SMCG-HRA Series. Transient Voltage Suppression Diodes Surface Mount 1500W > SMCG-HRA series

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1 SMCG-HRA Series RoHS Pb e3 Description The SMCG-HRA series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. Features Agency Approvals AGENCY Parameter Symbol Value Unit Peak Pulse Power Dissipation at T A =25ºC by 1/µs waveform (Fig.2)(Note 1), (Note 2) P PPM 15 W Power Dissipation on infinite heat sink at T A =5 O C Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3) Maximum Instantaneous Forward Voltage at A for Unidirectional only Operating Junction and Storage Temperature Range Typical Thermal Resistance Junction to Lead Typical Thermal Resistance Junction to Ambient AGENCY FILE NUMBER E23531 Maximum Ratings and Thermal Characteristics (T A =25 O C unless otherwise noted) P M(AV) 6.5 W I FSM 2 A V F 3.5 V T J, T STG -65 to 15 C R ujl 15 C/W R uja 75 C/W Notes: 1. Non-repetitive current pulse, per Fig. 4 and derated above T A = 25 O C per Fig Mounted on copper pad area of.31x.31 (8. x 8.mm) to each terminal. 3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only, duty cycle=4 per minute maximum. High-Reliability upscreened for critical applications require higher reliability performance and low infant mortality failures. Excellent clamping capability Low incremental surge resistance Typical I R less than 1µA above 12V For surface mounted applications to optimize board space L bend lead forming gives best solderbility for Hi reliability application Typical failure mode is short from over-specified voltage or current Whisker test is conducted based on JEDEC JESD21A per its table 4a and 4c IEC ESD 15kV(Air), 8kV (Contact) ESD protection of data lines in accordance with IEC (IEC81-2) Applications EFT protection of data lines in accordance with IEC (IEC81-4) Built-in strain relief Fast response time: typically less than 1.ps from V to BV min 15W peak pulse power capability at 1/μs waveform, repetition rate (duty cycles):.1% V J = V C x (1+αT x (T J - 25)) (αt:temperature Coefficient, typical value is.1%) Glass passivated chip junction High temperature soldering guaranteed: 26 C/1 seconds at terminals Meet MSL level1, per J-STD-2, LF maximun peak of 26 C Matte tin lead free plated Halogen free RoHS compliant with exemption 7a and 7c-I 2nd level interconnect is Pb-free per IPC/JEDEC J-STD-69A.1 TVS devices are ideal for the protection of I/O Interfaces, V CC bus and other vulnerable circuits used in Telecom, Computer, Industrial and Consumer electronic applications. Functional Diagram Bi-directional Cathode Anode Uni-directional

2 Electrical Characteristics Part Number (Uni) Part Number (Bi) Marking Note: 1. For bidirectional type having V R of 1 volts and less, the I R limit is double. Reverse Stand off Voltage V R (Volts) Breakdown Voltage V BR I T UNI BI MIN MAX Test Current I T (ma) Maximum Clamping Voltage V I pp (V) Maximum Peak Pulse Current I pp (A) Maximum Reverse Leakage I V R (µa) SMCG5.A-HRA SMCG5.CA-HRA GDEH BDEH X SMCG6.A-HRA SMCG6.CA-HRA GDGH BDGH X SMCG6.5A-HRA SMCG6.5CA-HRA GDKH BDKH X SMCG7.A-HRA SMCG7.CA-HRA GDMH BDMH X SMCG7.5A-HRA SMCG7.5CA-HRA GDPH BDPH X SMCG8.A-HRA SMCG8.CA-HRA GDRH BDRH X SMCG8.5A-HRA SMCG8.5CA-HRA GDTH BDTH X SMCG9.A-HRA SMCG9.CA-HRA GDVH BDVH X SMCG1A-HRA SMCG1CA-HRA GDXH BDXH X SMCG11A-HRA SMCG11CA-HRA GDZH BDZH X SMCG12A-HRA SMCG12CA-HRA GEEH BEEH X SMCG13A-HRA SMCG13CA-HRA GEGH BEGH X SMCG14A-HRA SMCG14CA-HRA GEKH BEKH X SMCG15A-HRA SMCG15CA-HRA GEMH BEMH X SMCG16A-HRA SMCG16CA-HRA GEPH BEPH X SMCG17A-HRA SMCG17CA-HRA GERH BERH X SMCG18A-HRA SMCG18CA-HRA GETH BETH X SMCG2A-HRA SMCG2CA-HRA GEVH BEVH X SMCG22A-HRA SMCG22CA-HRA GEXH BEXH X SMCG24A-HRA SMCG24CA-HRA GEZH BEZH X SMCG26A-HRA SMCG26CA-HRA GFEH BFEH X SMCG28A-HRA SMCG28CA-HRA GFGH BFGH X SMCG3A-HRA SMCG3CA-HRA GFKH BFKH X SMCG33A-HRA SMCG33CA-HRA GFMH BFMH X SMCG36A-HRA SMCG36CA-HRA GFPH BFPH X SMCG4A-HRA SMCG4CA-HRA GFRH BFRH X SMCG43A-HRA SMCG43CA-HRA GFTH BFTH X SMCG45A-HRA SMCG45CA-HRA GFVH BFVH X SMCG48A-HRA SMCG48CA-HRA GFXH BFXH X SMCG51A-HRA SMCG51CA-HRA GFZH BFZH X SMCG54A-HRA SMCG54CA-HRA GGEH BGEH X SMCG58A-HRA SMCG58CA-HRA GGGH BGGH X SMCG6A-HRA SMCG6CA-HRA GGKH BGKH X SMCG64A-HRA SMCG64CA-HRA GGMH BGMH X SMCG7A-HRA SMCG7CA-HRA GGPH BGPH X SMCG75A-HRA SMCG75CA-HRA GGRH BGRH X SMCG78A-HRA SMCG78CA-HRA GGTH BGTH X SMCG85A-HRA SMCG85CA-HRA GGVH BGVH X SMCG9A-HRA SMCG9CA-HRA GGXH BGXH X SMCGA-HRA SMCGCA-HRA GGZH BGZH X SMCG11A-HRA SMCG11CA-HRA GHEH BHEH X SMCG12A-HRA SMCG12CA-HRA GHGH BHGH X Agency Approval

3 Screen Process % vision inspection MIL-STD-75 method 274 %High Temperature Storage Life (168hrs,175C) MIL-STD-75 method 131 % X-RAY inspection MIL-STD-75 method 276 % Temperature cycle test (-55-15C, 2 cycles, dwell time 15 min) MIL-STD-75 method 151 % Reflow (2x) JEDEC J-STD-2 % surge test (2x) MIL-STD-75 method 466 % HTRB(15C, Bias=VR(8% breakdown voltage), 96hrs),for Bidirection products, 96hrs for each direction Final electrical test( % 3 sigma limit, % dynamic test and PAT limit) MIL STD 75 method 138 MIL-STD-75 method Note: Up-screen program can be specified by customer s request via contacting Littelfuse service I-V Curve Characteristics Uni-directional Bi-directional Ipp Vc VBR VR IR IT VF V Vc VBR VR IT IR IR IT VRVBR Vc V Ipp Ipp P PPM Peak Pulse Power Dissipation -- Max power dissipation V R Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation V BR Breakdown Voltage -- Maximum voltagethat flows though the TVS at a specified test current (I T ) V C Clamping Voltage -- Peak voltage measured across the TVS at a specified Ippm (peak impulse current) I R V F Reverse Leakage Current -- Current measured at V R Forward Voltage Drop for Uni-directional Ratings and Characteristic Curves (T A =25 C unless otherwise noted) Figure 1 - TVS Transients Clamping Waveform Figure 2 - Peak Pulse Power Rating Voltage Transients Voltage or Current Voltage Across TVS Current Through TVS P PPM -Peak Pulse Power (kw) 1 1 TJ initial = Tamb Time t d -Pulse Width (ms) continues on next page.

4 Ratings and Characteristic Curves (T A =25 C unless otherwise noted) (Continued) Figure 3 - Peak Pulse Power Derating Curve Figure 4 - Pulse Waveform Peak Pulse Power (P PP ) or Current (I PP ) Derating in Percentage % T J - Initial Junction Temperature (ºC) I PPM - Peak Pulse Current, % I RSM 15 5 td tr=1µsec Peak Value IPPM Half Value IPPM 2 IPPM ( ) TJ=25 C Pulse Width(td) is defined as the point where the peak current decays to 5% of IPPM 1/µsec. Waveform as defined by R.E.A t-time (ms) Figure 5 - Typical Junction Capacitance Figure 6 - Typical Transient Thermal Impedance Cj(pF) Uni-directional V=V Bi-directional V=V Uni-directional V=V R Bi-directional V=V 1 R V BR -Reverse Breakdown Voltage(V) Transient Thermal Impedance ( C/W) T -Pulse Duration (s) P Figure 7 - Maximum Non-Repetitive Peak Forward Surge Current Uni-Directional Only I FSM - Peak Forward Surge Current (A) Number of Cycles at 6 Hz

5 Temperature (T) Transient Voltage Suppression Diodes Soldering Parameters Reflow Condition Lead free assembly t p Pre Heat - Temperature Min (T s(min) ) 15 C - Temperature Max (T s(max) ) 2 C - Time (min to max) (t s ) 6 12 secs T P T L T s(max) Ramp-up t L Critical Zone T L to T P Average ramp up rate (Liquidus Temp (T L ) to peak 3 C/second max T S(max) to T L - Ramp-up Rate 3 C/second max Reflow - Temperature (T L ) (Liquidus) 217 C - Time (min to max) (t s ) 6 15 seconds Peak Temperature (T P ) 26 +/-5 C T s(min) 25 C t s Preheat t 25 C to Peak Time (t) Ramp-down Time within 5 C of actual peak Temperature (t p ) 3 seconds Ramp-down Rate 6 C/second max Time 25 C to peak Temperature (T P ) 8 minutes Max. Do not exceed 26 C Environmental Specifications High Temp. Storage JESD22-A13 Physical Specifications HTRB JESD22-A18 Weight Case Polarity.7 ounce,.21 grams JEDEC DO-215AB. Molded plastic body over glass passivated junction Color band denotes positive end (cathode) except Bidirectional. Thermal Shock JESD22-A16 MSL JEDEC-J-STD-2, Level 1 H3TRB JESD22-A11 Terminal Matte Tin-plated leads, Solderable per JESD22-B12 RSH JESD22-A111 Dimensions DO-215AB (SMCG) Cathode Band Dimensions Inches Millimeters Min Max Min Max A C A B C B D D H N E F G E F I G Dimensions in inches and (millimeters) J K L H I J K L M M N Solder Pads

6 Part Numbering System Part Marking System SMCG xxx CA-HR SERIES V R VOLTAGE A BI-DIRECTIONAL WITHOUT GROUP B TEST High Reliability 5% V BR VOLTAGE TOLERANCE F XXX YMXXX Cathode Band (for Uni-directional products only) Littelfuse Logo Marking Code Trace Code Marking Y:Year Code M: Month Code XXX: Lot Code Packaging Part number Component Package Quantity Packaging Option Packaging Specification SMCGxxxXX-HRA DO-215AB 15 Tape & Reel 24mm tape /13 reel EIA STD RS-481 Tape and Reel Specification.945 (24.).157 (4.) Cathode.472 (12.).59 DIA (1.5) Cover tape.8 (2.2) Arbor Hole Dia. 13. (33) Dimensions are in inches (and millimeters)..96 (24.4) Direction of Feed