DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS Mid-voltage: NP0/X7R (Pb Free & RoHS compliant)
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1 w DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS Mid-voltage: NP0/X7R (Pb Free & RoHS compliant) 100 V TO 500 V 10 pf to 470 nf Product specification Sep 08, 2005 V. 0
2 Product specification 2 SCOPE This specification describes Midvoltage NP0/X7R series chip capacitors with lead-free terminations. APPLICATIONS PCs, hard disk, game PCs Power supplies LCD panel ADSL, modem FEATURES Supplied in tape on reel Nickel-barrier end termination ORDERING INFORMATION Components may be ordered by using either a Phycomp s unique 12NC or Phycomp clear text code. PHYCOMP ORDERING CODE 12NC CODE 2 2 X X X X X X X X X X Carrier type 22 blister 38 paper 54 bulk Capacitance value (1) Tolerance 5 ±5% 6 ±10% Rated voltage - Termination V; NiSn V; NiSn V; NiSn V; NiSn Size SCM041 Temperature characteristic 1 NP0 5 X7R Packaging (2) 1 reel: 180 mm; 7" 5 reel: 330 mm; 13" 4 bulk case (1) Refer to Conversion table of capacitance & last 2 digits of 12NC (2) Quantity on reel depends on thickness classification; see section Thickness classification and packing quantities for 100 V to 500 V. Conversion table of capacitance & last 2 digits of 12NC for NP , , , , , , , , , , , , , , , , ,900 57
3 Product specification 3 Conversion table of capacitance & last 2 digits of 12NC for X7R , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , CTC CODE Size code Temp. Char. CG = NP0 2R = X7R Capacitance Tolerance Rated voltage 225 = 2,200,000 pf; the third digit signifies the multiplying factor: 0 = 1 1 = 1,0 2 = 1,00 3 = 1,000 4 = 10,000 5 = 100,000 6 = 1,000,000 8 = = 0.1 J = ±5% K = ±10% 0 = 100 V B = 200 V C = 250 V D = 500 V Termination Packing Marking Series B = NiSn 2 = 180 mm; 7 paper 3 = 330 mm; 13 paper B = 180 mm; 7 blister F = 330 mm; 13 blister P = Bulk case 0 = No marking 0 = conv. ceramic D = BME Example: 0603CG100J0B200
4 Product specification 4 CONSTRUCTION The capacitor consists of a rectangular block of ceramic dielectric in which a number of interleaved metal electrodes are contained. This structure gives rise to a high capacitance per unit volume. The inner electrodes are connected to the two end terminations and finally covered with a layer of plated tin (NiSn). The terminations are lead-free. A cross section of the structure is shown in Fig.1. Fig. 1 terminations electrodes MLB457 ceramic material Surface mounted multilayer ceramic capacitor construction DIMENSION For dimension see Table 1 Table 1 TYPE CC0603 CC0805 CC1206 CC1210 CC1808 CC1812 L1 (mm) 1.6 ± ± ± ± ± ±0.30 T L2 L4 L1 L3 MBB211 Fig. 2 Surface mounted multilayer ceramic capacitor dimension W W (mm) 0.8 ± ± ± ± ±0.30 T (mm) Refer to table 2 to 7 L2/L3 min (mm) max L4 (mm) min
5 Product specification 5 CAPACITANCE RANGE & THICKNESS FOR NP0 100V Table 2 For NP0 100 V sizes from 0603 to 1812 CAPACITANCE 100 V ± ± ± ,000 1,200 1, ±0.10 1,800 2, ±0.10 2,700 3,300 3, ±0.10 4,700 5, ±0.10
6 Product specification 6 Table 2 For NP0 100 V sizes from 0603 to 1812 (continued) CAPACITANCE 100 V NOTE 6,800 8, ± ,000 12,000 15,000 18,000 22,000 27,000 33,000 39,000 47, Values in shaded cells indicate thickness class in mm. 2. Capacitance range < 10 pf is on request ±0.10 CAPACITANCE RANGE & THICKNESS FOR NP0 200/250 V Table 3 For NP0 200/250 V sizes from 0603 to 1812 CAPACITANCE 200/250 V ± ± ±
7 Product specification 7 Table 3 For NP0 200/250 V size from 0603 to 1812 (continued) CAPACITANCE 200/250 V NOTE ± ± ± ±0.10 1, ±0.10 1,200 1,500 1, ± ±0.10 2,200 2,700 3,300 3,900 4,700 5,600 6,800 8,200 10, Values in shaded cells indicate thickness class in mm. 2. Capacitance range < 10 pf is on request ±0.10 CAPACITANCE RANGE & THICKNESS FOR NP0 500 V Table 4 For NP0 500 V sizes from 0805 to 1812 CAPACITANCE 500 V ± ±
8 Product specification 8 Table 4 For NP0 500 V sizes from 0805 to 1812 (continued) CAPACITANCE 500 V ± ± ± ± ± ,000 1, ±0.10 1,500 1,800 2,200 2,700 3,300 3,900 4,700 5,600 6,800 8,200 10,000 NOTE 1. Values in shaded cells indicate thickness class in mm. 2. Capacitance range < 10 pf is on request.
9 Product specification 9 CAPACITANCE RANGE & THICKNESS FOR X7R 100V Table 5 For X7R 100 V sizes from 0805 to 1812 CAPACITANCE 100 V , ±0.10 1,500 2, ± ±0.10 3,300 4,700 6,800 10,000 15,000 22, ± ,000 47,000 68, ± , , , ± , ± , ± ,000 1,000,000 NOTE 1. Values in shaded cells indicate thickness class in mm.
10 Product specification 10 CAPACITANCE RANGE & THICKNESS FOR X7R 200/250 V Table 6 For X7R 200/250 V sizes from 0805 to 1812 CAPACITANCE 200/250 V , ±0.10 1,500 2,200 3, ±0.10 4,700 6,800 10,000 15, ± ± ,000 33,000 47,000 68, , , , ± , ± , ,000 1,000,000 NOTE 1. Values in shaded cells indicate thickness class in mm.
11 Product specification 11 CAPACITANCE RANGE & THICKNESS FOR X7R 500 V Table 7 For X7R 500 V sizes from 0805 to 1812 CAPACITANCE 500 V , ±0.10 1,500 2,200 3,300 4, ±0.10 6,800 10,000 15,000 22,000 33, ± ,000 68, , ± , , , , ,000 1,000,000 NOTE 1. Values in shaded cells indicate thickness class in mm.
12 Product specification 12 THICKNESS CLASSES AND PACKING QUANTITY Table 8 DESCRIPTION SIZE THICKNESS 8 mm TAPE WIDTH/AMOUNT PER REEL 12 mm TAPE WIDTH CODE CLASSIFICATION Ø180 mm, 7 Ø330 mm, 13 /AMOUNT PER REEL (mm) Paper Blister Paper Blister Ø180 mm, 7 Blister ±0.10 4, ±0.10 4, ±0.10 4, ±0.1 4, , ±0.10 4, , ±0.10 4, ±0.10 4, , ± , , ± , , , ± , , ± , , Mid/High voltage 1.15 ± , , , ± , ± , , ± , ± , ± , ± , ± , ± , , ± , ± , ± , ± ,000
13 Product specification 13 ELECTRICAL CHARACTERISTICS NP0/X7R DIELECTRIC CAPACITORS; NISN TERMINATIONS Unless otherwise stated all electrical values apply at an ambient temperature of 20±1 C, an atmospheric pressure of 86 to 106 kpa, and a relative humidity of 63 to 67%. Table 9 DESCRIPTION Capacitance range (1) VALUE 10 pf to 470 nf Capacitance tolerance (1) ±5% and ±10% Dissipation factor (D.F.) (1) : NP0 X7R Insulation resistance after 1 minute at U r (DC) Maximum capacitance change as a function of temperature (temperature characteristic/coefficient): NP0 X7R Operating temperature range: NP0/X7R 0.1% 2.5% R ins 10 GΩ or R ins C 500 seconds whichever is less ±30 ppm/ C ±15% 55 C to +125 C NOTE 1. NP0: frequency = 1 MHz for C 1 nf, measuring at voltage 1 Vrms; frequency = 1 KHz for C > 1 nf, measuring at voltage 1 V rms X7R: frequency = 1 KHz for C 10 µf, measuring at voltage 1 V rms.
14 Product specification 14 TESTS AND REQUIREMENTS Table 10 Test condition, procedure and requirements TEST TEST METHOD PROCEDURE REQUIREMENTS Mounting IEC / The capacitors may be mounted on printed-circuit boards or ceramic substrates No visible damage Visual inspection and dimension check 4.4 Any applicable method using 10 magnification In accordance with specification Capacitance NP0: f = 1 MHz for C 1 nf, measuring at voltage 1 V rms at 20 C; f = 1 KHz for C > 1 nf, measuring at voltage 1 V rms at 20 C X7R: f = 1 KHz for C 10 µf, measuring at voltage 1 V rms at 20 C Within specified tolerance Dissipation factor (D.F.) NP0: f = 1 MHz for C 1 nf, measuring at voltage 1 V rms at 20 C; f = 1 KHz for C > 1 nf, measuring at voltage 1 V rms at 20 C X7R: f = 1 KHz for C 10 µf, measuring at voltage 1 V rms at 20 C In accordance with specification Insulation resistance At U r (DC) for 1 minute In accordance with specification Voltage proof Test voltage (DC) applied for 1 minute U r 100 V: 2.5 U r applied to NP0/X7R series 100 V < U r 200 V: 1.5 U r +100 V applied to NP0/X7R series 200 V < U r 500 V: 1.3 U r +100 V applied to NP0/X7R series U r > 500 V: 1.3 U r applied to NP0/X7R series I: 7.5 ma No breakdown or flashover Temperature characteristic 4.6 Between minimum and maximum temperature NP0: l C/Cl: 30 ppm/ C X7R: l C/Cl: 15% Adhesion 4.15 A force applied for 10 seconds to the line joining the terminations and in a plane parallel to the substrate for size 0603: a force of 5 N applied for size 0402: a force of 2.5 N applied No visible damage
15 Product specification 15 Table 10 Test condition, procedure and requirements (continued) TEST TEST METHOD PROCEDURE REQUIREMENTS Bond strength of plating on end face IEC / Mounting in accordance with IEC paragraph 4.3 Conditions: bending 1 mm at a rate of 1 mm/s, radius jig 340 mm No visible damage NP0: l C/Cl: 1% or 0.5 pf whichever is greater X7R: l C/Cl: 10% Resistance to soldering heat 4.9 Precondition: / 10 C for 1 hour, then keep for 24 ±1 hours at room temperature Preheating: for size 1206: 120 to 150 C for 1 minute Preheating: for size >1206: 100 to 120 C for 1 minute and 0 to 200 C for 1 minute Solder bath temperature: 260 ±5 C Dipping time: 10 ±0.5 seconds Recovery time: 24 ±2 hours. The termination shall be well tinned NP0: l C/Cl: 0.5% or 0.5 pf whichever is greater X7R: l C/Cl: 10% D.F.: within initial specified value R ins : within initial specified value Solderability 4.10 Unmounted chips completely immersed in a solder bath at 235 ±5 C Dipping time: 2 ±0.5 seconds Depth of immersion: 10 mm The termination shall be well tinned. Rapid change of temperature 4.11 Preconditioning; / 10 C for 1 hour, then keep for 24 ±1 hours at room temperature 5 cycles with following detail: 30 minutes at lower category temperature; 30 minutes at upper category temperature Recovery time 24 ±2 hours. No visual damage NP0: l C/Cl: 1% or 1 pf whichever is greater X7R: l C/Cl: 15% D.F.: within initial specified value R ins : within initial specified value Damp heat, with U r load 4.13 Initial measurements; after /-10 C for 1 hour, then keep for 24 ±1 hours at room temperature Duration and conditions: 500 ±12 hours at 40 ±2 C; 90 to 95% RH; U r applied Final measurement: perform a heat treatment at / 10 C for 1 hour, final measurements shall be carried out 24 ±1 hours after recovery at room temperature without load. NP0: l C/Cl: 2% or 1 pf whichever is greater X7R: l C/Cl: 15% NP0: D.F.: 2 initial value max. X7R 100 V: D.F. 5% NP0: R ins 2,500 MΩ or R ins C r 25 seconds, whichever is less X7R: R ins 500 MΩ or R ins C r 25 seconds, whichever is less
16 Product specification 16 Table 10 Test condition, procedure and requirements (continued) TEST TEST METHOD PROCEDURE REQUIREMENTS Endurance IEC / Preconditioning; Initial measurements; after /-10 C for 1 hour, then keep for 24 ±1 hours at room temperature Duration and conditions: 1,000 ±12 hours at upper category temperature with 1.5 U r voltage applied Final measurement: perform a heat treatment at / 10 C for 1 hour, final measurements shall be carried out 24 ±1 hours after recovery at room temperature without load. NP0: l C/Cl: 2% or 1 pf whichever is greater X7R: l C/Cl: 15% NP0: D.F.: 2 initial value max. X7R 100 V: D.F. 5% NP0: R ins 4,000 MΩ or R ins C r 40 seconds, whichever is less X7R: R ins 1,000 MΩ or R ins C r 50 seconds, whichever is less
17 Product specification REVISION HISTORY REVISION DATE CHANGE NOTIFICATION DESCRIPTION Version 0 Sep 08, New
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