CHIP FERRITE BEADS ARRAY

Transcription

1 CHIP FERRITE BEADS ARRAY Features 1. Availabe in a wide range of impedance values and providing excellent EMI suppression characteristics for various types of noise. 2. Line(3,4) is achievable with a single chip, it can be very usefully adopted in high density circuit designs. 3. Heat generation and crosstalk between adjacent circuits are minimized. 4. Excellent solderability. Applications 1. Waveform correction in personal computers, electric equipment, communication equipment, OA equipment, and provides radiated noise countermeasures in interfaces and harness connecting parts. 2. Prevents noise intrustion in video, LCD module, etc. 3. Parallel signal line. Ordering Information HB3 M 121 J T (1) (2) (3) (4) (5) (6) (7) (8) (1) Series HB : For signal line (2) Type 3 : 3 Array 4 : 4 Array (3) Material & Design H : For general purpose S : For high speed M : For high impedance type T, V : For Low speed (4) Diminsions The first two digits : length(mm) The last two digits : width(mm) (5) Thickness A : 0.9mm max B ; 0.7mm max C : 1.2mm max (6) Impedance(at MHz) The first two digit are significant. The last digits is the number of zeros following. (7) Termination J : Nickel barrier (8) Packing B : Bulk Pack T : Tape & Reel (' 178mm [ 7 inches ]) L : Tape & Reel (' 254mm [ 10 inches ]) Shape and Dimensions 3 Array unit ; mm[inches] Type L W T C'ß C' D M A B [ ] [ ].2 [.0608].2 [.0608] 00.1 [.0304] [.0204] [ ] [ ] ~0.45 [.008~.018] ~0.45 [.008~.018] 0.2 [ ] 0.2 [ ] 0.2 [.0108] 0.2 [.0108] unit ; mm[inches] 4 Array Type L W T C'ß C' D M HB3 HB4 A B C [ ] [ ] [ ].2 [.0608].2 [.0608].2 [.0608] 00.1 [.0304] [.0204] 1..1 [.0404] [ ] [ ] [ ] ~0.45 [.008~.018] ~0.45 [.008~.018] ~0.45 [.008~.018] 00.1 [.0304] 00.1 [.0304] 00.1 [.0304] 0.1 [ ] 0.1 [ ] 0.1 [ ] unit ; mm[inches] Type L W T C'ß C' D M HB42010 B [ ] [ ] [.0204] [ ] max [.012 max] [ ] 0.2 max [.008 max] 20

2 Specifications Part No. HB3H HB3M121 HB3M201 HB3M301 HB3M1 HB3M102 HB4H HB4M0 HB4M800 HB4M121 HB4M201 HB4M301 HB4M471 HB4M1 HB4M102 HB4T0 HB4T121 HB4T201 HB4T301 HB4T1 HB4T102 HB4S500 HB4S800 HB4S121 HB4S201 HB4S301 HB4V400 HB4V0 HB4V800 HB4V121 HB4V201 HB4V301 HB4M2010 HB4M HB4M20100 HB4M HB4M HB4M HB4M HB4T2010 HB4T HB4T20100 HB4T HB4T HB4T HB4T HB4S2010 HB4S2010 HB4S20100 HB4S typ Z at ( ) min DC Resistance ( ) max Rated Current (ma) max Parts with other electrical characteristics can be provided upon customer fls request. Test equipment : HP4291A + HP16192A 21

3 Electrical Characteristics 3 Array Z R X HB3M121J HB3M1J HB3M102J 4 Array ( Series) HB4MJ HB4M0J HB4M800J HB4M121J HB4M201J HB4M301J HB4M1J HB4M102J HB4T121J 22

4 4 Array ( Series) HB4T201J HB4T301J HB4T1J HB4SA500J HB4S0J HB4S121J HB4S201J HB4S301J HB4V121J HB4V201J HB4V301J 23

5 Features 4 Array (2010 Series) Z R X HB4M2010B400J HB4M2010B800J HB4M2010B121J HB4M2010B201J HB4M2010B301J HB4T2010B400J HB4T2010B121J HB4T2010B201J HB4T2010B301J HB4S2010BJ HB4S2010BJ 24

6 RELIABILITY AND TEST CONDITIONS CHIP FERRITE BEADS ARRAY ITEM Operating temp. range Storage temp. & humidity range Resistance to solder heat Solderability Reflow soldering REQUIREMENTS 3 array 4 array array 55 ~ max., 70% RH max. 1. No damage such as cracks should be caused in chip element. 2. More than 75% of the terminal electrode shall be covered with new solder. 3. Impedance change : within 30% 1. More than % of the terminal electrode shall be covered with new solder. 1. More than 50% of the terminal electrode shall be covered with new solder. S ª S ˆT*0.5 ª T TEST CONDITION at packing condition Preheat temperature : to Preheat time : 1min. Solder temperature : 2 10 Dipping time : sec. Preheat temperature : to Preheat time : 1min. Solder temperature : Dipping time : 3 1sec. Preheat temperature : Preheat time : 1min. Solder temperature : 230 Soldering time: 10 sec. max. (Reflow soldering profile) Tensile strength (Terminal strength) 1. No mechanical damage W W unit:kgf (W) 1.2() 1.2() 0.6 ( ) T max. 0.7mm W(Kgf) min. Adhension of terminal electrode (Flexure strength) 1. No mechanical damage unit: mm (a,b,c), Kgf (W) R O.5 Land Pattern a b c d W W a d b c Body strength (Bending strength) 1. The body shall not be damaged by forces applied on the right. W mm R O.5 unit: mm (d), Kgf (W) T d W 1.3 d

7 CHIP FERRITE BEADS ARRAY Drop Vibration ITEM Thermal shock (Temperature cycle) REQUIREMENTS 3 array 4 array array 1. No mechanical damage 1. No mechanical damage 1. No mechanical damage TEST CONDITION Drop 10 times on a concrete floor from a height of 91cm. Frequency : 10~55~10Hz Amplitude : 1.52 mm Direction and time : X,Y,Z directions for 2 hours Step min. Step min. Number of cycle : times Heat load resistance 1. No mechanical damage Temperature : 85 2 Applied current : rated current Time : 1,000 hours Measured at room ambient temperature after placing for 24 hours Low temp. resistance 1. No mechanical damage Temperature : 40 5 Time : 1,000 hours Measured at room ambient temperature after placing for 24 hours Humidity resistance 1. No mechanical damage Temperature : 40 2 Humidity : ~95% RH Time : 500 hours Measured at room ambient temperature after placing for 24 hours Humidity load resistance 1. No mechanical damage Temperature : 40 2 Humidity : ~95% RH Applied current : rated current Time : 500 hours Measured at room ambient temperature after placing for 24 hours Cross talk 1. Cross talk : Max 30dB Cross talk=20 log(vx/vin) Drop voltage : 5 V Pulse Width : ns Pulse duration: 16.6 ms Test diagram: Fig.1 Pulse generator b a Drop voltage(a~b):vin (5Vrms) Output voltage(1,2,3~4):vx Digital storage OSC Fig.1 Cross talk test diagram 61

8 PACKING STANDARD QUANTITY Type Q flty(pcs) REMARKS 03 15,000 10, ,000 BULK CASSETTE 10,000 4,000 4mm pitch 8, ,000 7,000 3,000 7,000 3,000 1,500 1, mm 254mm REEL DIMENSION unit:mm R j178 j254 Type 03, 5, 18,, Array 4516, 4532, 5750 j1 0.5 j2 W W[mm] ] more than 50 less than 1.5 unit:mm TAPING DIMENSION / 8mm wide Embossing Tape unit:mm Sprocket hole j Chip cavity B A P T Ko PRODUCT Type A 0.1 B 0.1 P 0.1 Ko 0.1 T(max.) CHIP BEADS CHIP BEADS ARRAY CHIP FERRITE INDUCTOR CHIP EMI SUPPRESSION FILTER CHIP EMI FILTER ARRAY CHIP LC FILTER CHIP COMMON MODE FILTER CHIP FEEDTHRU CHIP VARISTOR CHIP VARISTOR ARRAY CHIP SURGE ABSORBER

9 Paper Tape unit:mm Sprocket hole j Chip cavity B A P 0.1 T 0.05 PRODUCT Type A 0.1 B 0.1 P 0.1 T(max.) MICRO INDUCTOR CHIP BEADS CHIP INDUCTOR CHIP VARISTOR CHIP SURGE ARRAY TAPING DIMENSION / 12mm wide Embossing Tape unit:mm Sprocket hole j Chip cavity B A P T Ko PRODUCT Type A 0.1 B 0.1 P 0.1 Ko 0.1 T(max.) CHIP BEADS CHIP FEEDTHRU unit ; mm 82

10 5 BULK CASSETTE DIMENSION Unit:mm Slider Shutter Connecting Port TOP TAPE STRENGTH The force for tearing off top tape is 20 to 70 grams in the arrow direction. Top tape 165 to 180 Embossing tape TAPING MATERIAL Embossed Tape Paper Tape Top tape Top tape Paper tape Plastic/thermally activated adhesive Embossment Bottom tape Sprocket hole Embossed carrier Chip cavity LEADER AND BLANK PORTION Blank Portions Chip Cavity Blank Portions Leader 10 to 20 pitches 20 to 40 pitches 210mm to 250mm Drawing direction The pitch holes shift within mm for cumulative 10 pitches. 83

11 LAND PATTERN DESIGN BEAD, INDUCTOR, VARISTOR, SURGE ABSORBER ARRAY SIZE a b c unit ; mm Land pattern Land pattern <3 array> <4 array> unit ; mm SIZE array a b c d 3 array 4 array EMI SUPPRESSION FILTER, LC FILTER, FEEDTHRU CAPACITOR e f Land pattern f Land pattern < size> <, 4516 size> unit ; mm SIZE a b c d e f

12 LAND PATTERN DESIGN COMMON MODE FILTER, VARISTOR ARRAY SIZE POLE(Array) a b c d 2 POLE 2 Array 2 POLE 2 Array unit ; mm ÆEMI FILTER ARRAY Land pattern e unit ; mm SIZE POLE(Array) a b c d e 4 Array

13 SOLDERING PROFILE REFLOW SOLERING PROFILE preheating sec. max. soldering 10 sec. max. cooling sec. min sec. max. sec. min. FLOW SOLDERING PROFILE preheating sec. max. dipping 10 sec. max. cooling sec. min. 250 sec. min. MANUAL SOLDERING solder iron max. 30W T /0.5 sec. Tc soldering 2 sec. max. Diameter of solder iron 1.2 mm max. 86