Multi-Layer Ferrite Chip Beads

Transcription

1 Multi-Layer Ferrite Chip Beads ODEING CODE BF T T S PODUCT CODE BF : For General Signal Lines BP : For Power Lines BH : For High Speed Signal Lines (MHz~) BS : For Higher Speed Signal Lines (MHz~) DIMENSION (L W) Code Dimension EIA Code Dimension EIA mm mm 1.. mm mm mm 3 IMPEDANCE CODE Code 1 2 (Ω) TOLEANCE CODE T= ± % PACKAGING CODE T = Paper Tape P = Embossed Tape TYPE CODE S=Standard =Low DC B=GHz Band U=High GHz Band THICKNESS CODE(mm) 3=.3 =. 8=.8 9=.9 B=1.1 1 ev.11

2 EMI Suppression Standard External Dimensions Unit: mm/(inch) Series L W 3 (1) (2) 18 (3) 12 () 3216 (16).±.3 (.24 ±.1) 1. ±. (. ±.4) 1. ±. (.63 ±.8) 2. +/-. (.79 +/-.8) 3. +/-. (.126 +/-.8). ±.3 (.12 ±.1). ±. (. ±.4). ±. (.31 ±.8) 1. +/-. (.47 +/-.8) 1. +/-. (.63 +/-.8) A (Min/Max). ±. (.6 ±.2). ±. (. ±.6). ±. (.12 ±.8). +/-. (. +/-.12). +/-. (. +/-.12) ecommended pad dimensions Land Pattern Soldering SMD resist Inductor c b a Size mm (EIA) L x W (mm) a (mm) b (mm) c (mm) 3(1).6*.3.2 to.3.2 to.3. to.4 (2) 1.*..3 to..3 to.4.4 to. 18 (3) 1.6*.8.7 to 1..6 to.8.7 to.8 12 () 2.* to to.9 1. to (16) 3.2* to to to 1.6 2

3 Beads For Signal Lines(BF series) Feature 1. High density packaging is possible. This series requires less space and has greater EMI suppression effects. 2. Different types with the same shape are available. 3. Excellent in physical properties, such as terminal strength, flexure strength, soldering resistance and solderability. 4. Applicable to both flow and reflow soldering. Application 1. Computers and peripheral devices, personal computers, VC and cameras. 2. Noise suppression in digital equipment, car stereo, car engines controllers and OA electronic instruments. 3. Communication equipment. Part Numbers & Characteristic BF3 series (EIA 1 Size) Standard Low DC Ordering Code (Ω)±% Test Frequency (MHz) DC esistance (Ω) MA. ated Current (ma) MA. Thickness (mm) BF32TTS ±.3 BF33TTS ±.3 BF3TTS3.. ±.3 BF3121TTS ±.3 BF3241TTS ±.3 BF31TTS3 1.. ±.3 BF32TTS3 2.. ±.3 BF3121TT ±.3 BF3241TT ±.3 BF31TT ±.3 BF32TT3 1.. ±.3 OPEATING TEMPEATUE ANGE: - TO +1 BF series (EIA 2 Size) Standard Low DC Ordering Code (Ω)±% Test Frequency (MHz) DC esistance (Ω) MA. ated Current (ma) MA. Thickness (mm) BFTTS. 1,. ±. BFTTS. 1,. ±. BFTTS.. ±. BF121TTS ±. BF221TTS ±. BF241TTS ±. BF1TTS.2 7. ±. BF471TTS ±. BF1TTS.. ±. BF2TTS 1,.. ±. BF2TTS 1,.. ±. BF182TTS 1,.. ±. BF221TT 2.1. ±. BF1TT.3. ±. BF2TT ±. GHz Band High GHz Band Ordering Code DC esistance ated Current Thickness at MHZ at 1GHZ (mm) (Ω)±% (Ω)±% (Ω) MA. (ma) MA. BF1TTB.7 BF2TTB 1, 1, 1.. ±.. ±. BF221TTU 2.7. ±. BF471TTU 47 1, 1.. ±. OPEATING TEMPEATUE ANGE: - TO +1 3 ev.11

4 BF18 series (EIA 3 Size) Standard Ordering Code (Ω)±% Test Frequency (MHz) DC esistance (Ω) MA. ated Current (ma) MA. Thickness (mm) BF1TTS8.. ±. BF1TTS8.. ±. BF18TTS8.. ±. BF18TTS8. 9. ±. BF181TTS8.. ±. BF18121TTS8 1.. ±. BF18221TTS ±. BF18241TTS ±. BF181TTS8. 9. ±. BF18471TTS ±. BF181TTS8.4. ±. BF182TTS8 1,.4. ±. BF182TTS8 2,.. ±. 4 GHz Band DC esistance ated Current Thickness Ordering Code at MHZ at 1GHZ (Ω) MA. (ma) MA. (mm) (Ω)±% (Ω)±% BF181TTB ± BF182TTB8 1, 1,.. ± 4 OPEATING TEMPEATUE ANGE: - TO +1 BF12 series (EIA Size) Standard Ordering Code (Ω) ±% Test Frequency (MHz) DC esistance (Ω) MA. ated Current (ma) MA. Thickness (mm) BF121TTS ±. BF123TTS ±. BF12TTS9..9 ±. BF12121TTS ±. BF121TTS9..9 ±. BF12221TTS ±. BF121TTS9..9 ±. BF12331TTS ±. BF12471TTS ±. BF11TTS9..9 ±. BF121TTS9..9 ±. BF122TTS9 1,.4.9 ±. OPEATING TEMPEATUE ANGE: - TO +1 4 EMI Suppression Multi-Layer Ferrite Bead for General Signal Lines BF3216 series (EIA 16 Size) Test Frequency DC esistance ated Current Thickness Ordering Code (Ω)±% (MHz) (Ω) MA. (ma) MA. (mm) BF32162TPSB ±.3 Standard BF32163TPSB ±.3 OPEATING TEMPEATUE ANGE: - TO

5 (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) TYPICAL ELECTICAL CHAACTEISTICS (IMPEDANCE VS FEQUENCY) BF3 series (EIA 1 Size) BF32TTS3 4 3 BF33TTS3 1 BF3TTS BF3121TTS3 1 Freq.(MHz) 1, 1 Freq.(MHz) 1, 1 Freq.(MHz) 1, 1 Freq.(MHz) 1, 3 BF3241TTS3 7 BF31TTS3 1, 1, 1, BF32TS3 1 Freq.(MHz) 1, 1 Freq.(MHz) 1, 1 Freq.(MHz) 1, BF3121TT Freq.(MHz) 1, BF3241TT3 3 1 Freq.(MHz) 1, BF31TT3 7 1 Freq.(MHz) 1, BF32TT3 1, 1, 1, 1 Freq.(MHz) 1, BF series (EIA 2 Size) BFTTS Freq.(MHz) 1, BFTTS Freq.(MHz) 1, BFTTS Freq.(MHz) 1, BF121TTS Freq.(MHz) 1, BF221TTS 3 1 Freq.(MHz) 1, BF241TTS Freq.(MHz) 1, BF1TTS Freq.(MHz) 1, BF471TTS 7 1 Freq.(MHz) 1, 9 BF1TTS 1, BF2TTS 1, BF2TTS 2, BF182TTS 7 1, 1, 1, 1, 1, 1, 1, 1, 1, 1, 1, 1 Freq.(MHz) 1, 1 Freq.(MHz) 1, 1 Freq.(MHz) 1, 1 Freq.(MHz) 1, 3 BF221TT 9 7 BF1TT 1, 1, 1, BF2TT 1 Freq.(MHz) 1, 1 Freq.(MHz) 1, 1 Freq.(MHz) 1, ev.11

6 1, Freq.(MHz) 1, BF18 series (EIA 3 Size) EMI Suppression Multi-Layer Ferrite Bead for General Signal Lines (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) BF1TTB 1, BF2TTB 1, BF221TTU 1, BF471TTU 1, 1, 1, 1, 1 Freq.(MHz) 1, 1, 1 Freq.(MHz) 1, 1, 1, 1 Freq.(MHz) 1, BF1TTS8 7 BF1TTS8 1 BF18TTS8 1 BF18TTS Freq.(MHz) 1, BF181TTS Freq.(MHz) 1, BF181TTS Freq.(MHz) 1, BF182TTS8 2, 1 Freq.(MHz) 1, BF18121TTS8 1 Freq.(MHz) 1, BF18471TTS8 7 1 Freq.(MHz) 1, 1 Freq.(MHz) 1, BF18221TTS8 3 1 Freq.(MHz) 1, BF181TTS Freq.(MHz) 1, 1 Freq.(MHz) 1, BF18241TTS8 3 1 Freq.(MHz) 1, BF182TTS8 1, 1, 1 Freq.(MHz) 1, 2, 1, 1, 1 Freq.(MHz) 1, 1, 1, BF181TTB8 1, 1, 1, BF182TTB8 1 Freq.(MHz) 1, 1 Freq.(MHz) 1, 6

7 (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) (ohm) BF12 series (EIA Size) BF121TTS9 7 BF123TTS9 1 1 BF12TTS9 BF12121TTS9 1 Freq.(MHz) 1, BF121TTS9 1 Freq.(MHz) 1, BF12221TTS9 3 Freq.(MHz) 1 1, BF121TTS Freq.(MHz) 1, BF12331TTS Freq.(MHz) 1, BF12471TTS9 1 Freq.(MHz) 1, BF11TTS9 7 1 Freq.(MHz) 1, BF121TTS9 1 Freq.(MHz) 1, BF122TTS9 1, 7 1, 1 Freq.(MHz) 1, 1 Freq.(MHz) 1, 1 Freq.(MHz) 1, 1 Freq.(MHz) 1, BF3216 series (EIA 16 Size) BF32162TPSB BF32163TPSB Freq.(MHz) 1, 1 Freq.(MHz) 1, 7 ev.11

8 Testing Condition & equirements No. Item Test Condition equirements 1 Appearance Ferrite Beads shall be visually inspected for visible evidence of defect. In accordance with specification. 2 Measuring frequency:±1mhz Applied Voltage: mv Measuring equipment and fixture: 3: HP4291A A : HP4291B A 18: HP4291B A 12: HP4291A + 192A 3216: HP4291A + 192A Within specified tolerance. 3 DC esistance a. Temperature: ±3 b. elative Humidity: 4~7%H c. Measuring equipment: HP Dimension Dimension shall be measured with caliper or micrometer In accordance with electrical specification. In accordance with dimension specification. Solder-ability Preheat:, seconds Solder temperature: 24± Flux: osin Dip time: 4±1 seconds More than 7% of the terminal electrode part shall be covered with new solder. Solder the chip to test jig then apply a force in the direction shown in below. The soldering shall be done with the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock. 6 Bending Strength No mechanical damage shall be observed. Preheat:, seconds Solder temperature: 27± Flux: osin Dip time: ±1 seconds EMI Suppression Multi-Layer Ferrite Bead 7 esistance to Soldering Heat BH BS_Series Preheating temperature : The chip shall not be cracks. More than 7% of terminal electrode shall be covered with solder. to 1 Preheating time :3 min. Preheat:, seconds Solder temperature: 2± Flux: osin Dip time: ±. seconds 8

9 Humidity: 9 to 9% H. Temperature: ±2 Testing time: ±12 hours 8 High Humidity Load Life Test Humidity: 9 to 9% H. Temperature: ±2 BH_Series Testing time: +24/- hours No visible damage. : Within±% of the initial value. ecovery:2 to 3 hrs of recovery under the standard condition after the removal from test chamber. Measurement: After placing for 24±2 hours min. BH_Series Measurement: After placing for 48±2 hours min. Temperature:Maximum and Minimum,kept stabilized for ±3 minutes each 9 Thermal Shock Cycle: cycles Measurement: After placing for 24±2 hours min. BH_Series Measurement: After placing for 48±2 hours min. No visible damage : Within±% of the initial value. Temperature: 8±3 (BP_3 Series) 1±3 Testing time: ±12 hours High Temperature Load BH_Series Temperature: 1±3 Testing time: +24/- hours No visible damage. : Within±% of the initial value. ecovery:2 to 3 hrs of recovery under the standard condition after the removal from test chamber. Measurement: After placing for 24±2 hours min. BH_Series Measurement: After placing for 48±2 hours min. 9 ev.11

10 Temperature ( ) EMI Suppression Multi-Layer Ferrite Bead Temperature ( ) Soldering Profile for SMT Process with SnPb Solder Paste. The rate of preheat should not exceed 4 /sec and a target of 2 /sec is preferred. Ceramic chip components should be preheated to within to 1 of the soldering. Soldering 2 to 2 ~ sec. Gradual Natural Cooling Preheating over 1 min over 1 min Over,within sec Time (sec.) Soldering Profile for SMT Process with Lead Free Solder Paste. The rate of preheat should not exceed 4 /sec and a target of 2 /sec is preferred. Ceramic chip components should be preheated to within to 1 of the soldering. Soldering 2 to 2 ~ sec. Gradual Natural Cooling Preheating over 1 min over 1 min Over,within 9sec Time (sec.)

11 Packaging Specification Paper Tape Material:Paper ( Dimensions in mm) TYPE A B W P T CHIPS / EEL , , , , Embossed Tape Material:Embossed ( Dimensions in mm) TYPE A B W P T CHIPS / EEL , eel dimensions Dimensions in mm TYPE 4mm 8mm A 178±2 178±2 B 21.±.8 21.±.8 C 13.±.8 13.±.8 G.. N 7 7 T ev.11