MULTILAYER CERAMIC ANTENNA FOR BLUETOOTH & WLAN IEEE b (2.45G Hz ISM Band) Product Specification

Transcription

1 MULTILAYER ERAMI ANTENNA FOR BLUETOOTH & WLAN IEEE b (2.45G Hz ISM Band) QUIK REFERENE DATA Product Specification entral Frequency* Bandwidth Gain VSWR Polarization Azimuth Impedance** Operating Temperature Termination Resistance to soldering heat Maximum Power 2.45 GHz >100 MHz 1.2dBi max 2.0 max Linear Omni-directional 50Ω -55~125 o Ni/Sn (Environmentally-Friendly Leadless) 260 o, 10 sec. 1W * Three types of antenna are available for central frequency adjustment (type 245, type 260, type 270) ** Antenna is built-in internal impedance circuit and ground point can be grounded optionally for matching free purpose. Special Environmental oncerns- Green Products Design: The foil making process is using environmentally-friendly aqueous solvent technology. Termination is lead free (Pb free) and packing materials can be re-cycled Grant Lin/liff Page 1 sheet A4

2 APPLIATION Suggested Layout 0.8cm 0.2cm Ground plane(back side) leanance 0.8cm Bluetooth module or other RF Module Phycomp Antenna leanance 0.8cm 50Ohm Transmission Line (by Microstrip Line or oplanar Waveguide) Bluetooth Notebooks and PDAs with Phycomp Antenna IEEE b WLAN ards with Phycomp Antenna Grant Lin/liff Page 2 sheet A4

3 DIMENSIONAL DATA Figure Dimension Port s2 s3 s4 s1 F G T s2 s3 s4 W s1 F G L L W T F G S1 S2 S3 S4 7.35±0.25 mm 5.5±0.2 mm 1.3±0.2 mm 0.9±0.25 mm 1.25±0.35 mm 0.5±0.3 mm 1.25±0.35 mm 1.25±0.35 mm 0.9±0.25 mm 1.25±0.35 mm Feed Termination Ground Termination (Optional*) - N Solder Termination N Solder Termination N Solder Termination N Solder Termination * Antenna has a built-in circuit at Ground Termination. However, Ground Termination is optional if good matching is attainable. If good matching is attainable during application, Ground Termination can be used as N Solder Termination. SOLDER LAND PATTERN Figure Dimensions Remark s1 L s2 L W F 8.30 ± 0.10 mm 5.70 ± 0.10 mm 1.00 ± 0.10 mm Feed Pad F s3 W G 1.40 ± 0.10 mm 0.90 ± 0.10 mm Ground Pad (Optional*) G s4 S ± 0.10 mm N Mount Pad S2 S ± 0.10 mm 1.00 ± 0.10 mm N Mount Pad N Mount Pad S ± 0.10 mm N Mount Pad Grant Lin/liff Page 3 sheet A4

4 ELETRIAL DATA entral Frequency Bandwidth Gain VSWR Polarization Azimuth Beamwidth Impedance Operating Temperature Termination Resistance to soldering heat Maximum Power 2.45 GHz 100 MHz 0 ~ 1.2dBi 2.0 max Linear Omni-directional 50Ω -55~125 o Ni/Sn (Environmental Friendly Leadless) 260 o, 10 sec. 1W Radiation Pattern Polar plot E Plane H Plane Grant Lin/liff Page 4 sheet A4

5 STANDARD TEST BOARD FOR RADIATION PATTERN & SWR 14 mm 8 mm 14 mm 1.2 mm SMA Material:FR4 PB 0.8 mm 50 Ohm Microstrip Line Antenna, use only Feed Termination Grant Lin/liff Page 5 sheet A4

6 RELIABILITY DATA (Reference to IE Specification) IE / E LAUSE IE TEST METHOD TEST PROEDURE REQUIREMENTS 4.4 Mounting The antenna can be mounted on printedcircuit boards or ceramic substrates by applying wave soldering, reflow soldering (including vapour phase soldering) or conductive adhesive 4.5 Visual inspection and dimension check Any applicable method using 10 magnification Antenna Frequency = 2.45 GHz; at 20 o 4.8 Adhesion A force of 5 N applied for 10 s to the line joining the terminations and in a plane parallel to the substrate 4.9 Bond strength of plating on end face Mounted in accordance with E , paragraph 4.4 In accordance with specification (chip off 4mm) Standard test board in page 4 onditions: bending 1mm at a rate of 1mm/s, radius jig. 340 mm, 2mm warp on FR4 board of 90 mm length Grant Lin/liff Page 6 sheet A4

7 IE / E LAUSE IE TEST METHOD (Tb) Resistance to soldering heat Resistance to leaching TEST PROEDURE REQUIREMENTS 260 ± 5 for 10 ± 0.5 s in a static solder bath 260 ± 5 for 30 ± 1 s in a static solder bath (Ta) Solderability Zero hour test, and test after storage (20 to 24 months) in original atmosphere; un-mounted chips completely immersed for 2 ± 0.5 s in 235 ± (Na) Rapid change of temperature -55 (30 minutes) to +125 (30 minutes); 100 cycles (a) Damp heat 500 ± 12 hours at 60 ; 90 to 95 % RH 4.15 Endurance 500 ± 12 hours at 125 ; The terminations shall be well tinned after recovery and entral Freq. hange ± 6% Using visual enlargement of 10, dissolution of the termination shall not exceed 10% The termination must be well tinned, at least 75% is well tinned at termination entral Freq. hange ± 6% 2 hours recovery entral Freq. hange ± 6% 2 hours recovery entral Freq. hange ± 6% Grant Lin/liff Page 7 sheet A4

8 ORDERING INFORMATION: Method I- by 12N Ordering ode The antennas may be ordered by using the 12 N ordering code. These code numbers can be determined by the following rules: F M S T A F. Family ode 43 = Antenna. Packing Type ode 11 = 180 mm/ 7" blister (1000pcs), 12 = 330 mm/13" blister (4000 pcs) 13 = Bulk (1000 pcs) M. Materials ode 1 = High Frequency Material S. Size ode 11 = 7.35 * 5.5 * 1.3 mm T. Tolerance 00 = 100 M Hz Band Width A. Working Frequency (three types of antenna are available) 245 = 2.45 GHz Type = ( ) GHz * Intention for shift up 150MHz Type = ( ) GHz * Intention for shift up 250MHz Type 270 Example: 12N Product description: Antenna (43) by 180 mm blister (11) of High Frequency Material (1), Size 7.35*5.5*1.3 mm (1); Tolerance (00) of 100 MHz (VSWR<2) Working Frequency (245) = 2.45G Hz ORDERING INFORMATION: Method II- by lear Text ode The antennas may be ordered by using the 16-digit clear text ordering code. These code numbers can be determined by the following rules: AN K (lear Text ode Example) AN K Product entral Freq. Bandwidth Material Size Quantities Packing AN= 00= >100MHz 07=K7 0705=07*05*1. 1 = 1K Antenna 3 mm 4 = 4K 2450=2.45GHz 2600=2.60GHz 2700=2.70GHz K=7" plastic F =13" plastic B = Bulk Grant Lin/liff Page 8 sheet A4

9 Taping Blister Tape DIMENSION: Serial no ecking note Index Spec 1 Sprocket hole Do 1.55± Pocket hole D1 1.50± Distance sprocket hole/sprocket hole Po 4.0± Distance pocket/pocket P1 8.0± Distance sprocket hole/pocket P2 2.0± Tape width W 16.0± Distance sprocket hole/outside E 1.75± Distance sprocket hole/pocket F 7.50± Pocket length Ao 5.85± Pocket length Bo 7.60± Pocket depth Ko 1.70± Thickness of tape T 0.30± x sprocket hole pitch 10Po 40.0±0.10 Grant Lin/liff Page 9 sheet A4

10 7 (180mm) Reel Specifications Product size code Units per Reel Tape Width D W 1 W 2 Antenna ±1.0 62± ±0.2 Grant Lin/liff Page 10 sheet A4

11 13 (330mm) Reel Specifications Product size code Units per Reel Tape Width D W 1 T Antenna ± ± ± ±0.1 Grant Lin/liff Page 11 sheet A4