Transient Voltage Suppression Diodes Surface Mount 1500W > SMCJ-HRA series. Bi-directional 1500 W 6.5 W 200 A V BR 3.5/5.0 V. -55 to 150 C 15 C/W

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1 RoHS Uni-directional Description Bi-directional The SMCJ-HRA High Reliability series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. These are available with a variety of upscreening options for enhanced reliability. Agency Approvals AGENCY Parameter Symbol Value Unit Peak Pulse Power Dissipation at T A =25ºC by 1/µs waveform (Fig.1)(Note 1), (Note 2) P PPM 15 W Power Dissipation on infinite heat sink at T A =5 O C Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3) Maximum Instantaneous Forward Voltage at A for Unidirectional only (Note 4) Operating Junction and Storage Temperature Range Typical Thermal Resistance Junction to Lead Typical Thermal Resistance Junction to Ambient AGENCY FILE NUMBER E23531 Maximum Ratings and Thermal Characteristics (T A =25 O C unless otherwise noted) P M(AV) 6.5 W I FSM 2 A V F 3.5/5. V T J, T STG -55 to 15 C R ujl 15 C/W R uja 75 C/W Notes: 1. Non-repetitive current pulse, per Fig. 3 and derated above T A = 25 O C per Fig Mounted on copper pad area of.31x.31 (8. x 8.mm) to each terminal. 3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only, duty cycle=4 per minute maximum. 4. V F <3.5V for V BR _< 2V and V F <5.V for V BR _> 21V. Features High reliability devices with fabrication and assembly lots traceability Enhanced reliability screening options are available in reference to MIL-PRF-195. Refer to screen process table for more detail on screening options For surface mounted applications to optimize board space Low profile package Built-in strain relief V J = V C x (1+αT x (T J - 25)) (αt:temperature Coefficient) Glass passivated chip junction 15W peak pulse power capability at 1/μs waveform, repetition rate (duty cycles):.1% Fast response time: typically less than 1.ps from V to BV min Excellent clamping capability Low incremental surge resistance Typical I R less than 1µA above 12V High Temperature soldering guaranteed: 26 C/4 seconds at terminals Plastic package has Underwriters laboratory flammability 94V-O Meet MSL level1, per J-STD-2, LF maximun peak of 26 C Matte tin lead free plated Halogen free and RoHS compliant Functional Diagram Bi-directional Applications SMCJ-HRA devices are ideal for the high reliability protection of I/O Interfaces, V CC bus and other vulnerable circuits used in Telecom, Computer, Industrial and Consumer electronic applications. Cathode Anode Uni-directional 34 1

2 Electrical Characteristics Part Number (Uni) Part Number (Bi) Marking Reverse Stand off Voltage V R Breakdown Voltage V BR I T UNI BI (Volts) MIN MAX Test Current I T (ma) Maximum Clamping Voltage V I pp (V) Maximum Peak Pulse Current I pp (A) Maximum Reverse Leakage I V R (µa) SMCJ5.A-HRA SMCJ5.CA-HRA GDEH BDEH X SMCJ6.A-HRA SMCJ6.CA-HRA GDGH BDGH X SMCJ6.5A-HRA SMCJ6.5CA-HRA GDKH BDKH X SMCJ7.A-HRA SMCJ7.CA-HRA GDMH BDMH X SMCJ7.5A-HRA SMCJ7.5CA-HRA GDPH BDPH X SMCJ8.A-HRA SMCJ8.CA-HRA GDRH BDRH X SMCJ8.5A-HRA SMCJ8.5CA-HRA GDTH BDTH X SMCJ9.A-HRA SMCJ9.CA-HRA GDVH BDVH X SMCJ1A-HRA SMCJ1CA-HRA GDXH BDXH X SMCJ11A-HRA SMCJ11CA-HRA GDZH BDZH X SMCJ12A-HRA SMCJ12CA-HRA GEEH BEEH X SMCJ13A-HRA SMCJ13CA-HRA GEGH BEGH X SMCJ14A-HRA SMCJ14CA-HRA GEKH BEKH X SMCJ15A-HRA SMCJ15CA-HRA GEMH BEMH X SMCJ16A-HRA SMCJ16CA-HRA GEPH BEPH X SMCJ17A-HRA SMCJ17CA-HRA GERH BERH X SMCJ18A-HRA SMCJ18CA-HRA GETH BETH X SMCJ2A-HRA SMCJ2CA-HRA GEVH BEVH X SMCJ22A-HRA SMCJ22CA-HRA GEXH BEXH X SMCJ24A-HRA SMCJ24CA-HRA GEZH BEZH X SMCJ26A-HRA SMCJ26CA-HRA GFEH BFEH X SMCJ28A-HRA SMCJ28CA-HRA GFGH BFGH X SMCJ3A-HRA SMCJ3CA-HRA GFKH BFKH X SMCJ33A-HRA SMCJ33CA-HRA GFMH BFMH X SMCJ36A-HRA SMCJ36CA-HRA GFPH BFPH X SMCJ4A-HRA SMCJ4CA-HRA GFRH BFRH X SMCJ43A-HRA SMCJ43CA-HRA GFTH BFTH X SMCJ45A-HRA SMCJ45CA-HRA GFVH BFVH X SMCJ48A-HRA SMCJ48CA-HRA GFXH BFXH X SMCJ51A-HRA SMCJ51CA-HRA GFZH BFZH X SMCJ54A-HRA SMCJ54CA-HRA GGEH BGEH X SMCJ58A-HRA SMCJ58CA-HRA GGGH BGGH X SMCJ6A-HRA SMCJ6CA-HRA GGKH BGKH X SMCJ64A-HRA SMCJ64CA-HRA GGMH BGMH X SMCJ7A-HRA SMCJ7CA-HRA GGPH BGPH X SMCJ75A-HRA SMCJ75CA-HRA GGRH BGRH X SMCJ78A-HRA SMCJ78CA-HRA GGTH BGTH X SMCJ85A-HRA SMCJ85CA-HRA GGVH BGVH X SMCJ9A-HRA SMCJ9CA-HRA GGXH BGXH X SMCJA-HRA SMCJCA-HRA GGZH BGZH X SMCJ11A-HRA SMCJ11CA-HRA GHEH BHEH X SMCJ12A-HRA SMCJ12CA-HRA GHGH BHGH X SMCJ13A-HRA SMCJ13CA-HRA GHKH BHKH X SMCJ15A-HRA SMCJ15CA-HRA GHMH BHMH X SMCJ16A-HRA SMCJ16CA-HRA GHPH BHPH X SMCJ17A-HRA SMCJ17CA-HRA GHRH BHRH X Note: 1. For bidirectional type having V R of 1 volts and less, the I R limit is double. 2.SMCJ-HRA voltage binning can be specified by customer s request via contacting Littlefuse service Agency Approval 35 2

3 Screen Process % vision inspection MIL-STD-75 method 274 %High Temperature Storage Life (168hrs,15C) MIL-STD-75 method 131 % X-RAY inspection MIL-STD-75 method 276 % Temperature cycle test (-55-15C, 2 cycles, dwell time 15 min) MIL-STD-75 method 151 % Reflow (2X) JEDEC J-STD-2 % surge test (2x) MIL-STD-75 method 466 % HTRB(15C, Bias=VR(8% breakdown voltage), 96hrs),for Bidirection products, 96hrs for each direction MIL STD 75 method 138 Final electrical test( % 3 sigma limit, % dynamic test and PAT limit) Note: Up-screen program can be specified by customer s request via contacting Littlefuse service I-V Curve Characteristics MIL-STD-75 method Uni-directional Bi-directional Ipp Vc VBR VR IR IT VF V Vc VBR VR IT IR IR IT VRVBR Vc V Ipp Ipp P PPM Peak Pulse Power Dissipation -- Max power dissipation V R Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation V BR Breakdown Voltage -- Maximum current that flows though the TVS at a specified test current (I T ) V C Clamping Voltage -- Peak voltage measured across the suppressor at a specified Ippm (peak impulse current) I R V F Reverse Leakage Current -- Current measured at V R Forward Voltage Drop for Uni-directional Ratings and Characteristic Curves (T A =25 C unless otherwise noted) Figure 1 - TVS Transients Clamping Waveform Figure 2 - Peak Pulse Power Rating Voltage Transients Voltage or Current Voltage Across TVS Current Through TVS P PPM -Peak Pulse Power (kw) 1.31x.31" (8.x8.mm) Copper Pad Area Time t d -Pulse Width (sec.) 36 3 continues on next page.

4 Ratings and Characteristic Curves (T A =25 C unless otherwise noted) (Continued) Figure 3 - Pulse Derating Curve Figure 4 - Pulse Waveform Peak Pulse Power (P PP ) or Current (I PP ) Derating in Percentage % T A -Ambient temperature (ºC) I PPM - Peak Pulse Current, % I RSM 15 5 td tr=1µsec Peak Value IPPM Half Value IPPM 2 IPPM ( ) TJ=25 C Pulse Width(td) is defined as the point where the peak current decays to 5% of IPPM 1/µsec. Waveform as defined by R.E.A t-time (ms) Figure 5 - Typical Junction Capacitance Figure 6 - Steady State Power Dissipation Derating Curve Cj (pf) R Bi-directional V=V Uni-directional V=V R 1 Tj=25C f=1.mhz Vsig=5mVp-p V BR - Reverse Breakdown Voltage (V) P M(AV), Steady Sate Power Dissipation (W) T A - Ambient Temperature (ºC) Figure 7 - Maximum Non-Repetitive Peak Forward Surge Current Uni-Directional Only I FSM - Peak Forward Surge Current (A) Number of Cycles at 6 Hz 37 4

5 Temperature (T) Soldering Parameters Reflow Condition Lead free assembly t p - Temperature Min (T s(min) ) 15 C Pre Heat - Temperature Max (T s(max) ) 2 C - Time (min to max) (t s ) 6 18 secs Average ramp up rate (Liquidus Temp (T L ) to peak 3 C/second max T S(max) to T L - Ramp-up Rate 3 C/second max Reflow - Temperature (T L ) (Liquidus) 217 C - Time (min to max) (t s ) 6 15 seconds Peak Temperature (T P ) 26 +/-5 C Time within 5 C of actual peak Temperature (t p ) 2 4 seconds Ramp-down Rate 6 C/second max Time 25 C to peak Temperature (T P ) 8 minutes Max. Do not exceed 28 C Physical Specifications Weight Case Polarity.7 ounce,.21 grams JEDEC DO214AB. Molded plastic body over glass passivated junction Color band denotes positive end (cathode) except Bidirectional. T P T L T s(max) T s(min) 25 C t s Preheat t 25 C to Peak Environmental Specifications High Temp. Storage HTRB Thermal Shock Ramp-up Time (t) JESD22-A13 JESD22-A18 JESD22-A16 t L Critical Zone T L to T P Ramp-down MSL JEDEC-J-STD-2C, Level 1 H3TRB JESD22-A11 Terminal Matte Tin-plated leads, Solderable per JESD22-B12D RSH JESD22-B16C Dimensions I A D E J DO-214AB (SMC J-Bend) Cathode Band (for Uni-directional products only) K B F G L H C Dimensions Inches Millimeters Min Max Min Max A B C D E F G H I J K L Solder Pads (all dimensions in mm) 38 5

6 Part Numbering System SMCJ XXX CA-HR A Part Marking System WITHOUT GROUP B TEST HIGH RELIABILITY 5% VOLTAGE TOLERANCE BI-DIRECTIONAL VOLTAGE SERIES F XXXX YMXXX Cathode Band Littelfuse Logo Marking Code Trace Code Marking Y:Year Code M: Month Code XXX: Lot Code Packaging Part number Component Package Quantity Packaging Option Packaging Specification SMCJxxxXX-HRA DO-214AB 3 Tape & Reel 16mm/13 tape EIA STD RS-481 SMCJxxxXX-HRAT7 DO-214AB 5 Tape & Reel 16mm/7 tape EIA STD RS-481 Tape and Reel Specification.157 (4.).63 (16.) Cathode.8 (2.2) Arbor Hole Dia..315 (8.) Optional 7 7. (187) (33).59 DIA (1.5) Cover tape Dimensions are in inches (and millimeters)..65 (16.4) Direction of Feed 39 6

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