Notice for TAIYO YUDEN Products

Transcription

1 Notice for TAIYO YUDEN Products [ For General Electronic Equipment (General Environment) ] Please read this notice before using the TAIYO YUDEN products. EMINDES Product information in this catalog is as of October 27. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or use of our products. Please note that TAIYO YUDEN shall not be in any way responsible for any damages and defects in products or equipment incorporating our products, which are caused under the conditions other than those specified in this catalog or individual product specification sheets. Please contact TAIYO YUDEN for further details of product specifications as the individual product specification sheets are available. Please conduct validation and verification of our products in actual condition of mounting and operating environment before using our products. The products listed in this catalog are intended for use in general electronic equipment (e.g., AV equipment, OA equipment, home electric appliances, office equipment, information and communication equipment including, without limitation, mobile phone, and PC) and medical equipment classified as Class I or II by IMDF. Please be sure to contact TAIYO YUDEN for further information before using the products for any equipment which may directly cause loss of human life or bodily injury (e.g., transportation equipment including, without limitation, automotive powertrain control system, train control system, and ship control system, traffic signal equipment, disaster prevention equipment, medical equipment classified as Class III by IMDF, highly public information network equipment including, without limitation, telephone exchange, and base station). Please do not incorporate our products into any equipment requiring high levels of safety and/or reliability (e.g., aerospace equipment, aviation equipment*, medical equipment classified as Class IV by IMDF, nuclear control equipment, undersea equipment, military equipment). *Note: There is a possibility that our products can be used only for aviation equipment that does not directly affect the safe operation of aircraft (e.g., in-flight entertainment, cabin light, electric seat, cooking equipment) if such use meets requirements specified separately by TAIYO YUDEN. Please be sure to contact TAIYO YUDEN for further information before using our products for such aviation equipment. When our products are used even for high safety and/or reliability-required devices or circuits of general electronic equipment, it is strongly recommended to perform a thorough safety evaluation prior to use of our products and to install a protection circuit as necessary. Please note that unless you obtain prior written consent of TAIYO YUDEN, TAIYO YUDEN shall not be in any way responsible for any damages incurred by you or third parties arising from use of the products listed in this catalog for any equipment requiring inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN as described above. Information contained in this catalog is intended to convey examples of typical performances and/or applications of our products and is not intended to make any warranty with respect to the intellectual property rights or any other related rights of TAIYO YUDEN or any third parties nor grant any license under such rights. Please note that the scope of warranty for our products is limited to the delivered our products themselves and TAIYO YUDEN shall not be in any way responsible for any damages resulting from a fault or defect in our products. Notwithstanding the foregoing, if there is a written agreement (e.g., supply and purchase agreement, quality assurance agreement) signed by TAIYO YUDEN and your company, TAIYO YUDEN will warrant our products in accordance with such agreement. The contents of this catalog are applicable to our products which are purchased from our sales offices or authorized distributors (hereinafter TAIYO YUDEN s official sales channel ). Please note that the contents of this catalog are not applicable to our products purchased from any seller other than TAIYO YUDEN s official sales channel. Caution for Export Some of our products listed in this catalog may require specific procedures for export according to U.S. Export Administration egulations, Foreign Exchange and Foreign Trade Control Law of Japan, and other applicable regulations. Should you have any questions on this matter, please contact our sales staff.

2 MULTILAYE CHIP BEAD INDUCTOS(BK SEIES) PATS NUMBE * Operating Temp.:-55~+25 WAVE* EFLOW *Except for BK42, BK63, BK5 B K 6 8 H S 2 - T =Blank space Series name Code BK Series name Multilayer chip bead inductor 2Dimensions(L W) Code Type(inch) Dimensions (L W)[mm] 42 42(5) (2) (42) (63) (85) Material Code HW HS H HM LM LL TS TM Material efer to impedance curves for material differences STANDAD ETENAL DIMENSIONS / STANDAD QUANTITY L W e T 4Nominal impedance Code (example) Nominal impedance[ω] Characteristics Code - 6Packaging Code T 7Internal code Code Type L W T e BK 42 (5) BK 63 (2) BK 5 (42) BK 68 (63) BK 225 (85).4±.2 (.6±.).6±.3 (.24±.).±.5 (.39±.2).6±.5 (.63±.6) 2.+.3/-. (.79+.2/-.4) 2.+.3/-. (.79+.2/-.4).2±.2 (.8±.).3±.3 (.2±.).5±.5 (.2±.2).8±.5 (.3±.6).25±.2 (.49±.8).25±.2 (.49±.8).2±.2 (.8±.).3±.3 (.2±.).5±.5 (.2±.2).8±.5 (.3±.6).85±.2 (.33±.8).25±.2 (.49±.8).+.4/-.3 (.4+.2/-.).5±.5 (.6±.2).25±. (.±.4).3±.2 (.2±.8).5±.3 (.2±.2).5±.3 (.2±.2) Characteristics Standard Packaging Taping Internal code Standard Standard quantity[pcs] Paper tape Embossed tape Unit:mm(inch) NOISE SUPPESSION COMPONENTS /FEITE BEAD INDUCTOS This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website ( 5

3 PATS NUMBE BK 42 Parts number EHS Nominal impedance [Ω] tolerance [MHz] DC esistance [Ω](max.) ated current [ma](max.) Thickness [mm] BK 42HS-T ohs ±5Ω ±.2 BK 42HS7-T ohs 7 ±25% ±.2 BK 42HS2-T ohs 2 ±25% ±.2 BK 42HM-T ohs ±5Ω ±.2 BK 42HM75-T ohs 75 ±25% ±.2 BK 42HM2-T ohs 2 ±25% ±.2 BK 42HM5-T ohs 5 ±25% ±.2 BK 42HM8-T ohs 8 ±25% ±.2 BK 42HM24-T ohs 24 ±25% ±.2 BK 42HM33-T ohs 33 ±25% ±.2 BK 42LL22-T ohs 22 ±25% ±.2 BK 42LL47-T ohs 47 ±25%. 2.2 ±.2 BK 42LL-T ohs ±25% 2..2 ±.2 NOISE SUPPESSION COMPONENTS /FEITE BEAD INDUCTOS BK 63 BK 63HS22-T ohs 22 ±25% ±.3 BK 63HS33-T ohs 33 ±25% ±.3 BK 63HS8-T ohs 8 ±25% ±.3 BK 63HS2-T ohs 2 ±25% ±.3 BK 63HS24-T ohs 24 ±25% ±.3 BK 63HS6-T ohs 6 ±25% ±.3 BK 63HM6-T ohs 6 ±25% ±.3 BK 63HM2-T ohs 2 ±25% ±.3 BK 63HM24-T ohs 24 ±25% ±.3 BK 63HM47-T ohs 47 ±25%.5.3 ±.3 BK 63HM6-T ohs 6 ±25%.2.3 ±.3 BK 63H2-T ohs 2 ±25% ±.3 BK 63H24-T ohs 24 ±25% ±.3 BK 63H6-T ohs 6 ±25% ±.3 BK 63H2-T ohs ±25% ±.3 BK 63H22-T ohs 2 ±25% ±.3 BK 63LL-T ohs ±25% ±.3 BK 63LL22-T ohs 22 ±25% ±.3 BK 63LL33-T ohs 33 ±25% ±.3 BK 63LL47-T ohs 47 ±25% ±.3 BK 63LL56-T ohs 56 ±25%..3 ±.3 BK 63LL8-T ohs 8 ±25%.3.3 ±.3 BK 63LL2-T ohs 2 ±25%.5.3 ±.3 BK 63TS8-T ohs 8 ±25% ±.3 BK 63TS2-T ohs 2 ±25% ±.3 BK 63TS24-T ohs 24 ±25% ±.3 BK 63TS6-T ohs 6 ±25% ±.3 BK 63TM8-T ohs 8 ±25% ±.3 BK 63TM2-T ohs 2 ±25% ±.3 BK 63TM24-T ohs 24 ±25% ±.3 BK 63TM6-T ohs 6 ±25% ±.3 BK 5 Parts number Parts number EHS EHS Nominal impedance [Ω] Nominal impedance [Ω] tolerance tolerance [MHz] [MHz] DC esistance [Ω](max.) DC esistance [Ω](max.) ated current [ma](max.) ated current [ma](max.) Thickness [mm] Thickness [mm] BK 5HW68-T ohs 68 ±25% ±.5 BK 5HW2-T ohs 2 ±25% ±.5 BK 5HW24-T ohs 24 ±25% ±.5 BK 5HW43-T ohs 43 ±25% ±.5 BK 5HW6-T ohs 6 ±25% ±.5 BK 5HS-T ohs ±25%.3,.5 ±.5 BK 5HS33-T ohs 33 ±25% ±.5 BK 5HS68-T ohs 68 ±25%. 7.5 ±.5 BK 5HS8-T ohs 8 ±25%. 7.5 ±.5 BK 5HS2-T ohs 2 ±25% ±.5 BK 5HS24-T ohs 24 ±25% ±.5 BK 5HS43-T ohs 43 ±25% ±.5 BK 5HS6-T ohs 6 ±25% ±.5 BK 5HS2-T ohs ±25% ±.5 BK 5H6-T ohs 6 ±25% ±.5 BK 5HM75-T ohs 75 ±25% ±.5 BK 5HM2-T ohs 2 ±25% ±.5 BK 5HM24-T ohs 24 ±25% ±.5 BK 5HM47-T ohs 47 ±25% ±.5 BK 5HM6-T ohs 6 ±25% ±.5 BK 5HM2-T ohs ±25% ±.5 BK 5LL-T ohs ±25%. 5.5 ±.5 BK 5LL22-T ohs 22 ±25% ±.5 BK 5LL33-T ohs 33 ±25% ±.5 BK 5LL47-T ohs 47 ±25% ±.5 BK 5LL68-T ohs 68 ±25% ±.5 BK 5LL2-T ohs 2 ±25% ±.5 BK 5LL8-T ohs 8 ±25% ±.5 BK 5LL24-T ohs 24 ±25% ±.5 BK 5LM82-T ohs 8 ±25% ±.5 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website ( 6

4 PATS NUMBE BK 68 BK 68HW2-T ohs 2 ±25% ±.5 BK 68HW24-T ohs 24 ±25% ±.5 BK 68HW43-T ohs 43 ±25% ±.5 BK 68HW6-T ohs 6 ±25% ±.5 BK 68HS22-T ohs 22 ±25%.5,5.8 ±.5 BK 68HS33-T ohs 33 ±25%.8,2.8 ±.5 BK 68HS47-T ohs 47 ±25%. 9.8 ±.5 BK 68HS6-T ohs 6 ±25%. 8.8 ±.5 BK 68HS8-T ohs 8 ±25%. 6.8 ±.5 BK 68HS2-T ohs 2 ±25% ±.5 BK 68HS24-T ohs 24 ±25% ±.5 BK 68HS6-T ohs 6 ±25% ±.5 BK 68HS2-T ohs ±25% ±.5 BK 68HM2-T ohs 2 ±25% ±.5 BK 68HM24-T ohs 24 ±25% ±.5 BK 68HM47-T ohs 47 ±25% ±.5 BK 68HM6-T ohs 6 ±25% ±.5 BK 68HM2-T ohs ±25% ±.5 BK 68LL3-T ohs 3 ±25% ±.5 BK 68LL47-T ohs 47 ±25% ±.5 BK 68LL56-T ohs 56 ±25% ±.5 BK 68LL68-T ohs 68 ±25% ±.5 BK 68LL2-T ohs 2 ±25% ±.5 BK 68LL8-T ohs 8 ±25% ±.5 BK 68LL24-T ohs 24 ±25% ±.5 BK 68LL33-T ohs 33 ±25% ±.5 BK 68LL43-T ohs 43 ±25% ±.5 BK 68LL5-T ohs 5 ±25% ±.5 BK 68LL68-T ohs 68 ±25%. 5.8 ±.5 BK 68LM75-T ohs 75 ±25% ±.5 BK 68LM52-T ohs 5 ±25% ±.5 BK 68LM82-T ohs 8 ±25% ±.5 BK 68LM252-T ohs 25 ±25%. 2.8 ±.5 BK 68TS43-T ohs 43 ±25%.2±3% 4.8 ±.5 BK 68TS6-T ohs 6 ±25%.27±3% 35.8 ±.5 BK 68TS2-T ohs ±25%.3±3% 3.8 ±.5 BK 225 Parts number Parts number EHS EHS Nominal impedance [Ω] Nominal impedance [Ω] tolerance tolerance [MHz] [MHz] DC esistance [Ω](max.) DC esistance [Ω](max.) ated current [ma](max.) ated current [ma](max.) Thickness [mm] Thickness [mm] BK 225HS5-T ohs 5 ±25%.5,2.85 ±.2 BK 225HS22-T ohs 22 ±25%.5,2.85 ±.2 BK 225HS33-T ohs 33 ±25%.5,2.85 ±.2 BK 225HS47-T ohs 47 ±25%.5,.85 ±.2 BK 225HS75-T ohs 75 ±25%.,.85 ±.2 BK 225HS-T ohs ±25% ±.2 BK 225HS2-T ohs 2 ±25% ±.2 BK 225HS24-T ohs 24 ±25% ±.2 BK 225HS43-T ohs 43 ±25% ±.2 BK 225HS6-T ohs 6 ±25% ±.2 BK 225HS2-T ohs ±25% ±.2 BK 225HM2-T ohs 2 ±25% ±.2 BK 225HM24-T ohs 24 ±25% ±.2 BK 225HM47-T ohs 47 ±25% ±.2 BK 225HM6-T ohs 6 ±25% ±.2 BK 225HM2-T ohs ±25% ±.2 BK 225LL56-T ohs 56 ±25% ±.2 BK 225LL2-T ohs 2 ±25% ±.2 BK 225LL24-T ohs 24 ±25% ±.2 BK 225LM75-T ohs 75 ±25% ±.2 BK 225LM52-T ohs 5 ±25% ±.2 BK 225LM82-T ohs 8 ±25% ±.2 BK 225LM252-T ohs 25 ±25% ±.2 NOISE SUPPESSION COMPONENTS /FEITE BEAD INDUCTOS This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website ( 7

5 ELECTICAL CHAACTEISTICS BK42 BK42 HS Frequency [MHz] Frequency [MHz] Frequency [MHz] Frequency [MHz] BK42 HM Frequency [MHz] Frequency [MHz] Frequency [MHz] BK42 LL22 BK42 HM33 Frequency [MHz] BK42 LL Frequency [MHz] BK42 HM Frequency [MHz] BK42 HM Frequency [MHz] Frequency [MHz] BK63 BK63 HS Frequency [MHz] 5 4 Frequency [MHz] BK63 HM47 BK63 HM BK63 HM24 6 BK63 HS BK63 HS33 [ ] 6 BK42 LL 7 FEITE BEAD INDUCTOS NOISE SUPPESSION COMPONENTS BK42 HM BK42 HM75 BK42 HM BK42 HS2 25 BK42 HS This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website ( 8 8

6 ELECTICAL CHAACTEISTICS Frequency [MHz] BK63 H BK63 LL47 BK63 LL BK63 LL56 5 BK63 LL Frequency [MHz] BK63 LL8 BK63 LL BK63 TS8 2 5 BK63 TM8 2 BK63 TM BK63 TM BK63 TM24 BK63 TS BK63 TS BK63 TS FEITE BEAD INDUCTOS NOISE SUPPESSION COMPONENTS Frequency [MHz] BK63 LL [ ] 2 BK63 H BK63 H [ ] BK63 H BK63 H2 2 BK BK5 HW BK5 HW BK5 HW2 25 BK5 HW This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website ( 8 9

7 ELECTICAL CHAACTEISTICS BK5 HW6 BK5 HS BK5 HS33 25 BK5 HS Frequency MHz Frequency MHz Frequency MHz 5 5 Frequency MHz 25 BK5 HS8 25 BK5 HS NOISE SUPPESSION COMPONENTS /FEITE BEAD INDUCTOS 5 5 Frequency MHz BK5 HM Frequency MHz BK5 HM BK5 HS2 Frequency MHz BK5 LL BK5 H6 BK5 LL Frequency MHz BK5 HM BK5 LL BK5 LL47 5 BK5 LL This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website ( 2

8 ELECTICAL CHAACTEISTICS BK68 BK5 LM FEITE BEAD INDUCTOS NOISE SUPPESSION COMPONENTS BK68 LL3 BK68 LL47 BK68 LL56 BK68 LL This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website ( 8 2

9 ELECTICAL CHAACTEISTICS 5 BK68 LL NOISE SUPPESSION COMPONENTS /FEITE BEAD INDUCTOS BK225 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website ( 22

10 ELECTICAL CHAACTEISTICS 5 5 NOISE SUPPESSION COMPONENTS /FEITE BEAD INDUCTOS This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website ( 23

11 Multilayer chip inductors Multilayer chip inductors for high frequency, Multilayer chip bead inductors Multilayer common mode choke coils(mc series F type) Metal Multilayer Chip Power Inductors (MCOIL TM MC series) PACKAGING Minimum Quantity Tape & eel Packaging Type Thickness Standard Quantity [pcs] mm(inch) Paper Tape Embossed Tape CK68(63).8 (.3) 4 - CK225(85).85(.33) (.49) - 2 CKS225(85).85(.33) (.49) - 2 CKP68(63).8 (.3) 4 - CKP22(85).9 (.35) - 3 CKP26(86).9 (.35) (.28) - 3 CKP252(8).9 (.35) - 3. (.43) - 2 NM22(85).9 (.35) - 3 NM252(8).9 (.35) - 3. (.43) - 2 LK5(42).5 (.2) - LK68(63).8 (.3) 4 - LK225(85).85(.33) (.49) - 2 HK63(2).3 (.2) 5 - HK5(42).5 (.2) - HK68(63).8 (.3) 4 - HK225(85).85(.33) - 4. (.39) - 3 HKQ42(5).2 (.8) 2 4 HKQ63W(2).3 (.2) 5 - HKQ63S(2).3 (.2) 5 - HKQ63U(2).3 (.2) 5 - AQ5(42).5 (.2) - BK42(5).2 (.8) 2 - BK63(2).3 (.2) 5 - BK5(42).5 (.2) - BKH63(2).3 (.2) 5 - BKH5(42).5 (.2) - BK68(63).8 (.3) 4 - BK225(85).85(.33) (.49) - 2 BK2(84).45(.8) 4 - BK326(26).8 (.3) - 4 BKP42(5).2 (.8) 2 - BKP63(2).3 (.2) 5 - BKP5(42).5 (.2) - BKP68(63).8 (.3) 4 - BKP225(85).85(.33) 4 - MCF65(22).3 (.2) 5 - MCF86(32).4 (.6) - MCF2(54).55(.22) - 5 MCF2(84).45(.8) - 4 MCFK68(63).6 (.24) 4 - MCFE68(63).65(.26) 4 - MCKK68(63).(.39) 3 MCHK22(86).8 (.3) 4 - MCKK22(85).(.39) - 3 i_mlci_pack_e-e6

12 2Taping material Card board carrier tape Chip Filled Bottom tape Top tape Base tape Sprocket hole Chip cavity CK 68 CKP 68 CK 225 CKS 225 LK 5 LK 68 LK 225 HK 63 HK 5 HK 68 HKQ 42 HKQ 63 AQ 5 BK 42 BK 63 BK 5 BK 68 BK 225 BK 2 BKP 42 BKP 63 BKP 5 BKP 68 BKP 225 BKH 63 BKH 5 MCF 65 MC 68 MC 22 Chip Embossed Tape Top tape Sprocket hole CK 225 CKS 225 CKP 22 CKP 26 CKP 252 NM 22 NM 252 LK 225 HKQ 42 HK 225 BK 225 BK 326 MCF 86 MCF 2 MCF 2 MC 68 MC 22 Base tape Chip cavity Chip Filled Chip 3Taping Dimensions Paper tape (8mm wide) φ.5+./- Sprocket hole (φ.59+.4/-).75±. (.69±.4) Unit:mm(inch) T A B 3.5±.5 (.38±.2) 8.±.3 (.35±.2) F 4.±. (.57±.4) 2.±.5 (.79±.2) i_mlci_pack_e-e6

13 Type Thickness mm(inch) CK68(63).8 (.3) CK225(85).85(.33) CKS225(85).85(.33) CKP68(63).8 (.3) LK5(42).5 (.2) LK68(63).8 (.3) LK225(85).85(.33) HK63(2).3 (.2) HK5(42).5 (.2) HK68(63).8 (.3) HKQ42(5).2 (.8) HKQ63W(2).3 (.2) HKQ63S(2).3 (.2) HKQ63U(2).3 (.2) AQ5(42).5 (.2) BK42(5).2 (.8) BK63(2).3 (.2) BK5(42).5 (.2) BK68(63).8 (.3) BK225(85).85(.33) BK2(84).45(.8) BKP42(5).2 (.8) BKP63(2).3 (.2) BKP5(42).5 (.2) BKP68(63).8 (.3) BKP225(85).85(.33) BKH63(2).3 (.2) BKH5(42).5 (.2) MCF65(22).3 (.2) MCFK68(63).6 (.24) MCFE68(63).65(.26) MCHK22(85).8 (.3) Chip cavity Insertion Pitch Tape Thickness A B F T.±.2.8±.2 4.±..max (.39±.8) (.7±.8) (.57±.4) (.43max).5±.2 2.3±.2 4.±..max (.59±.8) (.9±.8) (.57±.4) (.43max).5±.2 2.3±.2 4.±..max (.59±.8) (.9±.8) (.57±.4) (.43max).±.2.8±.2 4.±..max (.39±.8) (.7±.8) (.57±.4) (.43max).65±..5±. 2.±.5.8max (.26±.4) (.45±.4) (.79±.2) (.3max).±.2.8±.2 4.±..max (.39±.8) (.7±.8) (.57±.4) (.43max).5±.2 2.3±.2 4.±..max (.59±.8) (.9±.8) (.57±.4) (.43max).4±.6.7±.6 2.±.5.45max (.6±.2) (.28±.2) (.79±.2) (.8max).65±..5±. 2.±.5.8max (.26±.4) (.45±.4) (.79±.2) (.3max).±.2.8±.2 4.±..max (.39±.8) (.7±.8) (.57±.4) (.43max).25±.4.45±.4 2.±.5.36max (.±.2) (.8±.2) (.79±.2) (.4max).4±.6.7±.6 2.±.5.45max (.6±.2) (.28±.2) (.79±.2) (.8max).4±.6.7±.6 2.±.5.45max (.6±.2) (.28±.2) (.79±.2) (.8max).4±.6.7±.6 2.±.5.45max (.6±.2) (.28±.2) (.79±.2) (.8max).75±..5±. 2.±.5.8max (.3±.4) (.45±.4) (.79±.2) (.3max).25±.4.45±.4 2.±.5.36max (.±.2) (.8±.2) (.79±.2) (.4max).4±.6.7±.6 2.±.5.45max (.6±.2) (.28±.2) (.79±.2) (.8max).65±..5±. 2.±.5.8max (.26±.4) (.45±.4) (.79±.2) (.3max).±.2.8±.2 4.±..max (.39±.8) (.7±.8) (.57±.4) (.43max).5±.2 2.3±.2 4.±..max (.59±.8) (.9±.8) (.57±.4) (.43max).2±. 2.7±. 4.±..8max (.47±.4) (.85±.4) (.57±.4) (.3max).25±.4.45±.4 2.±.5.36max (.±.2) (.8±.2) (.79±.2) (.4max).4±.6.7±.6 2.±.5.45max (.6±.2) (.28±.2) (.79±.2) (.8max).65±..5±. 2.±.5.8max (.26±.4) (.45±.4) (.79±.2) (.3max).±.2.8±.2 4.±..max (.39±.8) (.7±.8) (.57±.4) (.43max).5±.2 2.3±.2 4.±..max (.59±.8) (.9±.8) (.57±.4) (.43max).4±.6.7±.6 2.±.5.45max (.6±.2) (.28±.2) (.79±.2) (.8max).65±..5±. 2.±.5.8max (.26±.4) (.45±.4) (.79±.2) (.3max).62±.3.77±.3 2.±.5.45max (.24±.) (.3±.) (.79±.2) (.8max).±.5.9±.5 4.±..72max (.43±.2) (.75±.2) (.57±.4) (.28max).±.5.9±.5 4.±..9max (.43±.2) (.75±.2) (.57±.4) (.35max).55±.2 2.3±.2 4.±..9max (.6±.8) (.9±.8) (.57±.4) (.35max) Unit : mm(inch) i_mlci_pack_e-e6

14 Embossed Tape (8mm wide) φ.5+./- Sprocket hole (φ.59+.4/-).75±. (.69±.4) Unit:mm(inch) A B 3.5±.5 (.38±.2) 8.±.3 (.35±.2) F 4.±. (.57±.4) 2.±.5 (.79±.2) Type Thickness mm(inch) CK225(85).25(.49) CKS225(85).25(.49) CKP22(85).9 (.35) CKP26(86).9 (.35) CKP252(8).7 (.28).9 (.35). (.43) NM22(85).9 (.35) NM252(8).9 (.35). (.43) LK225(85).25(.49) HK225(85).85(.33). (.39) BK225(85).25(.49) BK326(26).8(.3) MCF86(32).4 (.6) MCF2(54).55(.22) MCF2(84).45(.8) MCKK68(63). (.39) MCKK22(85). (.39) Chip cavity Insertion Pitch Tape Thickness A B F K T.5±.2 2.3±.2 4.± (.59±.8) (.9±.8) (.57±.4) (.79) (.2).5±.2 2.3±.2 4.± (.59±.8) (.9±.8) (.57±.4) (.79) (.2).55±.2 2.3±.2 4.±..3.3 (.6±.8) (.9±.8) (.57±.4) (.5) (.2).8±. 2.2±. 4.± (.7±.4) (.87±.4) (.57±.4) (.5) (.).4 (.55) 2.3±. 2.8±. 4.±..4.3 (.9±.4) (.±.4) (.57±.4) (.55) (.2).7 (.67).55±.2 2.3±.2 4.±..3.3 (.6±.8) (.9±.8) (.57±.4) (.5) (.2).4 2.3±. 2.8±. 4.±. (.55).3 (.9±.4) (.±.4) (.57±.4).7 (.2) (.67).5±.2 2.3±.2 4.± (.59±.8) (.9±.8) (.57±.4) (.79) (.2).5.5±.2 2.3±.2 4.±. (.59).3 (.59±.8) (.9±.8) (.57±.4) 2. (.2) (.79).5±.2 2.3±.2 4.± (.59±.8) (.9±.8) (.57±.4) (.79) (.2).9±. 3.5±. 4.±..4.3 (.75±.4) (.38±.4) (.57±.4) (.55) (.2).75±.5.95±.5 2.± (.3±.2) (.37±.2) (.79±.2) (.22) (.2).5±.5.4±.5 4.± (.45±.2) (.55±.2) (.57±.4) (.26) (.2).±. 2.3±. 4.± (.43±.4) (.9±.4) (.57±.4) (.33) (.2).±..95±. 4.± (.43±.4) (±.4) (.57±.4) (.55) (.).55±.2 2.3±.2 4.± (.6±.8) (.9±.8) (.57±.4) (.53) (.) Unit : mm(inch) i_mlci_pack_e-e6

15 Embossed Tape (4mm wide) Unit:mm(inch) Sprocket hole φ.8±.4 (φ.3±.2).9±.5 (.35±.2) A B.8±.2 (.7±.) 4.±.5 (.57±.2) F 2.±.4 (.79±.2).±.2 (.39±.) Thickness Chip cavity Insertion Pitch Tape Thickness Type mm(inch) A B F K T HKQ42(5).2 (.8) ±.2.5max..25max. Unit : mm 4LEADE AND BLANK POTION Blank portion Chip cavity Blank portion Leader 6mm or more (6.3inches or more) 5eel Size Direction of tape feed mm or more (3.94inches or more) 4mm or more (5.7inches or more) E t C D B A W A B C D E φ78±2. φ5 or more φ3.±.2 φ2.±.8 2.±.5. t W 4mm width tape.5max. 5±. 8mm width tape 2.5max. ±.5 6Top tape strength The top tape requires a peel-off force of.~.7n in the direction of the arrow as illustrated below. Pull direction (Unit : mm) ~5 Top tape Base tape i_mlci_pack_e-e6

16 Multilayer chip inductors Multilayer chip inductors for high frequency, Multilayer chip bead inductors Multilayer common mode choke coils(mc series F type) Metal Multilayer Chip Power Inductors (MCOIL TM MC series) ELIABILITY DATA. Operating Temperature ange BK42 BK63 BK5 BKH63 BKH5 BK68 BK225 BK2 AAY BK326 BKP42 BKP63 BKP5 BKP68 BKP225 MCF 65 MCF 86 MCF 2 MCF 2 CK68 CK225 CKS225 Specified Value CKP68 CKP22 CKP26 CKP252 NM22 NM252 LK5 LK68 LK225 HKQ42 HK63 HK5 HK68 HK225 HKQ63W/HKQ63S/HKQ63U AQ5 MCFK68 MCFE68 MCKK68 MCHK22 MCKK22-55~+25-55~+85-4~+85-4~+85-55~+25-4~+85-55~+25-4~+25 (Including self-generated heat) i_mlci_reli_e-e6

17 2. Storage Temperature ange BK42 BK63 BK5 BKH63 BKH5 BK68 BK225 BK2 AAY BK326 BKP42 BKP63 BKP5 BKP68 BKP225 MCF 65 MCF 86 MCF 2 MCF 2 CK68 CK225 CKS225 Specified Value CKP68 CKP22 CKP26 CKP252 NM22 NM252 LK5 LK68 LK225 HKQ42 HK63 HK5 HK68 HK225 HKQ63W/HKQ63S/HKQ63U AQ5 MCFK68 MCFE68 MCKK68 MCHK22 MCKK22-55~+25-55~+85-4~+85-4~+85-55~+25-4~+85-55~+25-4~+85 i_mlci_reli_e-e6

18 3. ated Current BK42 5~75mA DC BK63 ~5mA DC BK5 2~mA DC BKH63 5~45mA DC BKH5 2~3mA DC BK68 5~5mA DC BK225 2~2mA DC AAY BK2 ma DC BK326 ~2mA DC BKP42.55~.A DC BKP63.8~.8A DC BKP5.8~2.4A DC BKP68.~3.A DC BKP225.5~4.A DC MCF 65.5A DC MCF 86.~.3A DC MCF 2.~.6A DC MCF 2.A DC CK68 5~6mA DC CK225 6~5mA DC CKS225 ~28mA DC Specified Value CKP68.35~.9A DC CKP22.7~.7A DC CKP26.9~.6A DC CKP252.~.8A DC NM22.~.2A DC NM252.9~.2A DC LK5 2~25mA DC LK68 ~5mA DC LK225 5~3mA DC HK63 6~47mA DC HK5 ~3mA DC (-55~+25 ) 2~9mA DC (-55~+85 ) HK68 5~3mA DC HK225 3mA DC HKQ42 ~5mA DC HKQ63W ~85mA DC HKQ63S 3~6mA DC HKQ63U 9~9mA DC AQ5 28~7mA DC MCFK68 Idc : 5~23mA DC, Idc2 : 9~2mA DC MCFE68 Idc : 4~26mA DC, Idc2 : 8~5mA DC MCKK68 Idc : 28~2mA DC Idc2 : 3~26mA DC MCHK22 Idc : 226~432mA DC, Idc2 : 47~36mA DC MCKK22 Idc : 36~62mA DC, Idc2 : 2~4mA DC Definition of rated current: In the CK, CKS and BK Series, the rated current is the value of current at which the temperature of the element is increased within 2. In the BK Series P type, CK Series P type, NM Series, the rated current is the value of current at which the temperature of the element is increased within 4. In the LK, HK, HKQ63, and AQ Series, the rated current is either the DC value at which the initial L value is decreased within 5% with the application of DC bias, or the value of current at which the temperature of the element is increased within 2. In the HKQ42(~9N), the rated current is either the DC value at which the initial L value is decreased within 5% with the application of DC bias, or the value of current at which the temperature of the element is increased within 2. In the HKQ42(N~), the rated current is either the DC value at which the initial L value is decreased within 5% with the application of DC bias, or the value of current at which the temperature of the element is increased within 25. In the MC Series, Idc is the DC value at which the initial L value is decreased within 3% and Idc2 is the DC value at which the temperature of element is increased within 4 by the application of DC bias. (at 2 ) i_mlci_reli_e-e6

19 4. Specified Value Test Methods and emarks BK42 ~33Ω ±5Ω(Ω), ±25%(Other) BK63 ~2Ω ±25% BK5 ~8Ω ±25% BKH63 25~5Ω ±25% BKH5 6~8Ω ±25% BK68 22~25Ω ±25% BK225 5~25Ω ±25% BK2 5~Ω ±25% AAY BK326 6~Ω ±25% BKP42 ~33Ω ±5Ω(Ω) ±25%(Other) BKP63 ~2Ω ±5Ω(Ω), ±25%(Other) BKP5 ~33Ω ±5Ω(EM), ±25%(Other) BKP68 33~47Ω ±25% BKP225 33~33Ω ±25% MCF 65 2~9Ω ±5Ω(2Ω), ±2%(35Ω,9Ω),±25%(6Ω) MCF 86 2~9Ω ±5Ω(2Ω), ±2%(47Ω,9Ω),±25%(3Ω) MCF 2 4~9Ω ±2%(2H9),±25%(Other) MCF 2 9Ω ±25% CK68 CK225 CKS225 CKP68 CKP22 CKP26 CKP252 NM22 NM252 LK5 LK68 LK225 - HKQ42 HK63 HK5 HK68 HK225 HKQ63W/HKQ63S/HKQ63U AQ5 MCFK68 MCFE68 MCKK68 MCHK22 MCKK22 BK42Series, BKP42Series : ±MHz Measuring equipment : E499A(or its equivalent) Measuring jig : 697A(or its equivalent) BK63Series, BKP63Series : ±MHz Measuring equipment : 429A(or its equivalent) Measuring jig : 693A(or its equivalent) BK5Series, BKP5Series,BKH5Series : ±MHz Measuring equipment : 429A(or its equivalent) Measuring jig : 692A(or its equivalent), 693A(or its equivalent) BK68 225Series, BKP68 225Series : ±MHz Measuring equipment : 429A(or its equivalent), 495A(or its equivalent) Measuring jig : 692A(or its equivalent) or 692A(or its equivalent)/hw BK2 326Series, MCF Series : ±MHz Measuring equipment : 429A(or its equivalent), 495A(or its equivalent) Measuring jig : 692A(or its equivalent) i_mlci_reli_e-e6

20 5. Inductance Specified Value Test Methods and emarks BK42 BK63 BK5 BKH63 BKH5 BK68 BK225 BK2 AAY BK326 - BKP42 BKP63 BKP5 BKP68 BKP225 MCF 65 MCF 86 MCF 2 MCF 2 CK68 4.7~.μH: ±2% CK225.~.μH: ±2% CKS225.~.μH: ±2% CKP68.33~2.2μH: ±2% CKP22.47~4.7μH: ±2% CKP26.47~4.7μH: ±2% CKP252.47~4.7μH: ±2% NM22.82~.μH: ±2% NM252.~2.2μH: ±2% LK5.2~2.2μH: ± or 2% LK68.47~33.μH: ±2%.~2.μH: ±% LK225.47~33.μH: ±2%.~2.μH: ±% HK63.~6.2nH: ±.3nH 6.8~nH: ±5% HK5.~6.2nH: ±.3nH 6.8~27nH: ±5% HK68.~5.6nH: ±.3nH 6.8~47nH: ±5% HK225.5~5.6nH: ±.3nH 6.8~47nH: ±5% HKQ42.5~3.9nH: ±. or.2 or.3nh 4.3~5.6nH: ±.3nH or 3% or 5% 6.2~47nH: ±3 or 5% HKQ63W.6~3.9nH: ±. or.2 or.3nh 4.3~6.2nH: ±.2 or.3nh or 3 or 5% 6.8~3nH: ±3 or 5% 33~nH: ±5% HKQ63S.6~6.2nH: ±.2 or.3nh 6.8~22nH: ±3 or 5% HKQ63U.6~4.2nH: ±. or.2 or.3nh 4.3~6.5nH: ±.2 or.3nh 6.8~22nH: ±3 or 5% AQ5.~6.2nH: ±.3nH 6.8~5nH: ±5% MCFK68.24~.μH: ±2% MCFE68.24~.μH: ±2% MCKK68.24~.μH: ±2% MCHK22.24~.μH: ±2% MCKK22.24~.μH: ±2% CK LK CKP NM MC Series : 2~4MHz(CK68) : 2~25MHz(CK225) : 2~MHz(CKS225) : ~25MHz(LK5) : ~5MHz(LK68) :.4~5MHz(LK225) : MHz(CKP68 CKP22 CKP26 CKP252 NM22 NM252 MCFK68 MCFE68 MCHK22 MCKK22) Measuring equipment /jig : 494A+685B+692A(or its equivalent) 495A A(or its equivalent) 4294A+692A(or its equivalent) 429A+693A(or its equivalent)/lk5 4285A+4284A+42842C (or its equivalent)/ckp68 CKP22 CKP26 CKP252 NM22 NM252 MCFK68 MCFE68 MCKK68 MCHK22 MCKK22 Measuring current : ma rms(.47~4.7μh).ma rms(5.6~33μh) HK HKQ AQ Series : MHz(HK63 HK5 AQ5) : 5/MHz(HK68 HK225) : 5MHz(HKQ63S HKQ63U) : 3/5MHz(HKQ63W) : /5MHz(HKQ42) Measuring equipment /jig : 429A+697A(or its equivalent)/hk63 AQ5 429A+693A(or its equivalent)/hk5 E499A+697A(or its equivalent)/hkq63s HKQ63U HKQ63W 429A+692A + in-house made jig(or its equivalent)/hk68 HK225 E499A+696D(or its equivalent)/hkq42 i_mlci_reli_e-e6

21 6. Q Specified Value Test Methods and emarks BK42 BK63 BK5 BKH63 BKH5 BK68 BK225 BK2 AAY BK326 BKP42 BKP63 BKP5 BKP68 BKP225 MCF 65 MCF 86 MCF 2 MCF 2 CK68 CK225 CKS225 CKP68 CKP22 CKP26 CKP252 NM22 NM252 LK5 LK68 LK225 HK63 HK5 HK68 HK225 HKQ42 HKQ63W HKQ63S HKQ63U AQ5 MCFK68 MCFE68 MCKK68 MCHK22 MCKK22 LK Series Measuring equipment /jig Measuring current HK HKQ AQ Series Measuring equipment /jig - - ~2 min. ~35 min. 5~5 min. 4~5 min. 8 min. 8~2 min. ~8 min. 3~8 min. 6~5 min. ~3 min. 4 min. 8 min. - : ~25MHz(LK5) : ~5MHz(LK68) :.4~5MHz(LK225) : 494A+685B+692A(or its equivalent) 495A A(or its equivalent) 4294A+692A(or its equivalent) 429A+693A(or its equivalent)/lk5 ma rms(.47~4.7μh).ma rms(5.6~33μh) : MHz(HK63 HK5 AQ5) : 5/MHz(HK68 HK225) : 5MHz(HKQ63S HKQ63U) : 3/5MHz(HKQ63W) : /5MHz(HKQ42) : 429A+697A(or its equivalent)/hk63 AQ5 429A+693A(or its equivalent)/hk5 E499A+697A(or its equivalent)/hkq63s HKQ63U HKQ63W 429A+692A + in-house made jig(or its equivalent)/hk68, HK225 E499A+696D(or its equivalent)hkq42 i_mlci_reli_e-e6

22 7. DC esistance Specified Value Test Methods and emarks BK42.7~.2Ωmax. BK63.65~.5Ω max. BK5.3~.9Ω max. BKH63.26~3.2Ω max. BKH5.85~2.Ω max. BK68.5~.Ω max. BK225.5~.75Ω max. AAY BK2.~.9Ω max. BK326.5~.8Ω max. BKP42.5~.5Ω max. BKP63.3~.8Ω max. BKP5.273~.22Ω max. BKP68.25~.8Ω max. BKP225.2~.75Ω max. MCF ~5.Ω max MCF 86.5~5.Ω max. MCF 2.5~4.5Ω max. MCF 2 4.5Ω max. CK68.45~.85Ω(±3%) CK225.6~.65Ω max. CKS225.2~.52Ω max. CKP68.5~.35Ω max. CKP22.8~.28Ω max. CKP26.75~.2Ω max CKP252.5~.6Ω max. NM22.~.5Ω max. NM252.~.22Ω max. LK5.4~.6Ω max. LK68.2~2.2Ω max. LK225.~.Ω max. HK63.~3.74Ω max. HK5.8~4.8Ω max. HK68.5~2.6Ω max. HK225.~.5Ω max. HKQ42.8~5.Ω max. HKQ63W.7~4.Ω max. HKQ63S.6~.29Ω max. HKQ63U.6~.29Ω max. AQ5.7~.45Ω max. MCFK68.5~.224Ω max. MCFE68.~.34Ω max. MCKK68.38~.23Ω max. MCHK22.24~.Ω max. MCKK22.25~.9Ω max. Measuring equipment:voac-742, VOAC-752, VOAC-752(made by Iwasaki Tsushinki), HIOKI3227 (or its equivalent) i_mlci_reli_e-e6

23 8. Self esonance Frequency(SF) BK42 BK63 BK5 BKH63 BKH5 BK68 BK225 Specified Value Test Methods and emarks BK2 AAY BK326 BKP42 BKP63 BKP5 BKP68 BKP225 MCF 65 MCF 86 MCF 2 MCF 2 CK68 CK225 CKS225 CKP68 CKP22 CKP26 CKP252 NM22 NM252 LK5 LK68 LK225 HK63 HK5 HK68 HK225 HKQ42 HKQ63W HKQ63S HKQ63U AQ5 MCFK68 MCFE68 MCKK68 MCHK22 MCKK22 LK CK Series : Measuring equipment Measuring jig HK HKQ AQ Series : Measuring equipment - 7~25MHz min. 24~235MHz min. 24~75MHz min. - 4~8MHz min. 9~26MHz min. 3~32MHz min. 9~MHz min. 4~MHz min. 3~MHz min. 2~4MHz min. 2~MHz min. 8~MHz min. 9~MHz min. 9~MHz min. 23~MHz min. - : 495A(or its equivalent) : A(or its equivalent) : 879C(or its equivalent) 8753D(or its equivalent)/hk225 i_mlci_reli_e-e6

24 9. Temperature Characteristic BK42 BK63 BK5 BKH63 BKH5 BK68 BK225 Specified Value Test Methods and emarks AAY BKP42 BKP63 BKP5 BKP68 BKP225 MCF 65 MCF 86 MCF 2 MCF 2 CK68 CK225 CKS225 CKP68 CKP22 CKP26 CKP252 NM22 NM252 LK5 LK68 LK225 HK63 HK5 HK68 HK225 HKQ42 HKQ63W HKQ63S BK2 BK326 HKQ63U AQ5 MCFK68 MCFE68 MCKK68 MCHK22 MCKK22 HK HKQ AQ Series: Temperature range : -3~+85 eference temperature : +2 MC Series: Temperature range : -4~+85 eference temperature : +2 - Inductance change:within ±% i_mlci_reli_e-e6

25 . esistance to Flexure of Substrate BK42 BK63 BK5 BKH63 BKH5 BK68 BK225 AAY BK2 BK326 Specified Value BKP42 BKP63 BKP5 BKP68 BKP225 MCF 65 MCF 86 MCF 2 MCF 2 CK68 CK225 CKS225 CKP68 CKP22 CKP26 CKP252 NM22 NM252 LK5 LK68 LK225 HK63 HK5 HK68 HK225 HKQ42 HKQ63W HKQ63S HKQ63U AQ5 MCFK68 MCFE68 MCKK68 MCHK22 MCKK22 No mechanical damage. Warp : 2mm(BK Series without 42size BKP BKH5 CK CKS CKP LK HK HKQ63S HKQ63U AQ Series MCF2 MC Series) : mm(bk42 BKP42 BKH63 HKQ42 HKQ63W MCF Series without 2 size,) Testing board : glass epoxy-resin substrate Thickness :.8mm 2 Test Methods and emarks Board -23 Warp Deviation± (Unit:mm) i_mlci_reli_e-e6

26 . Solderability Specified Value Test Methods and emarks BK42 BK63 BK5 BKH63 BKH5 BK68 BK225 BK2 AAY BK326 BKP42 BKP63 BKP5 BKP68 BKP225 MCF 65 MCF 86 MCF 2 MCF 2 CK68 CK225 CKS225 CKP68 CKP22 CKP26 CKP252 NM22 NM252 LK5 LK68 LK225 HK63 HK5 HK68 HK225 HKQ42 HKQ63W HKQ63S HKQ63U AQ5 MCFK68 MCFE68 MCKK68 MCHK22 MCKK22 Solder temperature Solder temperature Duration :23±5 (JIS 3282 H6A or H63A) :245±3 (Sn/3.Ag/.5Cu) :4± sec. At least 9% of terminal electrode is covered by new solder. i_mlci_reli_e-e6

27 2. esistance to Soldering BK42 BK63 BK5 BKH63 BKH5 BK68 BK225 Specified Value AAY BKP42 BKP63 BKP5 BKP68 BKP225 MCF 65 MCF 86 MCF 2 MCF 2 CK68 CK225 CKS225 CKP68 CKP22 CKP26 CKP252 NM22 NM252 BK2 BK326 change:within ±3% change:within ±2% Inductance change ~47: Within ±% 68~: Within ±5% CKS225 : Within ±2% CKP68 CKP22 CKP26 CKP252 NM22 NM252: Within ±3% LK5 Inductance change: Within ±5% LK68 Inductance change LK225 47N~47: Within ±% 56~33: Within ±5% HK63 HK5 HK68 HK225 HKQ42 Inductance change: Within ±5% HKQ63W HKQ63S HKQ63U AQ5 MCFK68 MCFE68 MCKK68 Inductance change: Within ±% MCHK22 MCKK22 Solder temperature :26±5 Duration :±.5 sec. Test Methods and Preheating temperature :5 to 8 emarks Preheating time :3 min. Flux :Immersion into methanol solution with colophony for 3 to 5 sec. ecovery :2 to 3 hrs of recovery under the standard condition after the test.(see Note ) (Note ) When there are questions concerning measurement result;measurement shall be made after 48±2 hrs of recovery under the standard condition. i_mlci_reli_e-e6

28 3. Thermal Shock BK42 BK63 BK5 BKH63 BKH5 BK68 BK225 AAY BKP42 BKP63 BKP5 BKP68 BKP225 MCF 65 MCF 86 MCF 2 MCF 2 CK68 CK225 CKS225 BK2 BK326 change: Within ±3% change: Within ±2% Inductance change:within ±2% Q change:within ±3% Inductance change:within ±2% Specified Value CKP68 CKP22 CKP26 CKP252 Inductance change: Within ±3% NM22 NM252 LK5 LK68 Inductance change: Within ±% Q change: Within ±3% LK225 HK63 HK5 HK68 HK225 HKQ42 Inductance change: Within ±% Q change: Within ±2% HKQ63W HKQ63S HKQ63U AQ5 MCFK68 MCFE68 MCKK68 Inductance change: Within ±% MCHK22 MCKK22 Conditions for cycle Step temperature( ) time(min.) Minimum operating temperature +/-3 3±3 Test Methods and 2 oom temperature 2~3 emarks 3 Maximum operating temperature +3/- 3±3 4 oom temperature 2~3 Number of cycles:5 ecovery:2 to 3 hrs of recovery under the standard condition after the test.(see Note ) (Note ) When there are questions concerning measurement result;measurement shall be made after 48±2 hrs of recovery under the standard condition. i_mlci_reli_e-e6

29 4. Damp Heat( Steady state) BK42 BK63 BK5 BKH63 BKH5 BK68 BK225 Specified Value Test Methods and emarks AAY BKP42 BKP63 BKP5 BKP68 BKP225 MCF 65 MCF 86 MCF 2 MCF 2 CK68 CK225 CKS225 CKP68 CKP22 CKP26 CKP252 NM22 NM252 LK5 LK68 LK225 BK2 BK326 change: Within ±3% change: Within ±2% Inductance change: Within ±2% Q change: Within ±3% Inductance change: Within ±2% Inductance change: Within ±3% Inductance change: Within ±% Q change: Within ±3% Inductance change: Within ±2% Q change: Within ±3% HK63 HK5 HK68 HK225 HKQ42 Inductance change: Within ±% Q change: Within ±2% HKQ63W HKQ63S HKQ63U AQ5 MCFK68 MCFE68 MCKK68 Inductance change: Within ±% MCHK22 MCKK22 BK BKP BKH LK CK CKS CKP NM Series MCF Series: Temperature :4±2 Humidity :9 to 95%H Duration :5 +24/- hrs ecovery :2 to 3 hrs of recovery under the standard condition after the removal from test chamber.(see Note ) HK HKQ AQ MC Series: Temperature :6±2 Humidity :9 to 95%H Duration :5 +24/- hrs ecovery :2 to 3 hrs of recovery under the standard condition after the removal from test chamber.(see Note ) (Note ) When there are questions concerning measurement result;measurement shall be made after 48±2 hrs of recovery under the standard condition. i_mlci_reli_e-e6

30 5. Loading under Damp Heat BK42 BK63 BK5 BKH63 BKH5 BK68 BK225 Specified Value Test Methods and emarks AAY BKP42 BKP63 BKP5 BKP68 BKP225 CK68 CK225 CKS225 BK2 BK326 change: Within ±3% Inductance change: Within ±2% Q change: Within ±3% Inductance change: Within ±2% CKP68 CKP22 CKP26 CKP252 Inductance change: Within ±3% NM22 NM252 LK5 Inductance change: Within ±% Q change: Within ±3% LK68 Inductance change:.47~2.μh: Within ±% 5.~33.μH: Within ±5% Q change: Within ±3% LK225 Inductance change: Within ±2% Q change: Within ±3% HK63 HK5 HK68 HK225 HKQ42 Inductance change: Within ±% Q change: Within ±2% HKQ63W HKQ63S HKQ63U AQ5 MCFK68 MCFE68 MCKK68 Inductance change: Within ±% MCHK22 MCKK22 BK BKP BKH LK CK CKS CKP NM Series: Temperature :4±2 Humidity :9 to 95%H Applied current :ated current Duration :5 +24/- hrs ecovery :2 to 3 hrs of recovery under the standard condition after the removal from test chamber.(see Note ) HK HKQ AQ MC Series: Temperature :6±2 Humidity :9 to 95%H Applied current :ated current MC series ; Idc2max Duration :5 +24/- hrs ecovery :2 to 3 hrs of recovery under the standard condition after the removal from test chamber.(see Note ) Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35 of temperature, 45 to 85% relative humidity, and 86 to 6kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 2±2 of temperature, 6 to 7% relative humidity, and 86 to 6kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." (Note ) Measurement shall be made after 48±2 hrs of recovery under the standard condition. i_mlci_reli_e-e6

31 6. Loading at High Temperature BK42 BK63 BK5 BKH63 BKH5 BK68 BK225 Specified Value AAY BKP42 BKP63 BKP5 BKP68 BKP225 MCF 65 MCF 86 MCF 2 MCF 2 CK68 CK225 CKS225 CKP68 CKP22 CKP26 CKP252 NM22 NM252 LK5 LK68 LK225 HK63 HK5 HK68 HK225 HKQ42 HKQ63W HKQ63S HKQ63U AQ5 MCFK68 MCFE68 MCKK68 MCHK22 MCKK22 BK2 BK326 change: Within ±3% change: Within ±2% Inductance change: Within ±2% Q change: Within ±3% Inductance change: Within ±2% Inductance change: Within ±3% Inductance change: Within ±% Q change: Within ±3% Inductance change:.47~2.μh: Within ±% 5.~33.μH: Within ±5% Q change: Within ±3% Inductance change: Within ±2% Q change: Within ±3% Inductance change: Within ±% Q change: Within ±2% Inductance change: Within ±% Test Methods and emarks Temperature Applied current Duration ecovery : Maximum operating temperature :ated current MC series ; Idc2max :5 +24/- hrs :2 to 3 hrs of recovery under the standard condition after the removal from test chamber. (See Note ) Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35 of temperature, 45 to 85% relative humidity, and 86 to 6kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 2±2 of temperature, 6 to 7% relative humidity, and 86 to 6kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." (Note ) Measurement shall be made after 48±2 hrs of recovery under the standard condition. i_mlci_reli_e-e6

32 Precautions on the use of Multilayer chip inductors Multilayer chip inductors for high frequency, Multilayer chip bead inductors Multilayer common mode choke coils(mc series F type) Metal Multilayer Chip Power Inductors (MCOIL TM MC series) PECAUTIONS. Circuit Design Precautions Verification of operating environment, electrical rating and performance. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications. As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from components used in general purpose applications. Operating Current(Verification of ated current). The operating current including inrush current for inductors must always be lower than their rated values. 2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect. 2. PCB Design Precautions Pattern configurations(design of Land-patterns). When inductors are mounted on a PCB, the size of land patterns and the amount of solder used(size of fillet)can directly affect inductor performance. Therefore, the following items must be carefully considered in the design of solder land patterns: () The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. (2) When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated by solder-resist. (3) The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to design land patterns smaller than terminal electrode of chips. Pattern configurations(inductor layout on panelized[ breakaway] PC boards). After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processes (PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.)for this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to minimize stress. Pattern configurations(design of Land-patterns). The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts(larger fillets which extend above the component end terminations). Examples of improper pattern designs are also shown. () ecommended land dimensions for a typical chip inductor land patterns for PCBs Chip inductor Land pattern Solder-resist Chip inductor C W Technical considerations B A B L ecommended land dimensions for wave-soldering (Unit:mm) Type Size L W A.8~..~.4.~.4.~.4.~.4.8~2.5 B.5~.8.8~.5.8~.5.8~.5.6~..8~.7 C.6~.8.9~.2.9~.2.3~.6.6~2..2~.6 ecommended land dimensions for reflow-soldering (Unit:mm) Type Size L W A.5~.25.2~.3.45~.55.5~.55.8~..8~.2.8~.2.8~.2.~.4.8~2.5 B.~.2.2~.3.4~.5.3~.4.6~.8.8~.2.8~.2.8~.2.6~..6~.5 C.5~.3.25~.4.45~.55.6~.7.6~.8.9~.6.9~.6.2~2..8~2.2.2~2. i_mlci_prec_e-e6

33 Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns. c d c ecommended land dimension for eflow-soldering Type L Size W a.7~.9.5~.6.45~.55.25~.35.27~.33 a b a a b a d b.8~..5~.6.7~.8.25~.35.7~.23 c.4~.5.2~.3.25~.35.25~.35.2~.26 d (Unit:mm) ((2) Examples of good and bad solder application Item Not recommended ecommended Lead wire of component Solder-resist Mixed mounting of SMD and leaded components Component placement close to the chassis Hand-soldering of leaded components near mounted components Chassis Solder (for grounding) Electrode pattern Lead wire of component Soldering iron Solder-resist Solder-resist Solder-resist Horizontal component placement Pattern configurations(inductor layout on panelized[ breakaway] PC boards) -. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical stresses from board warp or deflection. Item Not recommended ecommended Deflection of the board Position the component at a right angle to the direction of the mechanical stresses that are anticipated. -2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on inductor layout. An example below should be counted for better design. E D Perforation C A Slit B Magnitude of stress A>B=C>D>E -3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure. i_mlci_prec_e-e6

34 3. Considerations for automatic placement Precautions Adjustment of mounting machine. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards. 2. The maintenance and inspection of the mounter should be conducted periodically. Selection of Adhesives. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use. Adjustment of mounting machine. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the following points should be considered before lowering the pick-up nozzle: () The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the board. (2) The pick-up pressure should be adjusted between and 3N static loads. (3) To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement: Item Improper method Proper method Single-sided mounting chipping or cracking supporting pins or back-up pins Double-sided mounting chipping or cracking supporting pins or back-up pins Technical considerations 2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical impact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the pin should be conducted periodically. Selection of Adhesives. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of the inductors may result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect component placement, so the following precautions should be noted in the application of adhesives. () equired adhesive characteristics a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive should have sufficient strength at high temperatures. c. The adhesive should have good coating and thickness consistency. d. The adhesive should be used during its prescribed shelf life. e. The adhesive should harden rapidly. f. The adhesive must not be contaminated. g. The adhesive should have excellent insulation characteristics. h. The adhesive should not be toxic and have no emission of toxic gasses. (2) When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect component placement. Too little adhesive may cause the inductors to fall off the board during the solder process. Too much adhesive may cause defective soldering due excessive flow of adhesive on to the land or solder pad. [ecommended conditions] Amount of adhesives After inductors are bonded Figure 85 case sizes as examples a a a.3mm min b b ~2μm c Area with no adhesive c c 4. Soldering Precautions Selection of Flux. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use; () Flux used should be with less than or equal to. wt% (Chlorine conversion method) of halogenated content. Flux having a strong acidity content should not be applied. (2) When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level. (3) When using water-soluble flux, special care should be taken to properly clean the boards. Soldering. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us about peak temperature when you use lead-free paste. i_mlci_prec_e-e6

35 Selection of Flux -. When too much halogenated substance(chlorine, etc.)content is used to activate the flux, or highly acidic flux is used, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the Inductor. -2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. -3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux. Soldering -. Preheating when soldering Heating: Chip inductor components should be preheated to within to 3 of the soldering. Cooling: The temperature difference between the components and cleaning process should not be greater than. Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock. Technical considerations [eflow soldering] ecommended conditions for eutectic soldering ecommended condition for Pb-free soldering Temperature( ) 3 2 Preheating 23 Within sec. 6sec. 6sec Min. Min. Slow cooling Temperature( ) 3 2 Preheating5 6sec. Min. Peak 26 Max. Within sec. Heating above 23 4sec. Max. Slow cooling Ceramic chip components should be preheated to within to 3 of the soldering. Assured to be reflow soldering for 2 times. MC series; Peak 23 (eutectic soldering) 26 (Pb-free soldering)max within 5sec. Caution. The ideal condition is to have solder mass(fillet)controlled to /2 to /3 of the thickness of the inductor, as shown below: /2T~/3T Inductor Solder T PC board 2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible. [Wave soldering] ecommended conditions for eutectic soldering ecommended condition for Pb-free soldering ~25 Within 3sec. Temperature( ) 2 Preheating 2sec. Min. Slow cooling Temperature( ) 2 2sec. Min. Preheating 5 Peak 26 Max. Within sec. Slow cooling Ceramic chip components should be preheated to within to 3 of the soldering. Assured to be wave soldering for time. Except for reflow soldering type. Caution. Make sure the inductors are preheated sufficiently. 2. The temperature difference between the inductor and melted solder should not be greater than to Cooling after soldering should be as gradual as possible. 4. Wave soldering must not be applied to the inductors designated as for reflow soldering only. [Hand soldering] ecommended conditions for eutectic soldering ecommended condition for Pb-free soldering Temperature( ) ~28 Within 3sec. Preheating 6sec. Min. Slow cooling Temperature( ) T Peak 35 Max. Within 3sec. Preheating 5 Min. Slow cooling 6sec. Min. ( T 9 ( 326Type max), T 3 ( 3225 Type min) It is recommended to use 2W soldering iron and the tip is φor less. The soldering iron should not directly touch the components. Assured to be soldering iron for time. Note: The above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. i_mlci_prec_e-e6