Chip Beads & Inductors

Transcription

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2 Introduction SAMWHA s CB, CBA, CM, CPI series of chip components consist of compact, high performance beads and inductors. Their innovative components and case structures mean low DC resistance and outstanding high frequency characteristics. These series are designed for a variety of applications, facilitating component selection for individual circuit requirements. Products Guide Product Name Application Material Part Number Impedance / Inductance Range Dimensions Signal line(g) General Frequency(A) CB GA CB GK CB GM 10~ ~2000 5~ Chip Ferrite Beads Power Signal line(p) Ultra Power Signal line(u) Medium Frequency(K, J) High Frequency(M) Very High Frequency(V) CB GV CB PA CB PK CB PM CB UA CB UM 5~1000 5~600 5~600 5~300 5~120 5~ A CBA GA 30~1000 Chip Ferrite Beads Array Signal Line K, J M CBA GK CBA GM 30~ ~ V CBA GV 30~1000 Chip Ferrite Inductors Signal Line Ferrite(F) CM F 0.047~33 H Chip Power Low DCR Use(L) Ferrite + CPI LZ 0.1~4,.7 H Inductors High Ldc Use(H) Ceramic(Z) CPI HZ 0.1~10 H

3 How to Order(Product Identification) CB 1608 G A 102 T CM 1608 F R22 K T CBA 3216 G A 102 N4 E CPI 2520 L Z 4R7 M E Mark CB CBA CM CPI Product Name Chip Ferrite Beads Chip Ferrite Beads Array Chip Ferrite Inductors Chip Power Inductors Mark Dimension Mark Dimension mm 0.5 mm mm 0.8 mm mm 1.25 mm mm 1.60 mm mm 2.0 mm mm 1.6 mm mm 2.5 mm Mark G P U Applications Signal Line High Power Line Ultra High Power Line Mark Material A General Frequency K, J Medium Frequency M High Frequency 300 = = = = 1000 L Low DCR Type V Very High Frequency H High Ldc Type F Ferrite Z Ferrite + Ceramic R22 = 0.22 H 2R2 = 2.2 H 4R7 = 4.7 H 100 = 10 H Mark Tolerance K 10 % M 20 % N 30 % Mark T E Packaging Tape & Reel Pack Embossed Tape Pack N4 = 4 array

4 Chip Ferrite Beads Features Various size(1005~4532) High impedance characteristics Low Rdc, High Current characteristics Good reliability(monolithic structure) Magnetically shielded Fast mounting speed RoHS compliant Applications High frequency noise removal of digital equipment PDP/LCD Monitor, Digital TV/VCR etc. Shape & Dimensions (Unit : mm) Size L W T B S How to Order(Product Identification) Typical Material Characteristics CB 1608 G A 102 T Temperature Range Operating Temp. -55 ~ +125 Storage Temp. -55 ~ +125 CB : Chip Ferrite Beads The first two digits : Length(mm) The last two digits : Width(mm) G : Signal Line P : High Current Line U : Ultra High Current Line

5 Chip Ferrite Beads A : General Frequency K, J : Medium Frequency M : High Frequency V : Very High Frequency The first two digits represents significant The last digit is the number of zeros following ex) 121 = 120( ) T : Reel Paper Packaging E : Reel Embossed Tape Packaging Specifications Part No. Impedance25% DC ResistanceMax. Rated Current Max. Test Frequency CB1005GA CB1005GA CB1005GA CB1005GA CB1005GA CB1005GA CB1005GA CB1005GA CB1005GA CB1005GK CB1005GK CB1005GK CB1005GK CB1005GK CB1005GK CB1005GK CB1005GK CB1005GK CB1005GM CB1005GM CB1005GM CB1005GV CB1005GV CB1005GV CB1005GV CB1005GV CB1005GV CB1005GV Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B

6 Electrical Characteristics

7 Chip Ferrite Beads Specifications Part No. Impedance25% DC ResistanceMax. Rated Current Max. Test Frequency CB1608GA CB1608GA CB1608GA CB1608GA CB1608GA CB1608GA CB1608GA CB1608GA CB1608GA CB1608GA CB1608GA CB1608GA CB1608GA CB1608GJ CB1608GJ CB1608GJ CB1608GK CB1608GK CB1608GK CB1608GK CB1608GK CB1608GK CB1608GK CB1608GK CB1608GK CB1608GK CB1608GK CB1608GM CB1608GM CB1608GM CB1608GM CB1608GM CB1608GM CB1608GM CB1608GM CB1608GM CB1608GM CB1608GM CB1608GM CB1608GV CB1608GV CB1608GV CB1608GV CB1608GV CB1608GV Measuring Equipment : Z - HP4291B / E4991A Rdc - HP4338B

8 Electrical Characteristics

9 Chip Ferrite Beads Electrical Characteristics

10 Specifications Part No. Impedance25% DC Resistance Max. Rated Current Max. Test Frequency CB1005PK CB1005PA CB1608PA CB1608PA CB1608PA CB1608PA CB1608PA CB1608PA CB1608PA CB1608PA CB1608PA CB1608PA CB1608PK CB1608PK CB1608PK CB1608PK CB1608PK CB1608PK CB1608PK CB1608PK CB1608PK CB1608PK CB1608PJ CB1608PJ CB1608PJ CB1608PM CB1608PM CB1608PM Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B

11 Chip Ferrite Beads Electrical Characteristics

12 Specifications Part No. Impedance25% DC Resistance Max. Rated Current Max. Test Frequency CB2012GA CB2012GA CB2012GA CB2012GA CB2012GA CB2012GA CB2012GA CB2012GA CB2012GA CB2012GA CB2012GA CB2012GA CB2012GK CB2012GK CB2012GK CB2012GK CB2012GK CB2012GK CB2012GK CB2012GK CB2012GK CB2012GK CB2012GJ CB2012GJ CB2012GM CB2012GM CB2012GM CB2012GM CB2012GM CB2012GM CB2012GM CB2012GM CB2012GM CB2012GV CB2012GV CB2012GV Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B

13 Chip Ferrite Beads Electrical Characteristics

14 Electrical Characteristics

15 Chip Ferrite Beads Specifications Part No. Impedance25% DC ResistanceMax. Rated Current Max. Test Frequency CB2012PA CB2012PA CB2012PA CB2012PA CB2012PA CB2012PA CB2012PA CB2012PA CB2012PA CB2012PA CB2012PK CB2012PK CB2012PK CB2012PK CB2012PK CB2012PK CB2012PK CB2012PK CB2012PK CB2012PK CB2012PK CB2012PK CB2012PK CB2012PK CB2012PJ CB2012PJ CB2012PM CB2012PM CB2012PM CB2012PM CB2012PM CB2012PM CB2012PM Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B

16 Electrical Characteristics

17 Chip Ferrite Beads Specifications Part No. Impedance25% DC ResistanceMax. Rated Current Max. Test Frequency CB3216GA CB3216GA CB3216GA CB3216GA CB3216GA CB3216GA CB3216GA CB3216GA CB3216GA CB3216GA CB3216GA CB3216GA CB3216GK CB3216GK CB3216GK CB3216GK CB3216GK CB3216GK CB3216GK CB3216GK CB3216GM CB3216GM CB3216GM CB3216GM CB3216GM CB3216GM Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B

18 Electrical Characteristics

19 Chip Ferrite Beads Specifications Part No. Impedance25% DC ResistanceMax. Rated Current Max. Test Frequency CB3216PA CB3216PA CB3216PA CB3216PA CB3216PA CB3216PA CB3216PA CB3216PA CB3216PA CB3216PA CB3216PA CB3216PA CB3216PA CB3216PA CB3216PA CB3216PA CB3216PA CB3216PK CB3216PK CB3216PJ CB3216PM CB3216PM Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B

20 Electrical Characteristics

21 Chip Ferrite Beads Ultra Power Line Series Part No. Impedance25% DC ResistanceMax. Rated Current Max. Test Frequency CB1608UA CB1608UA CB1608UA CB1608UA CB1608UA260S CB1608UK CB1608UK CB2012UA CB2012UA CB2012UA CB2012UA CB2012UK CB2012UK CB2012UJ CB2012UM CB3216UA CB3216UA CB3216UA CB3216UM CB3216UM CB4516UM CB4532UK CB4532UK Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B

22 Electrical Characteristics

23 Chip Ferrite Beads Arrays Chip Ferrite Beads Arrays Features Good reliability (Monolithic structure) Magnetically shielded Fast mounting speed RoHS compliant Applications CD-ROM, DVD, MD Lines Digital TVs and VTRs Shape & Dimensions (Unit : mm) Size L W T B D E How to Order(Product Identification) Typical Material Characteristics CBA 3216 G A 102 N4 E Temperature Range Operating Temp. -55 ~ +125 Storage Temp. -10 ~ +40 CBA : Chip Ferrite Beads Array The first two digits : Length(mm) The last two digits : Width(mm) G : Signal Line P : High Current Line U : Ultra High Current Line

24 A : General Frequency K, J : Medium Frequency M : High Frequency V : Very High Frequency E : Reel Embossed Tape Packaging The first two digits represents significant The last digit is the number of zeros following ex) 121 = 120( ) N4 : 4 array Specifications Part No. Impedance25% DC ResistanceMax. Rated Current Max. Test Frequency CBA3216GA300N CBA3216GA600N CBA3216GA121N CBA3216GA221N CBA3216GA301N CBA3216GA471N CBA3216GA601N CBA3216GA102N CBA3216GK600N CBA3216GK121N CBA3216GK221N CBA3216GK301N CBA3216GK471N CBA3216GK601N CBA3216GK102N CBA3216GM300N CBA3216GM600N CBA3216GM121N CBA3216GM301N CBA3216GM471N CBA3216GM601N Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B

25 Chip Ferrite Beads Arrays Electrical Characteristics

26 Chip Giga Ferrite Beads Features Applications High impedance characteristics at GHz band PDP/LCD Monitor, DSC, DVC, Set Top Box Good reliability (Monolithic structure) Mobile phone Magnetically shielded Fast mounting speed RoHS compliant Dimensions (Unit : mm) Size L W T B How to Order(Product Identification) CB 2012 G A 601 T Temperature Range Operating Temp. -55 ~ +125 Storage Temp. -55 ~ +125 GB : Giga Ferrite Beads The first two digits : length(mm) G : Signal Line The last two digits : width(mm) P : High Current Line T : Reel paper packaging E : Reel embossed tape packaging The first two digits represents significant The last digit is the number of zeros following ex) 601 = 600 ( )

27 Chip Giga Ferrite Beads Specifications Part No. Impedance25% DC Resistance40% DC Resistance Rated Max. Max. GB1005GA GB1005GA GB1005GA GB1005GA GB1005GM GB1005GM Electrical Characteristics

28 Specifications Impedance25% DC Resistance40% DC Resistance Rated Current ma Max. Max. GB1608GA % GB1005GA % GB1005GK (Typ.) GB1005GK (Typ.) GB1005GM (Min.) GB1005GV % GB1005GV % Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B Electrical Characteristics

29 Chip Ferrite Inductors Chip Ferrite Inductors Features High Q, stable inductance in wide frequency Good reliability(monolithic structure) Magnetically shielded Fast mounting speed RoHS compliant Applications Computer and its Peripherals Hard-disk Drivers Audio/Visual Equipment Shape & Dimensions (Unit : mm) Size L W T B How to Order(Product Identification) CM 1608 F R22 K T Temperature Range Operating Temp. -40 ~ +85 Storage Temp. -10 ~ +40 CM : Chip Ferrite Inductors The first two digits : Length(mm) F : Ferrite The last two digits : Width(mm) 22n = 22nH 2R2 = 2.2nH K : 10% M : 20% T : Reel paper packaging 220 = 22 R22 = 0.22 E : Reel embossed tape packaging

30 Specifications Part No. Inductance Q Test Frequency SRF DC Resistance Ratde Current T Tolerance Min. Min. Max. (ma) Max. (mm) CM1005FR CM1005FR CM1005FR CM1005FR CM1005FR CM1005FR CM1005FR CM1005FR % CM1005FR CM1005FR CM1005FR CM1005FR CM1005F1R CM1005F1R Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B Electrical Characteristics

31 Chip Ferrite Inductors Specifications Inductance Q Test Frequency SRF DC Resistance Ratde Current T Part No. Tolerance Min. Min. Max. (ma) Max. (mm) CM1608FR CM1608FR CM1608FR CM1608FR CM1608FR CM1608FR CM1608FR CM1608FR CM1608FR CM1608F1R % 20% CM1608F1R CM1608F1R CM1608F1R CM1608F2R CM1608F2R CM1608F3R CM1608F3R CM1608F4R CM1608F Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B

32 Specifications Inductance Q Test Frequency SRF DC Resistance Ratde Current T Part No. Tolerance Min. Min. Max. (ma) Max. (mm) CM2012FR CM2012FR CM2012FR CM2012FR CM2012FR CM2012FR CM2012FR CM2012F1R CM2012F1R CM2012F1R CM2012F2R % CM2012F2R % CM2012F3R CM2012F3R CM2012F4R CM2012F5R CM2012F6R CM2012F8R CM2012F CM2012F CM2012F CM2012F CM3216F1R CM3216F1R CM3216F1R CM3216F2R CM3216F3R CM3216F4R CM3216F5R % CM3216F6R CM3216F8R CM3216F CM3216F CM3216F Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B

33 Chip Power Inductors Chip Power Inductors Features Low DC resistance and High DC Biased products in the class. Completely lead-free product and support lead-free solders. Low thickness and high current density products. Complex products of co-fired ceramic and magnetic materials. Applications DC-DC converters and power modules used for the following equipments. Compact electrical instruments such as cellular phones, PDA, DVC, DSC and HDD. Shape & Dimensions (Unit : mm) Size L W T B max max max max max max How to Order(Product Identification) CPI 2520 N H L 4R7 M E Measurement Equipments Agilent 4284A(Precision LCR Meter) Agilent 42841A(Bias Current Source) Temperature Range Operating Temp. -40 ~ +85 Storage Temp. -10 ~ +40 CPI : Chip Power Inductors The First two digits : length (mm) S : 0.6mm D : 0.8mm The Last two digits : Width (mm) N : 1.0mm T : 1.2mm

34 L : Low DCR type H : High Current type U : Very High Current type K : 10% M : 20% N : 30% 2R2 : 2.2 4R7 : : 10.0 T : Real paper packaging E : Real embossed tape packaging B : BulK packaging Characteristics - High Current Type Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) CPI2012NHL1R0MT 1.0 max % % 1.0 CPI2012NHL1R5MT 1.0 max % % 0.9 CPI2012NHL2R2MT 1.0 max % % 0.9 CPI2012NHL3R3MT 1.0 max % % 0.8 CPI2012NHL4R7MT 1.0 max % % 0.6 Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) CPI2012SHL1R0MT 0.6 max % % 0.60 CPI2012SHL1R5MT 0.6 max % % 0.55 CPI2012SHL2R2MT 0.6 max % % 0.50 CPI2012SHL3R3MT 0.6 max % % 0.40 CPI2012SHL4R7MT 0.6 max % % 0.30 Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) CPI2016NHL1R0ME 1.0 max % % 1.30 CPI2016NHL1R5ME 1.0 max % % 1.30 CPI2016NHL2R2ME 1.0 max % % 1.20 CPI2016NHL3R3ME 1.0 max % % 1.00 CPI2016NHL4R7ME 1.0 max % % 0.90

35 Chip Power Inductors Characteristics - High Current Type Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) CPI3225NHL1R0ME 1.0 max % % 1.30 CPI3225NHL1R5ME 1.0 max % % 1.30 CPI3225NHL2R2ME 1.0 max % % 1.20 CPI3225NHL3R3ME 1.0 max % % 1.10 CPI3225NHL4R7ME 1.0 max % % 1.00 CPI3225NHL6R8ME 1.0 max % % 0.90 CPI3225NHL100ME 1.0 max % % 0.80

36 Characteristics - Low DC Resistance Yype Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) CPI1608NLLR47MT 1.0 max % % 1.10 CPI1608NLLR68MT 1.0 max % % 1.05 CPI1608NLL1R0MT 1.0 max % % 1.00 CPI1608NLL1R5MT 1.0 max % % 0.90 CPI1608NLL2R2MT 1.0 max % % 0.80 Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) CPI2012NLLR47MT 1.0 max % % 1.30 CPI2012NLL1R0MT 1.0 max % % 1.20 CPI2012NLL1R5MT 1.0 max % % 1.10 CPI2012NLL2R2MT 1.0 max % % 1.00 CPI2012NLL3R3MT 1.0 max % % 0.80 CPI2012NLL4R7MT 1.0 max % % 0.70 Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) CPI2520NLL1R0ME 1.0 max % % 1.50 CPI2520NLL1R5ME 1.0 max % % 1.50 CPI2520NLL2R2ME 1.0 max % % 1.30 CPI2520NLL3R3ME 1.0 max % % 1.20 CPI2520NLL4R7ME 1.0 max % % 1.10 Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) CPI3225NLL4R7ME 1.0 max % % 1.10 CPI3225NLL100ME 1.0 max % % 0.90

37 Chip Power Inductors Characteristics - High Efficiency Type Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) EPI2012NLYR24MT 1.0 max % % 3.2 EPI2012NLYR33MT 1.0 max % % 3.0 EPI2012NLYR47MT 1.0 max % % 2.6 EPI2012NLYR56MT 1.0 max % % 2.2 Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) EPI2016NLYR15ME 1.0 max % % 3.5 EPI2016NLYR24ME 1.0 max % % 3.2 EPI2016NLYR33ME 1.0 max % % 3.0 EPI2016NLYR47ME 1.0 max % % 2.6 EPI2016NLYR56ME 1.0 max % % 2.5 Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) EPI2520NLYR47ME 1.0 max % % 3.2 EPI2520NLYR68ME 1.0 max % % 3.0 EPI2520NLY1R0ME 1.0 max % % 2.7

38 Characteristics - High Current Type

39 Chip Power Inductors Characteristics - High Current Type

40 Characteristics - Low DC Resistance Type

41 Chip Power Inductors Characteristics - High Efficiency Type

42 Reliability and Test Conditions Operating Temperature Range Storage Temperature Range 55 ~ ~ Max., 70% RH Max. Chip Beads Item Requirements Test Conditions at Packing Condition Chip Inductors Solderability Resistance to Soldering Heat Reflow Soldering More than 90% of the terminal electrode shall be covered with new solder 1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. Impedance shall not change more than 30 % 4. Inductance shall not change more than 10 % 5. Q shall not change more than 20 % More than 50% of the terminal electrode shall be covered with new solder - Preheat Temperature : 100~150 - Preheat Time : 60sec. - Solder Temperature : Soldering Time : 10sec. - Preheat Temperature : 100~150 - Preheat Time : 60sec. - Solder Temperature : Soldering Time : sec. - Preheat Temperature : Preheat Time : 60sec. - Solder Temperature : Soldering Time : 10sec. Max. (Reflow Soldering Profile) High Temperature Resistance High Temperature Load Resistance 1. No mechanical damage 2. Impedance shall not change more than 30 % 3. Inductance shall not change more than 10 % 4. Q shall not change more than 20 % - Temperature : Time : hours - Measurement at room ambient temperature after placing for 24 hours - Temperature : Applied Current : Rated Current - Time : hours - Measurement at room ambient temperature after placing for 24 hours Humidity Resistance - Temperature : Humidity : 90 2%RH - Time : hours - Measurement at room ambient temperature after placing for 24 hours

43 Chip Beads Chip Inductors Item Requirements Test Conditions Humidity Load Resistance Low Temperature Resistance Thermal Shock Vibration 1. No mechanical damage 2. Impedance shall not change more than 30 % 3. Inductance shall not change more than 10 % 4. Q shall not change more than 20 % - Temperature : Humidity : 90 2% RH - Applied Current : Rated Current - Time : hours - Measurement at room ambient temperature after placing for 24 hours - Temperature : Time : hours - Measurement at room ambient temperature after placing for 24 hours for 30minutes 40 3 for 30minutes for 30minutes 85 3 for 30minutes 3. Repeat 100 Cycle - Frequency : 10~55Hz - Amplitude : 1.5mm - Direction : X, Y, Z - Sweep Time : 2hours for each axis Drop Flexure Strength No Mechanical Damage Type A(mm) B(mm) C(mm) W(kgf) Drop 10 times on a concrete floor from a height of 100cm Bending Strength The terminal electrode shall be neither break off nor the chip damage

44 Item Requirements Test Conditions Operating Temperature Range Storage Temperature Range -55 ~ Max., 70% RH Max. at Packing Condition Solderability Resistance to Soldering heat More than 90% of the terminal electrode shall be covered with new solder 1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. Impedance shall not change more than 30 % - Preheat Temperature : 100~150 - Preheat Time : 60sec. - Solder Temperature : Soldering Time : 10 1sec. - Preheat Temperature : 100~150 - Preheat Time : 60sec. - Solder Temperature : Soldering Time : sec. Reflow Soldering More than 50% of the terminal electrode shall be covered with new solder - Preheat Temperature : Preheat Time : 60sec. - Solder Temperature : Soldering Time : 10sec. Max. (Reflow Soldering Profile) High Temperature Resistance - Temperature : Time : hours - Measurement at room ambient temperature after placing for 24 hours High Temperature Load Resistance 1. No mechanical damage 2. Impedance shall not change more than 30 % - Temperature : Applied Current : rated Current - Time : hours - Measurement at room ambient temperature after placing for 24 hours Humidity Resistance - Temperature : Humidity : 90 2% RH - Time : hours - Measurement at room ambient temperature after placing for 24 hours

45 Item Requirements Test Conditions Humidity Load Resistance - Temperature : Humidity : 90 2% RH - Applied Current : Rated Current - Time : hours - Measurement at room ambient temperature after placing for 24 hours Low Temperature Resistance Thermal Shock Vibration 1. No mechanical damage 2. Impedance shall not change more than 30 % - Temperature : Time : hours - Measurement at room ambient temperature after placing for 24 hours for 30minutes for 30minutes 3. repeat 100 Cycle - Frequency : 10~55Hz - Amplitude : 1.5mm - Direction : X, Y, Z - Sweep Time : 2hours for each axis Drop Drop 10 times on a concrete floor from a height of 100cm Flexure Strength No Mechanical Damage Type 4 Array A(mm) 0.8 B(mm) 0.8 C(mm) 3.0 W(kgf) 0.4 Bending strength The terminal electrode shall be neither break off nor the chip damage

46 Item Requirements Test Conditions Operating Temperature Range Storage Temperature Range 40 ~ ~40 Max., 70% RH Max. at Packing Condition Solderability Resistance to Soldering heat More than 90% of the terminal electrode shall be covered with new solder 1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. Impedance shall not change more than 20 % - Preheat Temperature : 100~150 - Preheat Time : 60sec. - Solder Temperature : Soldering Time : 10 1sec. - Preheat Temperature : 100~150 - Preheat Time : 60sec. - Solder Temperature : Soldering Time : sec. Reflow Soldering More than 50% of the terminal electrode shall be covered with new solder - Preheat Temperature : Preheat Time : 60sec. - Solder Temperature : Soldering Time : 10sec. Max. (Reflow Soldering Profile) High Temperature Resistance - Temperature : Time : hours - Measurement at room ambient temperature after placing for 24 hours High Temperature Load Resistance 1. No mechanical damage 2. Impedance shall not change more than 20 % - Temperature : Applied Current : Rated Current - Time : hours - Measurement at room ambient temperature after placing for 24 hours Humidity Resistance - Temperature : Humidity : 90 2% RH - Time : hours - Measurement at room ambient temperature after placing for 24 hours

47 Item Requirements Test Conditions Humidity Load Resistance - Temperature : Humidity : 90 2% RH - Applied Current : rated Current - Time : hours - Measurement at room ambient temperature after placing for 24 hours Low Temperature Resistance Thermal Shock Vibration 1. No mechanical damage 2. Inductance shall not change more than 20 % - Temperature : Time : hours - Measurement at room ambient temperature after placing for 24 hours for 30minutes for 30minutes 3. repeat 100 Cycle - Frequency : 10~55Hz - Amplitude : 1.5mm - Direction : X, Y, Z - Sweep Time : 2hours for each axis Drop Drop 10 times on a concrete floor from a height of 100cm Flexure Strength No Mechanical Damage Item A (mm) B (mm) C (mm) W (kgf) Bending Strength The terminal electrode shall be neither break off nor the chip damage

48 Soldering Profile Specifications which provide more details for the proper and safe use described product are available upon request. All specifications are subject to change without notice.

49 Wire-Wound Power Inductors Wire-Wound Power Inductors Features Metallic materials base provides large saturation current Low DC resistance and High DC biased products. Completely lead-free product and support lead-free solders. Price is low compared to the same products Applications DC-DC converters and Power modules used for the following equipment's. Smartphones, tablet PCs, digital cameras, etc. Shape & Dimensions (Unit : mm) Size L W T B max max max How to Order(Product Identification) WCC 2520 HP 4R7 M E Measurement Equipments Agilent 4284A (Precision LCR Meter) Agilent 42841A (Bias Current Source) Temperature Range Operating Temp. -40 ~ +105 Storage Temp. -40 ~ +105 (After mounting) WCC : Wire-Wound Power The first two digits : Length(mm) LP : Low DCR type Inductor The last two digits : Width(mm) HP : High Current type 2R2 = 2.2 4R7 = = 10.0 K : 10% M : 20% N : 30% T : Reel paper packaging E : Reel embossed tape packaging B : Bulk packaging

50 Characteristics - High Current Type Parts Number Inductance ( H) DC Resistance ( ) Max Saturationcurrent (A)_Idc1 Temperature Rise Current, (A)_Idc2 Typ. Max. Typ. Max. Typ. Max. Measuring frequency (MHz) WCC1608HPR24N % WCC1608HPR47N % WCC1608HPR68N % WCC1608HP1R0M % WCC1608HP1R5M % WCC1608HP2R2M % WCC1608HP3R3M % WCC1608HP4R7M % DC Resistance Saturationcurrent Temperature Rise Measuring Inductance ( ) Parts Number Max (A)_Idc1 Current, (A)_Idc2 frequency ( H) Typ. Max. Typ. Max. Typ. Max. (MHz) WCC2012HPR24N % WCC2012HPR47N % WCC2012HPR68N % WCC2012HP1R0M % WCC2012HP1R5M % WCC2012HP2R2M % WCC2012HP3R3M % WCC2012HP4R7M % Parts Number Inductance ( H) DC Resistance ( ) Max Saturationcurrent (A)_Idc1 Temperature Rise Current, (A)_Idc2 Typ. Max. Typ. Max. Typ. Max. Measuring frequency (MHz) WCC2520HPR24N % WCC2520HPR47N % WCC2520HPR68N % WCC2520HP1R0M % WCC2520HP1R5M % WCC2520HP2R2M % WCC2520HP3R3M % WCC2520HP4R7M % Idc1 is the DC current value having inductance decrease down to 30% Idc2 is the DC current value having temperature increase up to 40

51 Wire-Wound Power Inductors Characteristics - High Current Type

52 Chip Common Mode Filters Features Effective for suppressing common mode at high frequency from several MHz to GHz. MV/H suppresses high frequency noise that was unable to be suppressed with existing common mode choke coils. U Suitable for high speed differential transmission line DPS Applications USB, HDMI, DVI lines of PC, LCD-TV LVDS lines of Note-PC, LCDs MDDI, MIPI, MHL of Mobile phone Dimensions & Land Pattern (Size : mm) Size A B C E P Type A B C D ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~0.60

53 Chip Common mode Filters How to Order(Product Identification) CMH 0806 G M 900 N2 E Temperature Range Operating Temp. -40 ~ +85 Storage Temp. -40 ~ +85 (After mounting) CMH /CMV : Chip Common The first two digits : Length(mm) Mode Filter The last two digits : Width(mm) T : Reel paper packaging E : Reel embossed tape packaging 900 : : 20 N2 : Single N4 : Array Characteristics Parts Number No. of Lines Impedance at 100MHz ( ) DC Resistance ( ) Max. Rated Current [A] Max. Rated Voltage [V] Max. Insulation resistance [M ] Min. CMH0605GM120N CMH0605GM350N % CMH0605GM600N % CMH0605GM900N % Parts Number No. of Lines Impedance at 100MHz ( ) DC Resistance ( ) Max. Rated Current [A] Max. Rated Voltage [V] Max. Insulation resistance [M ] Min. CMH0806GM120N CMH0806GM330N % CMH0806GM470N % CMH0806GM900N %

54 Characteristics Parts Number No. of Lines Impedance at 100MHz ( ) DC Resistance ( ) Max. Rated Current [A] Max. Rated Voltage [V] Max. Insulation resistance [M ] Min. CMV1210GM400N % CMV1210GM900N % Parts Number No. of Lines Impedance at 100MHz ( ) DC Resistance ( ) Max. Rated Current [A] Max. Rated Voltage [V] Max. Insulation resistance [M ] Min. CMH2010GM900N

55 Chip Common mode Filters Characteristics

56 Characteristics

57 Appendix

58 SMD Type Packing Reel Packing 4000 pcs(standard) per Reel(option) 10 Reels per Inner BOX 6 Inner BOXES per Out BOX Appendix Mark SIZE A B C D E W 7 REEL 0603~ Min ~ , REEL 1005~ Min Number of Packages Type EIA CODE 7 QT/REEL 13 QT/REEL CS0603 CC ,000 CS1005 CC ,000 50,000 CS1608 CC0603 4,000 16,000 CS2012 CC0805 3,000~4,000 10,000 CS3216 CC1206 2,000~4,000 6,000~10,000 CS3225 CC1210 1,000~3,000 4,000~10,000 CS4520 CC1808 1,500~3,000 - CS4532 CC ~ Tape Dimensions TYPE EIA CODE A B C D E F G H J CS0603 CC CS1005 CC CS1608 CC CS2012 CC CS3216 CC CS3225 CC CS4520 CC CS4532 CC

59 SMD Type Packing Typical Performance Characteristics Appendix

60 Chip B/I Packing Standard Quantity Chip Beads Chip Inductors Chip Power Inductors Appendix Size Q TY(PCS) Remarks Section , ,000 4, T size , T size , T size 3, , , ,000 Reel Packing A B C Min D E W Leader & Blank Portion

61 Chip B/I Packing Tape Dimensions (Unit:mm) Type A 0.1 B 0.1 P 0.1 S 0.1 T(max.) Chip Beads Chip Inductors Chip Power Inductors Type A 0.1 B 0.1 C 0.1 D 0.1 Section Appendix

62 Memo