MULTILAYER CERAMIC ANTENNA FOR BLUETOOTH/WLAN IEEE b & WLAN IEEE a (2.45/5.2GHz) (Surface Mounted Ceramic Dual Band Antenna)

Transcription

1 MULTILAYER ERAMI ANTENNA FOR BLUETOOTH/WLAN IEEE b & WLAN IEEE a (2.45/5.2GHz) (Surface Mounted eramic Dual Band Antenna) Product Specification 1 (Preliminary) QUIK REFERENE DATA Dimension entral Frequency* Bandwidth Gain* 8.7* 8 * 0.9 mm 2.45 GHz /5.2GHz >100 MHz 3.5dBi 1.5dBi VSWR Polarization Azimuth Impedance Operating Temperature Termination Resistance to soldering heats Maximum Power 2.5 max Linear Omni-directional 50Ω -55~125 o Ni/Sn (Environmentally-Friendly Leadless) 260 o, 10 sec. 1W * Actual value will depend on size of customer ground plane Special Environmental oncerns- Green Products Design: The foil making process is using environmentally-friendly aqueous solvent technology. Termination is lead free (Pb free) and packing materials can be re-cycled 1 All the technical data and information contained herein are subject to change without prior notice Grant Lin/liff Page 1 sheet A4

2 APPLIATION Suggested Layout Ground plane(back side) 9mm leanance 2mm 6mm Bluetooth module or other RF Module a Antenn leanance 6mm 50Ohm Transmission Line (by Microstrip Line or oplanar Waveguide) DIMENSIONAL DATA Figure Dimension Port L W T 8.7 ±0.25 mm 8 ±0.2 mm 0.9 ±0.2 mm L F S ±0.25 mm 0.5 ±0.3 mm 1.25 ±0.35 mm Feed Termination - N Solder Termination F T W F Grant Lin/liff Page 2 sheet A4

3 SOLDER LAND PATTERN Figure Dimensions Remark L L F 10 ± 0.10 mm 1.40 ± 0.10 mm Feed Pad 0.90 ± 0.10 mm F S1 S ± 0.10 mm N Mount Pad Typical Radiation Pattern Polar Plot (Based on 35*15 Test Board) GHz H-Plane 0 5.2GHz E-Plane Grant Lin/liff Page 3 sheet A4

4 GHz H-Plane GHz E-Plane Grant Lin/liff Page 4 sheet A4

5 USTOMERIZED TEST BOARD FOR RETURN LOSS SMA onnector 4 inch coaxial cable RG-316 Phycomp Dual Band for IEEE802.11a & IEEE802.11b 1 cm 2.5 cm Solder Joint 1 50 Ohm Transmission Line 35mm Ground plane at back side min 2mm clearance 15mm RF Modules min 2mm clearance Dual Band Antenna 50 Ohm transmission line or coplanar wave guide No ground plane backside Remark: Different ground PB may have different central frequency. The central frequency may be customized. Grant Lin/liff Page 5 sheet A4

6 RELIABILITY DATA (Reference to IE Specification) IE IE 384/ E 32 TEST TEST PROEDURE REQUIREMENTS 100 METHOD LAUSE 4.4 Mounting The antenna can be mounted on printedcircuit boards or ceramic substrates by applying wave soldering, reflow soldering (including vapour phase soldering) 4.5 Visual inspection and dimension check or conductive adhesive Any applicable method using 10 magnification Antenna Frequency = 2.45/5.2 GHz; at 20 o 4.8 Adhesion A force of 3 N applied for 10 s to the line joining the terminations and in a plane parallel to the substrate 4.9 Bond strength of Mounted in accordance plating on end face with E , paragraph 4.4 In accordance with specification (chip off 4mm) Standard test board in page 4 onditions: bending 0.5 mm at a rate of 1mm/s, radius jig. 340 mm, 2mm warp on FR4 board of 90 mm length Grant Lin/liff Page 6 sheet A4

7 IE 384/ E LAUSE IE TEST METHOD (Tb) Resistance to soldering heat Resistance to leaching TEST PROEDURE REQUIREMENTS 260 ± 5 for 10 ± 0.5 s in a static solder bath 260 ± 5 for 30 ± 1 s in a static solder bath (Ta) Solderability Zero hour test, and test after storage (20 to 24 months) in original atmosphere; un-mounted chips completely immersed for 2 ± 0.5 s in 235 ± (Na) Rapid change of temperature -55 (30 minutes) to +125 (30 minutes); 100 cycles (a) Damp heat 500 ± 12 hours at 60 ; 90 to 95 % RH 4.15 Endurance 500 ± 12 hours at 125 ; The terminations shall be well tinned after recovery and entral Freq. hange ± 6% Using visual enlargement of 10, dissolution of the termination shall not exceed 10% The termination must be well tinned, at least 75% is well tinned at termination entral Freq. hange ± 6% 2 hours recovery entral Freq. hange ± 6% 2 hours recovery entral Freq. hange ± 6% Grant Lin/liff Page 7 sheet A4

8 ORDERING INFORMATION: Method I- by 12N Ordering ode The antennas may be ordered by using the 12 N ordering code. These code numbers can be determined by the following rules: F M S T A F. Family ode 43 = Antenna. Packing Type ode 11 = 180 mm/ 7" blister (1000pcs), M. Materials ode 1 = High Frequency Material 3 = High Frequency Material (FR4) S. Size ode 17 = 8.7 * 8 * 0.9 mm T. Tolerance 00 = 100 M Hz Band Width A. Working Frequency 252 = 2.45/5.2 GHz Dual Band Grant Lin/liff Page 8 sheet A4

9 Taping Blister Tape DIMENSION: Serial no ecking note Index Spec(mm) 1 Sprocket hole Do 1.55± Pocket hole D1 1.50± Distance sprocket hole/sprocket hole Po 4.0± Distance pocket/pocket P1 12.0± Distance sprocket hole/pocket P2 2.0± Tape width W 16.0± Distance sprocket hole/outside E 1.75± Distance sprocket hole/pocket F 7.50± Pocket length Ao 8.20± Pocket length Bo 9.10± Pocket depth Ko 1.25± Thickness of tape T 0.25± x sprocket hole pitch 10Po 40.0±0.20 Grant Lin/liff Page 9 sheet A4

10 7 (180mm) Reel Specifications Product size code Units per Reel Tape Width (mm) (mm) D (mm) W 1 (mm) W 2 (mm) Antenna ±1.0 62± ±0.2 Grant Lin/liff Page 10 sheet 190 A4