ACX Advanced Ceramic X

Transcription

1 FB2012 Series Multilayer Chip Band Pass Filter + Balun Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, etc. Specifications Part Number FB N2R4M_ Freq. Range (MHz) 2400 ~ 2500 Unbalanced Impedance (ohm) 50 Balanced Impedance (ohm) Conjugate match to MTK chipset Q ty/reel (pcs) : 4,000 Operating Temperature Range : -40 ~ +85 o C Storage Temperature Range : -40 ~ +85 o C Storage Period : 12 months max. Power Capacity : 1W max. Insertion BW (db) 3.0 max. BW 2.0 max. Phase Diff. (degree) Amp. Diff. (db) 2.0 max. Attenuation (db) 40 min.@ 880~960MHz 35 min.@1710~1880 MHz 25 min.@1880~1990 MHz 35 min.@4800~5000mhz 25 min.@7200~7500mhz Part Number FB N 2R4 M Type FB : Band Pass Filter + Balun Dimensions ( L W ) mm Balanced Impedance 06 : Conjugate match to MTK chipset Material Code N Central Frequency 2R4 : 2400MHz Specification Code M Packaging T: Tape & Reel B: Bulk Soldering =lead-containing /LF=lead-free FB N2R4MT/LF REV:3 PAGE:1/7

2 Terminal Configuration No. Terminal Name No. Terminal Name Unbalanced Port Balanced Port NC or DC Feed GND NC Balanced Port GND GND Dimensions a p Unit : mm a W T c L g b Mark L W T a b c g p Dimensions / * Solder Resist * * 1.0 Land Through-hole ( 0.3) 0.30 * Line width should be designed to match 50characteristic impedance, depending on PCB material and thickness. FB N2R4MT/LF REV:3 PAGE:2/7

3 Measuring Diagram Port 3* Network Analyzer** Port 2* GND GND GND Port 1(50 ) Port 1:Unbalanced Port Ports 2 and 3: Balanced Port IL=S ds21 RL=S ss11 Amp_balance = db(s(2,1)/s(3,1)) Phase_balance = Phase(S(2,1)/S(3,1)) *Impedance for ports 2 and 3 = Conjugate to Balanced Impedance/2 **E5071B from Agilent Typical Electrical Characteristics (T=25 o C) db(rl) db(il) dif_amplitude dif_phase freq, GHz freq, GHz Notes The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. FB N2R4MT/LF REV:3 PAGE:3/7

4 Taping Specifications Tape Dimensions (Unit: mm) & Quantity A D 1.75 ± C T EMBOSS B A E F TAPE Type A A B C D E F T Quantity/reel Tape material ± 4.0± 1.40± 2.15± 2.0± 3.5± 8.0± 1.00± 4,000pcs Plastic (Embossed) Reel Dimensions (Unit: mm) Label 1.4 ± ± 1 60±1 Label: Customer s Name, P/N, Q ty, Date, A 13.5±0.5 B Corp. Type A B ± ±0.3 Leader and Trailer Tape Trailer End Trailer (160 mm min.) Empty Compartments with Cover Tape (500 mm min.) FB N2R4MT/LF REV:3 PAGE:4/7

5 Peel-off Force Peeling Direction <10 0 Top Cover Tape Carrier Tape Peel-off force should be in the range of 0.6 N at a peel-off speed of 300±10 mm/min. Storage Conditions (1) Temperature: 5 ~35, relative humidity (RH): 45~75%. (2) Non-corrosive environment. Notes The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. FB N2R4MT/LF REV:3 PAGE:5/7

6 Mechanical & Environmental Characteristics Item Requirements Procedure Solderability Soldering strength (Termination Adhesion) 2. More than 95% of the terminal 1. Preheat: o C electrode shall be covered with 2. Solder: o C for 5 1 sec new solder 1. Solder specimen onto test jig. 2. Apply push force at 0.5mm/s until electrode pads are 1. 1kg minimum peeled off or ceramic are broken. Pushing force is applied to longitude direction 1. Solder specimen onto test jig (FR4, 0.8mm) using the recommend soldering profile. 2. Apply a bending force of 2mm deflection Deflection (Substrate Bending) R230 Pressure Rod 90mm 1. Temperature: 85 2 o C Heat/Humidity 2. Humidity: 90% ~ 95% RH 2. Fulfill the electrical specification Resistance 3. Duration: 1000±48hrs after test 4. Recovery: 1-2hrs 1. One cycle/step 1:125 ± 5C for 30 min Thermal shock step 2:- 40 ± 5C for 30 min 2. Fulfill the electrical specification (Temperature Cycle) 2. No of cycles:100 after test 3. Recovery:1-2 hrs 1. Temperature: -40 o 5 o C Low Temperature 2. Fulfill the electrical specification 2. Duration: 500 ±24hrs Resistance after test 3. Recovery: 1-2hrs FB N2R4MT/LF REV:3 PAGE:6/7

7 Soldering Conditions Typical Soldering Profile for Lead-free Process Reflow Soldering : Temperature ( o C) 260 o C 217 o C o C 20s max. Pre-heating s. Time (s.) s Notes The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. Corp. 16 Tzu Chiang Road, Hsinchu Industrial District Hsinchu Hsien 303, Taiwan TEL: FAX: acx@acxc.com.tw FB N2R4MT/LF REV:3 PAGE:7/7