage to 6. V V O Output Voltage -.5 to +.5 V I O Average Output Current 1 ma PD I Input Power Dissipation (1)(3) 4 mw PD O Output Power Dissipation (2)(3) 7 mw Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Max. Unit Ambient Operating Temperature ºC Supply Voltages (4) V V FL Logic Low Input Voltage.8 V I FH Logic High Input Current 5 16 ma I OL Logic Low Output Current 7 ma Isolation Characteristics (Apply over all recommended conditions, typical value is measured at = 25ºC) Symbol Parameter Conditions Min. Typ. Max. Units V ISO Input-Output Isolation Voltage freq = 6Hz, t = 1.min, I I-O 1µA (5)(6) 375 Vac RMS R ISO Isolation Resistance V I-O = 5V (5) 1 11 Ω C ISO Isolation Capacitance V I-O = V, freq = 1.MHz (5).2 pf Notes: 1. Derate linearly from 95 C at a rate of -1.4mW/ C 2. Derate linearly from 1 C at a rate of -3.47mW/ C. 3. Functional operation under these conditions is not implied. Permanent damage may occur if the device is subjected to conditions outside these ratings. 4..1µF bypass capacitor must be connected between 4 and Device is considered a two terminal device: Pins 1, and 3 are shorted together and Pins 4, 5, and 6 are shorted together. 6. 3,75 VAC RMS for 1 minute duration is equivalent to 4,5 VAC RMS for 1 second duration. FODM871 Rev
4 Electrical Characteristics (Apply over all recommended conditions) ( = -4ºC to +11ºC, 3.V 5.5V), unless otherwise specified. Typical value is measured at = 25ºC and = 3.3V. Symbol Parameter Test Conditions Min. Typ. Max. Units INPUT CHARACTERISTICS V F Forward Voltage I F = 1mA, Fig V BV R Input Reverse Breakdown I R = 1µA 5 15 V Voltage I FHL Threshold Input Current Fig ma OUTPUT CHARACTERISTICS I DDL Logic Low Output Supply Current = 3.3V, I F = 1mA, Fig. 3, ma = 5.V, I F = 1mA, Fig. 3, ma I DDH Logic High Output Supply = 3.3V, I F = ma, Fig ma Current = 5.V, I F = ma, Fig ma V OH Logic High Output Voltage = 3.3V, I O = -2µA, I F = ma.1v 3.3 V = 3.3V, I O = -4mA, I F = ma.5v 3.1 V = 5.V, I O = -2µA, I F = ma.1v 5. V = 5.V, I O = -4mA, I F = ma.5v 4.9 V V OL Logic Low Output Voltage I O = 2µA, I F = 1mA.27.1 V I O = 4mA, I F = 1mA.27.8 V FODM871 Rev
5 Switching Characteristics (Apply over all recommended conditions) ( = -4ºC to +11ºC, 3.V 5.5V, I F = 5mA), unless otherwise specified. Typical value is measured at = 25ºC and = 3.3V Symbol Parameter Test Conditions Min. Typ. Max. Units Date Rate (7) 2 Mbps t PW Pulse Width 5 ns t PHL Propagation Delay Time C L = 15pF, Fig. 7, 8, ns to Logic Low Output t PLH Propagation Delay Time C L = 15pF, Fig. 7, 8, ns to Logic High Output PWD Pulse Width Distortion, C L = 15pF, Fig. 9, ns t PHL - t PLH t PSK Propagation Delay Skew C L = 15pF (8) 3 ns t R Output Rise Time Fig. 11, ns (1% to 9%) t F Output Fall Time Fig. 11, ns (9% to 1%) CM H Common Mode Transient Immunity at Output High I F = ma, V O >.8, V CM = 1V, = 25ºC, Fig. 13 (9) 2 4 kv/µs CM L Common Mode Transient Immunity at Output Low C PDO Output Dynamic Power Dissipation Capacitance (1) I F = 5mA, V O <.8V, V CM = 1V, = 25ºC, Fig. 13 (9) 2 4 kv/µs 4 pf Notes: 7. Data rate is based on 1MHz, 5% NRZ pattern with a 5nsec minimum bit time. 8. t PSK is equal to the magnitude of the worst case difference in t PHL and/or t PLH that will be seen between any two units from the same manufacturing date code that are operated at same case temperature (±5 C), at same operating conditions, with equal loads (R L = 35Ω and C L = 15pF), and with an input rise time less than 5ns. 9. Common mode transient immunity at output high is the maximum tolerable positive dvcm/dt on the leading edge of the common mode impulse signal, Vcm, to assure that the output will remain high. Common mode transient immunity at output low is the maximum tolerable negative dvcm/dt on the trailing edge of the common pulse signal, Vcm, to assure that the output will remain low. 1.Unloaded dynamic power dissipation is calculated as follows: C PD x x f + I DD + V PD where f is switched time in MHz. FODM871 Rev
6 Typical Performance Curves (Continued) IDDL LOGIC LOW OUTPUT SUPPLY CURRENT (ma) IF INPUT FORWARD CURRENT (ma) IDDL DYNAMIC LOGIC LOW OUTPUT SUPPLY CURRENT (ma) = 11 C = 25 C = -4 C V F FORWARD VOLTAGE (V) AMBIENT TEMPERATURE ( C) Fig. 1 Input Forward Current vs. Forward Voltage I F = 1mA Fig 3. Logic Low Output Supply Current vs. Ambient Temperature = 5.V = 3.3V Fig. 5 Dynamic Logic Low Output Supply Current vs. Input Frequency ( = 3.3V) Frequency = 1MHz Duty Cycle = 5% I F = 1mA = 3.3V = 25 C = 11 C = -4 C IFHL INPUT THRESHOLD CURRENT (ma) IDDH LOGIC HIGH OUTPUT SUPPLY CURRENT (ma) IDDL DYNAMIC LOGIC LOW OUTPUT SUPPLY CURRENT (ma) Fig. 2 Input Threshold Current vs. Ambient Temperature = 5.V = 3.3V I F = ma AMBIENT TEMPERATURE ( C) Fig 4. Logic High Output Supply Current vs. Ambient Temperature = 5.V = 3.3V AMBIENT TEMPERATURE ( C) Fig. 6 Dynamic Logic Low Output Supply Current vs. Input Frequency ( = 5.V) Frequency = 1MHz Duty Cycle = 5% I F = 1mA = 5.V = 25 C = 11 C = -4 C f INPUT FREQUENCY (khz) f INPUT FREQUENCY (khz) FODM871 Rev
7 Typical Performance Curves (Continued) tp PROPAGATION DELAY (ns) ( tphl tplh ) PULSE WIDTH DISTORTION (ns) Fig 7. Propagation Delay vs. Ambient Temperature Frequency = 1MHz Duty Cycle = 5% I F = 5mA = 3.3V = 5.V tphl t PHL tplh t PLH Fig 9. Pulse Width Distortion vs. Ambient Temperature Frequency = 1MHz Duty Cycle = 5% I F = 5mA AMBIENT TEMPERATURE ( C) = 3.3V = 5.V AMBIENT TEMPERATURE ( C) Fig 11. Rise and Fall Time vs. Ambient Temperature 1 Frequency = 1MHz Duty Cycle = 5% I 9 F = 5mA tp PROPAGATION DELAY (ns) ( tphl tplh ) PULSE WIDTH DISTORTION (ns) Fig 1. Pulse Width Distortion vs Pulse Input Current 15 Frequency = 1MHz Duty Cycle = 5% = 25 C Fig 8. Propagation Delay vs. Pulse Input Current Frequency = 1MHz Duty Cycle = 5% = 25 C = 3.3V = 5.V t PLH t PLH I F PULSE INPUT CURRENT (ma) = 3.3V = 5.V t PHL t PHL I F PULSE INPUT CURRENT (ma) tr, tf RISE, FALL TIME (ns) t R t F tr 4 t F = 3.3V = 5.V AMBIENT TEMPERATURE ( C) FODM871 Rev
8 Schematics Pulse Gen. t f = tr = 5ns Z O = 5Ω Input Monitoring Node Input Output R IN t PHL V O Monitoring Node C L = 15pF Figure 12. Test Circuit for Propagation Delay Time, Rise Time and Fall Time V FF A B 9% 1% I F t f t PLH V CM V CC.1µF 5% I F = 5mA t r 9% 5% 1% V OL.1µF Bypass Output (Vo) Pulse Gen GND V CM V OH Switching Pos. (A), I F =.8 x CM H V OL.8V Switching Pos. (B), I F = 5mA CM L Figure 13. Test Circuit for Instantaneous Common Mode Rejection Voltage FODM871 Rev
9 Package Dimensions Notes: 1. No standard applies to this package. 2. All dimensions are in millimeters. 3. Dimensions are exclusive of burrs, mold flash, and tie bar extrusion. 4. Drawings filesname and revision: MKT-MFP5A. Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor s online packaging area for the most recent package drawings: FODM871 Rev
10 Ordering Information Option Order Entry Identifier Description No Suffix FODM871 Mini-Flat 5-pin, shipped in tubes (1 units per tube) R2 FODM871R2 Mini-Flat 5-pin, tape and reel (2,5 units per reel) All packages are lead free per JEDEC: J-STD-2B standard. Marking Information Definitions V Fairchild logo 2 Device number 3 IEC (VDE marking) 4 One digit year code, e.g., 9 5 Two digit work week ranging from 1 to 53 6 Assembly package code X M871 YY M FODM871 Rev
11 Tape and Reel Dimensions K t d W Description Tape Width Tape Thickness Sprocket Hole Pitch Sprocket Hole Diameter Sprocket Hole Location Pocket Location Pocket Pitch Pocket Dimension Pocket Hole Diameter Cover Tape Width Cover Tape Thickness Max. Component Rotation or Tilt Devices Per Reel 1 P Symbol W t P D E F P P A B K D W 1 d 2 1 A P P 2 B D D 1 F 2.54 Pitch Dimensions (mm) / ±.5 4. ± / ± ±.1 2. ±.1 8. ± ± ± ± Min ±.1 1 Max. 25 E W Reel Diameter 33mm (13") FODM871 Rev
12 Reflow Profile Temperature ( C) TP TL Tsmax Tsmin Max. Ramp-up Rate = 3 C/S Max. Ramp-down Rate = 6 C/S Preheat Area Time 25 C to Peak Time (seconds) Profile Feature Pb-Free Assembly Profile Temperature Min. (Tsmin) 15 C Temperature Max. (Tsmax) 2 C Time (t S ) from (Tsmin to Tsmax) 6 12 seconds Ramp-up Rate (t L to t P ) 3 C/second max. Liquidous Temperature (T L ) 217 C Time (t L ) Maintained Above (T L ) 6 15 seconds Peak Body Package Temperature 26 C + C / 5 C Time (t P ) within 5 C of 26 C 3 seconds Ramp-down Rate (T P to T L ) 6 C/second max. Time 25 C to Peak Temperature 8 minutes max. ts tl tp FODM871 Rev
13 TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries,and is not intended to be an exhaustive list of all such trademarks. AccuPower Auto-SPM Build it Now CorePLUS CorePOWER CROSSVOLT CTL Current Transfer Logic DEUXPEED Dual Cool EcoSPARK EfficientMax n ESBC Fairchild Fairchild Semiconductor FACT Quiet Series FACT FAST FastvCore FETBench FlashWriter * FPS F-PFS FRFET Global Power Resource SM Green FPS Green FPS e-series Gmax GTO IntelliMAX ISOPLANAR MegaBuck MICROCOUPLER MicroFET MicroPak MicroPak2 MillerDrive MotionMax Motion-SPM OptoHiT OPTOLOGIC OPTOPLANAR PDP SPM Power-SPM PowerTrench PowerXS Programmable Active Droop QFET QS Quiet Series RapidConfigure Saving our world, 1mW/W/kW at a time SignalWise SmartMax SMART START SPM STEALTH SuperFET SuperSOT -3 SuperSOT -6 SuperSOT -8 SupreMOS SyncFET Sync-Lock * Trademarks of System General Corporation, used under license by Fairchild Semiconductor. * The Power Franchise TinyBoost TinyBuck TinyCalc TinyLogic TINYOPTO TinyPower TinyPWM TinyWire TriFault Detect TRUECURRENT * " SerDes UHC Ultra FRFET UniFET VCX VisualMax XS DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOSSUME ANYLIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOESIT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on ourexternal website, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers fromthe proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary No Identification Needed Obsolete Product Status Formative / In Design First Production Full Production Not In Production Definition Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I49 FODM871 Rev
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