Transient Voltage Suppression Diodes Surface Mount 600W > SMBJ-HR series. Bi-directional. Features 5.0 W 100 A 3.5V/5.0 V. -55 to 150 C 20 C/W

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1 SMBJ-HR Series RoHS Uni-directional Description TVS Diode Arrays (SPA Family of Products Bi-directional The SMBJ-HR High Reliability series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. Features Agency Approvals AGENCY Maximum Ratings and Thermal Characteristics (T A =25 O C unless otherwise noted Parameter Symbol Value Unit Peak Pulse Power Dissipation at T A =25ºC by 1/µs Waveform P PPM 6 W (Fig.2(Note 1, (Note 2 Power Dissipation on Infinite Heat Sink at T A =5 O C P M(AV 5. W Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3 Maximum Instantaneous Forward Voltage at 5A for Unidirectional Only (Note 4 Operating Junction and Storage Temperature Range Typical Thermal Resistance Junction to Lead Typical Thermal Resistance Junction to Ambient AGENCY FILE NUMBER E128662/E23531 I FSM A V F 3.5V/5. V T J, T STG -55 to 15 C R ujl 2 C/W R uja C/W Notes: 1. Non-repetitive current pulse, per Fig. 4 and derated above T A = 25 O C per Fig Mounted on copper pad area of.2x.2 (5. x 5.mm to each terminal. 3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only, duty cycle=4 per minute maximum. 4. V F <3.5V for V BR _< 2V and V F <5.V for V BR _> 21V. Excellent clamping capability Low incremental surge resistance Typical I R less than 1µA above 12V For surface mounted applications to optimize board space Low profile package Typical failure mode is short from over-specified voltage or current Whisker test is conducted based on JEDEC JESD21A per its table 4a and 4c IEC ESD 15kV(Air, 8kV (Contact ESD protection of data lines in accordance with IEC (IEC81-2 EFT protection of data lines in accordance with IEC (IEC81-4 Built-in strain relief Applications Fast response time: typically less than 1.ps from V to BV min 6W peak pulse power capability at 1/μs waveform, repetition rate (duty cycles:.1% V J = V C x (1+αT x (T J - 25 (αt:temperature Coefficient Glass passivated chip junction High temperature soldering guaranteed: 26 C/4 seconds at terminals Plastic package has underwriters laboratory flammability 94V-O Meet MSL level1, per J-STD-2, LF maximun peak of 26 C Matte tin lead free plated Halogen free and RoHS compliant TVS devices are ideal for the protection of I/O Interfaces, V CC bus and other vulnerable circuits used in Telecom, Computer, Industrial and Consumer electronic applications. Functional Diagram Bi-directional Cathode Anode Uni-directional 214 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 5/8/14 83

2 Electrical Characteristics (T A =25 C unless otherwise noted Part Number (Uni Part Number (Bi TVS Diode Arrays (SPA Family of Products Marking Reverse Stand off Voltage V R (Volts Breakdown Voltage V BR I T UNI BI MIN MAX Test Current I T (ma Maximum Clamping Voltage V I pp (V Maximum Peak Pulse Current I pp (A Maximum Reverse Leakage I V R (µa SMBJ5.A-HR SMBJ5.CA-HR KE AE X SMBJ6.A-HR SMBJ6.CA-HR KG AG X SMBJ6.5A-HR SMBJ6.5CA-HR KK AK X SMBJ7.A-HR SMBJ7.CA-HR KM AM X SMBJ7.5A-HR SMBJ7.5CA-HR KP AP X SMBJ8.A-HR SMBJ8.CA-HR KR AR X SMBJ8.5A-HR SMBJ8.5CA-HR KT AT X SMBJ9.A-HR SMBJ9.CA-HR KV AV X SMBJ1A-HR SMBJ1CA-HR KX AX X SMBJ11A-HR SMBJ11CA-HR KZ AZ X SMBJ12A-HR SMBJ12CA-HR LE BE X SMBJ13A-HR SMBJ13CA-HR LG BG X SMBJ14A-HR SMBJ14CA-HR LK BK X SMBJ15A-HR SMBJ15CA-HR LM BM X SMBJ16A-HR SMBJ16CA-HR LP BP X SMBJ17A-HR SMBJ17CA-HR LR BR X SMBJ18A-HR SMBJ18CA-HR LT BT X SMBJ2A-HR SMBJ2CA-HR LV BV X SMBJ22A-HR SMBJ22CA-HR LX BX X SMBJ24A-HR SMBJ24CA-HR LZ BZ X SMBJ26A-HR SMBJ26CA-HR ME CE X SMBJ28A-HR SMBJ28CA-HR MG CG X SMBJ3A-HR SMBJ3CA-HR MK CK X SMBJ33A-HR SMBJ33CA-HR MM CM X SMBJ36A-HR SMBJ36CA-HR MP CP X SMBJ4A-HR SMBJ4CA-HR MR CR X SMBJ43A-HR SMBJ43CA-HR MT CT X SMBJ45A-HR SMBJ45CA-HR MV CV X SMBJ48A-HR SMBJ48CA-HR MX CX X SMBJ51A-HR SMBJ51CA-HR MZ CZ X SMBJ54A-HR SMBJ54CA-HR NE DE X SMBJ58A-HR SMBJ58CA-HR NG DG X SMBJ6A-HR SMBJ6CA-HR NK DK X SMBJ64A-HR SMBJ64CA-HR NM DM X SMBJ7A-HR SMBJ7CA-HR NP DP X SMBJ75A-HR SMBJ75CA-HR NR DR X SMBJ78A-HR SMBJ78CA-HR NT DT X SMBJ85A-HR SMBJ85CA-HR NV DV X - SMBJ9CA-HR - DX X - SMBJCA-HR - DZ X - SMBJ11CA-HR - EE X - SMBJ12CA-HR - EG X - SMBJ13CA-HR - EK X - SMBJ15CA-HR - EM X - SMBJ16CA-HR - EP X - SMBJ17CA-HR - ER X Note: 1. For bidirectional type having V R of 1 volts and less, the I R limit is double. 2. % High Temperature Storage Life test and Reflow Simulation. 3. % HTRB(High Temperature Reverse Bias. For Unidirectional, 15 O C/%VR/96hours, for Bidirectional, 15 O C/%VR/192hrs(96hours for each direction for Bidirectional. 4. I R measured at room temperature +25 O C 5. Each lot of parts will pass group B test requirement. Agency Approval 214 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 5/8/14 84

3 Group B Test Requirement TVS Diode Arrays (SPA Family of Products Screen Method Condition Requirement Surge test Burn - In (HTRB 1/ µs Peak Pluse Waveform MIL -STD-75, Method Maximum clamping Voltage (V Peak Plus Current (I PP Applied voltage % V C Sample Size 45 perform 1x Accept failures Sample size hours (68 hours for bi-direction products, each direction 34 hours Accept failures Electrical test -- I R, V( T Sample size 45 Accept failures I-V Curve Characteristics Uni-directional Bi-directional Ipp Vc VBR VR IR IT VF V Vc VBR VR IT IR IR IT VRVBR Vc V Ipp Ipp P PPM Peak Pulse Power Dissipation -- Max power dissipation V R Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation V BR Breakdown Voltage -- Maximum voltage that flows though the TVS at a specified test current (I T V C Clamping Voltage -- Peak voltage measured across the suppressor at a specified Ippm (peak impulse current I R V F Reverse Leakage Current -- Current measured at V R Forward Voltage Drop for Uni-directional Ratings and Characteristic Curves (T A =25 C unless otherwise noted Figure 1 - TVS Transients Clamping Waveform Figure 2 - Peak Pulse Power Rating Voltage Transients Voltage or Current Voltage Across TVS Current Through TVS P PPM -Peak Pulse Power (kw 1 1.2x.2" (5.x5.mm Copper Pad Area Time t d -Pulse Width (sec. continues on next page. 85

4 Ratings and Characteristic Curves (T A =25 C unless otherwise noted (Continued TVS Diode Arrays (SPA Family of Products Figure 3 - Pulse Derating Curve Figure 4 - Pulse Waveform Peak Pulse Power (P PP or Current (I PP Derating in Percentage % T A -Ambient temperature (ºC I PPM - Peak Pulse Current, % I RSM 15 5 td tr=1µsec Peak Value IPPM Half Value IPPM 2 IPPM ( TJ=25 C Pulse Width(td is defined as the point where the peak current decays to 5% of IPPM 1/µsec. Waveform as defined by R.E.A t-time (ms Figure 5 - Typical Junction Capacitance Figure 6 - Steady State Power Dissipation Derating Curve 6 Cj (pf 1 R Bi-directional V=V R Uni-directional V=V Tj=25C f=1.mhz Vsig=5mVp-p V BR - Reverse Breakdown Voltage (V P M(AV, Steady State Power Dissipation (W T A - Ambient Temperature (ºC Figure 7 - Maximum Non-Repetitive Peak Forward Surge Current Uni-Directional Only 12 I FSM - Peak Forward Surge Current (A Number of Cycles at 6 Hz 8

5 Temperature (T Transient Voltage Suppression Diodes Soldering Parameters Reflow Condition TVS Diode Arrays (SPA Family of Products Lead free assembly t p Pre Heat Physical Specifications Weight Case Polarity - Temperature Min (T s(min 15 C - Temperature Max (T s(max 2 C - Time (min to max (t s 6 18 secs Average ramp up rate (Liquidus Temp (T L to peak T S(max to T L - Ramp-up Rate Reflow - Temperature (T L (Liquidus 217 C.3 ounce,.93 grams 3 C/second max 3 C/second max - Time (min to max (t s 6 15 seconds Peak Temperature (T P 26 +/-5 C Time within 5 C of actual peak Temperature (t p Ramp-down Rate Time 25 C to peak Temperature (T P Do not exceed 28 C 2 4 seconds 6 C/second max 8 minutes Max. JEDEC DO214AA. Molded plastic body over glass passivated junction Color band denotes cathode except Bidirectional T P T L T s(max T s(min 25 C t s Preheat t 25 C to Peak Environmental Specifications High Temp. Storage HTRB Temperature Cycling Ramp-up Time (t JESD22-A13 JESD22-A18 JESD22-A14 t L Critical Zone T L to T P Ramp-down MSL JEDEC-J-STD-2, Level 1 H3TRB JESD22-A11 Terminal Matte Tin-plated leads, Solderable per JESD22-B12 RSH JESD22-B16 Dimensions A D I E DO-214AA (SMB J-Bend J Cathode Band (for Uni-directional products only B F G K L H C Dimensions Inches Millimeters Min Max Min Max A B C D E F G H I J K L Littelfuse, Inc. Solder Pads Specifications are subject to change (all dimensions without notice. in mm Revised: 5/8/14 87

6 Part Numbering System SMBJ XXX CA-HR Part Marking System TVS Diode Arrays (SPA Family of Products High Reliability 5% VOLTAGE TOLERANCE F Cathode Band (for Uni-directional products only Littelfuse Logo SERIES BI-DIRECTIONAL VOLTAGE XX YMXXX Marking Code Trace Code Marking Y:Year Code M: Month Code XXX: Lot Code Packaging Part number Component Package Quantity Packaging Option Packaging Specification SMBJxxxXX-HR DO-214AA 3 Tape & Reel - 12mm tape/13 reel EIA STD RS-481 Tape and Reel Specification.157 (4..47 (12. Cathode.8 (2.2 Arbor Hole Dia..315 (8. Optional 7 7. ( (33.59 DIA (1.5 Cover tape Dimensions are in inches (and millimeters..49 (12.5 Direction of Feed 214 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 5/8/14 8

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