Surface Mount ESD Protection Diodes

Transcription

1 Surface Mount ESD Protection Diodes 1 2 MARKING (example only) XX YY Bar = cathode marking YY = type code (see table below) XX = date code DESIGN SUPPORT TOOLS click logo to get started Models Available FEATURES 200 W peak pulse power capability with a Available 10/1000 μs waveform, repetition rate (duty cycle): 0.01 % Low-profile package Wave and reflow solderable ESD immunity acc. IEC ± 30 kv contact discharge ± 30 kv air discharge ESD capability according to AEC-Q101: Available human body model: class H3B: > 8 kv Low incremental surge resistance, excellent clamping capability Low-Noise technology - very fast response time AEC-Q101 qualified available Material categorization: for definitions of compliance please see ORDERING INFORMATION PART NUMBER (EXAMPLE) AEC-Q101 QUALIFIED ENVIRONMENTAL AND QUALITY CODE RoHS-COMPLIANT + LEAD (Pb)-FREE TERMINATIONS TIN PLATED 3K PER 7" REEL (8 mm TAPE), 30K/BOX = MOQ PACKAGING CODE 10K PER 13" REEL (8 mm TAPE), 50K/BOX = MOQ ORDERING CODE (EXAMPLE) STANDARD HALOGEN-FREE SMF5V0A- E 3-08 SMF5V0A-E3-08 SMF5V0A- M 3-08 SMF5V0A-M3-08 SMF5V0A- H E 3-08 SMF5V0A-HE3-08 SMF5V0A- H M 3-08 SMF5V0A-HM3-08 SMF5V0A- E 3-18 SMF5V0A-E3-18 SMF5V0A- M 3-18 SMF5V0A-M3-18 SMF5V0A- H E 3-18 SMF5V0A-HE3-18 SMF5V0A- H M 3-18 SMF5V0A-HM3-18 PACKAGE DATA PACKAGE NAME SMF (DO-219AB) MOLDING COMPOUND Standard Halogen-free WEIGHT (mg) HEIGHT MAX. (mm) LENGTH MAX. (mm) WIDTH MAX. (mm) MOLDING COMPOUND FLAMMABILITY RATING UL 94 V-0 MOISTURE SENSITIVITY LEVEL MSL level 1 (acc. J-STD-020) WHISKER TEST ACC. JESD 201 class 2 SOLDERING CONDITIONS Peak temperature max. 260 C Rev. 1.5, 04-Dec-17 1 Document Number: 85881

2 ABSOLUTE MAXIMUM RATINGS (T amb = 25 C, unless otherwise specified) PARAMETER TEST CONDITIONS SYMBOL VALUE UNIT see Electrical Peak pulse current t p = 10/1000 μs waveform I PPM Characteristics A Peak pulse power t p = 8/20 μs waveform acc. IEC W P PP t p = 10/1000 μs waveform 200 W Peak forward surge current 8.3 ms single half sine-wave I FSM 50 A ESD immunity Contact discharge acc. IEC ; 10 pulses ± 30 kv V ESD Air discharge acc. IEC ; 10 pulses ± 30 kv Thermal resistance Mounted on epoxy glass PCB with 3 mm x 3 mm, Cu pads ( 40 μm thick) R thja 180 K/W Forward clamping voltage I F = 50A, t p = 400 μs V F 2.5 V Junction temperature T J 175 C Storage temperature range T stg -65 to +175 C Operating temperature range T op -65 to +175 C ELECTRICAL CHARACTERISTICS (T amb = 25 C, unless otherwise specified) PART NUMBER STD. TYPE CODE HALOGEN- FREE REVERSE BREAKDOWN VOLTAGE at I T, t p = 5 ms V BR MIN. (V) TEST CURRENT I T (ma) STAND-OFF VOLTAGE V RWM (V) MAXIMUM REVERSE CURRENT at V RWM MAXIMUM PEAK PULSE CURRENT t p = 10/1000 μs MAXIMUM REVERSE CLAMPING VOLTAGE at I PPM TYPICAL CAP. at V R = 0 V, f = 1 MHz PROTECTION PATHS Rev. 1.5, 04-Dec-17 2 Document Number: I R (μa) I PPM (A) V C MAX. (V) C D TYP. (pf) SMF5V0A AE NE SMF6V0A AG NG SMF6V5A AK NK SMF7V0A AM NM SMF7V5A AP NP SMF8V0A AR NR SMF8V5A AT NT SMF9V0A AV NV SMF10A AX NX SMF11A AZ NZ SMF12A BE OE SMF13A BG OG SMF14A BK OK SMF15A BM OM SMF16A BP OP SMF17A BR OR SMF18A BT OT SMF20A BV OV SMF22A BX OX SMF24A BZ OZ SMF26A CE PE SMF28A CG PG SMF30A CK PK SMF33A CM PM SMF36A CP PP SMF40A CR PR SMF43A CT PT SMF45A CV PV SMF48A CX PX SMF51A CZ PZ SMF54A CA PA SMF58A CC PC N channel

3 TYPICAL CHARACTERISTICS (T amb = 25 C, unless otherwise specified) 120 % Discharge Current I ESD 100 % 80 % 60 % 53 % 40 % 27 % 20 % Rise time = 0.7 ns to 1 ns 0 % Time (ns) I RSM (%) t 1 t 2 t 1 = 10 µs t 2 = 1000 µs t Fig. 1 - ESD Discharge Current Wave Form acc. IEC (330 /150pF) Fig. 4 - Pulse Waveform I PPM 100 % 8 µs to 100 % 80 % 60 % 20 µs to 50 % 40 % 20 % 0 % Time (µs) Fig. 2-8/20 μs Peak Pulse Current Wave Form acc. IEC C D in pf SMF43A SMF45A SMF48A SMF51A SMF54A SMF58A f = 1MHz Fig. 5 - Typical Capacitance C D vs. Reverse Voltage V R P PP - Peak Pulse Power (kw) 10 1 Non-repetitive pulse T A = 25 C C D in pf SMF22A SMF24A SMF26A SMF28A SMF30A SMF33A SMF36A SMF40A f = 1MHz µs 1.0 µs 10 µs 100 µs 1.0 ms 10 ms t d - Pulse Width (s) Fig. 3 - Peak Pulse Power Rating Fig. 6 - Typical Capacitance C D vs. Reverse Voltage V R Rev. 1.5, 04-Dec-17 3 Document Number: 85881

4 600 f = 1MHz 20 SMF16A C D in pf SMF11A SMF12A 200 SMF13A SMF14A SMF15A 100 SMF16A SMF17A SMF18A SMF20A Fig. 7 - Typical Capacitance C D vs. Reverse Voltage V R 18 SMF15A SMF14A 16 SMF13A 14 SMF12A SMF11A 12 SMF10A SMF9V0A 10 SMF8V5A T J = Junction Temperature = 25 C I R in μa Fig Typical Reverse Voltage V R vs. Reverse Current I R 1200 f = 1MHz 40 SMF33A C D in pf SMF5V0A SMF6V0A SMF6V5A SMF7V0A SMF7V5A SMF8V0A SMF8V5A SMF9V0A SMF10A Fig. 8 - Typical Capacitance C D vs. Reverse Voltage V R T J = Junction Temperature = 25 C I R in μa SMF30A SMF28A SMF26A SMF24A SMF22A SMF20A SMF18A SMF17A Fig Typical Reverse Voltage V R vs. Reverse Current I R 10 SMF8V0A 70 T J = Junction Temperature = 25 C SMF58A 9 SMF7V5A 65 SMF54A SMF7V0A SMF6V5A SMF6V0A SMF5V0A SMF51A SMF48A SMF45A SMF43A SMF40A 5 T J = Junction Temperature = 25 C I R in μa Fig. 9 - Typical Reverse Voltage V R vs. Reverse Current I R 45 SMF36A I R in μa Fig Typical Reverse Voltage V R vs. Reverse Current I R Rev. 1.5, 04-Dec-17 4 Document Number: 85881

5 PACKAGE DIMENSIONS in millimeters (inches): SMF (DO-219AB) 0.85 [0.033] 0.35 [0.014] 1.8 [0.071] min [0.010] 0.05 [0.002] Detail Z enlarged 1.9 [0.075] 1.7 [0.067] 0.1 [0.004] 0 [0.000] 1.2 [0.047] 0.8 [0.031] [0.114] 2.7 [0.106] 1.08 [0.043] 0.88 [0.035] 3.9 [0.154] 3.5 [0.138] foot print recommendation: Reflow soldering 1.3 [0.051] 1.3 [0.051] 1.4 [0.055] 2.9 [0.114] Created - Date: 15. February 2005 Rev. 5 - Date: 09. Oct Document no.: S8-V (4) Rev. 1.5, 04-Dec-17 5 Document Number: 85881

6 BLISTERTAPE DIMENSIONS in millimeters (inches) PS Document-No.: S8-V (3) Rev. 1.5, 04-Dec-17 6 Document Number: 85881

7 ORIENTATION IN CARRIER TAPE - SMF (DO-219AB) Unreeling direction SMF cathode Document no.: S8-V (4) Created - Date: 09. Feb Top view Rev. 1.5, 04-Dec-17 7 Document Number: 85881

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