Chip Beads & Inductors

Transcription

1 Chip Beads & Inductors Introduction Chip Components Guide SAMWHA s CB, CBA,CM, CD series of chip components consist of compact, high performance beads and inductors. Their innovative components and case structures mean low DC resistance and outstanding highfrequency characteristics. These series are designed for a variety of applications, facilitating component selection for individual circuit requirements. Products Guide Product Name Application Material Part Number / Dimensions Inductance range Signal Line (G) General Frequency (A) CB GA CB GK 1~4 6~1 Chip Ferrite Beads High Power Line (P) Medium Frequency (K) CB GM CB PA 5~1 11~ Ultra High Power Line(U) High Frequency (M) CB PM CB UM 5~6 5~12 Chip Ferrite Beads Array Signal Line General Frequency (A) Medium Frequency (K) High Frequency (M) CBA GA CBA GK CBA GM 3~1 6~1 3~ Chip Ferrite Inductors Signal Line Ferrite (F) CM F.47~33 H Chip Ceramic Inductors Signal Line Ceramic (C) CD C 1.~47nH

2 Chip Beads & Inductors Part Numbering CB 168 G A 12 T CBA 3216 G A 12 N4 E CM 168 F 22 K T CD 168 C 22N J T Series Mark CB CBA CM CD Product Name Chip Ferrite Beads Chip Ferrite Beads Array Chip Ferrite Inductors Chip Ceramic Inductors Dimension Mark Dimension 15 1.mm.5mm mm.8mm mm 1.25mm mm 1.6mm Applications Mark Applications G Signal Line P High Power Line U Ultra High Power Line Material Mark A K M F C Material General Frequency Medium Frequency High Frequency Ferrite Ceramic 3 = 3 21 = 2 61 = 6 12 = 1 Inductance 22N = 22nH 22 = 2.2 H Number of circuits N4 = 4 array Inductance Tolerance Mark G J K M N C S D Packaging Code Mark B T E 3N3 = 3.3nH 22 =.22 H Tolerance 2% 5% 1% 2% 3%.2nH.3nH.5nH Packaging Bulk Pack Tape & eel Pack Embossed Tape Pack 37

3 Features 1. Good reliability (Monolithic structure) 2. High impedance characteristics 3. Flow/eflow solder application Applications 1. Computer and its peripherals 2. I/O port, DC power lines, signal lines 3. Digital TV/VC 4. OA electronic equipment Product Identifications CB 168 G A 12 T Series Code CB : Chip Ferrite Beads Dimension Code The first two digits : length(mm) The last two digits : width(mm) Application Code G : Signal Line P : High power line U : Ultra high power line Material Code A : General frequency K : Medium frequency M : High frequency Value Code The first two digits are significant The last digit is the number of zeros following Packaging Code T : eel paper packaging E : eel embossed tape packaging B : Bulk packaging Shape and Dimensions (Unit:mm) Model L W T B CB CB CB

4 Specifications - CB 168 series - 39

5 Electrical Characteristics 2 CB 168 GA 1 6 CB 168 GA 3 12 CB 168 GA CB 168 GA CB 168 GA 151 CB 168 GA CB 168 GA 271 CB 168 GA 331 CB 168 GA

6 Electrical Characteristics 8 CB 168 GA CB 168 GA 12 CB 168 GK CB 168 GK CB 168 GK 151 CB 168 GK CB 168 GK 471 CB 168 GK 61 CB 168 GK

7 Electrical Characteristics 12 CB 168 GM 3 12 CB 168 GM 47 4 CB 168 GM CB 168 GM CB 168 GM 31 1 CB 168 GM CB 168 GM 61 2 CB 168 GM

8 Specifications - CB 168 series - Electrical Characteristics 6 CB 168 PA 3 12 CB 168 PA 6 12 CB 168 PM CB 168 PM 6 4 CB 168 PM

9 Specifications - CB 212 series - 44

10 Electrical Characteristics 2 CB 212 GA 1 6 CB 212 GA 3 8 CB 212 GA CB 212 GA 6 24 CB 212 GA CB 212 GA CB 212 GA CB 212 GA CB 212 GA

11 Electrical Characteristics 8 6 CB 212 GA CB 212 GA CB 212 GA CB 212 GA CB 212 GK CB 212 GK CB 212 GK CB 212 GK CB 212 GK

12 Specifications - CB 212 series - 47

13 Electrical Characteristics 2 CB 212 GM 5 2 CB 212 GM 6 2 CB 212 GM CB 212 GM CB 212 GM CB 212 GM CB 212 GM CB 212 GM 61 2 CB 212 GM

14 Specifications - CB 212 series - 49

15 Electrical Characteristics 2 CB 212 PA CB 212 PA 6 16 CB 212 PA CB 212 PA CB 212 PA CB 212 PM CB 212 PM CB 212 PM CB 212 UM

16 Specifications - CB 3216 series - 51

17 Electrical Characteristics 8 CB 3216 GA 35 8 CB 3216 GA 5 8 CB 3216 GA CB 3216 GA CB 3216 GA CB 3216 GA CB 3216 GA 31 8 CB 3216 GA CB 3216 GA

18 Electrical Characteristics CB 3216 GK CB 3216 GK CB 3216 GK CB 3216 GK CB 3216 GK CB 3216 GM CB 3216 GM CB 3216 GM 61 2 CB 3216 GM

19 Specifications - CB 3216 series - 54

20 Electrical Characteristics 8 CB 3216 PA 31 8 CB 3216 PA 35 8 CB 3216 PA CB 3216 PA CB 3216 PA CB 3216 PA CB 3216 PM CB 3216 PM CB 3216 UM

21 eliability and Test Conditions Chip Beads & Inductors Item equirements Test Conditions Operating temperature range Storage temperature range Solderability esistance to Soldering heat eflow soldering High temperature resistance High temperature load resistance Humidity resistance More than 9% of the terminal electrode shall be covered with new solder 1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. shall not change more than 3% More than 5% of the terminal electrode shall be covered with new solder 1. No mechanical damage -55 ~ ~ max., 7%H max. 2. shall not change more than 3% 3. Inductance shall not change more than 1% 4. Q shall not change more than 2% Preheat temperature : 1~15 Preheat time : 6 sec. Solder temperature : 23 1 Soldering time : 4 sec. Preheat temperature : 1~15 Preheat time : 6 sec. Solder temperature : 27 1 Soldering time :1.5 sec. Preheat temperature : 15 Preheat time : 6 sec. Solder temperature : 23 1 Soldering time :1 sec. max. (eflow soldering profile) Temperature : 85 2 Time : 5 12 hours Measurement at room ambient temperature after placing for 24 hours Temperature : 85 2 Applied current : rated current Time : 1 12 hours Measurement at room ambient temperature after placing for 24 hours Temperature : 4 2 Humidity : 9 2%H Time : 5 12 hours Measurement at room ambient temperature after placing for 24 hours - at packing condition Chip Beads Chip Inductors 74

22 eliability and Test Conditions Chip Beads & Inductors Item equirements Test Conditions Humidity load resistance Temperature : 4 2 Humidity : 9 2% H Applied current : rated current Time : 5 12 hours Measurement at room ambient temperature after placing for 24hours Low temperature resistance Thermal shock Vibration Drop Flexure strength 1. No mechanical damage 2. shall not change more than 3% 3. Inductance shall not change more than 1% 4. Q shall not change more than 2% No mechanical damage Type A [mm] B [mm] C [mm] W [kgf] Temperature : -4 5 Time : 1 12 hours Measurement at room ambient temperature after placing for 24hours for 3 minutes for 3 minutes 3. repeat 1 cycle Frequency : 1~55 Hz Amplitude : 1.5 mm Direction :, T, Sweep time : 2 hours for each axis Drop 1 times on a concrete floor from a height of 1 cm Bending strength The terminal electrode shall be neither break off nor the chip damage Chip Beads Chip Inductors 75

23 Packaging Bulk packaging eel packaging (Unit:mm) Type Array Q TY(PCS) 1, 4, (T).85 (T)1.25 4, 3, 3, 3, Leader and Blank portion 78

24 Packaging Taping Dimension Embossing Tape Unit : mm Paper Tape Unit : mm 79

25 Land Pattern Design Land Patten Design Chip Ferrite Beads, Chip Ceramic/Ferrite Inductors Unit : mm Chip Ferrite Beads Array Unit : mm 8

26 Soldering Profile Typocal Soldering Performance Profile Characteristics eflow Soldering Pre-heating Soldering 23 5 Cooling 6 sec. min 1 sec. max 6 sec. min Flow Soldering Pre-heating Soldering Cooling sec. min 3 sec. max 6 sec. min Flow Soldering 3 To Soldering Iron : 3W max. Diameter of soldering iron : 1.2 mm max. 2 sec. max Specifications which provide more details for the proper and safe use described product are available upon request. All specifications are subject to change without notice. 81